BA83472YFVM-C [ROHM]
BA83472Yxxx-C是高电压增益的运算放大器,是将独立的2个电路集成于1个芯片的单片IC。具有大动作电源电压范围3V~36V,以及大增益带宽积和高转换速率等特点,尤其适用于发动机控制单元、EPS、ABS等各种车载用途。并且,EMI耐受力具有优势,便于替换现有产品以及进行EMI设计。;型号: | BA83472YFVM-C |
厂家: | ROHM |
描述: | BA83472Yxxx-C是高电压增益的运算放大器,是将独立的2个电路集成于1个芯片的单片IC。具有大动作电源电压范围3V~36V,以及大增益带宽积和高转换速率等特点,尤其适用于发动机控制单元、EPS、ABS等各种车载用途。并且,EMI耐受力具有优势,便于替换现有产品以及进行EMI设计。 放大器 运算放大器 |
文件: | 总29页 (文件大小:1766K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
EMARMOURTM
Datasheet
Operational Amplifiers Series
Automotive High Speed
Excellent EMI Immunity
Operational Amplifiers
BA83472Yxxx-C BA83474YFV-C
General Description
Key Specifications
◼ Operating Supply Voltage Range
BA83472Yxxx-C
and
BA83474YFV-C
integrate
dual/quad independent high voltage gain Op-amps on a
single chip. An operating voltage range is wide with 3 V to
36 V. This operational amplifier is the most suitable for
automotive requirements such as sensor amplifier, engine
control unit, electric power steering, anti-lock braking
system and so on because it has features of high gain
bandwidth and high slew rate.
Single Supply:
Dual Supply:
◼ Temperature Range:
◼ Input Offset Voltage:
◼ Input Offset Current:
◼ Input Bias Current:
◼ Output Voltage Range:
3 V to 36 V
±1.5 V to ±18 V
-40 °C to +125 °C
10 mV (Max)
6 nA (Typ)
100 nA (Typ)
Furthermore, they have the advantage of EMI tolerance.
It makes easier replacing with conventional products or
simpler designing EMI.
(VS = 30 V) VEE + 0.3 V to VCC - 1.0 V (Typ)
◼ Slew Rate:
◼ Gain Bandwidth Product:
8.5 V/µs (Typ)
3 MHz (Typ)
Features
Package
W (Typ) x D (Typ) x H (Max)
5.0 mm x 6.2 mm x 1.71 mm
2.9 mm x 4.0 mm x 0.9 mm
5.0 mm x 6.4 mm x 1.35 mm
◼ EMARMOURTM Series
SOP8
◼ AEC-Q100 Qualified(Note 1)
MSOP8
SSOP-B14
◼ Single or Dual Power Supply Operation
◼ Wide Operating Supply Voltage Range
◼ Standard Op-Amp Pin-assignments
◼ High Open-loop Voltage Gain
◼ Internal ESD Protection Circuit
◼ Common-mode Input Voltage Range includes Ground
Level, allowing Direct Ground Sensing
◼ Wide Output Voltage Range
(Note 1) Grade 1
Applications
SOP8
MSOP8
◼ Engine Control Unit
◼ Electric Power Steering (EPS)
◼ Anti-Lock Braking System (ABS)
◼ All Automotive Application
Typical Application Circuit
RF = 10 kΩ
VCC = +2.5 V
SSOP-B14
RIN = 100 Ω
푅퐹
푉푂푈푇 = −
푉
퐼푁
VIN
VOUT
푅퐼푁
VEE = -2.5 V
EMARMOUR™ is a trademark or a registered trademark of ROHM Co., Ltd.
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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Pin Configurations
BA83472YF-C: SOP8
BA83472YFVM-C: MSOP8
BA83474YFV-C: SSOP-B14
(TOP VIEW)
(TOP VIEW)
OUT1
-IN1
OUT4
-IN4
1
14
13
OUT1
VCC
8
CH1
1
CH4
2
-
+
-
+
+IN1
VCC
+IN2
-IN2
+IN4
VEE
3
4
5
12
11
CH1
- +
-IN1 2
+IN1 3
7 OUT2
-IN2
6
10 +IN3
CH2
+ -
-
-
+
+
9
8
-IN3
CH2
CH3
6
7
4
5 +IN2
VEE
OUT2
OUT3
Pin Descriptions
BA83472YF-C: SOP8
BA83472YFVM-C: MSOP8
Pin No.
Pin Name
OUT1
-IN1
Function
1
2
3
4
5
6
7
8
Output1
Inverting input1
Non-inverting input1
+IN1
Negative power supply / Ground
Non-inverting input2
Inverting input2
VEE
+IN2
-IN2
Output2
OUT2
VCC
Positive power supply
BA83474YFV-C: SSOP-B14
Pin No.
Pin Name
Function
1
2
OUT1
-IN1
Output1
Inverting input1
Non-inverting input1
Positive power supply
Non-inverting input2
Inverting input2
Output2
3
+IN1
VCC
+IN2
-IN2
4
5
6
7
OUT2
OUT3
-IN3
Output3
8
Inverting input3
Non-inverting input3
Negative power supply / Ground
Non-inverting input4
Inverting input4
Output4
9
10
11
12
13
14
+IN3
VEE
+IN4
-IN4
OUT4
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BA83472Yxxx-C BA83474YFV-C
Block Diagram
BA83472YF-C: SOP8
BA83472YFVM-C: MSOP8
+IN 3,5
8
VCC
OUT
Iref
+
-
4
VEE
-IN
AMP
1,7
2,6
BA83474YFV-C: SSOP-B14
3,5,
10,12
+IN
VEE
-IN
VCC
4
Iref
+
11
AMP
-
1,7,
8,14
2,6,
9,13
OUT
Description of Blocks
1. OPAMP:
This block is an operational amplifier with a wide operating supply voltage Range, a high slew rate (8.5 V/μs) and high-
gain bandwidth product (3 MHz).
2. Iref:
This block supplies reference current which is needed to operate OPAMP block.
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BA83472Yxxx-C BA83474YFV-C
Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
Supply Voltage (VCC - VEE
)
VS
VID
36
V
V
Differential Input Voltage(Note 1)
Common-mode Input Voltage Range
Input Current
36
VICMR
II
(VEE - 0.3) to (VEE + 36.0)
V
±10
-55 to +150
150
mA
°C
°C
Storage Temperature Range
Maximum Junction Temperature
Tstg
Tjmax
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) The differential input voltage indicates the voltage difference between inverting input and non-inverting input. The input pin voltage is set to VEE or more.
Thermal Resistance(Note 2)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 4)
2s2p(Note 5)
SOP8
Junction to Ambient
Junction to Top Characterization Parameter(Note 3)
θJA
197.4
21
109.8
19
°C/W
°C/W
ΨJT
MSOP8
Junction to Ambient
Junction to Top Characterization Parameter(Note 3)
θJA
284.1
21
135.4
11
°C/W
°C/W
ΨJT
SSOP-B14
Junction to Ambient
Junction to Top Characterization Parameter(Note 3)
θJA
159.6
13
92.8
9
°C/W
°C/W
ΨJT
(Note 2) Based on JESD51-2A (Still-Air).
(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 4) Using a PCB board based on JESD51-3.
(Note 5) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
4 Layers
Top
Copper Pattern
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Single Supply
Dual Supply
3
5
36
Operating Supply Voltage (VCC - VEE
)
Vs
V
±1.5
-40
±2.5
+25
±18.0
+125
Operating Temperature
Topr
°C
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BA83472Yxxx-C BA83474YFV-C
Function Explanation
1. EMARMOURTM
EMARMOURTM is the brand name given to ROHM products developed by leveraging proprietary technologies covering
layout, process, and circuit design to achieve ultra-high noise immunity that limits output voltage fluctuation to ±300 mV
or less across the entire noise frequency band during noise evaluation testing under the international ISO11452-2
standard. This unprecedented noise immunity reduces design load while improving reliability by solving issues related to
noise in the development of vehicle electrical systems.
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Electrical Characteristics (Unless otherwise specified VS = 30 V, VEE = -15 V)
○BA83472Yxxx-C
Limits
Typ
Temperature
Range
Parameter
Symbol
Unit
mV
Condition
Min
-
Max
10
25 °C
1
-
VOUT = 0 V
Absolute value
-
-
10
10
Input Offset Voltage
VIO
-40 °C to +125 °C
VS = 5 V, VEE = 0 V
VOUT = VS / 2
-
Absolute value
25 °C
-40 °C to +125 °C
25 °C
-
6
75
100
150
200
5.5
6
VOUT = 0 V
Absolute value
Input Offset Current
Input Bias Current(Note 1)
Supply Current
IIO
nA
-
-
-
100
IB
nA VOUT = 0 V
mA RL = ∞
-40 °C to +125 °C
25 °C
-
-
-
4.3
ICC
-40 °C to +125 °C
25 °C
-
3.7
3.5
13.7
13.5
13.5
-
-
4
-
VS = 5 V, VEE = 0 V
RL = 2 kΩ
-40 °C to +125 °C
25 °C
-
-
Output Voltage High
VOH
14
-
V
V
RL = 10 kΩ
RL = 2 kΩ
-40 °C to +125 °C
25 °C
-
-
-
-
25 °C
0.1
0.3
0.6
-14.3
-14.0
-13.5
-
VS = 5 V, VEE = 0 V
RL = 2 kΩ
-40 °C to +125 °C
25 °C
-
-
Output Voltage Low
VOL
-
-14.7
RL = 10 kΩ
RL = 2 kΩ
-40 °C to +125 °C
25 °C
-
-
-
-
25 °C
80
70
0
100
Large Signal Voltage Gain
AV
dB RL ≥ 2 kΩ, VOUT = ±10 V
-40 °C to +125 °C
25 °C
-
-
-
-
3.0
2.4
Common-mode Input
Voltage Range
VS = 5 V, VEE = 0 V
VOUT = VS / 2
VICMR
V
-40 °C to +125 °C
0
Common-mode Rejection
Ratio
CMRR
25 °C
70
97
-
dB VOUT = 0 V
Power Supply Rejection Ratio PSRR
Output Source Current(Note 2) ISOURCE
25 °C
25 °C
70
10
10
10
97
30
-
-
-
-
-
dB VOUT = 0 V
VS = 5 V, VEE = 0 V
V+IN = 1 V, V-IN = 0 V
VOUT = 0 V,
mA
-40 °C to +125 °C
25 °C
1 CH is short circuit
VS = 5 V, VEE = 0 V
30
V+IN = 0 V, V-IN = 1 V
VOUT = 5 V,
Output Sink Current(Note 2)
ISINK
mA
-40 °C to +125 °C
25 °C
10
-
-
3
-
-
-
-
1 CH is short circuit
Gain Bandwidth Product
Slew Rate
GBW
SR
MHz
V/μs
-
25 °C
-
8.5
-
VIN = -10 V to +10 V
G = 0 dB, RL = 2 kΩ
-40 °C to +125 °C
5
Channel Separation
CS
25 °C
-
120
-
dB
-
(Note 1) Current direction: Since first input stage is composed with PNP transistor, input bias current flows out of IC.
(Note 2) Under high temperatures, please consider the power dissipation when selecting the output current. When the output pin is continuously shorted the output
current reduces the internal temperature by flushing.
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Electrical Characteristics (Unless otherwise specified VS = 30 V, VEE = -15 V) - continued
○BA83474YFV-C
Limits
Typ
Temperature
Range
Parameter
Symbol
Unit
Condition
Min
-
Max
10
25 °C
1
-
VOUT = 0 V
Absolute value
-
-
10
10
Input Offset Voltage
VIO
mV
-40 °C to +125 °C
VS = 5 V, VEE = 0 V
VOUT = VS / 2
-
Absolute value
25 °C
-40 °C to +125 °C
25 °C
-
6
75
100
150
200
11.0
12
-
VOUT = 0 V
Absolute value
Input Offset Current
Input Bias Current(Note 1)
Supply Current
IIO
nA
-
-
-
100
IB
nA VOUT = 0 V
mA RL = ∞
-40 °C to +125 °C
25 °C
-
-
-
8.6
ICC
-40 °C to +125 °C
25 °C
-
3.7
3.5
13.7
13.5
13.5
-
-
4
VS = 5 V, VEE = 0 V
RL = 2 kΩ
-40 °C to +125 °C
25 °C
-
-
Output Voltage High
VOH
14
-
V
V
RL = 10 kΩ
RL = 2 kΩ
-40 °C to +125 °C
25 °C
-
-
-
-
25 °C
0.1
0.3
0.6
-14.3
-14.0
-13.5
-
VS = 5 V, VEE = 0 V
RL = 2 kΩ
-40 °C to +125 °C
25 °C
-
-
Output Voltage Low
VOL
-
-14.7
RL = 10 kΩ
RL = 2 kΩ
-40 °C to +125 °C
25 °C
-
-
-
-
25 °C
80
70
0
100
Large Signal Voltage Gain
AV
dB RL ≥ 2 kΩ, VOUT = ±10 V
-40 °C to +125 °C
25 °C
-
-
-
-
3.0
2.4
Common-mode Input
Voltage Range
VS = 5 V, VEE = 0 V
VOUT = VS / 2
VICMR
V
-40 °C to +125 °C
0
Common-mode Rejection
Ratio
CMRR
25 °C
70
97
-
dB VOUT = 0 V
Power Supply Rejection Ratio PSRR
Output Source Current(Note 2) ISOURCE
25 °C
25 °C
70
10
10
10
97
30
-
-
-
-
-
dB VOUT = 0 V
VS = 5 V, VEE = 0 V
V+IN = 1 V, V-IN = 0 V
VOUT = 0 V,
mA
-40 °C to +125 °C
25 °C
1 CH is short circuit
VS = 5 V, VEE = 0 V
30
V+IN = 0 V, V-IN = 1 V
VOUT = 5 V,
Output Sink Current(Note 2)
ISINK
mA
-40 °C to +125 °C
25 °C
10
-
-
3
-
-
-
-
1 CH is short circuit
Gain Bandwidth Product
Slew Rate
GBW
SR
MHz
V/μs
-
25 °C
-
8.5
-
VIN = -10 V to +10 V
G = 0 dB, RL = 2 kΩ
-40 °C to +125 °C
5
Channel Separation
CS
25 °C
-
120
-
dB
-
(Note 1) Current direction: Since first input stage is composed with PNP transistor, input bias current flows out of IC.
(Note 2) Under high temperatures, please consider the power dissipation when selecting the output current. When the output pin is continuously shorted the output
current reduces the internal temperature by flushing.
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Typical Performance Curves
VEE = -15 V
14
14
12
10
8
BA83472Yxxx-C
BA83474YFV-C
Ta = -40 °C
BA83472Yxxx-C
BA83474YFV-C
VS = 3.0 V
VS = 5.0 V
VS = 30.0 V
VS = 36.0 V
Ta = +25 °C
12
10
8
Ta = +125 °C
6
6
4
4
2
2
0
0
0
10
20
Supply Voltage: VS [V]
30
40
-50 -25
0
25
50
75 100 125 150
Ambient Temperature: Ta [°C]
Figure 1. Supply Current vs Supply Voltage
Figure 2. Supply Current vs Ambient Temperature
0.0
-5.0
20
15
10
5
-10.0
-15.0
-20.0
0
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25
50
75 100 125 150
Ambient Temperature: Ta [°C]
Ambient Temperature: Ta [°C]
Figure 3. Output Voltage High vs Ambient Temperature
(VS = 30 V, RL = 10 kΩ)
Figure 4. Output Voltage Low vs Ambient Temperature
(VS = 30 V, RL = 10 kΩ)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Typical Performance Curves - continued
VEE = -15 V
60
50
60
50
40
30
20
10
0
VS = 36 V
VS = 30 V
40
Ta = -40 ºC
30
VS = 5 V
Ta = +25 ºC
20
VS = 3 V
Ta = +125 ºC
10
0
0
1
2
3
4
5
-50 -25
0
25
50
75 100 125 150
Ambient Temperature: Ta[°C]
Output Voltage: VOUT [V]
Figure 5. Output Source Current vs Output Voltage
(VS = 5 V, VEE = 0 V)
Figure 6. Output Source Current vs Ambient Temperature
(VOUT = 0 V, VEE = 0 V)
100
100
80
10
1
Ta = -40 ºC
Ta = +125 ºC Ta = +25 ºC
60
VS = 3 V
40
0.1
VS = 5 V
20
0.01
0.001
VS = 36 V
VS = 30 V
0
-50 -25
0
25
50
75 100 125 150
0.0
1.0
2.0
3.0
4.0
5.0
Ambient Temperature: Ta [°C]
Output Voltage: VOUT [V]
Figure 7. Output Sink Current vs Output Voltage
(VS = 5 V, VEE = 0 V)
Figure 8. Output Sink Current vs Ambient Temperature
(VOUT = VS, VEE = 0 V)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Typical Performance Curves - continued
VEE = -15 V
15
10
5
15
10
5
Ta = -40 ºC
VS = 30 V
0
-5
0
VS = 5 V
VS = 3 V
Ta = +125 ºC
VS = 36 V
Ta = +25 ºC
-5
-10
-15
-10
-15
0
10
20
30
40
-50 -25
0
25
50
75 100 125 150
Supply Voltage: VS [V]
Ambient Temperature: Ta [°C]
Figure 9. Input Offset Voltage vs Supply Voltage
(VICM = VS / 2, VOUT = VS / 2)
Figure 10. Input Offset Voltage vs Ambient Temperature
(VICM = VS / 2, VOUT = VS / 2)
200
200
180
160
140
120
100
80
180
160
140
120
100
80
Ta = -40 ºC
VS = 5 V
VS = 3 V
VS = 36 V
Ta = +125 ºC
VS = 30 V
Ta = +25 ºC
60
60
40
40
20
20
0
0
0
10
20
30
40
-50 -25
0
25
50
75 100 125 150
Supply Voltage: VS [V]
Ambient Temperature: Ta [ºC]
Figure 11. Input Bias Current vs Supply Voltage
(VICM = VS / 2, VOUT = VS / 2)
Figure 12. Input Bias Current vs Ambient Temperature
(VICM = VS / 2, VOUT = VS / 2)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Typical Performance Curves - continued
VEE = -15 V
100
75
10
8
Ta = +125 ºC
6
50
Ta = +25 ºC
4
Ta = +25 ºC
Ta = -40 ºC
25
2
0
0
Ta = -40 ºC
Ta = +125 ºC
-2
-25
-50
-75
-100
-4
-6
-8
-10
-1
0
1
2
3
4
5
0
5
10
15
20
25
30
35
40
Common-mode Input Voltage: VICM [V]
Supply Voltage: VS [V]
Figure 13. Input Offset Voltage vs
Common-mode Input Voltage
(VS = 5 V)
Figure 14. Input Offset Current vs
Supply Voltage
(VICM = VS / 2, VOUT = VS / 2)
100
75
140
130
120
110
100
90
50
Ta = -40 ºC
VS = 36 V
VS = 3 V
Ta = +25 ºC
25
0
VS = 30 V
VS = 5 V
-25
-50
-75
-100
80
Ta = +125 ºC
70
60
-50 -25
0
25
50
75 100 125 150
0
10
20
30
40
Supply Voltage: VS [V]
Ambient Temperature: Ta [°C]
Figure 16. Large Signal Voltage Gain vs
Supply Voltage
Figure 15. Input Offset Current vs
Ambient Temperature
(RL = 2 kΩ)
(VICM = VS / 2, VOUT = VS / 2)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Typical Performance Curves - continued
VEE = -15 V
140
130
120
110
140
120
100
80
Ta = +125 ºC
Ta = +25 ºC
VS = 36 V
100
90
VS = 3 V
Ta = -40 ºC
VS = 5 V
80
VS = 30 V
60
70
60
40
-50 -25
0
25
50
75 100 125 150
0
10
20
30
40
Ambient Temperature: Ta[°C]
Supply Voltage: VS [V]
Figure 17. Large Signal Voltage Gain vs
Ambient Temperature
Figure 18. Common-mode Rejection Ratio vs
Supply Voltage
(RL=2 kΩ)
140
140
120
100
80
130
120
110
100
90
VS = 36 V
VS = 30 V
VS = 5 V
VS = 3 V
80
60
70
40
60
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25
50
75 100 125 150
Ambient Temperature: Ta [ºC]
Ambient Temperature: Ta [ºC]
Figure 19. Common-mode Rejection Ratio vs
Ambient Temperature
Figure 20. Power Supply Rejection Ratio vs
Ambient Temperature
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Typical Performance Curves - continued
VEE = -15 V
14
12
14
12
10
8
10
Ta = -40 ºC
VS = 36 V
8
Ta = +25 ºC
VS = 30 V
6
6
4
2
0
Ta = +125 ºC
VS = 5 V
4
2
0
-50 -25
0
25 50 75 100 125 150
0
5
10
15
20
25
30
35
40
Ambient Temperature: Ta [ºC]
Supply Voltage: VS [V]
Figure 22. Slew Rate (Low to High) vs
Ambient Temperature
(RL = 2 kΩ)
Figure 21. Slew Rate (Low to High) vs
Supply Voltage
(RL = 2 kΩ)
40
40
35
30
25
20
15
10
5
35
30
25
20
15
10
5
Ta = -40 ºC
VS = 36 V
Ta = +25 ºC
VS = 30 V
Ta = +125 ºC
VS = 5 V
0
0
0
5
10
15
20
25
30
35
40
-50 -25
0
25
50
75 100 125 150
Supply Voltage: VS [V]
Ambient Temperature: Ta [ºC]
Figure 24. Slew Rate (High to Low) vs
Ambient Temperature
(RL = 2 kΩ)
Figure 23. Slew Rate (High to Low) vs
Supply Voltage
(RL = 2 kΩ)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Typical Performance Curves - continued
VEE = -15 V
50
0
PHASE
40
-30
GAIN
30
-60
-90
20
10
0
-120
-150
-180
-10
1
10
100
1000
10000
Frequency: f [kHz]
Figure 25.
Voltage Gain, Phase vs Frequency
(VS = 30 V, AV = 40 dB
RL = 2 kΩ, CL = 100 pF, Ta = 25 °C)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Application Information
Test Circuit 1
VCC, VEE, VEK, VICM Unit: V
VF
SW1
SW2
SW3
VCC
VEE
VEK
VICM Calculation
Parameter
Input Offset Voltage
Input Offset Current
VF1
VF2
VF3
VF4
VF5
VF6
VF7
VF8
VF9
VF10
ON
OFF
OFF
ON
ON
OFF
ON
OFF
OFF
+15
+15
-15
-15
0
0
0
0
1
2
Input Bias Current
OFF
ON
+15
-15
0
0
3
4
5
6
OFF
+15
+15
+15
+15
+2
-15
-15
-15
-15
-2
+10
-10
0
0
0
Large Signal Voltage Gain
ON
ON
ON
ON
ON
ON
-15
+13
0
Common-mode Rejection Ratio
(Common-mode Input Voltage Range)
OFF
OFF
0
0
Power Supply Rejection Ratio
+18
-18
0
0
-Calculation-
ȁ
ȁ
푉퐹1
1. Input Offset Voltage (VIO)
[V]
푉 =
퐼푂
Τ
ꢀ + 푅퐹 푅푆
2. Input Offset Current (IIO)
3. Input Bias Current (IB)
ȁ
ȁ
푉퐹2−푉퐹1
[A]
ꢁ퐼푂
=
ሺ
Τ ሻ
푅퐼 × ꢀ + 푅퐹 푅푆
ȁ
퐹3ȁ
푉퐹4−푉
[A]
ꢁ퐵 =
ሺ
Τ ሻ
ꢂ × 푅퐼 × ꢀ + 푅퐹 푅푆
4. Large Signal Voltage Gain (AV)
ሺ
Τ ሻ
∆푉퐸퐾 × ꢀ + 푅퐹 푅푆
[dB]
퐴ꢃ = ꢂ0 × log
ȁ
ȁ
푉 − 푉퐹6
퐹5
5. Common-mode Rejection Ratio (CMRR)
6. Power Supply Rejection Ratio (PSRR)
ሺ
Τ ሻ
∆푉퐼ꢄꢅ × ꢀ + 푅퐹 푅푆
퐶푀푅푅 = ꢂ0 × log
[dB]
ȁ
ȁ
푉퐹8 − 푉퐹7
ሺ
Τ ሻ
∆푉 × ꢀ + 푅퐹 푅푆
ꢄꢄ
[dB]
푃ꢆ푅푅 = ꢂ0 × log
0.1 μF
ȁ
ȁ
푉퐹1ꢇ − 푉퐹9
RF = 50 kΩ
SW1
500 kΩ
0.01 μF
15 V
VCC
EK
VOUT
RS = 50 Ω
500 kΩ
RI = 10 kΩ
RI = 10 kΩ
DUT
SW3
NULL
-15 V
1000 pF
RS = 50 Ω
50 kΩ
RL
V
VICM
VF
SW2
VEE
Figure 26. Test Circuit 1 (One Channel Only)
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Application Information - continued
Test Circuit 2
SW No.
SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12
Supply Current
OFF OFF OFF ON
OFF ON
OFF OFF OFF OFF
OFF ON OFF OFF
OFF
ON
OFF
OFF
OFF
Output Voltage High
Output Voltage Low
OFF OFF ON
OFF OFF ON
OFF OFF ON
OFF OFF ON
OFF OFF OFF OFF
OFF OFF OFF OFF
OFF OFF OFF OFF
ON
Output Source
Current
OFF OFF ON
OFF OFF ON
OFF OFF ON
OFF OFF ON
OFF
ON
Output Sink Current
Slew Rate
OFF
OFF
ON
OFF OFF OFF ON
OFF OFF ON
ON
ON
ON
ON
ON
OFF
Gain Bandwidth
Product
OFF ON OFF OFF ON
ON
OFF ON
OFF
OFF
V
SW4
VH
R2
VCC
SW5
VL
Input Wave
t
SW2
SW1
RS
SW3
V
SR = ΔV/Δt
90%
R1
C
VH
SW7
SW12
SW6
SW8 W9SW10
SW11
VEE
ΔV
RL
CL
10%
VIN
VIN
VL
VOUT
Δt
t
Output Wave
Figure 27. Test Circuit 2 (Each Op-Amp)
Figure 28. Slew Rate Input Output Wave
VCC
VCC
OTHER
CH
R1 // R2
R1 // R2
VEE
VEE
R1
VIN
R2
R1
R2
VOUT1
= 0.5 [Vrms]
V
V
VOUT2
ꢀ00 × 푉푂푈푇1
푉푂푈푇2
퐶ꢆ = ꢂ0 × log
Figure 29. Test Circuit 3 (Channel Separation)
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Application Information - continued
EMI Immunity
BA8347xYxxx-C series have high tolerance from electromagnetic interference because they have integrated EMI filter, and the
EMI design is simple. The data on ROHM board in the IC simple substance are as follows. They are most suitable for the
replacement from conventional products. The test condition is based on ISO11452-2.
<Test Condition> Based on ISO11452-2
Test Circuit : Voltage Follower
VCC : 12V
V+IN : 6V
Test Method : Substituted Law
(Progressive Wave)
Field Intensity : 200V/m
Test Wave : CW (Continuous Wave)
Frequency : 200MHz – 1000MHz (2% step)
V+IN+0.6
V+IN+0.4
V+IN+0.2
V+IN
Conventional Product
BA8347xYxxx-C
V+IN-0.2
V+IN-0.4
V+IN-0.6
200
400
600
800
1000
Frequency [MHz]
Figure 30. EMI Characteristics
EMI Evaluation Board (BA83472Yxxx-C)
EMI Evaluation Board (BA83474YFV-C)
Figure 31. EMI Evaluation Board
Figure 32. Measurement Circuit of EMI Evaluation
(Note) The above data is obtained using typical sample on ROHM board. These values are not guaranteed. Please confirm characteristics
when used in actual application.
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Application Information – continued
1) Unused Circuits
When there are unused op-amps, it is recommended that they are connected as in Figure 33, setting the non-inverting
input pin within the Common-mode Input Voltage Range (VICMR).
VCC
+
-
VICM
Voltage within
VICMR
VEE
Figure 33. Example of application
circuit for unused op-amp
2) Input Voltage
Applying VEE + 36 V to the input pin is possible without causing deterioration of the electrical characteristics or destruction,
regardless of the supply voltage. However, this does not ensure normal circuit operation. Please note that the circuit
operates normally only when the input voltage is within the Common-mode Input Voltage range of the electric
characteristics.
3) Power Supply (Single / Dual)
The op-amp operates when the voltage supplied is between VCC and VEE. Therefore, the single supply op-amp can be used
as dual supply op-amp as well.
4) IC Handling
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations of the electrical
characteristics due to piezo resistance effects. Please pay attention to defecting or bending the board.
5) Output Capacitor
When the VCC pin is shorted to VEE (GND) electric potential in a state where electric charge is accumulated in the external
capacitor that is connected to the output pin, the accumulated electric charge will flow through parasitic elements or pin
protection elements inside the circuit and discharges to the VCC pin and thus may cause damage to the internal circuit (by
thermal destruction). When using this IC as a comparator, when not used in a negative feedback circuit, and when used in
an application circuit where an output capacitive load does not cause oscillations, please set the value of the capacitor
connected to the output pin to 0.1 μF or less to prevent IC damage caused by the accumulation of electric charge as
mentioned above.
6) Oscillation by Output Capacitor
Please pay attention to the oscillation by capacitive load and in designing an application of constitutes a negative feedback
loop circuit with these ICs.
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Application Examples
○Voltage Follower
Using this circuit, the output voltage (VOUT) is configured
to be equal to the input voltage (VIN). This circuit also
stabilizes the output voltage due to high input impedance
and low output impedance. Computation for output
voltage is shown below.
VCC
VOUT
푉푂푈푇 = 푉
퐼푁
VIN
VEE
Figure 34. Voltage Follower Circuit
○Inverting Amplifier
RF
For inverting amplifier, input voltage (VIN) is amplified by
a voltage gain which depends on the ratio of RIN and RF,
and then it outputs phase-inverted voltage (VOUT). The
output voltage is shown in the next expression.
VCC
RIN
VIN
푅퐹
푉푂푈푇 = −
푉
퐼푁
VOUT
푅퐼푁
This circuit has input impedance equal to RIN.
RIN // RF
VEE
Figure 35. Inverting Amplifier Circuit
○Non-inverting Amplifier
RF
For non-inverting amplifier, input voltage (VIN) is amplified
by a voltage gain, which depends on the ratio of RIN and
RF. The output voltage (VOUT) is in-phase with the input
voltage and is shown in the next expression.
VCC
RIN
VIN
푅퐹
푉푂푈푇 = (ꢀ +
)푉
퐼푁
VOUT
푅퐼푁
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational amplifier.
RIN // RF
VEE
Figure 36. Non-inverting Amplifier Circuit
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 37. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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Ordering Information
B A 8 3 4 7 x Y x x x - C x x
Number of Channels
2: Dual
Package
F: SOP8
Product Rank
C: for Automotive
4: Quad
FVM: MSOP8
FV: SSOP-B14
Packaging and forming specification
E2: Embossed tape and reel
TR: Embossed tape and reel
Lineup
Temperature
Operating Supply
Voltage Range
Number of
Channels
Orderable Part
Package
Reel of 2500
Range
Number
SOP8
BA83472YF-CE2
Dual
-40 °C to +125 °C
3 V to 36 V
MSOP8
Reel of 3000
Reel of 2500
BA83472YFVM-CTR
BA83474YFV-CE2
Quad
SSOP-B14
Marking Diagram
SOP8 (TOP VIEW)
Part Number Marking
8 3 4 7 2
LOT Number
Pin 1 Mark
MSOP8 (TOP VIEW)
Part Number Marking
LOT Number
8
3
4
2
7
Pin 1 Mark
SSOP-B14 (TOP VIEW)
Part Number Marking
LOT Number
Pin 1 Mark
83474
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Physical Dimension and Packing Information
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT: mm)
PKG: SOP8
Drawing No.: EX112-5001-1
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Physical Dimension and Packing Information – continued
Package Name
MSOP8
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Physical Dimension and Packing Information – continued
Package Name
SSOP-B14
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Revision History
Date
Revision
001
Changes
14.Feb.2020
New Release
18.Sep.2020
09.Nov.2020
01.Oct.2022
002
003
004
Add Lineup (BA83472YFVM-C)
Add Lineup (BA83474YFV-C)
Modified title
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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