BD2206G-LB [ROHM]
本产品是面向工业设备市场的产品，保证可长期稳定供货。 是适合这些用途的产品。存储卡插槽用高边开关为内置了用于存储卡插槽电源线的带过电流限制功能的高边开关IC。开关部1个电路内置了低导通电阻的N通道MOSFET。还内置了过热检测、低电压锁定、软启动等功能。;
| 型号： | BD2206G-LB |
| 厂家： | 
ROHM |
| 描述： | 本产品是面向工业设备市场的产品，保证可长期稳定供货。 是适合这些用途的产品。存储卡插槽用高边开关为内置了用于存储卡插槽电源线的带过电流限制功能的高边开关IC。开关部1个电路内置了低导通电阻的N通道MOSFET。还内置了过热检测、低电压锁定、软启动等功能。 开关 软启动 存储 |
| 文件： | 总25页 (文件大小：542K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Load Switch ICs
for Portable Equipment
BD2202G-LB BD2206G-LB
General Description
Key Specifications
This is the product guarantees long time support in
Industrial market. The High-side switch, which has
over-current protection function, is used for the power
supply line of a memory card slot. In the switch part, an
N-channel MOSFET with low ON resistance has been 1
circuit integrated. The switch goes OFF when the
over-current condition lasts longer than the
over-current shutdown time. The OFF switch is set to
latch off mode. The operating voltage range is 2.7V to
3.6V and the current limit value is set on 400mA, 1A.
Moreover, functions of soft start, under voltage lockout,
and over temperature protection are integrated.
Input voltage range:
ON resistance :
Over current threshold:
BD2202G
2.7V to 3.6V
150mΩ(Typ.)
0.25A min., 1.0A max.
0.8A min., 1.6A max.
0.01μA (Typ.)
BD2206G
Standby current:
Operating temperature range:
-25℃ to +85℃
Package
W(Typ.) D(Typ.) H (Max.)
2.90mm x 2.80mm x 1.25mm
SSOP5
Features
Long time support a product for Industrial
applications.
Single low on-resistance (Typ. = 150mΩ) Nch
MOS FET
Continuous load current
¾ 0.2A:
¾ 0.5A:
Control input logic:
Soft start function
(BD2202G)
(BD2206G)
Active-High
SSOP5
Over current protection circuit
Over temperature protection circuit
Under voltage lockout
Applications
Industrial Equipment, Memory card slots of STB,
Digital still camera, Cell Phones, Notebook PC.
Typical Application Circuit
VIN
Cin
V
IN
Current
limit
Charge
pump
VOUT
Cout
UVLO
Control logic
Rout
Thermal
shutdown
EN
OFF
ON
GND
Lineup
Over current threshold
Typ.
Control input logic
Package
Orderable Part Number
Min.
Max.
0.25A
0.8A
-
-
1.0A
High
High
SSOP5
SSOP5
Reel of 3000 BD2202G-LBTR
Reel of 3000 BD2206G-LBTR
1.6A
○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.
www.rohm.com
TSZ02201-0E3E0H300370-1-2
21.Feb.2014 Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
1/22
TSZ22111･14･001
Datasheet
BD2202G-LB BD2206G-LB
Block Diagram
VIN
GND
EN
Current
limit
Charge
pump
VOUT
UVLO
Control logic
Thermal
shutdown
Pin Configuration
TOP VIEW
VIN VOUT
GND
5
4
1
2
3
NC
EN
Pin Description
Pin Number Pin Name
I / O
I
Pin function
Power supply input terminal.
1
2
3
4
5
VIN
GND
EN
Input terminal to the power switch and supply of the internal circuit.
Ground.
I
I
Power Switch enable input.
Active-High Switch on input. Logic high turns the switch on.
No connection.
N.C
-
Power switch output.
VOUT
O
www.rohm.com
TSZ02201-0E3E0H300370-1-2
21.Feb.2014 Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
2/22
TSZ22111･15･001
Datasheet
BD2202G-LB BD2206G-LB
Absolute Maximum Ratings
Parameter
Symbol
VIN
Limits
-0.3 to 6.0
-0.3 to 6.0
-0.3 to VIN + 0.3
-55 to 150
675*1
Unit
V
Supply voltage
EN voltage
VEN
V
OUT voltage
VOUT
TSTG
PD
V
Storage temperature
Power dissipation
°C
mW
*1
Mounted on 70mm * 70mm * 1.6mm grass-epoxy PCB. Derating: 5.4mW/℃ for operating above Ta=25℃
Recommended Operating Range
◎BD2202G
Parameter
Symbol
VIN
Limits
Unit
V
Operating voltage range
Operating temperature range
Operating load current
2.7 to 3.6
-25 to 85
TOPR
ILO
°C
0
to 200
mA
◎BD2206G
Parameter
Symbol
VIN
Limits
Unit
V
Operating voltage range
Operating temperature range
Operating load current
2.7 to 3.6
-25 to 85
TOPR
ILO
°C
0
to 500
mA
Electrical Characteristics
◎BD2202G
(Unless otherwise specified, VIN = 3.3V, Ta = 25°C)
DC characteristics
Limits
Typ.
70
Parameter
Symbol
Unit
Condition
Min.
Max.
90
Operating current
Standby current
IDD
-
μA
μA
V
VEN = 3.3V, VOUT = OPEN
VEN = 0V, VOUT = OPEN
High level input
ISTB
-
2.0
-
0.01
-
1
-
EN input voltage
VEN
-
0.8
1.0
200
V
Low level input
EN input current
ON resistance
IEN
-1.0
-
0.01
150
μA
mΩ
VEN = 0V or VEN = 3.3V
IOUT = 50mA
RON
Over-current Threshold
ITH
0.25
-
1.0
A
Short-circuit output current
Output leak current
ISC
200
-
-
600
10
mA
μA
V
VOUT = 0V
ILEAK
0.01
2.3
2.2
VEN = 0V, VOUT = 0V
VIN increasing
VIN decreasing
VTUVH
VTUVL
2.1
2.0
2.5
2.4
UVLO threshold
V
AC characteristics
Parameter
Limits
Typ.
1.2
2
Symbol
Unit
Condition
Min.
0.25
0.4
50
Max.
6
Output rise time
TON1
TON2
ms
ms
μs
ROUT=500Ω, COUT=0.1μF
ROUT=500Ω, COUT=0.1μF
ROUT=500Ω, COUT=0.1μF
ROUT=500Ω, COUT=0.1μF
At continuous over current
At discontinuous over current
Output turn on time
10
Output fall time
TOFF1
100
100
10
200
200
15
Output turn off time
TOFF2
50
μs
Over current shutdown time 1
Over current shutdown time 2
TBLANK1
TBLANK2
5
ms
ms
3
-
15
www.rohm.com
TSZ02201-0E3E0H300370-1-2
21.Feb.2014 Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
3/22
TSZ22111･15･001
Datasheet
BD2202G-LB BD2206G-LB
Electrical Characteristics - continued
◎BD2206G
(Unless otherwise specified, VIN = 3.3V, Ta = 25°C)
DC characteristics
Limits
Typ.
70
Parameter
Symbol
Unit
Condition
Min.
Max.
90
Operating current
Standby current
IDD
-
μA
μA
V
VEN = 3.3V, VOUT = OPEN
VEN = 0V, VOUT = OPEN
High level input
ISTB
-
2.0
-
0.01
-
1
-
EN input voltage
VEN
-
0.8
1.0
200
V
Low level input
EN input current
ON resistance
IEN
-1.0
-
0.01
150
μA
mΩ
VEN = 0V or VEN = 3.3V
IOUT = 50mA
RON
Over-current Threshold
ITH
0.8
-
1.6
A
Short-circuit output current
Output leak current
ISC
750
-
-
1350
10
mA
μA
V
VOUT = 0V
ILEAK
0.01
2.3
2.2
VEN = 0V, VOUT = 0V
VIN increasing
VIN decreasing
VTUVH
VTUVL
2.1
2.0
2.5
UVLO threshold
2.4
V
AC characteristics
Parameter
Limits
Typ.
1.2
2
Symbol
Unit
Condition
Min.
0.25
0.4
50
Max.
6
Output rise time
TON1
TON2
ms
ms
μs
ROUT=500Ω, COUT=0.1μF
ROUT=500Ω, COUT=0.1μF
ROUT=500Ω, COUT=0.1μF
ROUT=500Ω, COUT=0.1μF
At continuous over current
At discontinuous over current
Output turn on time
10
Output fall time
TOFF1
100
100
10
200
200
15
Output turn off time
TOFF2
50
μs
Over current shutdown time 1
Over current shutdown time 2
TBLANK1
TBLANK2
5
ms
ms
3
-
15
www.rohm.com
TSZ02201-0E3E0H300370-1-2
21.Feb.2014 Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
4/22
TSZ22111･15･001
Datasheet
BD2202G-LB BD2206G-LB
Measurement Circuits
OUT
NC
VIN
GND
EN
OUT
VIN
GND
EN
NC
A. Operating current
B. EN input voltage, Output rise / fall time
OUT
NC
OUT
NC
VIN
GND
EN
VIN
GND
EN
C.ON resistance
D. Over current protection characteristics
Figure 1. Measurement circuits
Timing Diagrams
50%
VEN
50%
Over currentdetection
TON2
TOFF2
VOUT
90%
90%
IOUT
VOUT
10%
10%
TOFF1
TON1
TBLANK
Figure 2. Switch Turn on / off time
Figure 3. Over current limits characteristics
www.rohm.com
TSZ02201-0E3E0H300370-1-2
21.Feb.2014 Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
5/22
TSZ22111･15･001
Datasheet
BD2202G-LB BD2206G-LB
Typical Performance Curves
90
90
80
70
60
50
40
30
20
10
0
Ta=25°C
VIN=3.3V
80
70
60
50
40
30
20
10
0
-50
0
50
100
2
2.5
3
3.5
4
SUPPLY VOLTAGE : VIN [V]
AMBIENT TEMPERATURE : Ta [°C]
Figure 4. Operating current
EN Enable
Figure 5. Operating current
EN Enable
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.8
0.6
0.4
0.2
0.0
VIN=3.3V
Ta=25°C
2
2.5
3
3.5
4
-50
0
50
100
]
SUPPLY VOLTAGE : VIN [V]
AMBIENT TEMPERATURE : Ta [
℃
Figure 6. Operating current
EN Disable
Figure 7. Operating current
EN Disable
www.rohm.com
TSZ02201-0E3E0H300370-1-2
21.Feb.2014 Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
6/22
TSZ22111･15･001
Datasheet
BD2202G-LB BD2206G-LB
Typical Performance Curves - continued
2.0
2.0
1.5
1.0
0.5
0.0
Ta=25°C
VIN=3.3 V
Low to High
High to Low
Low to High
1.5
High to Low
1.0
0.5
0.0
-50
0
50
100
2
2.5
3
3.5
4
SUPPLY VOLTAGE : VIN[V]
AMBIENT TEMPERATURE : Ta[
]
℃
Figure 8. EN input voltage
Figure 9. EN input voltage
250
200
150
100
50
250
200
150
100
50
VIN=3.3V
Ta=25°C
0
0
2
2.5
3
3.5
4
-50
0
50
100
SUPPLY VOLTAGE : VDD[V]
Figure 10. ON resistance
AMBIENT TEMPERATURE : Ta [
]
℃
Figure 11. ON resistance
www.rohm.com
TSZ02201-0E3E0H300370-1-2
21.Feb.2014 Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
7/22
TSZ22111･15･001
Datasheet
BD2202G-LB BD2206G-LB
Typical Performance Curves - continued
0.6
0.6
0.5
0.4
0.3
0.2
VIN=3.3V
Ta=25°C
0.5
0.4
0.3
0.2
-50
0
50
100
2
2.5
3
3.5
4
SUPPLY VOLTAGE : VIN[V]
AMBIENT TEMPERATURE : Ta[
]
℃
Figure 12. Short circuit output current
(BD2202G)
Figure 13. Short circuit output current
(BD2202G)
1.35
1.25
1.15
1.05
0.95
0.85
0.75
1.35
1.25
1.15
1.05
0.95
0.85
0.75
VIN=3.3V
Ta=25°C
2
2.5
3
3.5
4
-50
0
50
100
SUPPLY VOLTAGE : VIN[V]
AMBIENT TEMPERATURE : Ta[
]
℃
Figure 14. Short circuit output current
(BD2206G)
Figure 15. Short circuit output current
(BD2206G)
www.rohm.com
TSZ02201-0E3E0H300370-1-2
21.Feb.2014 Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
8/22
TSZ22111･15･001
Datasheet
BD2202G-LB BD2206G-LB
Typical Performance Curves - continued
15
15
14
13
12
11
10
9
Ta=25°C
VIN=3.3V
14
13
12
11
10
9
8
8
7
7
6
6
5
5
2
2.5
3
3.5
4
-50
0
50
100
SUPPLY VOLTAGE : VIN[V]
SUPPLY VOLTAGE : Ta[
]
℃
Figure 16. Over current shutdown time
Figure 17. Over current shutdown time
2500
2500
2000
1500
1000
500
Ta=25°C
VIN=3.3V
2000
1500
1000
500
0
0
2
2.5
3
3.5
4
-50
0
50
100
SUPPLY VOLTAGE : VIN[V]
AMBIENT TEMPERATURE : Ta[
]
℃
Figure 18. Output rise time
Figure 19. Output rise time
www.rohm.com
TSZ02201-0E3E0H300370-1-2
21.Feb.2014 Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
9/22
TSZ22111･15･001
Datasheet
BD2202G-LB BD2206G-LB
Typical Performance Curves - continued
2500
2500
2000
1500
1000
500
Ta=25°C
VIN=3.3V
2000
1500
1000
500
0
0
-50
0
50
100
]
2
2.5
3
3.5
4
SUPPLY VOLTAGE : VIN[V]
AMBIENT TEMPERATURE : Ta[
℃
Figure 20. Output turn on time
Figure 21. Output turn on time
200
150
100
50
200
150
100
50
VIN=3.3V
Ta=25°C
-50
0
50
100
2
2.5
3
3.5
4
SUPPLY VOLTAGE : VIN [V]
AMBIENT TEMPERATURE : Ta[
]
℃
Figure 22. Output fall time
Figure 23. Output fall time
www.rohm.com
TSZ02201-0E3E0H300370-1-2
21.Feb.2014 Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
10/22
TSZ22111･15･001
Datasheet
BD2202G-LB BD2206G-LB
Typical Performance Curves - continued
200
200
150
100
50
Ta=25°C
VIN=3.3V
150
100
50
2
2.5
3
3.5
4
-50
0
50
100
SUPPLY VOLTAGE : VIN[V]
Figure 24. Output turn off time
AMBIENT TEMPERATURE : Ta[
]
℃
Figure 25. Output turn off time
0.20
0.16
0.12
0.08
0.04
0.00
2.5
2.4
2.3
2.2
2.1
2
VUVLOH
VUVLOL
-50
0
50
100
-50
0
50
AMBIENT TEMPERATURE : Ta[
Figure 27. UVLO hysteresis voltage
100
]
AMBIENT TEMPERATURE : Ta[
]
℃
℃
Figure 26. UVLO threshold voltage
www.rohm.com
TSZ02201-0E3E0H300370-1-2
21.Feb.2014 Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
11/22
TSZ22111･15･001
Datasheet
BD2202G-LB BD2206G-LB
Typical Wave Forms
VOUT
(1/div.)
VOUT
(1/div.)
VIN=3.3V
RL=500Ω
CL=0.1uF
V/EN
(1/div.)
VIN=3.3V
RL=500Ω
CL=0.1uF
V/EN
(1/div.)
TIME (0.5div.)
TIME (0.5div.)
Figure 28. Output turn on response
Figure 29. Output turn off response
IOUT
(0.1A/div.)
IOUT
(0.2A/div.)
VIN=3.3V
CIN=10uF
CL=0.1uF
VIN=3.3V
CIN=10uF
CL=0.1uF
VOUT
(1V/div.)
VOUT
(1V/div.)
VEN
(1V/div.)
VEN
(1V/div.)
TIME (2ms/div.)
TIME (2ms/div.)
Figure 30. Current limit response
Enable into short circuit
(BD2202G)
Figure 31. Current limit response
Enable into short circuit
(BD2206G)
www.rohm.com
TSZ02201-0E3E0H300370-1-2
21.Feb.2014 Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
12/22
TSZ22111･15･001
Datasheet
BD2202G-LB BD2206G-LB
Typical Wave Forms - continued
IOUT
(0.2A/div.)
IOUT
(0.2A/div.)
VIN=3.3V
CIN=10uF
CL=0.1uF
VIN=3.3V
CIN=10uF
CL=0.1uF
VOUT
(1V/div.)
VOUT
(1V/div.)
TIME (2ms/div.)
TIME (2ms/div.)
Figure 32. Current limit response
Figure 33. Current limit response
Output shorted to GND
(BD2206G)
Output shorted to GND
(BD2202G)
IOUT
(0.1A/div.)
IOUT
(0.2A/div.)
VIN=3.3V
CIN=10uF
CL=0.1uF
VIN=3.3V
CIN=10uF
CL=0.1uF
VOUT
(1V/div.)
VOUT
(1V/div.)
TIME (5ms/div.)
TIME (5ms/div.)
Figure 34. Current limit response
Ramped load (1A/10ms)
(BD2202G)
Figure 35. Current limit response
Ramped load (1A/10ms)
(BD2206G)
www.rohm.com
TSZ02201-0E3E0H300370-1-2
21.Feb.2014 Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
13/22
TSZ22111･15･001
Datasheet
BD2202G-LB BD2206G-LB
Typical Wave Forms - continued
VIN
VIN
(1V/div.)
(1V/div.)
VOUT
VOUT
(1V/div.)
(1V/div.)
RL=500Ω
CL=0.1uF
RL=500Ω
CL=0.1uF
IOUT
(10mA/div.)
IOUT
(10mA/div.)
TIME (5ms/div.)
TIME (500ms/div.)
Figure 36. UVLO VIN rising
Figure 37. UVLO VIN falling
Typical application circuit
VIN
Cin
V
IN
Current
limit
Charge
pump
VOUT
Cout
UVLO
Control logic
Rout
Thermal
shutdown
EN
OFF
ON
GND
Application Information
When excessive current flows due to output short-circuit or so, ringing occurs because of inductance between power
source line to IC, and may cause bad influences on IC operations. In order to avoid this case, connect a bypass
capacitor across IN terminal and GND terminal of IC. 1μF or higher is recommended.
This application circuit does not guarantee its operation.
When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for
external components including AC/DC characteristics as well as dispersion of the IC.
www.rohm.com
TSZ02201-0E3E0H300370-1-2
21.Feb.2014 Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
14/22
TSZ22111･15･001
Datasheet
BD2202G-LB BD2206G-LB
Operation Description
BD2202G and BD2206G are high side switch ICs with over-current protection function. The operating voltage range is
from 2.7V to 3.6V and the current limit value is set to 400mA and 1A respectively.
When an over-current condition lasts longer than its over-current shutdown time, the switch turns OFF. The OFF switch
is set to latch mode. The switch set to latch mode returns to normal by toggling EN pin from High to Low to High.
1.Switch On/Off control
VIN terminal and VOUT terminal are connected to the drain and the source of switch MOSFET respectively. And the
VIN terminal is used also as power source input to internal control circuit.
When the switch is turned on from EN control input, VIN and VOUT are connected by a 150mΩ switch. In normal
condition, the switch is bidirectional. Therefore, when the voltage of VOUT is higher than VIN the current flows from
VOUT to VIN.
In the switch MOSFET, there is a parasitic diode (body diode) between drain and source. So, even when the switch is
off, when voltage of VOUT is higher than VIN, the current flows through the body diode from VOUT to VIN.
2. Over current detection (OCD)
The over current detection circuit limits current flowing in switch MOSFET when it exceeds its limit threshold. There
are three types of responses against over current. The over current detection circuit is in operation when the power
switch is ON (when EN signal is active).
2-1 When the switch is turned on while the output is in short-circuit status
When the switch is turned on while the output is in short-circuit status, the switch goes into current limit status
immediately.
2-2 When the output short-circuits while the switch is on
When the output short-circuits or high-current load is connected while the switch is on, very large current flows
until the over current limit circuit reacts. When the current detection and limit circuit works, current limitation is
carried out.
2-3 When the output current increases gradually
When the output current increases gradually, current limitation does not work until the output current exceeds the
over current detection value. When it exceeds the detection value, current limitation is carried out.
3.Over current shutdown
When the over current detection circuit detects an over current, TBLANK timer starts working. When the over current
condition disappears before TBLANK2 stage, TBLANK timer is reset. When the over current condition progresses to
more than TBLANK1, the switch is shut off. The OFF switch is set to latch off mode. The latch is reset when EN
terminal is toggled or when UVLO is detected.
4.Under voltage lockout (UVLO)
UVLO keeps the power switch off until VIN voltage exceeds 2.3V (Typ.). Moreover, from a power switch ON situation,
if VIN voltage drops to 2.2V (Typ.), the power switch is set to OFF. UVLO has a 100mV hysteresis. The under voltage
lock out circuit is in operation when power switch is ON (when EN signal is active).
5.Thermal shutdown
When the chip temperature increases to 160°C (Typ.), the thermal shut down circuit works and the power switch is
turned OFF. When the chip temperature falls to 140°C (Typ.), the power switch output returns to normal. This
operation will repeat itself until the causes of the chip temperature rise are removed or until the power switch output is
turned off.
The thermal shutdown circuit is in operation when the power switch is ON (when EN signal is active).
www.rohm.com
TSZ02201-0E3E0H300370-1-2
21.Feb.2014 Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
15/22
TSZ22111･15･001
Datasheet
BD2202G-LB BD2206G-LB
TBLANK2
TBLANK1
Outputcurrent
Switch sta tus
EN voltage
ON
OFF
ON
Figure 38. Over-current detection, shutdown operation (return with EN input)
TBLANK2
TBLANK1
Outputcurrent
Switch sta tus
VIN voltage
ON
OFF
ON
VTUVL
VTUVH
Figure 39. Over-current detection, shutdown operation (return with UVLO operation)
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
TSZ02201-0E3E0H300370-1-2
21.Feb.2014 Rev.002
16/22
Datasheet
BD2202G-LB BD2206G-LB
Power Dissipation
(SSOP5)
700
600
500
400
300
200
100
0
0
25
50
75
100
℃
125
150
AMBIENT TEMPERATURE : Ta [
]
Figure 40. Power dissipation curve (Pd-Ta Curve)
I/O Equivalence Circuit
Pin Name
Pin Number
Equivalence circuits
EN
3
VOUT
5
www.rohm.com
TSZ02201-0E3E0H300370-1-2
21.Feb.2014 Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
17/22
TSZ22111･15･001
Datasheet
BD2202G-LB BD2206G-LB
Operational Notes
(1) Absolute Maximum Ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
(2) Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply terminals.
(4) Power Supply Lines
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply
lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting
the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of
temperature and aging on the capacitance value when using electrolytic capacitors.
(5) Ground voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that
no pins are at a voltage below the ground pin at any time, even during transient condition.
(6) Short between Pins and Mounting Errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the
pins.
(7) Operation under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
(8) Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
(9) Regarding Input Pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
C
E
Pin A
B
C
E
N
P+
P+
P+
N
N
N
P+
P
N
P
N
P substrate
P substrate
Parasitic
element
GND
GND
GND
GND
Parasitic element
Parasitic element
Other adjacent elements
Figure 41.
Example of monolithic IC structure
www.rohm.com
TSZ02201-0E3E0H300370-1-2
21.Feb.2014 Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
18/22
TSZ22111･15･001
Datasheet
BD2202G-LB BD2206G-LB
(10)GND Wiring Pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on
the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line
impedance.
(11)External capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
(12)Thermal Shutdown Circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal
temperature of the IC reaches a specified value. Do not continue to operate the IC after this function is activated. Do
not use the IC in conditions where this function will always be activated.
(13)Thermal Consideration
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd)
in actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (Pc≥Pd).
Package Power dissipation
Power dissipation
: Pd (W)=(Tjmax－Ta)/θja
: Pc (W)=(Vcc－Vo)×Io+Vcc×Ib
Tjmax : Maximum junction temperature=150℃, Ta : Peripheral temperature[℃] ,
θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W],
Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current
www.rohm.com
TSZ02201-0E3E0H300370-1-2
21.Feb.2014 Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
19/22
TSZ22111･15･001
Datasheet
BD2202G-LB BD2206G-LB
Ordering Information
B D 2 2 0 x G
-
L B T R
Part Number
Package
G : SSOP5
Product class
LB for Industrial applications
Packaging and forming specification
TR: Embossed tape and reel
Marking Diagram
SSOP5 (TOP VIEW)
Part Number Marking
LOT Number
Part Number
Part Number Marking
BD2202G
BD2206G
AN
AR
www.rohm.com
TSZ02201-0E3E0H300370-1-2
21.Feb.2014 Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
20/22
TSZ22111･15･001
Datasheet
BD2202G-LB BD2206G-LB
Physical Dimension Tape and Reel Information
Package Name
SSOP5
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
TSZ02201-0E3E0H300370-1-2
21.Feb.2014 Rev.002
21/22
Datasheet
BD2202G-LB BD2206G-LB
Revision History
Date
Revision
001
Changes
13.Mar.2012
New Release
Delete sentence “and log life cycle” in General Description and Futures (page 1).
Change “Industrial Applications” to “Industrial Equipment” in Applications (page 1).
Applied new style (“title”, “Ordering Information” and “Physical Dimension Tape and Reel
Information”).
21.Feb.2014
002
www.rohm.com
TSZ02201-0E3E0H300370-1-2
21.Feb.2014 Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
22/22
TSZ22111･15･001
Daattaasshheeeett
Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - SS
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - SS
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
相关型号：
©2020 ICPDF网 联系我们和版权申明