BD18326NUF-M_技术文档

Datasheet

40 V 600 mA 1ch Constant Current Driver

for Automotive LED Lamps

BD18326NUF-M

General Description

Key Specifications

The BD18326NUF-M is a constant current driver IC for

driving automotive LED lamp, that can withstand up to 40

V. Small-size package is suitable for use in socket LED

driver applications.

The BD18326NUF-M offers high reliability with built-in

functions for the thermal de-rating function, the LED open

detection, the output short circuit protection, the SET pin

short circuit protection, the over-voltage mute function, the

current bypass function at reduced-voltage, the output for

fault flag function and the input for output current OFF

control signal.

 Input Voltage Range:

 Output Current Accuracy:

 Maximum Output Current:

5.5 V to 20 V

±5 %

400 mA (DC)

600 mA (ON Duty: 50 %)

-40 °C to +150 °C

 Operating Temperature Tj:

Package

VSON10FV3030

W (Typ) x D (Typ) x H (Max)

3.0 mm x 3.0 mm x 1.0 mm

Features

 AEC-Q100 Qualified^{(Note 1)}

 Functional Safety Supportive Automotive Products

 CR Timer for PWM Dimming

 Thermal De-rating Function (THD)

 LED Open Detection

 Output Short Circuit Protection (OUT SCP)

 SET Pin Short Circuit Protection (SET SCP)

 Over Voltage Mute Function (OVM)

 Current Bypass Function at Reduced-Voltage

 Disable LED Open Detection Function

at Reduced-Voltage (OPM)

 Output for Fault Flag / Input for Output Current OFF

Control Signal (PBUS)

(Note 1) Grade1

Applications

 Automotive LED Exterior Lamps

(Rear Lamp, Turn Lamp, DRL/Position Lamp, Fog

Lamp)

 Automotive Interior Lamps

(Air Conditioner Lamp, Interior Light, Cluster Light

etc.)

Typical Application Circuit

PWM

SW

D1

D2

D3

OUT

VIN

C_OUT

BD18326NUF-M

C_VIN

DC

SW

CRT

R_DCINC_CRT

R_CRT

ISINK

EXP-PAD

+B

DISC

THD

SET

PBUS

R_BP1

R_SET

NTC

BPCNT

GND

R_BP3

R_BP2

〇Product structure: Silicon integrated circuit 〇This product has no designed protection against radioactive rays.

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Pin Configuration

(TOP VIEW)

EXP-PAD

Pin Descriptions

Pin No.

Pin Name

Function

1

2

VIN

BPCNT

PBUS

CRT

Power supply input

Current bypass function at reduced-voltage setting^{(Note 1)}

Output for fault flag / Input for output current OFF control signal^{(Note 2)}

CR timer setting 1^{(Note 3)}

3

4

5

DISC

THD

CR timer setting 2^{(Note 3)}

6

Thermal de-rating setting^{(Note 4)}

7

SET

Output current setting^{(Note 1)}

8

GND

9

ISINK

OUT

Current sink pin for current bypass function at reduced-voltage

Current output

10

-

Heat radiation pad. The EXP-PAD is connected to GND.

EXP-PAD

(Note 1) Do not connect external capacitor.

(Note 2) Open the PBUS pin when not in use output for fault flag / input for output current OFF control signal.

(Note 3) Short the CRT pin to the VIN pin and open the DISC pin or connect it to GND when in use at DC mode only.

(Note 4) Open the THD pin when not in use thermal de-rating function.

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BD18326NUF-M

Block Diagram

VIN

Bandgap

VREG

OVM

V_BG

to Current

Setting

Block

TSD

UVLO

OPM

Current

Driver

100 mA

OUT

to 600 mA

VBG

LED Open

Detection

V_BG

V_IN

PBUS

V_BG

Control

Logic

0.05 V

OUT SCP

BPCNT

V_BG

V_REG

0.6 V ↔0.8 V

ISINK

Bypass

Control

CR

TIMER

CRT

DISC

V_BG

LED Open

Detection

(ISINK)

VREG

SET

SCP

I_THD

Current

Setting

THD

VBG

from OVM

Block

GND

SET

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BD18326NUF-M

Description of Blocks

(Unless otherwise specified, Tj = 25 °C, V_IN= 13 V)

1. Table of Operations

The BD18326NUF-M has a built-in CR timer for PWM dimming and it is possible to change between PWM dimming

mode and DC mode. Once the VIN pin voltage V_INis 17.4 V (Typ) or more, the output current I_OUTis limited to

suppress the heat generation from the IC.

It is possible to detect the LED open state or short circuit state by monitoring the OUT pin voltage. In case of the LED

abnormality detection, it can notify the abnormality to the outside by changing the PBUS pin voltage to low.

The output current is also turned OFF when the Low signal is input to the PBUS pin.

In addition, under voltage lock out (UVLO) and thermal shutdown circuit (TSD) are built-in, which further increase

system reliability.

The correspondence table is given below. For details, refer to functional description of each block.

Output

Detecting Condition

Operation

CRT Pin

Current

(I_OUT

PBUS Pin

-

Mode

[Detect]

[Release]

)

V_CRT

2.0 V (Typ)

≥

100 mA

to 400 mA

DC

-

Refer to

Description of

Blocks 4

Refer to

Description of

Blocks 4

PWM Dimming

-

Thermal

De-rating

(THD)

Refer to

Description of

Blocks 9

-

V_THD≤ 0.8 V (Typ)

V_IN≥ 17.4 V (Typ)

V_THD> 0.8 V (Typ)

V_IN< 17.4 V (Typ)

Over Voltage

Mute

Refer to

Description of

Blocks 10

(OVM)

V_OUT

V_IN- 0.050 V (Typ)

and

≥

V_OUT<

V_IN- 0.050 V (Typ)

or

LED

Open Detection

(OUT Pin)

-

OFF

-

Low

-

VIN ≥ 11.0 V (Typ)

VIN < 11.0 V (Typ)

LED

Open Detection

(ISINK Pin)

V_ISINK

5.80 V (Typ)

≥

V_ISINK<

4.60 V (Typ)

Output

Short Circuit

Protection

(OUT SCP)

OFF

V_OUT≤ 0.6 V (Typ)

V_OUT≥ 0.8 V (Typ)

Low

SET Pin Short

Circuit Protection

(SET SCP)

I_SET≤ 0.5 mA (Typ)

V_PBUS≤ 0.6 V (Typ)

I_SET> 0.5 mA (Typ)

V_PBUS≥ 2.4 V (Typ)

Input for Output

Current OFF

Control Signal

(PBUS)

V_PBUS

0.6 V (Typ)

input

≤

-

Under Voltage

Lock Out

OFF

-

High

Low

V_IN≤ 4.50 V (Typ)

V_IN≥ 6.05 V (Typ)

(UVLO)

Thermal

Shutdown Circuit

(TSD)

Tj ≥ 175 C (Typ)

Tj ≤ 150 C (Typ)

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Description of Blocks – continued

(Unless otherwise specified, Tj = 25 °C, V_IN= 13 V)

2. Output Current I_OUTSetting

The output current I_OUTcan be set by the value of the output current setting resistor R_SET

.

퐾

푅

푆퐸ꢀ

퐼_푂푈푇

=

[mA]

푆퐸ꢀ

where:

ꢁ_ꢂꢃ푇

ꢄ_ꢂꢃ푇

is the output current setting coefficient, 2400 (Typ).

is the output current setting resistor. [kΩ]

VIN

Current

Driver

+B

100 mA

OUT

to 600 mA

IOUT

Current

Setting

GND

SET

R_SET

Output Current Setting

2.1

Relationship between VIN Pin Voltage V_INand Output Current I_OUT

Set the VIN pin voltage V_INand output current I_OUTto satisfy the following relationship.

푉 ≥ 푉

× ꢆ + 푉_퐷푅

[V]

ꢅ푁

푓_퐿ꢃ퐷

Where:

푉

ꢅ푁

is the VIN pin voltage.

푉

푓_퐿ꢃ퐷

is the forward voltage of LED.

ꢆ

is the number of LED.

푉_퐷푅

is the drop voltage between the VIN pin and the OUT pin.

3. SET Pin Short Circuit Protection (SET SCP)

Once the current which flows through the SET pin is more than or equal to the SET pin short circuit protection threshold

current I_{SET_SH}(0.50 mA (Typ)), the output current I_OUTis turned off to prevent thermal damage of the IC, and it can

notify the abnormality to the outside by changing the PBUS pin output to low.

VIN

Current

Driver

100 mA

to 600 mA

PBUS

OUT

Control

Logic

PBUS

SET

SCP

Current

Setting

GND

SET

R_SET

SET Pin Short Circuit Protection

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Description of Blocks – continued

(Unless otherwise specified, Tj = 25 °C, V_IN= 13 V)

4. PWM Dimming Operation

PWM dimming is performed by connecting external parts to the CRT pin and the DISC pin as shown below. PWM

dimming frequency and ON duty width can be set by the values of the external resistor R_CRTand the external capacitor

C_CRT

. When use the DC mode only, connect the CRT pin to the VIN pin and open the DISC pin.

A triangular waveform is generated when the DC SW is open as shown below. Output current I_OUTis turned OFF

while the CRT pin voltage ramps up and I_OUTis turned ON while the CRT pin voltage is ramp down.

Once the CRT pin voltage is V_{CRT_DIS1}(2.0 V (Typ)) or more, it turns to DC mode. And once the CRT pin voltage is

more than V_{CRT_DIS2}(2.4 V (Typ)), the DISC pin ON resistance changes from R_DISC1(50 Ω (Typ)) to R_DISC2(5 kΩ (Typ))

and the power consumption of the IC is reduced by reducing the inflow current of the DISC pin.

VIN

V_REG

Current

Driver

100 mA

CRTIMER

DC SW

OUT

to 600 mA

I_CRT

CRT

R_CRT

I_OUT

C_CRT

Control

Logic

V_{CRT_DIS1}

GND

V_{CRT_DIS2}

DISC

R_DISC1

R_DISC2

Ramp up

Ramp down

VCRT_DIS1

2.0 V (Typ)

CRT Pin

Voltage

ΔV_CRT

V_{CRT_CHA}

0.8 V (Typ)

t_OFF

t_ON

ΔV_CRTx C_CRT

I_CRT

V_{CRT_CHA}

t_OFF

=

= R_CHAx C_CRT

t_ON= - (R_CRT+ R_DISC1) x C_CRTx ln

(

)

V_{CRT_DIS1}

I_OUT

OFF

I_OUT

ON

I_OUT

OFF

I_OUT

ON

I_OUT

OFF

I_OUT

ON

Output Current

I_OUT

PWM Dimming Operation

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4. PWM Dimming Operation – continued

4.1

CRT Pin Voltage Ramp Up Time t_OFFand Ramp Down Time t_ON

CRT pin voltage ramp up time t_OFFand ramp down time t_ONcan be set by the following equations.

Make sure that t_ONis set PWM minimum pulse width t_MINto 50 μs or more.

∆ꢇ

× ꢉ

퐶ꢈꢀ

푡_푂퐹퐹

=

= ꢄ_ꢉ퐻퐴× ꢊ_ꢉ푅푇

[ms]

ꢅ

퐶ꢈꢀ

푡_푂푁= − ꢄ_ꢉ푅푇+ ꢄ_{퐷ꢅꢂꢉ1}× ꢊ_ꢉ푅푇× 퐼푛 ꢋ_ꢇ^ꢇ^{퐶ꢈꢀ_퐶ꢌꢍ}ꢑ

(

)

퐶ꢈꢀ_ꢎꢏ푆ꢐ

where:

푉

is the CRT pin charge voltage,

is the CRT pin discharge voltage 1,

is the CRT pin charge current,

is the capacitor for setting CR timer,

is the resistor for setting CR timer,

is the CRT pin charge resistor,

is the DISC pin ON resistor 1,

0.8 V (Typ).

2.0 V (Typ).

40 μA (Typ).

[μF].

[kΩ].

30 kΩ (Typ).

25 Ω (Typ).

ꢉ푅푇_ꢉ퐻퐴

푉

ꢉ푅푇_퐷ꢅꢂ1

퐼_ꢉ푅푇

ꢊ_ꢉ푅푇

ꢄ_ꢉ푅푇

ꢄ_ꢉ퐻퐴

ꢄ_{퐷ꢅꢂꢉ1}

4.2

4.3

PWM Dimming Frequency f_PWM

PWM frequency is defined by t_ONand t_OFF

.

1

ꢒ

푃푊푀

=

[Hz]

ꢓ

ꢔꢕ

ꢖ ꢓ

ꢔꢗꢗ

ON Duty (D_ON

)

PWM ON duty is defined by t_ONand t_OFF

.

ꢓ

ꢔꢕ

ꢘ_푂푁

=

× ꢙ00

[%]

ꢓ

ꢔꢕ

ꢖ ꢓ

ꢔꢗꢗ

(Example) In case of R_CRT= 3.6 kΩ (Typ), C_CRT= 0.1 μF (Typ)

푡_푂퐹퐹= ꢄ_ꢉ퐻퐴× ꢊ_ꢉ푅푇= 30 × 0.ꢙ = 3.0

ꢄ_{퐷ꢅꢂꢉ1}

[ms]

푉_{ꢉ푅푇_ꢉ퐻퐴}

푡_푂푁= − ꢚꢄ_ꢉ푅푇

+

ꢛ × ꢊ_ꢉ푅푇× 퐼푛 ꢜ

ꢝ

ꢙ000

푉_{ꢉ푅푇_퐷ꢅꢂ1}

25

ꢞ.8

= − ꢋ3.6 + _1ꢞꢞꢞꢑ × 0.ꢙ × 퐼푛 ꢋ ꢑ = 0.33ꢟ

[ms]

[Hz]

[%]

2.ꢞ

1

ꢒ

=

= 300

푃푊푀

ꢓ

ꢔꢕ

ꢖ ꢓ

ꢠ.ꢞ ꢖ ꢞ.ꢠꢠ2

ꢔꢗꢗ

ꢓ

ꢞ.ꢠꢠ2

ꢔꢕ

ꢘ_푂푁

=

× ꢙ00 =

ꢔꢗꢗ

× ꢙ00 = ꢙ0.0

ꢓ

ꢔꢕ

ꢖ ꢓ

ꢠ.ꢞ ꢖ ꢞ.ꢠꢠ2

4.4

PWM Dimming Operation Using External Signal

If input the external pulse signal to the CRT pin as shown below, make sure that input pulse signal high voltage ≥

2.2 V and pulse signal low voltage ≤ 0.72 V. Also, open the DISC pin.

V_REG

CRT

CR

TIMER

Control

Logic

μ-Con

V_BG

DISC

GND

In Case External Pulse Signal Input to the CRT Pin

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4. PWM Dimming Operation – continued

4.5

About the Deviation of the CRT Pin Voltage Ramp Up/Down Time Due to Reverse Current Characteristics

of Reverse Connection Protection Diodes

If this IC is used to drive LED as shown below, there is a possibility of the deviation of the CRT pin voltage ramp

up/down time from the settings depends on reverse current characteristics of connected reverse current

protection diodes (D2, D3).

Consider a diode which is recommended by ROHM or a diode which is 1 μA (Max) or less of reverse current

characteristics because reverse current Ir of a diode especially increases at high temperature.

Since reverse current flows even with the recommended diodes, connect a resistor of R_DCINof 10 kΩ or less

between Point A and GND so that the voltage at point A does not rise.

●Mechanism of the deviation of the CRT pin voltage ramp up/down time from the settings.

A) During the PWM dimming mode, Point A on the below figure is in the high impedance (Hi-Z) state.

↓

B) Reverse current Ir of D2 and D3 flow to Point A.

(Power supply voltage is being input into the cathode of D2, so mainly reverse current of D2 flows to C1.)

→Reverse current Ir of D3 is added to the CRT pin charge current and discharge current, so the CRT pin

voltage ramp up/down time deviates from the settings.

↓

C) C1 gets charged, voltage at Point A rises.

↓

D) Point A voltage is the CRT pin voltage of each IC or more.

↓

E) Forward voltage Vf is generated to the diode D3.

↓

F) D3 flows forward current If.

→Forward current If of D3 is added to the CRT pin charge current and discharge current, so the CRT pin

voltage ramp up/down time deviates from the settings.

↓

Repetition of B) to F).

D1

D2

VIN

OUT

BD18326NUF-M

Point A

Ir

D3

CRT

If

GND

R_DCIN

C1

Vf

DISC

Mechanism of the Deviation of the CRT Pin Voltage Ramp Up/Down Time

due to Reverse Connection Protection Diodes

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Description of Blocks – continued

(Unless otherwise specified, Tj = 25 °C, V_IN= 13 V)

5. LED Open Detection

• In case any of Point A to Point C is in the open state

Once the OUT pin voltage V_OUTbecomes more than or equal to LED open detection voltage V_OPD(V_IN- 0.050 V

(Typ)), it can notify the abnormality to the outside by changing the PBUS pin output to low.

• In case any of Point D or Point E is in the open state

Once the ISINK pin voltage becomes 5.80 V (Typ) or more, the ISINK pin current I_ISINKis turned OFF^{(Note 1)}

.

After

that, once the OUT pin voltage V_OUTbecomes more than or equal to LED open detection voltage V_OPD(V_IN- 0.050 V

(Typ)), it can notify the abnormality to the outside by changing the PBUS pin output to low.

(Note 1) While output current bypass function at reduced-voltage (Refer to Description of Function 13) is activated, the LED is lighted because the

output current flows to the two upper side LEDs.

6. Disable LED Open Detection Function at Reduced-Voltage (OPM)

The disable LED open detection function serves to prevent LED open erroneous detection at the reduced-voltage

during the ramp up/down of the VIN pin voltage. Even if the LED is in the open state, LED open is not detected until

the VIN pin voltage becomes more than disable LED open detection voltage at reduced-voltage V_{IN_OPM}(11.0 V (Typ)).

Set V_{IN_OPM}to satisfy the following formula.

푉

> 푉

ꢅ푁_푂푃ꢃ푅푅

ꢅ푁_푂푃푀

(

푉 − 푉_푂푃퐷

ꢅ푁

)

푉

= 푉

× ꢆ +

[V]

ꢅ푁_푂푃ꢃ푅푅

푓_퐿ꢃ퐷_푂푃퐷

where:

푉

is the VIN pin disable LED open detection voltage at reduced-voltage.

is the VIN pin LED open erroneous detection voltage at reduced-voltage.

is the LED Vf at LED open release.

ꢅ푁_푂푃푀

푉

ꢅ푁_푂푃ꢃ푅푅

푉

푓_퐿ꢃ퐷_푂푃퐷

ꢆ

is the number of LED.

푉_푂푃퐷

is the LED open detection voltage.

VIN

Current

Driver

100 mA

+B

to 600 mA

OUT

OPM

Point A

Point B

I_OUT

LED Open

Detection

PBUS

Control

Logic

PBUS

0.050 V

ISINK

Point C

Point D

IISINK

Bypass

Control

LED Open Detection

(ISINK)

Point E

V_{IN_OPM}

V_{IN_OPERR}

VIN

Disable

LED Open

Detection

Area

Disable

LED Open

Detection

Area

V_IN

VOP = VIN - 0.050 V

V_OUT

V_OUT= V_{f_LED}x N

LED Open

Erroneous

Detection

Area

LED Open

Erroneous

Detection

Area

IOUT

I_OUT

4.5 V

V_PBUS

VIN Pin Disable LED Open Detection Voltage at Reduced-Voltage

and LED Open Erroneous Detection Voltage at Reduced-Voltage

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Description of Blocks – continued

(Unless otherwise specified, Tj = 25 °C, V_IN= 13 V)

7. Output Short Circuit Protection (OUT SCP)

Once the OUT pin voltage is less than or equal to the OUT pin short circuit protection voltage V_SCP(0.6 V (Typ)), then

the short circuit protection is activated when SCP delay time t_SCP1(25 μs (Typ)) passes. At that time output current

I_OUTis turned off to prevent the thermal damage of the IC and it can notify the abnormality to the outside by changing

the PBUS pin output to low.

In order to avoid the malfunction when the power is turned on, the short circuit protection is not activated until the CRT

pin voltage is more than 2.0 V (Typ) after UVLO is released.

In addition, in case it is in the output short circuit state (V_OUT< 0.6 V (Typ)) since the power is turned on, the output

short circuit protection is activated when V_CRT> 2.0 V (Typ) condition is reached and t_{IOUT_ON}(40 μs (Typ)) and t_SCP2(85

μs (Typ)) pass, after UVLO is released.

VIN

Current

Driver

100 mA

40 µs Filter

(at Start-Up)

OUT

to 600 mA

SHORT

PBUS

GND

VIN

Control

Logic

PBUS

OUT SCP

1.0 V ⇔1.1 V

25 µs

Filter

85 µs

Filter

0.6 V ⇔0.8 V

Output Short

Circuit State

Output Short

Circuit State

5.25 V

V_IN

2.0 V

V_CRT

0.8 V

ON

0.8 V

0.6 V

V_OUT

ON

40 μs 85 μs

25 μs

OFF

I_OUT

High

Low

VPBUS

Output Short Circuit Protection (OUT SCP)

Current at OUT Pin Short Circuit

7.1

The OUT pin sources the OUT pin short circuit current I_{OUT_SCP}(1.2 mA (Typ)) once its voltage is less than 1.0 V

(Typ) in order to prevent the malfunction of the short circuit protection.

V_IN

1.0 V (Typ)

Current

Driver

V_OUT

100 mA

OUT

to 600 mA

SHORT

0 V

V_IN

OUT SCP

1.2 mA (Typ)

1.0 V ⇔1.1 V

I_{OUT_SCP}

0 mA

Current at OUT Pin Short Circuit

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Description of Blocks – continued

(Unless otherwise specified, Tj = 25 °C, V_IN= 13 V)

8. Caution of Using LED Open Detection and Output Short Circuit Protection

8.1

Connection Method of LEDs to the OUT Pin

Protection functions could be enabled or disabled based on how LEDs are connected to the OUT pin.

OUT

・・・

1 string

in series

2 or more

strings in parallel

2 or more strings in parallel

Matrix connection

Connection Method of LEDs

Connection Method

1 string in series

Output Short Circuit Protection

Detectable

LED Open Detection

Detectable

2 or more strings in parallel

Detectable

Not detectable^{(Note 1)}

2 or more strings in parallel

(Matrix connection)

Detectable

Not detectable ^{(Note 2)}

(Note 1) Detectable only when 1 or more LEDs are open in all strings.

(Note 2) Detectable only when all LEDs from any string are open.

8.2

The Enable Zone of LED Open Detection and Output Short Circuit Protection, and Hi-Z Zone of the OUT

The enable zone of LED open detection and output short circuit protection is different between DC mode and

PWM dimming mode.

DC mode

PWM dimming mode

: LED open detection and output short circuit protection are enable in all zone.

: LED open detection is enable in only CRT ramp down zone.

Output short circuit protection is enable in all zone.

There is a zone which the OUT pin becomes Hi-Z at PWM dimming mode. During this time noise^{(Note 3)}may

affect the decrease of the OUT pin voltage and cause malfunction of output short circuit protection. To prevent

this, consider measurements such as connecting a capacitor C_OUT^(Note4)between the OUT pin and GND nearby

IC. (Recommended value by ROHM: C_OUT= 0.1 μF GCM188L81H104KA42 murata)

(Note 3) Conducted noise, Radiated noise, Crosstalk of wiring and connecter etc.

(Note 4) In case connecting a capacitor with 0.1 μF or more, do evaluation of a delay time from the power-on of V_INuntil output current I_OUTflows

and pulse width of output current I_OUTat PWM dimming mode. (Refer to example of evaluation: Description of Blocks 8.3)

[DC Mode]

[PWM Dimming Mode]

V_CRT

V_OUT

IOUT

0 V

V_OUT

0 V

IOUT

0 mA

OUT pin Hi-Z

Zone

OUT pin Hi-Z

Zone

None

Hi-Z

LED Open

Detection

LED Open

Detection

Enable

Output Short

Circuit Protection

Output Short

Circuit Protection

Enable

The Enable Zone of LED Open Detection, Output Short Circuit Protection,

and Hi-Z Zone of the OUT Pin

OUT

C_OUT

BD18326NUF-M

Capacitor Connected to the OUT Pin

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8. Caution of Using LED Open Detection and Output Short Circuit Protection – continued

8.3

Evaluation Example of PWM Dimming I_OUTPulse Width

Evaluation condition: V_IN= 13 V, Tj = 25 °C, 3 White LEDs in series, PWM ON Duty = 3.2 %, Pulse width = 0.105

ms, PWM Frequency = 300 Hz

C_OUT= 0.10 μF

C_OUT= 0.47 μF

V_CRT

1.0 V / div

LED Anode

2.0 V / div

LED Anode

2.0 V / div

I_OUT= 100 mA

I_OUT= 240 mA

I_OUT= 400 mA

I_OUT= 600 mA

I_OUT

200 mA / div

I_OUT

200 mA / div

50 μs / div

V_CRT

1.0 V / div

V_CRT

1.0 V / div

LED Anode

2.0 V / div

LED Anode

2.0 V / div

I_OUT

200 mA / div

I_OUT

200 mA / div

50 μs / div

V_CRT

1.0 V / div

V_CRT

1.0 V / div

LED Anode

2.0 V / div

LED Anode

2.0 V / div

I_OUT

200 mA / div

I_OUT

200 mA / div

50 μs / div

V_CRT

1.0 V / div

V_CRT

1.0 V / div

LED Anode

2.0 V / div

LED Anode

2.0 V / div

I_OUT

200 mA / div

I_OUT

200 mA / div

50 μs / div

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8. Caution of Using LED Open Detection and Output Short Circuit Protection – continued

8.4

Maximum Capacitance Value Connected to the OUT Pin (C_OUT)

When the capacitance connected to the OUT pin is above the recommended range (1.0 μF or more), the delay

time of output rise time could be in around hundreds of microseconds. Below are examples of evaluation data

for reference.

Measurement conditions: V_IN= 13 V, Tj = 25 °C, DC mode, 3 LEDs in series

C_OUT= 0.10 μF

C_OUT= 0.47 μF

V_IN

10 V / div

V_PBUS

10 V / div

I_OUT

200 mA / div

I_OUT

200 mA / div

200 μs / div

C_OUT= 1.00 μF

C_OUT= 10.00 μF

V_IN

10 V / div

V_PBUS

10 V / div

I_OUT

200 mA / div

I_OUT

200 mA / div

200 μs / div

Capacitor Connected to the OUT Pin

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BD18326NUF-M

Description of Blocks – continued

(Unless otherwise specified, Tj = 25 °C, V_IN= 13 V)

9. Thermal De-rating Function (THD)

It is possible to reduce the output current I_OUTat high temperature and suppress the degradation of the LED by

connecting a thermistor to the THD pin. Once the THD pin voltage is less than or equal to thermal de-rating start

voltage V_THDS(0.8 V (Typ)), the output current I_OUTis reduced according to the THD pin voltage.

Open the THD pin when not using thermal de-rating function.

In case variation of the THD pin voltage is steep, take measures such as connecting a capacitor to the THD pin to

prevent the output current chattering. In addition, evaluate I_OUTwaveform on actual board because the output

amplifier may not follow the steep variation.

The thermal de-rating function can be set by the following formula.

푉_푇퐻퐷= 퐼_푇퐻퐷× ꢄ_푁푇ꢉ

[V]

ꢁ_ꢂꢃ푇

ꢄ_ꢂꢃ푇

푉_푇퐻퐷

(

)

=

퐼_푂푈푇푉_푇퐻퐷≤ 0.ꢡ 푉

×

푉

ꢂꢃ푇

Where:

퐼_푇퐻퐷

ꢄ_푁푇ꢉ

퐼_푂푈푇

푉_푇퐻퐷

is the THD pin source current, 200 μA (Typ).

is the resistance of NTC thermistor.

is the output current.

is the THD pin voltage.

푉

ꢂꢃ푇

is the SET pin voltage, 0.8 V (Typ).

VIN

I_OUT

100 %

+B

Current

Driver

100 mA

I_OUT

OUT

to 600 mA

VREG

50 %

ITHD

THD

R_NTC

Current

Setting

0.4

0.8

GND

SET

V_THD[V]

Thermal De-rating Function

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BD18326NUF-M

Description of Blocks – continued

(Unless otherwise specified, Tj = 25 °C, V_IN= 13 V)

10. Over Voltage Mute Function (OVM)

Once the VIN pin voltage V_INis over voltage mute start voltage V_OVMS17.4 V (Typ) or more, the over voltage mute

function is activated to decrease the output current I_OUTin order to suppress the heat generation from the IC.

The output current I_OUTwill decay at -20 %/V (Typ).

IOUT

VIN

17.4 V (Typ)

+B

Current

Driver

100 mA

100 %

OVM

OUT

to 600 mA

-20 %/V (Typ)

I_OUT

Current

Setting

GND

SET

0

V_OVMS

V_IN

Over Voltage Mute Function (OVM)

11. Under Voltage Lock Out (UVLO)

UVLO is a protection circuit to prevent malfunction of the IC when the power is turned on or when the power is

suddenly shut off. When the VIN pin voltage V_INis 4.50 V (Typ) or less, the output current I_OUTis turned OFF, and

when the VIN pin voltage V_INincreases to 6.05 V (Typ) or more, normal operation starts.

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BD18326NUF-M

Description of Blocks – continued

(Unless otherwise specified, Tj = 25 °C, V_IN= 13 V)

12. Output for Fault Flag / Input for Output Current OFF Control Signal (PBUS)

When abnormality such as LED open or output short circuit occurs, it can notify the abnormality to the outside by

changing the PBUS pin output from high to low. In addition, by externally controlling the PBUS pin from high to low,

the output current I_OUTis turned off. When using multiple ICs to drive multiple LED strings, it is possible to turn off all

LED strings at once by connecting the PBUS pins of each CH as shown in the figure below, even if LED open or output

short circuit occurs.

Caution of Using the PBUS Pin

Do not connect to the PBUS pins other than below list items due to the difference of ratings, internal threshold voltages,

and so on.

(BD18340FV-M, BD18341FV-M, BD18342FV-M, BD18343FV-M, BD18345EFV-M, BD18337EFV-M, BD18347EFV-M)

VIN

OUT

VIN

OUT

CH1

CH2

PBUS

LED

OFF

OPEN

GND

Mutual Communication via PBUS Line

PBUS Function

12.1

Example of Protective Operation Due to LED Open

A) CH1 LED

Open

CH1 V_OUT

ON

CH1 I_OUT

OFF

B) VPBUS: High→Low

V_PBUS

The OUT pin of CH2 is clampled

to 1.4 V at PBUS is low.

ON

CH2 V_OUT

1.4 V

ON

CH2 I_OUT

OFF

Example of Protective Operation

When CH1 is the LED open state, the PBUS pin of CH1 is changed from High to Low output. As the PBUS pin

becomes Low, LED driver of CH2 turns OFF its output current. The OUT pin voltage is clamped to 1.4 V (Typ) during

the OFF period, in order to prevent malfunction of output short circuit.

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BD18326NUF-M

Description of Blocks – continued

(Unless otherwise specified, Tj = 25 °C, V_IN= 13 V)

13. Current Bypass Function at Reduced-Voltage

The BD18326NUF-M is built-in current bypass function at reduced-voltage.

When the V_{IN_DIV}which is the resistor divider of the VIN pin voltage V_INis more than the BPCNT reference voltage V_BP

(2.0 V (Typ)), the ISINK pin sink current I_ISINKdecreases. The output current I_OUTchanges linearly.

The ISINK pin sink current I_ISINKcan be set by the following formula.

퐾

푆ꢏꢕꢢ

퐼_{ꢅꢂꢅ푁퐾}

=

+ 퐺_ꢂꢅ푁퐾× 퐼_{퐵푃ꢉ푁푇}÷ ꢙ0^ꢠ

[mA]

− 푉_퐵푃} × ꢙ0^ꢠ≥ 0 [μA]

[mA]

푅

푆퐸ꢀ

(

)

ꢏꢕ

1

푅

×

푅

× ꢇ

ꢖ 푅

× ꢇ

ꢣꢤꢦ

ꢣꢤꢐ

ꢣꢤ

ꢣꢤꢥ

퐼_{퐵푃ꢉ푁푇}

=

{

(

× 푅

ꢣꢤꢥ

)

ꢣꢤꢦ

푅

× 푅

ꢖ 푅

ꢣꢤꢥ

ꢣꢤꢐ

ꢣꢤꢦ

ꢣꢤꢐ

퐾

푆ꢏꢕꢢ

퐼_{ꢅꢂꢅ푁퐾_푀퐴푋}

=

푅

푆퐸ꢀ

Where:

ꢁ_ꢂꢅ푁퐾

ꢄ_ꢂꢃ푇

퐺_ꢂꢅ푁퐾

퐼_{퐵푃ꢉ푁푇}

ꢄ_퐵푃1

is the ISINK current setting coefficient,

is the output current setting resistor,

is the ISINK current gain,

3000 (Typ).

[kΩ]

-7300 (Typ).

[μA]

is the BPCNT pin input current,

is the resistor for setting current bypass 1, [kΩ]

is the resistor for setting current bypass 2, [kΩ]

is the resistor for setting current bypass 3, [kΩ]

ꢄ_퐵푃2

ꢄ_퐵푃ꢠ

푉_퐵푃

퐼_{ꢅꢂꢅ푁퐾_푀퐴푋}

is the BPCNT reference voltage,

is the ISINK pin maximum sink current,

2.00 V (Typ)

[mA]

V_IN

V_{IN_DIV}

VBP (2.00 V)

VIN

I_OUT

Current

Driver

100 mA

OUT

+B

to 600 mA

I_BPCNT

IOUT

BPCNT

R_BP3

R_BP1

R_BP2

I_{ISINK_MAX}

ISET

ISINK

I_ISINK

IISINK = IOUT

K_SINK

R_SET

I_OUTA

+

- G_SINKx I_BPCNT

KSINK

G_SINK

V

BP

I_ISINK

V_{IN_DIV}

-

I_OUTA

Current Bypass Function at Reduced-Voltage

When not using the current bypass function at reduced-voltage, the ISINK pin is connected to the GND and the

BPCNT pin is connected with pull-down resistor or to the GND.

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BD18326NUF-M

Description of Blocks – continued

(Unless otherwise specified, Tj = 25 °C, V_IN= 13 V)

14. ISINK Pin Sink Current On Delay Time at Power On

Once UVLO is released and the CRT pin voltage is V_{CRT_DIS1}(2.0 V (Typ)) or more, the ISINK pin sink current is OFF

until the ISINK Pin Sink Current On Delay Time at Power On t_{ISINKON_VINRISE}(40 μs (Typ)) elapses. At this time, the

ISINK Pin LED Open Monitor Current I_{OPISINK_MONI}is sourced from the ISINK pin to monitor the status of the ISINK pin.

If the LED connected between the ISINK pin and GND is open, it is detected that the ISINK pin voltage V_ISINKis

exceeded the ISINK Pin LED Open Detection Voltage V_OPISINKD(5.80 V (Typ)), and the ISINK pin sink current continues

to be OFF.

Set the external parts connected to the ISINK pin to satisfy the following formula.

ꢅ

ꢖ ꢓ

ꢏ푆ꢏꢕꢢꢔꢕ_ꢨꢏꢕꢈꢏ푆퐸

ꢔꢤ푆ꢏꢕꢢ_ꢧꢔꢕꢏ

푉_{푂푃ꢅꢂꢅ푁퐾퐷}

<

[V]

ꢉ

ꢩ퐸ꢎ

ꢖ ꢉ

ꢏ푆ꢏꢕꢢ

푉_{푂푃ꢅꢂꢅ푁퐾퐷}

퐼_{푂푃ꢅꢂꢅ푁퐾_푀푂푁ꢅ}

푡_{ꢅꢂꢅ푁퐾푂푁_ꢇꢅ푁푅ꢅꢂꢃ}

ꢊ_퐿ꢃ퐷

is the ISINK pin LED open detection voltage,

is the ISINK pin LED open monitor current,

is the ISINK pin sink current on delay time at power on,

is the LED parasitic capacitance,

5.80 V (Typ)

1.3 mA (Typ)

40 μs (Typ)

[nF]

ꢊ_{ꢅꢂꢅ푁퐾}

the capacitor connecting the ISINK pin,

[nF]

V_IN

OUT

VINUVLO Signal

LED ON Signal

V_IN

SW

ISINK

CLED

Delay Circuit

at Power On

Control

Logic

VOPISINKD

C_ISINK

ISINK Pin

Current Sink Circuit

VINUVLO

Release

VINUVLO

Detection

(VIN > VUVLOR)

(V_IN< V_UVLOD)

V_IN

(=V_CRT

)

t_{ISINKON_VINRISE}

VIN

V_{OPISINK D}

V_ISINK

V_OPISINKR

1.3mA (Typ)

I_OPISINK

OFF

_MONI

SW

OFF

ON

OFF

IISINK

OFF

ISINK Current

Sink Circuit

Forced

OFF

ISINK Pin Sink Current On Delay Time at Power On

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BD18326NUF-M

Description of Blocks – continued

(Unless otherwise specified, Tj = 25 °C, V_IN= 13 V)

15. Output Current Rise/Fall Time Fixed Function

The BD18326NUF-M has built-in output current rise/fall time fixed function.

It can suppress the noise generated to the power supply line by fixing the output current rise/fall time to 20 μs (Typ).

V_CRT

I_OUT

20 μs 20 μs

Output Current Rise/Fall Time Fixed Function

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BD18326NUF-M

Absolute Maximum Ratings (Ta = 25 °C)

No.

Parameter

Symbol

V_IN

Rating

-0.3 to +42.0

-0.3 to VIN+0.3 < +42.0

-0.3 to +20.0

-0.3 to +7.0

Unit

V

A-1 VIN Pin Voltage

A-2 CRT, DISC Pin Voltage

V_CRT, V_DISC

V_OUT

V

OUT Pin Voltage

V

A-3

A-4

PBUS, BPCNT, ISINK Pin

Voltage

V_PBUS, V_BPCNT, V_ISINK

V_SET, V_THD

Tstg

V

A-5 SET, THD Pin Voltage

V

A-6 Storage Temperature Range

-55 to +150

°C

Maximum Junction Temperature

Tjmax

150

A-7

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing

board size and copper area so as not to exceed the maximum junction temperature rating.

Thermal Resistance ^{(Note 1)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 3)}

2s2p^{(Note 4)}

VSON10FV3030

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

158.00

23.00

46.00

12.00

°C/W

Ψ_JT

(Note 1) Based on JESD51-2A (Still-Air).

(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 3) Using a PCB board based on JESD51-3.

(Note 4) Using a PCB board based on JESD51-5, 7.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3 mm x 76.2 mm x 1.57 mmt

Top

Copper Pattern

Thickness

70 μm

Footprints and Traces

Thermal Via^{(Note 5)}

Layer Number of

Measurement Board

Material

FR-4

Board Size

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

Pitch

Diameter

4 Layers

1.20 mm

Φ0.30 mm

Top

Copper Pattern

Bottom

Thickness

70 μm

Copper Pattern

Thickness

35 μm

Copper Pattern

Thickness

70 μm

Footprints and Traces

74.2 mm x 74.2 mm

(Note 5) This thermal via connects with the copper pattern of all layers.

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Recommended Operating Conditions

No.

Parameter

Symbol

V_IN

Min

5.5

Typ

Max

20.0

Unit

V

O-1 Supply Voltage^{(Note 1) (Note 2)}

13.0

OUT Pin Maximum Output Current

(DC)

O-2

I_OUT(DC)

I_OUT(50%DUTY)

f_PWM

-

400

600

750

-

mA

Hz

µs

OUT Pin Maximum Output Current

(ON Duty: 50 %)

-

O-3

O-4 PWM Dimming Frequency

200

50

-40

O-5 PWM Minimum Pulse Width ^{(Note 3)}

t_MIN

Operating Temperature

Topr

+150

°C

O-6

(Note 1) ASO should not be exceeded.

(Note 2) At start up, apply 6.5 V or more once. The value is the voltage range after applying 6.5 V or more once.

(Note 3) It is the same as when the pulse input to the CRT pin.

External Parts Setting Range

No.

Parameter

Symbol

C_{VIN_DC}

Min

Typ

-

Max

-

Unit

μF

Capacitor Connecting The VIN Pin

at Operating DC Mode Only^{(Note 3)}

P-1

0.47

Capacitor Connecting The VIN Pin

at Operating PWM Mode^{(Note 3)}

P-2

C_{VIN_PWM}

1.0

-

μF

Capacitor

P-3 Connecting The OUT Pin^{(Note 4)}

(I_LED< 400 mA)

C_{OUT U400}

1.0

Capacitor

P-4 Connecting The OUT Pin^{(Note 4)}

(I_LED≥ 400 mA)

C_{OUT O400}

0.1

-

1.0

μF

nF

Capacitor

P-5

C_ISINK

Connecting The ISINK Pin

P-6 Capacitor for Setting CR Timer

C_CRT

R_CRT

R_SET

R_DCIN

R_BP1

R_BP2

R_BP3

0.047

0.1

0.100

0.220

50.0

24.0

10

μF

kΩ

Resistor for Setting CR Timer

-

P-7

P-8

Resistor for Setting Output Current

4.0

P-9 Resistor for DCIN Pull-down

P-10 Resistor for Setting BPCNT 1

-

10.5

3.3

100.0

30.0

96.50

Resistor for Setting BPCNT 2

Resistor for Setting BPCNT 3

P-11

P-12

0.24

(Note 3) Connect C_{VIN_DC}or C_{VIN_PWM}within 10 mm from the IC. If they are connected more than 10 mm from the IC, there is a possibility of unstable operation

such as oscillation of output current I_OUTetc. So consider with enough evaluation on actual board

(Note 4) If a long wire connects from the OUT pin to the LED anode, there is a possibility of output current I_OUToscillation.

After consideration with enough evaluation, connect a capacitor connecting to the OUT pin C_OUTbetween the OUT pin and GND to prevent oscillation.

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BD18326NUF-M

Electrical Characteristics

(Unless otherwise specified Tj = -40 °C to +150 °C, V_IN= 13 V)

Limit

Typ

No.

Parameter

Symbol

Unit

Conditions

Min

Max

Circuit Current

VIN Pin Circuit Current

at Normal Mode

E-1

E-2

E-3

I_VIN1

I_VIN2

I_VIN3

-

2.6

2.4

2.7

5.0

mA

R_SET= 24 kΩ

VIN Pin Circuit Current

at LED Open Detection

V_OUT= Open

R_SET= 24 kΩ

VIN Pin Circuit Current

at PBUS = Low

V_PBUS= 0 V

R_SET= 24 kΩ

Output Current

VOUT = 2.0 V

VCRT = 0 V, Tj = 25 °C

E-4 OUT OFF Current

I_{OUT_OFF}

V_DR1

-

1.0

0.92

1.03

1.25

30

μA

V

Drop Voltage

E-5

Tj = -40 °C

I_OUT= 600 mA

Between VIN Pin and OUT Pin 1

Drop Voltage

Between VIN Pin and OUT Pin 2

Tj = +25 °C

I_OUT= 600 mA

E-6

E-7

V_DR2

-

V

Drop Voltage

Between VIN Pin and OUT Pin 3

Tj = +150 °C

I_OUT= 600 mA

V_DR3

-

V

I_OUT= 20 %→80 %

R_SET= 10 kΩ

E-8 Output Current Rise Time

E-9 Output Current Fall Time

I_{OUT_RISE}

I_{OUT_FALL}

ΔI_RISEFALL

10

-5

20

0

µs

I_OUT= 80 %→20 %

R_SET= 10 kΩ

30

The Difference Between Output

E-10

5

R_SET= 10 kΩ

Current Rise Time and Fall Time

LED Open Detection

OUT Pin

E-11

V_IN

- 0.080

V_IN

- 0.050

V_IN

- 0.020

V_OPD

V

LED Open Detection Voltage

ISINK Pin

E-12

V_OPISINKR

V_OPISINKD

4.35

5.50

0.65

10.5

4.60

5.80

1.50

11.0

4.85

6.10

2.50

11.5

V_ISINK: Sweep down

V_ISINK: Sweep up

V_IN= 6.5V, V_ISINK= 6.2V

V_IN

LED Open Release Voltage

ISINK Pin

E-13

V

LED Open Detection Voltage

ISINK Pin

E-14

I_OPISINK

_MONI

mA

V

LED Open Monitor Current

Release Voltage for Function to

E-15

V_{IN_OPM}

Disable LED Open Detection

Output Short Circuit Protection (OUT SCP)

E-16 Current at OUT Pin Short Circuit

I_{OUT_SCP}

V_SCP

0.2

0.5

0.7

0.9

10

-

1.2

0.6

0.8

1.0

25

2.0

0.7

0.9

1.2

50

-

mA

V

OUT Pin Short Circuit Protection

Voltage

E-17

OUT Pin Short Circuit Protection

Release Voltage

E-18

V_SCPR

V_ISCPON

t_SCP1

V

Current ON Voltage at OUT Pin

Short Circuit

E-19

V

E-20 SCP Delay Time

µs

E-21 SCP Disable Time at Power On

t_SCP2

85

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Electrical Characteristics – continued

(Unless otherwise specified Tj = -40 °C to +150 °C, V_IN= 13 V)

Limit

Typ

No.

Parameter

Symbol

Unit

Conditions

Min

Max

Output Current Setting

R_SET

4 kΩ

=

Tj =

-40 °C

2280

2400

2520

to 10 kΩ

to +150 °C

2256

2232

2400

2544

2568

Tj = 25 °C

R_SET

10 kΩ

to 20 kΩ

=

Tj = 150 °C

E-22 Output Current Setting Coefficient

K_SET

-

Tj =

2160

2400

2640

-40 °C

to +150 °C

Tj =

-40 °C

to +150 °C

R_SET

20 kΩ

to 24 kΩ

=

Reference Voltage

E-23

V_{SET_REF}

I_{SET_SH}

0.72

0.24

0.80

0.50

0.88

1.20

V

V_SET

for Output Current Setting

SET Pin Short Circuit Protection

E-24

mA

Threshold Current

VIN = 0 V→13 V

t_{IOUT_ON}

t_IOUT(80 %) –

t_IOUT(@V_IN= V_UVLOR

R_SET= 24 kΩ

=

Output Current On Delay Time at

Power On

E-25

t_{IOUT_ON}

-

40

100

µs

)

Thermal De-Rating (THD)

E-26 THD Pin Source Current

I_THD

193

0.76

203

0.80

213

0.84

μA

V

E-27 Thermal De-Rating Start Voltage

E-28 Thermal De-Rating Gain

V_THDS

V_THD

ΔI_OUT/ ΔV_THD

V_THD: 0.667 V→0.333 V

V_IN= 13 V

G_THD

-131.3 -125.0 -118.7

%/V

CR Timer for PWM Dimming

E-29 CRT Pin Charge Current

I_CRT

36

0.72

1.80

2.10

28.5

0.38

10

40

0.80

2.00

2.40

30.0

0.40

25

44

0.88

2.20

3.00

31.5

0.42

80

μA

V

E-30 CRT Pin Charge Voltage

V_{CRT_CHA}

V_{CRT_DIS1}

V_{CRT_DIS2}

R_CHA

CRT Pin

E-31

V

Discharge Voltage 1

CRT Pin

E-32

V_CRT> V_{CRT_DIS2}

R_D1→R_D2

V

Discharge Voltage 2

CRT Pin

E-33

kΩ

V/V

Ω

Charge Resistance

V_{CRT_CHA}

V_{CRT_DIS1}

/

E-34 CRT Discharge Constant

E-35 DISC Pin ON Resistance 1

E-36 DISC Pin ON Resistance 2

E-37 CRT Pin Leakage Current

R_DISC1

R_DISC2

I_DISC= 10 mA

I_DISC= 100 μA

V_CRT= V_IN

2.5

5

10

kΩ

μA

I_{CRT_LEAK}

-

10

Over Voltage Mute Function (OVM)

ΔI_OUT= -3 %

ΔI_OUT

=

E-38 Over Voltage Mute Start Voltage

V_OVMS

16.0

-

17.4

-20

18.8

-

V

I_OUT(@V_IN= V_OVM) /

I_OUT(@V_IN= 13 V) -1

ΔI_OUT/ ΔV_IN

V_THD> 1.5 V

E-39 Over Voltage Mute Gain

G_OVM

%/V

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BD18326NUF-M

Electrical Characteristics – continued

(Unless otherwise specified Tj = -40 °C to +150 °C, V_IN= 13 V)

Limit

Typ

No.

Parameter

Symbol

Unit

Conditions

Min

Max

Output for Fault Flag / Input for Output Current OFF Control Signal (PBUS)

E-40 Input High Voltage

V_PBUSH

V_PBUSL

2.4

-

V

E-41 Input Low Voltage

0.6

300

0.6

5.5

10

E-42 PBUS Pin Source Current

E-43 PBUS Pin Output Low Voltage

E-44 PBUS Pin Output High Voltage

I_PBUS

75

-

150

-

μA

V

V_PBUS= 0 V

V_{PBUS_OL}

V_{PBUS_OH}

I_{PBUS_LEAK}

I_{PBUS_EXT}= 3 mA

I_{PBUS_EXT}= -10 μA

V_PBUS= 5 V

3.5

-

4.5

-

V

E-45 PBUS Pin Leakage Current

Under Voltage Lock Out (UVLO)

E-46 UVLO VIN Detection Voltage

μA

V_UVLOD

V_UVLOR

V_HYS

4.25

5.75

-

4.50

6.05

1.55

4.75

6.35

-

V

V_IN: Sweep down

V_IN: Sweep up

E-47 UVLO VIN Release Voltage

E-48 UVLO VIN Hysteresis Voltage

Current Bypass Function at Reduced-Voltage

1.94

2.00

2.06

E-49 BPCNT Reference Voltage

V_BP

V

I_BPCNT= 10 μA

I_BPCNT= 0 μA

K_SINK= I_SINKx R_SET

R_SET= 24 kΩ

ISINK Current Setting

2790

3000

3210

E-50

K_SINK

Coefficient

G_SINK

=

{I_ISINK1(@I_BPCNT= 5 μA) -

I_ISINK2(@I_BPCNT= 10 μA)} /

5 μA

-7447 -7230 -7013

E-51 ISINK Current Gain

G_SINK

-

R_SET= 24 kΩ

Voltage

Tj = -40 °C

I_ISINK= 600 mA

E-52

V_DRIS1

V_DRIS2

V_DRIS3

-

0.88

1.00

1.25

V

Between ISINK Pin and GND 1

Voltage

Tj = +25 °C

I_ISINK= 600 mA

E-53

Between ISINK Pin and GND 2

Voltage

Tj = +150 °C

E-54

Between ISINK Pin and GND 3

IISINK = 600 mA

V_ISINK= 2.0V,

V_IN> V_INUVLOR,

V_CRT> V_{CRT_DIS1}

→ I_SINK:ON

ISINK Pin Sink Current On

E-55

t_ISINKON

_VINRISE

20

40

-

μs

Delay Time at Power On

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Typical Performance Curves (Reference Data)

(Unless otherwise specified Tj = 25 °C, V_IN= 13 V)

5.0

800

700

600

500

400

300

200

100

0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

0

2

4

6

8

10 12 14 16 18 20

4

6

8

10 12 14 16 18 20 22 24

Supply Voltage: V [V]

IN

Resistor for Setting Output Current:R_SET[kΩ]

Figure 1. VIN Pin Circuit Current at Normal Mode

vs Supply Voltage

Figure 2. Output Current

vs Resistor for Setting Output Current

600

5.0

4.0

500

400

300

200

100

0

I_OUT= 100 mA

3.0

I_OUT= 240 mA

I_OUT= 400 mA

2.0

1.0

0.0

-1.0

-2.0

-3.0

-4.0

-5.0

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

0.0

0.2

0.4

0.6

0.8

1.0

1.2

-50 -25

0

25 50 75 100 125 150

Temperature [°C]

Drop Voltage between VIN Pin and OUT Pin:

V_DR1to V_DR3[V]

Figure 3. Output Current Accuracy vs Temperature

Figure 4. Output Current

vs Drop Voltage between VIN Pin and OUT Pin

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Typical Performance Curves (Reference Data) – continued

(Unless otherwise specified Tj = 25 °C, V_IN= 13 V)

500

400

300

200

100

0

R_SET= 6 kΩ

400

300

R_SET= 10 kΩ

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

200

R_SET= 24 kΩ

100

0

2

4

6

8

10 12 14 16 18 20

0

2

4

6

8

10 12 14 16 18 20

Supply Voltage: V [V]

IN

Figure 5. Output Current vs Supply Voltage

Figure 6. Output Current vs Supply Voltage

42.0

210

205

200

195

190

41.5

41.0

40.5

40.0

39.5

39.0

38.5

38.0

-50 -25

0

25 50 75 100 125 150

Temperature [°C]

-50 -25

0

25 50 75 100 125 150

Temperature [°C]

Figure 7. CRT Pin Charge Current vs Temperature

Figure 8. THD Pin Source Current vs Temperature

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Typical Performance Curves (Reference Data) – continued

(Unless otherwise specified Tj = 25 °C, V_IN= 13 V)

600

500

400

300

200

100

0

800

700

600

500

400

300

200

100

0

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

0.0

0.2

0.4

0.6

0.8

1.0

1.2

4

6

8

10 12 14 16 18 20 22 24

Voltage between ISINK Pin and GND:

V_DRIS1to V_DRIS3[V]

ResistorforSetting Output Current:R_SET[kΩ]

Figure 9. ISINK Pin Sink Current

vs Resistor for Setting Output Current

Figure 10. ISINK Pin Sink Current

vs Voltage between ISINK Pin and GND

150

125

100

75

Tj = -40 °C

Tj = +25 °C

Tj = +150 °C

50

25

0

5

10

15

20

25

30

BPCNT Pin Input Current:I_BPCNT[μA]

Figure 11. ISINK Pin Sink Current

vs BPCNT Pin Input Current

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Timing Chart

PWM Dimming Mode

DC Mode

LED

Current

OUTPUT

GND

LED

Current

OUTPUT

GND

LED

OPEN

ISET

LED

ISET

SHORT Bypass

Current

De-rating

SHORT

OPEN

De-rating

SHORT

13

V

V_IN

V_CRT

V_THD

V_OUT

V_PBUS

I_OUT

6.05 V

4.50

V

13 V

0.667 V

40 μs

V

IN

- 0.050 V

V_IN- 0.050 V

0.8

V

0.6

V

0.8

V

0.6

V

20 μs

I_ISINK

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Application Examples

1. I_OUT= 200 mA, 3 White LEDs in Series, Unused Thermal De-rating Function

SW

D1

OUT

VIN

Z_D

C_VIN

+B

U1

BD18326NUF-M

CR

ISINK

DISC

THD

SET

GND

R_BP1

PBUS

BPCNT

R_SET

R_BP3

R_BP2

Recommended Parts List 1

Parts

IC

No

U1

D1

Parts Name

Value

UNIT

Product Maker

ROHM

BD18326NUF-M

RFN2LAM6STF

-

ROHM

Diode

NIPPON

CHEMICON

Z_D

TND12H-220KB00AAA0

-

Resistor

R_SET

C_VIN

MCR03EZPFX1202

12

kΩ

μF

ROHM

murata

Capacitor

GCM31CL81H105KA40

1.0

Caution: About Z_D, mount according to test standard of battery line.

2. I_OUT= 387 mA, 3 White LEDs in Series, Thermal De-rating Function

SW

D1

OUT

VIN

CR

Z_D

C_VIN

+B

U1

BD18326NUF-M

ISINK

DISC

THD

SET

GND

R_BP1

PBUS

BPCNT

NTC

R_SET

R_BP3

R_BP2

Recommended Parts List 2

Parts

IC

No

U1

D1

Parts Name

Value

UNIT

Product Maker

ROHM

BD18326NUF-M

RFN2LAM6STF

-

ROHM

Diode

NIPPON

CHEMICON

Z_D

TND12H-220KB00AAA0

-

Resistor

Thermistor

Capacitor

R_SET

NTC

C_VIN

MCR03EZPFX6201

6.2

150

1.0

kΩ

μF

ROHM

TDK

NTCG104LH154JTDS

GCM31CL81H105KA40

murata

Caution: About Z_D, mount according to test standard of battery line.

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Application Examples – continued

3. I_OUT= 387 mA, 3 White LEDs in Series, PWM ON Duty = 10 %, Pulse Width = 0.334 ms, PWM Frequency = 300 Hz

PWM

SW

D1

D2

OUT

VIN

Z_D

C_VIN

U1

DC

SW

BD18326NUF-M

D3

CR

ISINK

R_DCINC_CRT

R_CRT

+B

DISC

THD

SET

GND

R_BP1

PBUS

BPCNT

NTC

R_SET

R_BP3

R_BP2

Recommended Parts List 3

Parts

IC

No

U1

D1

D2

D3

Parts Name

Value

UNIT

Product Maker

BD18326NUF-M

RFN2LAM6STF

-

ROHM

Diode

NIPPON

CHEMICON

Z_D

TND12H-220KB00AAA0

-

R_SET

R_CRT

R_DCIN

NTC

C_VIN

MCR03EZPFX6201

MCR03EZPFX3601

MCR03EZPFX3902

NTCG104LH154JTDS

GCM31CL81H105KA40

GCM188L81H104KA42

6.2

3.6

39

kΩ

μF

ROHM

TDK

Resistor

Thermistor

Capacitor

150

1.0

0.1

murata

C_CRT

Caution: About Z_D, mount according to test standard of battery line.

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I/O Equivalence Circuits

No.

Name

Equivalence Circuit

No.

Equivalence Circuit

Name

BPCNT

(Pin 2)

THD

(Pin 6)

2

3

4

5

BPCNT

PBUS

CRT

6

THD

GND

(Pin 8)

GND

(Pin 8)

PBUS

(Pin 3)

SET

(Pin 7)

10 Ω

7

SET

(Typ)

GND

(Pin 8)

GND

(Pin 8)

VIN

(Pin 1)

CRT

(Pin 4)

ISINK

(Pin 9)

9

ISINK

GND

(Pin 8)

GND

(Pin 8)

VIN

(Pin 1)

DISC

(Pin 5)

OUT

(Pin 10)

DISC

10

OUT

5 kΩ

(Typ)

5.2V

(Typ)

GND

(Pin 8)

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Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3.

4.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

6.

Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and

routing of connections.

7.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

8.

9.

Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

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Operational Notes – continued

10. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 12. Example of Monolithic IC Structure

11. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

12. Thermal Shutdown Circuit (TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

13. Functional Safety

“ISO 26262 Process Compliant to Support ASIL-*”

A product that has been developed based on an ISO 26262 design process compliant to the ASIL level described in

the datasheet.

“Safety Mechanism is Implemented to Support Functional Safety (ASIL-*)”

A product that has implemented safety mechanism to meet ASIL level requirements described in the datasheet.

“Functional Safety Supportive Automotive Products”

A product that has been developed for automotive use and is capable of supporting safety analysis with regard to

the functional safety.

Note: “ASIL-*” is stands for the ratings of “ASIL-A”, “-B”, “-C” or “-D” specified by each product's datasheet.

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BD18326NUF-M

Ordering Information

B D 1 8 3 2 6 N U F

-

M E 2

Package

Product Rank

NUF:

VSON10FV3030

M: for Automotive

Packaging Specification

E2: Embossed tape and reel

Marking Diagram

VSON10FV3030 (TOP VIEW)

Part Number Marking

D 1 8

3 2 6

LOT Number

Pin 1 Mark

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Revision History

Date

Revision

001

Changes

New Release

28.Sep.2020

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

,

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.004


型号：	BD18326NUF-M
厂家：	ROHM
描述：	BD18326NUF-M是面向车载LED灯的40V高耐压恒流驱动器IC。使用小型封装，适合用作插座型LED灯的驱动用IC。BD18326NUF-M内置温度降额功能、LED开路检测、输出短路保护、SET端子短路保护、过电压保护功能、欠压时旁路功能、异常状态FLAG输出功能、输出电流OFF控制输入功能，可实现高可靠性。驱动插座驱动器
文件：	总39页 (文件大小：1870K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD18326NUF-M [ROHM]

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