TPS3307-33DGNR [ROCHESTER]
3-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8, GREEN, PLASTIC, MSOP-8;
| 型号： | TPS3307-33DGNR |
| 厂家： | 
Rochester Electronics |
| 描述： | 3-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8, GREEN, PLASTIC, MSOP-8 输入元件 光电二极管 |
| 文件： | 总21页 (文件大小：1781K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS3307-18, TPS3307-25, TPS3307-33
www.ti.com
SLVS199C–DECEMBER 1998–REVISED DECEMBER 2006
TRIPLE PROCESSOR SUPERVISORS
FEATURES
D OR DGN PACKAGE
(TOP VIEW)
•
Triple Supervisory Circuits for DSP and
Processor-Based Systems
SENSE1
SENSE2
SENSE3
GND
V
DD
1
2
3
4
8
7
6
5
•
Power-On Reset Generator With Fixed Delay
Time of 200ms, No External Capacitor Needed
MR
RESET
RESET
•
•
•
•
•
•
Temperature-Compensated Voltage Reference
Maximum Supply Current of 40µA
Supply Voltage Range: 2V to 6V
Defined RESET Output From VDD ≥ 1.1V
MSOP-8 and SO-8 Packages
Temperature Range : – 40°C to +85°C
TYPICAL APPLICATIONS
Figure 1 lists some of the typical applications for the TPS3307 family, and a schematic diagram for a
processor-based system application. This application uses TI part numbers TPS3307-33 and MSP430C325.
2.5V
5V
3.3V
• Applications using DSPs,
Microcontrollers or Microprocessors
V
DD
V
DD
w Industrial Equipment
100nF
SENSE 1
MSP430C325
RESET
w Programmable Controls
w Automotive Systems
SENSE 2
RESET
470kΩ
TPS3307−33
w Portable/Battery Powered Equipment
w Intelligent Instruments
GND
SENSE 3
GND
w Wireless Communication Systems
w Notebook/Desktop Computers
620kΩ
Figure 1. Applications Using the TPS3307 Family
DESCRIPTION
The TPS3307 family is a series of micropower supply voltage supervisors designed for circuit initialization
primarily in DSP and processor-based systems, which require more than one supply voltage.
The product spectrum of the TPS3307-xx is designed for monitoring three independent supply voltages:
3.3V/1.8V/adj, 3.3V/2.5V/adj or 3.3V/5V/adj. The adjustable SENSE input allows the monitoring of any supply
voltage >1.25V.
The various supply voltage supervisors are designed to monitor the nominal supply voltage as shown in the
following supply voltage monitoring table.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 1998–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPS3307-18, TPS3307-25, TPS3307-33
www.ti.com
SLVS199C–DECEMBER 1998–REVISED DECEMBER 2006
During power-on, RESET is asserted when the supply voltage VDD becomes higher than 1.1V. Thereafter, the
supply voltage supervisor monitors the SENSEn inputs and keeps RESET active as long as SENSEn remain
below the threshold voltage VIT+
.
An internal timer delays the return of the RESET output to the inactive state (high) to ensure proper system
reset. The delay time, td (typ) = 200ms, starts after all SENSEn inputs have risen above the threshold voltage VIT+
.
When the voltage at any SENSE input drops below the threshold voltage VIT–, the RESET output becomes
active (low) again.
The TPS3307-xx family of devices incorporates a manual reset input, MR. A low level at MR causes RESET to
become active. In addition to the active-low RESET output, the TPS3307-xx family includes an active-high
RESET output.
The devices are available in either 8-pin MSOP or standard 8-pin SO packages.
The TPS3307-xx devices are characterized for operation over a temperature range of –40°C to +85°C.
SUPPLY VOLTAGE MONITORING
NOMINAL SUPERVISED VOLTAGE
THRESHOLD VOLTAGE (TYP)
DEVICE
SENSE1
3.3V
SENSE2
1.8V
SENSE3
SENSE1
2.93V
SENSE2
1.68V
SENSE3
1.25V(1)
1.25V(1)
1.25V(1)
TPS3307-18
TPS3307-25
TPS3307-33
User defined
User defined
User defined
3.3V
2.5V
2.93V
2.25V
5V
3.3V
4.55V
2.93V
(1) The actual sense voltage has to be adjusted by an external resistor divider according to the application requirements.
AVAILABLE OPTIONS(1)
PACKAGED DEVICES
MARKING
DGN PACKAGE
CHIP FORM
(Y)
PowerPAD™
µ-SMALL OUTLINE
(DGN)
TA
SMALL OUTLINE
(D)
TPS3307-18D
TPS3307-25D
TPS3307-33D
TPS3307-18DGN
TPS3307-25DGN
TPS3307-33DGN
TIAAP
TIAAQ
TIAAR
TPS3307-18Y
TPS3307-25Y
TPS3307-33Y
–40°C to +85°C
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Function/Truth Tables
MR
L
SENSE1 > VIT1
SENSE2 > VIT2
SENSE3 > VIT3
RESET
RESET
X(1)
X(1)
X
0
1
0
1
0
1
0
1
L
L
L
L
L
L
L
L
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
0
0
0
0
0
1
0
1
1
0
1
0
1
1
1
1
(1) X = Don't care
2
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TPS3307-18, TPS3307-25, TPS3307-33
www.ti.com
SLVS199C–DECEMBER 1998–REVISED DECEMBER 2006
Functional Block Diagram
V
DD
TPS3307
14 kΩ
MR
R1
R3
+
_
SENSE 1
RESET
RESET
R2
RESET
Logic + Timer
+
_
SENSE 2
GND
R4
Reference
Voltage
of 1.25V
_
+
Oscillator
SENSE 3
Timing Diagram
SENSEn
V
(nom)
V
IT–
t
t
t
MR
1
0
RESET
1
0
t
d
t
d
t
d
RESET Because of SENSE Below V
RESET Because of MR
IT
RESET Because of SENSE Below V
IT–
RESET Because of SENSE Below V
IT–
3
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TPS3307-18, TPS3307-25, TPS3307-33
www.ti.com
SLVS199C–DECEMBER 1998–REVISED DECEMBER 2006
TPS3307Y Chip Information
These chips, when properly assembled, display characteristics similar to those of the TPS3307. Thermal
compression or ultrasonic bonding may take place on the doped aluminium bonding pads. The chips may be
mounted with conductive epoxy or a gold-silicon preform.
(1)
(2)
(3)
(4)
(8)
(7)
(6)
TPS3307Y
(5)
48
CHIP THICKNESS: 10 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T max = 150°C
J
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS
56
Table 2. Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME
GND
NO.
4
7
5
6
1
2
3
8
Ground
MR
I
O
O
I
Manual reset
RESET
RESET
SENSE1
SENSE2
SENSE3
VDD
Active-low reset output
Active-high reset output
Sense voltage input 1
Sense voltage input 2
Sense voltage input 3
Supply voltage
I
I
4
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TPS3307-18, TPS3307-25, TPS3307-33
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SLVS199C–DECEMBER 1998–REVISED DECEMBER 2006
Absolute Maximum Ratings(1)
Over operating free-air temperature range (unless otherwise noted).
UNIT
7V
(2)
Supply voltage, VDD
MR pin
All other pins(2)
–0.3V to VDD +0.3V
–0.3V to 7V
5mA
Maximum low output current, IOL
Maximum high output current, IOH
–5mA
Input clamp current, IIK (VI < 0 or VI > VDD
)
±20mA
Output clamp current, IOK (VO < 0 or VO > VDD
Continuous total power dissipation
Operating free-air temperature range, TA
Storage temperature range, Tstg
Soldering temperature
)
±20mA
See Dissipation Rating Table
–40°C to +85°C
–65°C to +150°C
+260°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND. For reliable operation the device must not be operated at 7V for more than t = 1000h
continuously.
Dissipation Rating Table
T
A ≤ +25°C
DERATING FACTOR
ABOVE TA = +25°C
TA = +70°C
POWER RATING
TA = +85°C
POWER RATING
PACKAGE
POWER RATING
DGN
D
2.14W
17.1mW/°C
5.8mW/°C
1.37W
1.11W
725mW
464mW
377mW
Recommended Operating Conditions
At specified temperature range.
MIN
MAX
UNIT
Supply voltage, VDD
2
6
VDD + 0.3
V
V
Input voltage at MR and SENSE3, VI
Input voltage at SENSE1 and SENSE2, VI
High-level input voltage at MR, VIH
Low-level input voltage at MR, VIL
Input transition rise and fall rate at MR, ∆t/∆V
Operating free-air temperature range, TA
0
0
(VDD+0.3)VIT/1.25V
V
0.7 x VDD
V
0.3 × VDD
50
V
ns/V
°C
–40
+85
5
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TPS3307-18, TPS3307-25, TPS3307-33
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SLVS199C–DECEMBER 1998–REVISED DECEMBER 2006
Electrical Characteristics
Over recommended operating free-air temperature range (unless otherwise noted).
PARAMETER
TEST CONDITIONS
VDD = 2V to 6V, IOH = –20 µA
VDD = 3.3V, IOH = –2mA
VDD = 6V, IOH = –3mA
MIN
TYP
MAX
UNIT
VDD – 0.2V
VDD – 0.4V
VDD – 0.4V
VOH
High-level output voltage
V
VDD = 2V to 6V, IOL = 20µA
VDD = 3.3V, IOL = 2mA
0.2
VOL
Low-level output voltage
Power-up reset voltage(1)
0.4
0.4
V
V
VDD = 6V, IOL = 3mA
VDD ≥ 1.1V, IOL = 20µA
0.4
VSENSE3
VDD = 2V to 6V, TA = 0°C to +85°C
1.22
1.64
2.20
2.86
4.46
1.25
1.28
1.72
2.30
3
1.68
2.25
2.93
4.55
V
VSENSE1,
VSENSE2
4.64
Negative-going input threshold
voltage(2)
VIT–
VDD = 2V to 6V,
TA = –40°C to +85°C
VSENSE3
1.22
1.25
1.29
V
V
1.64
2.20
2.86
4.46
1.68
2.25
2.93
4.55
10
1.73
2.32
3.02
4.67
VSENSE1,
VSENSE2
VIT–= 1.25V
VIT–= 1.68V
15
Vhys
Hysteresis at VSENSEn input
VIT–= 2.25V
20
mV
VIT–= 2.93V
30
VIT–= 4.55V
40
MR
MR = 0.7 × VDD, VDD = 6V
VSENSE1 = VDD = 6V
VSENSE2 = VDD = 6V
VSENSE3 = VDD
MR = 0V, VDD = 6V
VSENSE1,2,3 = 0V
–130
5
–180
8
SENSE1
SENSE2
SENSE3
MR
µA
IH
High-level input current
Low-level input current
6
9
–25
–25
25
nA
µA
nA
µA
pF
–430
–600
25
IL
SENSEn
IDD
Ci
Supply current
40
Input capacitance
VI = 0V to VDD
10
(1) The lowest supply voltage at which RESET becomes active. tr, VDD ≥ 15µs/V
(2) To ensure best stability of the threshold voltage, a bypass capacitor (ceramic 0.1µF) should be placed close to the supply terminals.
6
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TPS3307-18, TPS3307-25, TPS3307-33
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SLVS199C–DECEMBER 1998–REVISED DECEMBER 2006
Timing Requirements
At VDD = 2V to 6V, RL = 1MΩ, CL = 50pF, TA = +25°C.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
µs
SENSEn
MR
VSENSEnL = VIT–– 0.2V, VSENSEnH = VIT+ +0.2V
VIH = 0.7 × VDD, VIL = 0.3 × VDD
6
tw
Pulse width
100
ns
Switching Characteristics
At VDD = 2V to 6V, RL = 1MΩ, CL = 50pF, TA = +25°C.
PARAMETER
TEST CONDITIONS
I(SENSEn) ≥ VIT+ + 0.2V,
MR ≥ 0.7 × VDD. See Timing Diagram.
MIN
TYP
200
MAX
UNIT
V
td
Delay time
140
280
ms
Propagation (delay) time,
high-to-low level output
MR to RESETMR to
RESET
tPHL
tPLH
tPHL
tPLH
VI(SENSEn) ≥ VIT+ + 0.2V,
VIH = 0.7 × VDD, VIL = 0.3 × VDD
200
1
500
5
ns
Propagation (delay) time,
low-to-high level output
MR to RESETMR to
RESET
Propagation (delay) time,
high-to-low level output
SENSEn to RESET
SENSEn to RESET
VIH = VIT+ +0.2V, VIL = VIT–– 0.2V,
MR ≥ 0.7 × VDD
µs
Propagation (delay) time,
low-to-high level output
SENSEn to RESET
SENSEn to RESET
7
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TPS3307-18, TPS3307-25, TPS3307-33
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SLVS199C–DECEMBER 1998–REVISED DECEMBER 2006
Typical Characteristics
NORMALIZED SENSE THRESHOLD VOLTAGE
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
vs
FREE-AIR TEMPERATURE AT VDD
18
16
14
12
10
8
1.005
1.004
1.003
1.002
1.001
1
V
= 2V
DD
MR = Open
TPS3307−33
6
4
2
0.999
0.998
0.997
0
−2
−4
SENSEn = V
DD
−6
MR = Open
= 25°C
−8
T
A
0.996
0.995
−10
−0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7
−40
−15
10
35
60
85
V
DD
− Supply Voltage − V
T
A
− Free-Air Temperature − °C
Figure 2.
Figure 3.
INPUT CURRENT
vs
INPUT VOLTAGE AT MR
MINIMUM PULSE DURATION AT SENSE
vs
THRESHOLD OVERDRIVE
100
0
10
9
V
T
= 6V
= 25°C
DD
V
= 6V
DD
A
MR = Open
8
−100
−200
−300
−400
−500
−600
−700
7
6
5
4
3
2
−800
−900
1
0
4.5
−1−0.5 0 0.5 1 1.5 2 2.5 3 3.5 4
5 5.5 6 6.5
0
100 200 300 400 500 600 700 800 900 1000
SENSE − Threshold Overdrive − mV
V − Input Voltage at MR − V
I
Figure 4.
Figure 5.
8
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TPS3307-18, TPS3307-25, TPS3307-33
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SLVS199C–DECEMBER 1998–REVISED DECEMBER 2006
Typical Characteristics (continued)
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
2.5
2
6.5
6
V
= 2V
V
= 6V
DD
DD
MR = Open
MR = Open
5.5
5
4.5
4
1.5
−40°C
3.5
3
−40°C
85°C
1
2.5
2
85°C
1.5
1
0.5
0
0.5
0
0 −0.5 −1 −1.5 −2 −2.5 −3 −3.5 −4 −4.5 −5 −5.5 −6
0
−5 −10 −15 −20 −25 −30 −35 −40 −45 −50
I
− High-Level Output Current − mA
I
− High-Level Output Current − mA
OH
OH
Figure 6.
Figure 7.
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
2.5
2
6.5
6
V
= 2V
V
= 6V
DD
DD
MR = Open
MR = Open
5.5
5
4.5
4
1.5
1
3.5
3
85°C
85°C
2.5
2
1.5
1
0.5
0
−40°C
−40°C
0.5
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
0
5
10 15 20 25 30 35 40 45 50 55 60
I
− Low-Level Output Current − mA
I
− Low-Level Output Current − mA
OL
OL
Figure 8.
Figure 9.
9
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PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
PACKAGING INFORMATION
Orderable Device
TPS3307-18D
Status Package Type Package Pins Package Qty
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Top-Side Markings
Samples
Drawing
(1)
(2)
(3)
(4)
ACTIVE
SOIC
SOIC
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
75
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
30718
TPS3307-18DG4
TPS3307-18DGN
TPS3307-18DGNG4
TPS3307-18DGNR
TPS3307-18DGNRG4
TPS3307-18DR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
DGN
DGN
DGN
DGN
D
Green (RoHS
& no Sb/Br)
30718
AAP
MSOP-
PowerPAD
80
Green (RoHS
& no Sb/Br)
MSOP-
PowerPAD
80
Green (RoHS
& no Sb/Br)
AAP
MSOP-
PowerPAD
2500
2500
2500
2500
75
Green (RoHS
& no Sb/Br)
AAP
MSOP-
PowerPAD
Green (RoHS
& no Sb/Br)
AAP
SOIC
SOIC
SOIC
SOIC
Green (RoHS
& no Sb/Br)
30718
30718
30725
30725
AAQ
TPS3307-18DRG4
TPS3307-25D
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
TPS3307-25DG4
TPS3307-25DGN
TPS3307-25DGNG4
TPS3307-25DGNR
TPS3307-25DGNRG4
TPS3307-25DR
D
75
Green (RoHS
& no Sb/Br)
MSOP-
PowerPAD
DGN
DGN
DGN
DGN
D
80
Green (RoHS
& no Sb/Br)
MSOP-
PowerPAD
80
Green (RoHS
& no Sb/Br)
AAQ
MSOP-
PowerPAD
2500
2500
2500
2500
75
Green (RoHS
& no Sb/Br)
AAQ
MSOP-
PowerPAD
Green (RoHS
& no Sb/Br)
AAQ
SOIC
SOIC
SOIC
Green (RoHS
& no Sb/Br)
30725
30725
30733
TPS3307-25DRG4
TPS3307-33D
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
Orderable Device
Status Package Type Package Pins Package Qty
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Top-Side Markings
Samples
Drawing
(1)
(2)
(3)
(4)
TPS3307-33DG4
TPS3307-33DGN
TPS3307-33DGNG4
TPS3307-33DGNR
TPS3307-33DGNRG4
TPS3307-33DR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
D
8
8
8
8
8
8
8
75
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
30733
MSOP-
PowerPAD
DGN
DGN
DGN
DGN
D
Green (RoHS CU NIPDAUAG Level-1-260C-UNLIM
& no Sb/Br)
AAR
MSOP-
PowerPAD
80
Green (RoHS CU NIPDAUAG Level-1-260C-UNLIM
& no Sb/Br)
AAR
MSOP-
PowerPAD
2500
2500
2500
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
AAR
MSOP-
PowerPAD
Green (RoHS
& no Sb/Br)
AAR
SOIC
Green (RoHS
& no Sb/Br)
30733
30733
TPS3307-33DRG4
SOIC
D
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS3307-18, TPS3307-33 :
Automotive: TPS3307-18-Q1
•
Enhanced Product: TPS3307-18-EP, TPS3307-33-EP
•
Military: TPS3307-18M
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Enhanced Product - Supports Defense, Aerospace and Medical Applications
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Oct-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS3307-18DGNR
MSOP-
Power
PAD
DGN
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
TPS3307-18DR
SOIC
D
8
8
2500
2500
330.0
330.0
12.4
12.4
6.4
5.3
5.2
3.4
2.1
1.4
8.0
8.0
12.0
12.0
Q1
Q1
TPS3307-25DGNR
MSOP-
Power
PAD
DGN
TPS3307-25DR
SOIC
D
8
8
2500
2500
330.0
330.0
12.4
12.4
6.4
5.3
5.2
3.4
2.1
1.4
8.0
8.0
12.0
12.0
Q1
Q1
TPS3307-33DGNR
MSOP-
Power
PAD
DGN
TPS3307-33DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Oct-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS3307-18DGNR
TPS3307-18DR
MSOP-PowerPAD
SOIC
DGN
D
8
8
8
8
8
8
2500
2500
2500
2500
2500
2500
358.0
367.0
358.0
367.0
358.0
367.0
335.0
367.0
335.0
367.0
335.0
367.0
35.0
35.0
35.0
35.0
35.0
35.0
TPS3307-25DGNR
TPS3307-25DR
MSOP-PowerPAD
SOIC
DGN
D
TPS3307-33DGNR
TPS3307-33DR
MSOP-PowerPAD
SOIC
DGN
D
Pack Materials-Page 2
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