TMP06ART-500RL7 [ROCHESTER]
DIGITAL TEMP SENSOR-SERIAL, 12BIT(s), 2Cel, RECTANGULAR, SURFACE MOUNT, MO-178AA, SOT-23, 5 PIN;
| 型号： | TMP06ART-500RL7 |
| 厂家： | 
Rochester Electronics |
| 描述： | DIGITAL TEMP SENSOR-SERIAL, 12BIT(s), 2Cel, RECTANGULAR, SURFACE MOUNT, MO-178AA, SOT-23, 5 PIN 输出元件 传感器 换能器 |
| 文件： | 总29页 (文件大小：1607K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
± ±0.5°C AAcuratCꢀPW
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C
TWꢀ±./TWꢀ±6
FEATURES
FUNCTIONAL BLOCK DIAGRAM
V
Modulated serial digital output, proportional to
temperature
DD
5
TMP05/TMP06
0.ꢀ5C typical accuracy at 2ꢀ5C
1.05C accuracy from 05C to 705C
Two grades available
TEMPERATURE
SENSOR
AVERAGING
BLOCK/
COUNTER
Σ-Δ
CORE
1
OUT
Operation from −405C to +1ꢀ05C
Operation from 3 V to ꢀ.ꢀ V
REFERENCE
Power consumption 70 μW maximum at 3.3 V
CMOS-/TTL-compatible output on TMP0ꢀ
Flexible open-drain output on TMP06
Small, low cost, ꢀ-lead SC-70 and SOT-23 packages
OUTPUT
CONTROL
CLK AND
TIMING
GENERATION
CONV/IN
2
3
FUNC
4
APPLICATIONS
GND
Isolated sensors
Figure 1.
Environmental control systems
Computer thermal monitoring
Thermal protection
Industrial process control
Power-system monitors
A three-state FUNC input determines the mode in which the
TMP05/TMP06 operate.
GENERAL DESCRIPTION
The TMP05/TMP06 are monolithic temperature sensors that
generate a modulated serial digital output (PWM), which varies
in direct proportion to the temperature of the devices. The high
period (TH) of the PWM remains static over all temperatures,
while the low period (TL) varies. The B Grade version offers a
high temperature accuracy of 1°C from 0°C to 70°C with
excellent transducer linearity. The digital output of the TMP05/
TMP06 is CMOS-/TTL-compatible and is easily interfaced to
the serial inputs of most popular microprocessors. The flexible
open-drain output of the TMP06 is capable of sinking 5 mA.
The CONV/IN input pin is used to determine the rate at which
the TMP05/TMP06 measure temperature in continuously
converting mode and one shot mode. In daisy-chain mode, the
CONV/IN pin operates as the input to the daisy chain.
PRODUCT HIGHLIGHTS
1. The TMP05/TMP06 have an on-chip temperature sensor
that allows an accurate measurement of the ambient
temperature. The measurable temperature range is
–40°C to +150°C.
The TMP05/TMP06 are specified for operation at supply voltages
from 3 V to 5.5 V. Operating at 3.3 V, the supply current is
typically 370 μA. The TMP05/TMP06 are rated for operation
over the –40°C to +150°C temperature range. It is not recom-
mended to operate these devices at temperatures above 125°C
for more than a total of 5% (5,000 hours) of the lifetime of the
devices. They are packaged in low cost, low area SC-70 and
SOT-23 packages.
2. Supply voltage is 3 V to 5.5 V.
3. Space-saving 5-lead SOT-23 and SC-70 packages.
4. Temperature accuracy is typically 0.5°C. ꢀach part needs
a decoupling capacitor to achieve this accuracy.
5. Temperature resolution of 0.025°C.
6. The TMP05/TMP06 feature a one shot mode that reduces
the average power consumption to 102 μW at 1 SPS.
The TMP05/TMP06 have three modes of operation: continu-
ously converting mode, daisy-chain mode, and one shot mode.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice.
No license is granted by implication or otherwise under any patent or patent rights of Analog
Devices.Trademarks and registered trademarks are theproperty of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2006 Analog Devices, Inc. All rights reserved.
TWꢀ±./TWꢀ±6C
T BLECOFC°ONTENTSC
Features .............................................................................................. 1
Converter Details ....................................................................... 13
Functional Description.............................................................. 13
Operating Modes........................................................................ 13
TMP05 Output ........................................................................... 16
TMP06 Output ........................................................................... 16
Application Hints ........................................................................... 17
Thermal Response Time ........................................................... 17
Self-Heating ꢀffects.................................................................... 17
Supply Decoupling ..................................................................... 17
Layout Considerations............................................................... 18
Temperature Monitoring........................................................... 18
Daisy-Chain Application........................................................... 18
Continuously Converting Application .................................... 24
Outline Dimensions....................................................................... 26
Ordering Guide .......................................................................... 26
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
TMP05A/TMP06A Specifications ............................................. 3
TMP05B/TMP06B Specifications .............................................. 5
Timing Characteristics ................................................................ 7
Absolute Maximum Ratings............................................................ 8
ꢀSD Caution.................................................................................. 8
Pin Configuration and Function Descriptions............................. 9
Typical Performance Characteristics ........................................... 10
Theory of Operation ...................................................................... 13
Circuit Information.................................................................... 13
REVISION HISTORY
4/06—Rev. A to Rev. B
Deleted Figure 18............................................................................ 12
Changes to One Shot Mode Section ............................................ 14
Changes to Figure 20...................................................................... 14
Changes to Daisy-Chain Mode Section ...................................... 15
Changes to Figure 23...................................................................... 15
Changes to ꢀquation 5 and ꢀquation 7 ....................................... 17
Added Layout Considerations Section........................................ 18
Updated Outline Dimensions....................................................... 26
Changes to Ordering Guide.......................................................... 26
Changes to Table 1............................................................................ 3
Changes to Table 2............................................................................ 5
Changes to Table 8.......................................................................... 14
Changes to Table 9.......................................................................... 15
10/05—Rev. 0 to Rev. A
Changes to Specifications Table...................................................... 3
Changes to Absolute Maximum Ratings....................................... 8
Changes to Figure 4.......................................................................... 8
Changes to Figure 7........................................................................ 10
Changes to Figure 15...................................................................... 11
8/04—Revision 0: Initial Version
Rev. B | Page 2 of 28
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TWꢀ±./TWꢀ±6
SꢀE°IFI° TIONSC
TMP0ꢀA/TMP06A SPECIFICATIONS
All A grade specifications apply for −40°C to +150°C, VDD decoupling capacitor is a 0.1 μF multilayer ceramic, TA = TMIN to TMAX
,
VDD = 3.0 V to 5.5 V, unless otherwise noted.
Table 1.
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
TEMPERATURE SENSOR AND ADC
Nominal Conversion Rate (One Shot Mode)
Accuracy @ VDD = 3.0 V to 5.5 V
See Table 7
TA = 0°C to 70°C, VDD = 3.0 V to 5.5 V
TA = –40°C to +100°C, VDD = 3.0 V to 5.5 V
TA = –40°C to +125°C, VDD = 3.0 V to 5.5 V
TA = –40°C to +150°C, VDD = 3.0 V to 5.5 V
2
3
4
51
°C
°C
°C
°C
Temperature Resolution
TH Pulse Width
TL Pulse Width
0.025
40
76
°C/5 μs Step size for every 5 μs on TL
ms
ms
TA = 25°C, nominal conversion rate
TA = 25°C, nominal conversion rate
Quarter Period Conversion Rate
(All Operating Modes)
Accuracy
See Table 7
@ VDD = 3.3 V (3.0 V to 3.6 V)
@ VDD = 5 V (4.5 V to 5.5 V)
Temperature Resolution
TH Pulse Width
1.5
1.5
0.1
10
°C
°C
TA = –40°C to +150°C
TA = –40°C to +150°C
°C/5 μs Step size for every 5 μs on TL
ms
ms
TA = 25°C, QI conversion rate
TA = 25°C, QP conversion rate
TL Pulse Width
19
Double High/Quarter Low Conversion Rate
(All Operating Modes)
Accuracy
See Table 7
@ VDD = 3.3 V (3.0 V to 3.6 V)
@ VDD = 5 V (4.5 V to 5.5 V)
Temperature Resolution
TH Pulse Width
TL Pulse Width
Long-Term Drift
1.5
1.5
0.1
80
19
°C
°C
TA = –40°C to +150°C
TA = –40°C to +150°C
°C/5 μs Step size for every 5 μs on TL
ms
ms
°C
TA = 25°C, DH/QL conversion rate
TA = 25°C, DH/QL conversion rate
Drift over 10 years, if part is operated at 55°C
Temperature cycle = 25°C to 100°C to 25°C
0.081
0.0023
Temperature Hysteresis
SUPPLIES
°C
Supply Voltage
3
5.5
V
Supply Current
Normal Mode2
@ 3.3 V
@ 5.0 V
Quiescent2
370
425
600
650
μA
μA
Nominal conversion rate
Nominal conversion rate
@ 3.3 V
@ 5.0 V
One Shot Mode @ 1 SPS
3
5.5
30.9
12
20
μA
μA
μA
Device not converting, output is high
Device not converting, output is high
Average current @ VDD = 3.3 V,
nominal conversion rate @ 25°C
37.38
803.33
101.9
186.9
μA
Average current @ VDD = 5.0 V,
nominal conversion rate @ 25°C
VDD = 3.3 V, continuously converting at
nominal conversion rates @ 25°C
Average power dissipated for VDD = 3.3 V,
one shot mode @ 25°C
Average power dissipated for VDD = 5.0 V,
one shot mode @ 25°C
Power Dissipation
1 SPS
μW
μW
μW
Rev. B | Page 3 of 28
TWꢀ±./TWꢀ±6C
Parameter
TMP05 OUTPUT (PUSH-PULL)3
Min
Typ
Max
Unit
Test Conditions/Comments
Output High Voltage (VOH)
VDD − 0.3
2
V
V
IOH = 800 μA
IOL = 800 μA
Typ VOH = 3.17 V with VDD = 3.3 V
Output Low Voltage (VOL)
0.4
4
Output High Current (IOUT
Pin Capacitance
Rise Time (tLH)5
)
mA
pF
ns
ns
Ω
10
50
50
55
Fall Time (tHL)5
RON Resistance (Low Output)
TMP06 OUTPUT (OPEN DRAIN)3
Output Low Voltage (VOL)
Output Low Voltage (VOL)
Pin Capacitance
High Output Leakage Current (IOH)
Device Turn-On Time
Fall Time (tHL)6
RON Resistance (Low Output)
DIGITAL INPUTS3
Input Current
Input Low Voltage (VIL)
Input High Voltage (VIH)
Pin Capacitance
Supply and temperature dependent
0.4
1.2
V
V
IOL = 1.6 mA
IOL = 5.0 mA
10
0.1
20
30
55
pF
μA
ms
ns
Ω
5
PWMOUT = 5.5 V
Supply and temperature dependent
VIN = 0 V to VDD
1
μA
V
V
0.3 × VDD
0.7 × VDD
3
10
pF
1 It is not recommended to operate the device at temperatures above 125°C for more than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure beyond
this limit affects device reliability.
2 Normal mode current relates to current during TL. TMP05/TMP06 are not converting during TH, so quiescent current relates to current during TH.
3 Guaranteed by design and characterization, not production tested.
4 It is advisable to restrict the current being pulled from the TMP05 output because any excess currents going through the die cause self-heating. As a consequence,
false temperature readings can occur.
5 Test load circuit is 100 pF to GND.
6 Test load circuit is 100 pF to GND, 10 kΩ to 5.5 V.
Rev. B | Page 4 of 28
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TWꢀ±./TWꢀ±6
TMP0ꢀB/TMP06B SPECIFICATIONS
All B grade specifications apply for –40°C to +150°C; VDD decoupling capacitor is a 0.1 μF multilayer ceramic; TA = TMIN to TMAX
,
VDD = 3 V to 5.5 V, unless otherwise noted.
Table 2.
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
TEMPERATURE SENSOR AND ADC
Nominal Conversion Rate (One Shot Mode)
Accuracy1
See Table 7
@ VDD = 3.3 V ( 5%)
@ VDD = 5 V ( 10%)
@ VDD = 3.3 V ( 10%) and 5 V ( 10%)
0.2
0.4
1
°C
°C
°C
TA = 0°C to 70°C, VDD = 3.135 V to 3.465 V
TA = 0°C to 70°C, VDD = 4.5 V to 5.5 V
TA = –40°C to +70°C, VDD = 3.0 V to 3.6 V,
VDD = 4.5 V to 5.5 V
−1/+1.5
1.5
2
°C
°C
°C
TA = –40°C to +100°C, VDD = 3.0 V to 3.6 V,
VDD = 4.5 V to 5.5 V
TA = –40°C to +125°C, VDD = 3.0 V to 3.6 V,
2.5
4.52
V
DD = 4.5 V to 5.5 V
TA = –40°C to +150°C, VDD = 3.0 V to 3.6 V,
VDD = 4.5 V to 5.5 V
Temperature Resolution
TH Pulse Width
TL Pulse Width
0.025
40
76
°C/5 μs
ms
ms
Step size for every 5 μs on TL
TA = 25°C, nominal conversion rate
TA = 25°C, nominal conversion rate
See Table 7
Quarter Period Conversion Rate
(All Operating Modes)
Accuracy1
@ VDD = 3.3 V (3.0 V to 3.6 V)
@ VDD = 5.0 V (4.5 V to 5.5 V)
Temperature Resolution
TH Pulse Width
TL Pulse Width
Double High/Quarter Low Conversion Rate
(All Operating Modes)
1.5
1.5
0.1
10
°C
°C
°C/5 μs
ms
ms
TA = –40°C to +150°C
TA = –40°C to +150°C
Step size for every 5 μs on TL
TA = 25°C, QP conversion rate
TA = 25°C, QP conversion rate
See Table 7
19
Accuracy1
@ VDD = 3.3 V (3.0 V to 3.6 V)
@ VDD = 5 V (4.5 V to 5.5 V)
Temperature Resolution
TH Pulse Width
TL Pulse Width
Long-Term Drift
Temperature Hysteresis
SUPPLIES
1.5
1.5
0.1
80
19
°C
°C
°C/5 μs
ms
ms
°C
TA = –40°C to +150°C
TA = –40°C to +150°C
Step size for every 5 μs on TL
TA = 25°C, DH/QL conversion rate
TA = 25°C, DH/QL conversion rate
Drift over 10 years, if part is operated at 55°C
Temperature cycle = 25°C to 100°C to 25°C
0.081
0.0023
°C
Supply Voltage
Supply Current
Normal Mode3
@ 3.3 V
@ 5.0 V
Quiescent3
3
5.5
V
370
425
600
650
μA
μA
Nominal conversion rate
Nominal conversion rate
@ 3.3 V
@ 5.0 V
One Shot Mode @ 1 SPS
3
5.5
30.9
12
20
μA
μA
μA
Device not converting, output is high
Device not converting, output is high
Average current @ VDD = 3.3 V,
nominal conversion rate @ 25°C
37.38
μA
Average current @ VDD = 5.0 V,
nominal conversion rate @ 25°C
Rev. B | Page 5 of 28
TWꢀ±./TWꢀ±6C
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
Power Dissipation
803.33
μW
VDD = 3.3 V, continuously converting at
nominal conversion rates @ 25°C
1 SPS
101.9
186.9
μW
μW
Average power dissipated for VDD = 3.3 V,
one shot mode @ 25°C
Average power dissipated for VDD = 5.0 V,
one shot mode @ 25°C
TMP05 OUTPUT (PUSH-PULL)4
Output High Voltage (VOH)
VDD − 0.3
2
V
V
IOH = 800 μA
IOL = 800 μA
Typical VOH = 3.17 V with VDD = 3.3 V
Output Low Voltage (VOL)
0.4
5
Output High Current (IOUT
Pin Capacitance
Rise Time (tLH)6
)
mA
pF
ns
ns
Ω
10
50
50
55
Fall Time (tHL)6
RON Resistance (Low Output)
TMP06 OUTPUT (OPEN DRAIN)4
Output Low Voltage (VOL)
Output Low Voltage (VOL)
Pin Capacitance
High Output Leakage Current (IOH)
Device Turn-On Time
Fall Time (tHL)7
RON Resistance (Low Output)
DIGITAL INPUTS4
Input Current
Input Low Voltage (VIL)
Input High Voltage (VIH)
Pin Capacitance
Supply and temperature dependent
0.4
1.2
V
V
IOL = 1.6 mA
IOL = 5.0 mA
10
0.1
20
30
55
pF
μA
ms
ns
Ω
5
PWMOUT = 5.5 V
Supply and temperature dependent
VIN = 0 V to VDD
1
μA
V
V
0.3 × VDD
0.7 × VDD
3
10
pF
1 The accuracy specifications for 3.0 V to 3.6 V and 4.5 V to 5.5 V supply ranges are specified to 3-Σ performance.
2 It is not recommended to operate the device at temperatures above 125°C for more than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure beyond
this limit affects device reliability.
3 Normal mode current relates to current during TL. TMP05/TMP06 are not converting during TH, so quiescent current relates to current during TH.
4 Guaranteed by design and characterization, not production tested.
5 It is advisable to restrict the current being pulled from the TMP05 output because any excess currents going through the die cause self-heating. As a consequence,
false temperature readings can occur.
6 Test load circuit is 100 pF to GND.
7 Test load circuit is 100 pF to GND, 10 kΩ to 5.5 V.
Rev. B | Page 6 of 28
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TWꢀ±./TWꢀ±6
TIMING CHARACTERISTICS
TA = TMIN to TMAX, VDD = 3.0 V to 5.5 V, unless otherwise noted. Guaranteed by design and characterization, not production tested.
Table 3.
Parameter
Limit
40
76
50
50
Unit
Comments
TH
TL
ms typ
ms typ
ns typ
ns typ
ns typ
μs max
PWM high time @ 25°C under nominal conversion rate
PWM low time @ 25°C under nominal conversion rate
TMP05 output rise time
TMP05 output fall time
TMP06 output fall time
1
t3
t4
t4
1
2
30
25
t5
Daisy-chain start pulse width
1 Test load circuit is 100 pF to GND.
2 Test load circuit is 100 pF to GND, 10 kΩ to 5.5 V.
T
L
T
H
t3
t4
10% 90%
90% 10%
Figure 2. PWM Output Nominal Timing Diagram (25°C)
START PULSE
t5
Figure 3. Daisy-Chain Start Timing
Rev. B | Page 7 of 28
TWꢀ±./TWꢀ±6C
BSOLUTECW XIWUWCR TINGSC
Table 4.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. ꢀxposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
Rating
VDD to GND
–0.3 V to +7 V
–0.3 V to VDD + 0.3 V
10 mA
–40°C to +150°C
–65°C to +160°C
Digital Input Voltage to GND
Maximum Output Current (OUT)
Operating Temperature Range1
Storage Temperature Range
Maximum Junction Temperature, TJ max 150°C
5-Lead SOT-23 (RJ-5)
0.9
0.8
0.7
0.6
0.5
Power Dissipation2
Thermal Impedance4
θJA, Junction-to-Ambient (Still Air)
5-Lead SC-70 (KS-5)
WMAX = (TJ max – TA )/θJA
3
240°C/W
Power Dissipation2
WMAX = (TJ max – TA )/θJA
3
Thermal Impedance4
θJA, Junction-to-Ambient
θJC, Junction-to-Case
IR Reflow Soldering
Peak Temperature
Time at Peak Temperature
Ramp-Up Rate
0.4
0.3
0.2
0.1
0
SOT-23
534.7°C/W
172.3°C/W
SC-70
220°C (0°C/5°C)
10 sec to 20 sec
2°C/s to 3°C/s
−6°C/s
TEMPERATURE (°C)
Ramp-Down Rate
Time 25°C to Peak Temperature
IR Reflow Soldering (Pb-Free Package)
Peak Temperature
6 minutes max
Figure 4. Maximum Power Dissipation vs. Ambient Temperature
260°C (0°C)
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
20 sec to 40 sec
3°C/sec max
–6°C/sec max
8 minutes max
Time 25°C to Peak Temperature
1 It is not recommended to operate the device at temperatures above 125°C
for more than a total of 5% (5,000 hours) of the lifetime of the device. Any
exposure beyond this limit affects device reliability.
2 SOT-23 values relate to the package being used on a 2-layer PCB and SC-70
values relate to the package being used on a 4-layer PCB. See Figure 4 for a
plot of maximum power dissipation vs. ambient temperature (TA).
3 TA = ambient temperature.
4 Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient resistance is more useful for air-cooled PCB
mounted components.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. B | Page 8 of 28
C
TWꢀ±./TWꢀ±6
ꢀINC°ONFIGUR TIONC NDCFUN°TIONCDES°RIꢀTIONSCC
OUT
CONV/IN
FUNC
1
2
3
5
V
DD
TMP05/
TMP06
TOP VIEW
(Not to Scale)
4
GND
Figure 5. Pin Configuration
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
1
OUT
Digital Output. Pulse-width modulated (PWM) output gives a square wave whose ratio of high-to-low period is
proportional to temperature.
2
CONV/IN
Digital Input. In continuously converting and one shot operating modes, a high, low, or float input determines the
temperature measurement rate. In daisy-chain operating mode, this pin is the input pin for the PWM signal from
the previous part on the daisy chain.
3
FUNC
Digital Input. A high, low, or float input on this pin gives three different modes of operation. For details, see the
Operating Modes section.
4
5
GND
VDD
Analog and Digital Ground.
Positive Supply Voltage, 3.0 V to 5.5 V. Using a decoupling capacitor of 0.1 μF as close as possible to this pin is
strongly recommended.
Rev. B | Page 9 of 28
TWꢀ±./TWꢀ±6C
TYꢀI° LCꢀERFORW N°EC°H R °TERISTI°SCC
10
V
C
= 3.3V AND 5V
DD
9
8
7
6
5
4
3
2
= 100pF
LOAD
0
V
= 3.3V AND 5V
DD
OUT PIN LOADED WITH 10kΩ
1
1V/DIV
100ns/DIV
0
0
–50 –30 –10
10
30
50
70
90
110 130 150
TIME (ns)
TEMPERATURE (°C)
Figure 6. PWM Output Frequency vs. Temperature
Figure 9. TMP05 Output Rise Time at 25°C
8.57
8.56
8.55
8.54
8.53
8.52
8.51
8.50
V
C
= 3.3V AND 5V
DD
= 100pF
LOAD
0
OUT PIN LOADED WITH 10kΩ
AMBIENT TEMPERATURE = 25°C
1V/DIV
100ns/DIV
0
3.0
3.3
3.6
3.9
4.2
4.5
4.8
5.1
5.4
TIME (ns)
SUPPLY VOLTAGE (V)
Figure 7. PWM Output Frequency vs. Supply Voltage
Figure 10. TMP05 Output Fall Time at 25°C
140
120
100
80
V
= 3.3V AND 5V
DD
OUT PIN LOADED WITH 10kΩ
T
TIME
L
V
= 3.3V AND 5V
DD
R
R
C
= 1kΩ
= 10kΩ
PULLUP
LOAD
LOAD
= 100pF
0
60
T
TIME
H
40
20
1V/DIV
100ns/DIV
0
0
–50 –30 –10
10
30
50
70
90
110 130 150
TIME (ns)
TEMPERATURE (°C)
Figure 11. TMP06 Output Fall Time at 25°C
Figure 8. TH and TL Times vs. Temperature
Rev. B | Page 10 of 28
C
TWꢀ±./TWꢀ±6
2000
1800
1600
1400
1200
1000
800
1.25
1.00
0.75
0.50
0.25
0
V
= 3.3V AND 5V
DD
CONTINUOUS MODE OPERATION
NOMINAL CONVERSION RATE
RISE TIME
5V
–0.25
–0.50
–0.75
–1.00
–1.25
3.3V
600
FALL TIME
400
200
0
0
1000 2000 3000 4000 5000 6000 7000 8000 9000 10000
CAPACTIVE LOAD (pF)
–40
–20
0
20
40
60
80
100
120
140
TEMPERATURE (°C)
Figure 12. TMP05 Output Rise and Fall Times vs. Capacitive Load
Figure 15. Output Accuracy vs. Temperature
250
350
300
250
200
150
100
50
V
= 3.3V AND 5V
DD
CONTINUOUS MODE OPERATION
NOMINAL CONVERSION RATE
NO LOAD ON OUT PIN
V
= 3.3V AND 5V
DD
I
= 5mA
LOAD
200
150
100
50
I
= 1mA
LOAD
I
= 0.5mA
LOAD
0
–50
0
–50
–25
0
25
50
75
100
125
150
–25
0
25
50
75
100
125
150
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 13. TMP06 Output Low Voltage vs. Temperature
Figure 16. Supply Current vs. Temperature
35
30
25
20
15
255
250
245
240
235
230
225
220
215
AMBIENT TEMPERATURE = 25°C
CONTINUOUS MODE OPERATION
NOMINAL CONVERSION RATE
NO LOAD ON OUT PIN
V
= 3.3V AND 5V
DD
–50
–25
0
25
50
75
100
125
150
2.7
3.0
3.3
3.6
3.9
4.2
4.5
4.8
5.1
5.4
5.7
TEMPERATURE (°C)
SUPPLY VOLTAGE (V)
Figure 14. TMP06 Open Drain Sink Current vs. Temperature
Figure 17. Supply Current vs. Supply Voltage
Rev. B | Page 11 of 28
TWꢀ±./TWꢀ±6C
140
120
100
80
1.25
1.00
0.75
0.50
0.25
0
V
= 3.3V AND 5V
DD
AMBIENT TEMPERATURE = 25°C
FINAL TEMPERATURE = 120°C
60
TEMPERATURE OF
ENVIRONMENT (30°C)
CHANGED HERE
40
20
0
0
10
20
30
40
50
60
70
0
5
10
15
20
25
30
TIME (Seconds)
LOAD CURRENT (mA)
Figure 18. Response to Thermal Shock
Figure 19. TMP05 Temperature Error vs. Load Current
Rev. B | Page 12 of 28
C
TWꢀ±./TWꢀ±6
THEORYCOFCOꢀER TIONC
The modulated output of the comparator is encoded using a
circuit technique that results in a serial digital signal with a
mark-space ratio format. This format is easily decoded by any
microprocessor into either °C or °F values, and is readily
transmitted or modulated over a single wire. More importantly,
this encoding method neatly avoids major error sources
common to other modulation techniques because it is clock-
independent.
CIRCUIT INFORMATION
The TMP05/TMP06 are monolithic temperature sensors that
generate a modulated serial digital output that varies in direct
proportion with the temperature of each device. An on-board
sensor generates a voltage precisely proportional to absolute
temperature, which is compared to an internal voltage reference
and is input to a precision digital modulator. The ratiometric
encoding format of the serial digital output is independent of
the clock drift errors common to most serial modulation
techniques such as voltage-to-frequency converters. Overall
accuracy for the A grade is 2°C from 0°C to +70°C with
excellent transducer linearity. B grade accuracy is 1°C from
0°C to 70°C. The digital output of the TMP05 is CMOS-/TTL-
compatible and is easily interfaced to the serial inputs of most
popular microprocessors. The open-drain output of the TMP06
is capable of sinking 5 mA.
FUNCTIONAL DESCRIPTION
The output of the TMP05/TMP06 is a square wave with a
typical period of 116 ms at 25°C (CONV/IN pin is left floating).
The high period, TH, is constant, while the low period, TL, varies
with measured temperature. The output format for the nominal
conversion rate is readily decoded by the user as follows:
Temperature (°C) = 421 − (751 × (TH/TL))
(1)
The on-board temperature sensor has excellent accuracy and
linearity over the entire rated temperature range without
correction or calibration by the user.
T
T
L
H
Figure 21. TMP05/TMP06 Output Format
The sensor output is digitized by a first-order Σ-Δ modulator,
also known as the charge balance type analog-to-digital
converter. This type of converter utilizes time-domain over-
sampling and a high accuracy comparator to deliver 12 bits of
effective accuracy in an extremely compact circuit.
The time periods TH (high period) and TL (low period) are
values easily read by a microprocessor timer/counter port, with
the above calculations performed in software. Because both
periods are obtained consecutively using the same clock,
performing the division indicated in ꢀquation 1 results in a
ratiometric value independent of the exact frequency or drift of
the TMP05/TMP06 originating clock or the user’s counting clock.
CONVERTER DETAILS
The Σ-Δ modulator consists of an input sampler, a summing
network, an integrator, a comparator, and a 1-bit DAC. Similar
to the voltage-to-frequency converter, this architecture creates,
in effect, a negative feedback loop whose intent is to minimize
the integrator output by changing the duty cycle of the
comparator output in response to input voltage changes. The
comparator samples the output of the integrator at a much
higher rate than the input sampling frequency, which is called
oversampling. Oversampling spreads the quantization noise
over a much wider band than that of the input signal, improving
overall noise performance and increasing accuracy.
OPERATING MODES
The user can program the TMP05/TMP06 to operate in three
different modes by configuring the FUNC pin on power-up as
either low, floating, or high.
Table 6. Operating Modes
FUNC Pin
Operating Mode
Low
Floating
High
One shot
Continuously converting
Daisy-chain
Σ-Δ MODULATOR
Continuously Converting Mode
INTEGRATOR
COMPARATOR
In continuously converting mode, the TMP05/TMP06 continu-
ously output a square wave representing temperature. The
frequency at which this square wave is output is determined by
the state of the CONV/IN pin on power-up. Any change to the
state of the CONV/IN pin after power-up is not reflected in the
parts until the TMP05/TMP06 are powered down and back up.
+
VOLTAGE REF
AND VPTAT
+
–
–
1-BIT
DAC
TMP05/TMP06
OUT
(SINGLE-BIT)
CLOCK
GENERATOR
DIGITAL
FILTER
Figure 20. First-Order Σ-∆ Modulator
Rev. B | Page 13 of 28
TWꢀ±./TWꢀ±6C
One Shot Mode
Conversion Rate
In one shot mode, the TMP05/TMP06 output one square wave
representing temperature when requested by the microcon-
troller. The microcontroller pulls the OUT pin low and then
releases it to indicate to the TMP05/TMP06 that an output is
required. The time between the OUT pin going low to the time
it is released should be greater than 20 ns. Internal hysteresis in
the OUT pin prevents the TMP05/TMP06 from recognizing
that the pulse is going low (if it is less than 20 ns). The
temperature measurement is output when the OUT line is
released by the microcontroller (see Figure 22).
In continuously converting and one shot modes, the state of the
CONV/IN pin on power-up determines the rate at which the
TMP05/TMP06 measure temperature. The available conversion
rates are shown in Table 7.
Table 7. Conversion Rates
CONV/IN Pin
Conversion Rate
TH/TL (2ꢀ5C)
Low
Quarter period
(TH/4, TL/4)
10/19 (ms)
Floating
High
Nominal
Double high (TH x 2)
Quarter low (TL/4)
40/76 (ms)
80/19 (ms)
µCONTROLLER PULLS DOWN
OUT LINE HERE
µCONTROLLER RELEASES
OUT LINE HERE
The TMP05 (push-pull output) advantage when using the high
state conversion rate (double high/quarter low) is lower power
consumption. However, the trade-off is loss of resolution on the
low time. Depending on the state of the CONV/IN pin, two
different temperature equations must be used.
TEMP MEASUREMENT
T
H
>20ns
T
L
The temperature equation for the low and floating states’
conversion rates is
T
0
TIME
Figure 22. TMP05/TMP06 One Shot OUT Pin Signal
Temperature (°C) = 421 − (751 × (TH/TL))
(2)
In the TMP05 one shot mode only, an internal resistor is
switched in series with the pull-up MOSFꢀT. The TMP05 OUT
pin has a push-pull output configuration (see Figure 23).
Therefore, it needs a series resistor to limit the current drawn
on this pin when the user pulls it low to start a temperature
conversion. This series resistance prevents any short circuit
from VDD to GND, and, as a result, protects the TMP05 from
short-circuit damage.
Table 8. Conversion Times Using Equation 2
Temperature (5C)
TL (ms)
65.2
66.6
68.1
69.7
71.4
73.1
74.9
75.9
76.8
78.8
81
Cycle Time (ms)
–40
–30
–20
–10
0
10
20
25
30
105
107
108
110
111
113
115
116
V+
117
119
121
40
50
5kΩ
60
70
80
90
100
110
120
130
140
150
83.2
85.6
88.1
90.8
93.6
96.6
99.8
103.2
106.9
110.8
123
126
128
131
134
137
140
143
OUT
TMP05
Figure 23. TMP05 One Shot Mode OUT Pin Configuration
The advantages of the one shot mode include lower average
power consumption, and the microcontroller knowing that the
first low-to-high transition occurs after the microcontroller
releases the OUT pin.
147
151
Rev. B | Page 14 of 28
C
TWꢀ±./TWꢀ±6
The temperature equation for the high state conversion rate is
A second microcontroller line is needed to generate the conver-
sion start pulse on the CONV/IN pin. The pulse width of the
start pulse should be less than 25 μs but greater than 20 ns. The
start pulse on the CONV/IN pin lets the first TMP05/TMP06
part know that it should now start a conversion and output its
own temperature. Once the part has output its own temperature,
it outputs a start pulse for the next part on the daisy-chain link.
The pulse width of the start pulse from each TMP05/TMP06 part
is typically 17 μs.
Temperature (°C) = 421 − (93.875 × (TH/TL))
(3)
Table 9. Conversion Times Using Equation 3
Temperature (5C)
TL (ms)
16.3
16.7
17
17.4
17.8
18.3
18.7
19
Cycle Time (ms)
–40
–30
–20
–10
0
10
20
25
96.2
96.6
97.03
97.42
97.84
98.27
98.73
98.96
Figure 25 shows the start pulse on the CONV/IN pin of the first
device on the daisy chain. Figure 26 shows the PWM output by
this first part.
30
40
50
60
70
80
90
100
110
120
130
140
150
19.2
19.7
20.2
20.8
21.4
22
22.7
23.4
24.1
25
99.21
99.71
100.24
100.8
101.4
102.02
102.69
103.4
104.15
104.95
105.81
106.73
107.71
Before the start pulse reaches a TMP05/TMP06 part in the
daisy chain, the device acts as a buffer for the previous tempera-
ture measurement signals. ꢀach part monitors the PWM signal
for the start pulse from the previous part. Once the part detects
the start pulse, it initiates a conversion and inserts the result at
the end of the daisy-chain PWM signal. It then inserts a start
pulse for the next part in the link. The final signal input to the
microcontroller should look like Figure 27. The input signal on
Pin 2 (IN) of the first daisy-chain device must remain low until
the last device has output its start pulse.
25.8
26.7
27.7
If the input on Pin 2 (IN) goes high and remains high, the
TMP05/TMP06 part powers down between 0.3 sec and 1.2 sec
later. The part, therefore, requires another start pulse to generate
another temperature measurement. Note that to reduce power
dissipation through the part, it is recommended to keep Pin 2
(IN) at a high state when the part is not converting. If the IN pin
is at 0 V, the OUT pin is at 0 V (because it is acting as a buffer
when not converting), and is drawing current through either the
pull-up MOSFꢀT (TMP05) or the pull-up resistor (TMP06).
Daisy-Chain Mode
Setting the FUNC pin to a high state allows multiple TMP05/
TMP06s to be connected together and, therefore, allows one input
line of the microcontroller to be the sole receiver of all temperature
measurements. In this mode, the CONV/IN pin operates as the
input of the daisy chain. In addition, conversions take place at
the nominal conversion rate of TH/TL = 40 ms/76 ms at 25°C.
MUST GO HIGH ONLY
AFTER START PULSE HAS
BEEN OUTPUT BY LAST
TMP05/TMP06 ON DAISY CHAIN.
Therefore, the temperature equation for the daisy-chain mode
of operation is
START
PULSE
Temperature (°C) = 421 − (751 × (TH∕TL))
(4)
CONVERSION
STARTS ON
THIS EDGE
>20ns
AND
<25µs
OUT
CONV/IN
>20ns
TMP05/
TMP06
MICRO
T
#1
0
TIME
CONV/IN
OUT
IN
Figure 25. Start Pulse at CONV/IN Pin of First
TMP05/TMP06 Device on Daisy Chain
TMP05/
TMP06
#2
OUT
CONV/IN
TMP05/
TMP06
START
PULSE
#1 TEMP MEASUREMENT
#3
OUT
CONV/IN
TMP05/
TMP06
17µs
#N
OUT
T
TIME
0
Figure 26. Daisy-Chain Temperature Measurement
and Start Pulse Output from First TMP05/TMP06
Figure 24. Daisy-Chain Structure
Rev. B | Page 15 of 28
TWꢀ±./TWꢀ±6C
START
PULSE
#1 TEMP MEASUREMENT
#2 TEMP MEASUREMENT
#N TEMP MEASUREMENT
T
TIME
0
Figure 27. Daisy-Chain Signal at Input to the Microcontroller
TMP0ꢀ OUTPUT
TMP06 OUTPUT
The TMP05 has a push-pull CMOS output (Figure 28) and
provides rail-to-rail output drive for logic interfaces. The rise
and fall times of the TMP05 output are closely matched so that
errors caused by capacitive loading are minimized. If load
capacitance is large (for example, when driving a long cable),
an external buffer could improve accuracy.
The TMP06 has an open-drain output. Because the output
source current is set by the pull-up resistor, output capacitance
should be minimized in TMP06 applications. Otherwise,
unequal rise and fall times skew the pulse width and introduce
measurement errors.
OUT
An internal resistor is connected in series with the pull-up
MOSFꢀT when the TMP05 is operating in one shot mode.
V+
TMP06
Figure 29. TMP06 Digital Output Structure
OUT
TMP05
Figure 28. TMP05 Digital Output Structure
Rev. B | Page 16 of 28
C
TWꢀ±./TWꢀ±6
ꢀꢀLI° TIONCHINTSCC
THERMAL RESPONSE TIME
SUPPLY DECOUPLING
The time required for a temperature sensor to settle to a
specified accuracy is a function of the sensor’s thermal mass
and the thermal conductivity between the sensor and the object
being sensed. Thermal mass is often considered equivalent to
capacitance. Thermal conductivity is commonly specified using
the symbol Q and can be thought of as thermal resistance. It is
usually specified in units of degrees per watt of power transferred
across the thermal joint. Thus, the time required for the TMP05/
TMP06 to settle to the desired accuracy is dependent on the
package selected, the thermal contact established in that
particular application, and the equivalent power of the heat
source. In most applications, the settling time is probably best
determined empirically.
The TMP05/TMP06 should be decoupled with a 0.1 μF ceramic
capacitor between VDD and GND. This is particularly important
if the TMP05/TMP06 are mounted remotely from the power
supply. Precision analog products such as the TMP05/TMP06
require a well filtered power source. Because the parts operate
from a single supply, simply tapping into the digital logic power
supply could appear to be a convenient option. Unfortunately,
the logic supply is often a switch-mode design, which generates
noise in the 20 kHz to 1 MHz range. In addition, fast logic gates
can generate glitches hundreds of mV in amplitude due to
wiring resistance and inductance.
If possible, the TMP05/TMP06 should be powered directly
from the system power supply. This arrangement, shown in
Figure 30, isolates the analog section from the logic switching
transients. ꢀven if a separate power supply trace is not available,
generous supply bypassing reduces supply-line-induced errors.
Local supply bypassing consisting of a 0.1 μF ceramic capacitor
is critical for the temperature accuracy specifications to be
achieved. This decoupling capacitor must be placed as close as
possible to the TMP05/TMP06 VDD pin. A recommended
decoupling capacitor is Phicomp’s 100 nF, 50 V X74.
SELF-HEATING EFFECTS
The temperature measurement accuracy of the TMP05/TMP06
can be degraded in some applications due to self-heating. ꢀrrors
are introduced from the quiescent dissipation and power dissipated
when converting, that is, during TL. The magnitude of these
temperature errors depends on the thermal conductivity of the
TMP05/TMP06 package, the mounting technique, and the
effects of airflow. Static dissipation in the TMP05/TMP06 is
typically 10 μW operating at 3.3 V with no load. In the 5-lead
SC-70 package mounted in free air, this accounts for a
temperature increase due to self-heating of
It is important to keep the capacitor package size as small as
possible because ꢀSL (equivalent series inductance) increases
with increasing package size. Reducing the capacitive value
below 100 nF increases the ꢀSR (equivalent series resistance).
Using a capacitor with an ꢀSL of 1 nH and an ꢀSR of 80 mΩ is
recommended.
ꢁT = PDISS × θJA = 10 μW × 534.7°C/W = 0.0053°C
(5)
In addition, power is dissipated by the digital output, which is
capable of sinking 800 μA continuously (TMP05). Under an
800 μA load, the output can dissipate
TTL/CMOS
LOGIC
CIRCUITS
TMP05/
TMP06
0.1µF
P
DISS = (0.4 V)(0.8 mA)((TL)/TH + TL))
(6)
For example, with TL = 80 ms and TH = 40 ms, the power
dissipation due to the digital output is approximately 0.21 mW.
In a free-standing SC-70 package, this accounts for a tempera-
ture increase due to self-heating of
POWER
SUPPLY
ꢁT = PDISS × θJA = 0.21 mW × 534.7°C/W = 0.112°C
(7)
Figure 30. Use Separate Traces to Reduce Power Supply Noise
This temperature increase directly adds to that from the
quiescent dissipation and affects the accuracy of the TMP05/
TMP06 relative to the true ambient temperature.
It is recommended that current dissipated through the device be
kept to a minimum because it has a proportional effect on the
temperature error.
Rev. B | Page 17 of 28
TWꢀ±./TWꢀ±6C
nearby heat source, the thermal impedance between the heat
source and the TMP05/TMP06 must be considered. Often, a
thermocouple or other temperature sensor is used to measure
the temperature of the source, while the TMP05/TMP06
temperature is monitored by measuring TH and TL. Once the
thermal impedance is determined, the temperature of the heat
source can be inferred from the TMP05/TMP06 output.
LAYOUT CONSIDERATIONS
Digital boards can be electrically noisy environments and
glitches are common on many of the signals in the system.
The likelihood of glitches causing problems to the TMP05/
TMP06 OUT pin is very minute. The typical impedance of the
TMP05/TMP06 OUT pin when driving low is 55 Ω. When
driving high, the TMP05 OUT pin is similar. This low imped-
ance makes it very difficult for a glitch to break the VIL and VIH
thresholds. There is a slight risk that a sizeable glitch could
cause problems. A glitch can only cause problems when the
OUT pin is low during a temperature measurement. If a glitch
occurs that is large enough to fool the master into believing that
the temperature measurement is over, the temperature read
would not be the actual temperature. In most cases, the master
spots a temperature value that is erroneous and can request
another temperature measurement for confirmation. One area
that can cause problems is if this very large glitch occurs near
the end of the low period of the mark-space waveform, and the
temperature read back is so close to the expectant temperature
that the master does not question it.
One example of using the TMP05/TMP06’s unique properties is
in monitoring a high power dissipation microprocessor. ꢀach
TMP05/TMP06 part, in a surface-mounted package, is
mounted directly beneath the microprocessor’s pin grid array
(PGA) package. In a typical application, the TMP05/TMP06
output is connected to an ASIC, where the pulse width is
measured. The TMP05/TMP06 pulse output provides a
significant advantage in this application because it produces a
linear temperature output while needing only one I/O pin and
without requiring an ADC.
DAISY-CHAIN APPLICATION
This section provides an example of how to connect two
TMP05s in daisy-chain mode to a standard 8052 microcon-
troller core. The ADuC812 is the microcontroller used and the
core processing engine is the 8052. Figure 31 shows how to
interface to the 8052 core device. The TMP05 Program Code
ꢀxample 1 section shows how to communicate from the
ADuC812 to two daisy-chained TMP05s. This code can also be
used with the ADuC831 or any microprocessor running on an
8052 core.
One layout method that helps in reducing the possibility of a
glitch is to run ground tracks on either side of the OUT line.
Use a wide OUT track to minimize inductance and reduce noise
pickup. A 10 mil track minimum width and spacing is
recommended. Figure 31 shows how glitch protection traces
could be laid out.
10 MIL
GND
10 MIL
TIMER T0
TEMPSEGMENT = 1 TEMPSEGMENT = 2 TEMPSEGMENT = 3
STARTS
10 MIL
10 MIL
10 MIL
OUT
GND
TEMP_HIGH0
TEMP_HIGH1 TEMP_HIGH2
INTO
INTO
INTO
Figure 31. Use Separate Traces to Reduce Power Supply Noise
Another method that helps reduce the possibility of a glitch is to
use a 50 ns glitch filter on the OUT line. The glitch filter
eliminates any possibility of a glitch getting through to the
master or being passed along a daisy chain.
TEMP_LOW0
TEMP_LOW1
Figure 32. Reference Diagram for Software Variables
in the TMP05 Program Code Example 1
Figure 32 is a diagram of the input waveform into the ADuC812
from the TMP05 daisy chain. It illustrates how the code’s variables
are assigned and it should be referenced when reading the
TMP05 Program Code ꢀxample 1. Application notes showing
the TMP05 working with other types of microcontrollers are
available from Analog Devices at www.analog.com.
TEMPERATURE MONITORING
The TMP05/TMP06 are ideal for monitoring the thermal
environment within electronic equipment. For example, the
surface-mounted package accurately reflects the exact thermal
conditions that affect nearby integrated circuits.
The TMP05/TMP06 measure and convert the temperature at
the surface of their own semiconductor chip. When the
TMP05/TMP06 are used to measure the temperature of a
Figure 33 shows how the three devices are hardwired together.
Figure 34 to Figure 36 are flow charts for this program.
Rev. B | Page 18 of 28
C
TWꢀ±./TWꢀ±6
START
PULSE
V
DD
TMP05 (U1)
ADuC812
V
OUT
DD
CONV/IN
P3.7
0.1µF
V
DD
START
PULSE
T
(U1)
H
GND
FUNC
T
(U1)
L
T
0
TIME
V
DD
TMP05 (U2)
V
P3.2/INTO
OUT
DD
0.1µF
CONV/IN
V
DD
GND
FUNC
START
PULSE
T
(U1)
T (U2)
H
H
T
(U1)
T
(U2)
L
L
T
0
TIME
Figure 33. Typical Daisy-Chain Application Circuit
Rev. B | Page 19 of 28
TWꢀ±./TWꢀ±6C
DECLARE VARIABLES
INITIALIZE TIMERS
SET-UP UART
CONVERT VARIABLES
TO FLOATS
ENABLE TIMER
INTERRUPTS
CALCULATE
TEMPERATURE
FROM U1
SEND START
PULSE
TEMP U1 =
421 – (751 × (TEMP_HIGH0/
(TEMP_LOW0 – (TEMP_HIGH1)))
START TIMER 0
CALCULATE
TEMPERATURE
FROM U2
SET-UP EDGE
TRIGGERED
(H-L) INTO
TEMP U2 =
421 – (751 × (TEMP_HIGH1/
(TEMP_LOW1 – (TEMP_HIGH2)))
ENABLE INTO
INTERRUPT
SEND TEMPERATURE
RESULTS
ENABLE GLOBAL
INTERRUPTS
OUT OF UART
Figure 35. ADuC812 Temperature Calculation Routine Flowchart
WAIT FOR
INTERRUPT
PROCESS
INTERRUPTS
WAIT FOR END
OF MEASUREMENT
CALCULATE
TEMPERATURE
AND SEND
FROM UART
Figure 34. ADuC812 Main Routine Flowchart
Rev. B | Page 20 of 28
C
TWꢀ±./TWꢀ±6
ENTER INTERRUPT
ROUTINE
NO
CHECK IF TIMER 1
IS RUNNING
YES
START TIMER 1
COPY TIMER 1 VALUES
INTO A REGISTER
RESET TIMER 1
NO
IS TEMPSEGMENT
= 1
YE S
NO
IS TEMPSEGMENT
= 2
CALCULATE
TEMP_HIGH0
YES
RESET TIMER 0
TO ZERO
NO
IS TEMPSEGMENT
= 3
CALCULATE
TEMP_LOW0
USING TIMER 1
VALUES
YE S
CALCULATE
TEMP_HIGH1
USING TIMER 0
VALUES
CALCULATE
TEMP_LOW1
INCREMENT
TEMPSEGMENT
CALCULATE
TEMP_HIGH2
USING TIMER 0
VALUES
EXIT INTERRUPT
ROUTINE
RESET TIMER 0
TO ZERO
Figure 36. ADuC812 Interrupt Routine Flowchart
TMP05 Program Code Example 1
//=============================================================================================
// Description : This program reads the temperature from 2 daisy-chained TMP05 parts.
//
// This code runs on any standard 8052 part running at 11.0592MHz.
// If an alternative core frequency is used, the only change required is an
// adjustment of the baud rate timings.
//
// P3.2 = Daisy-chain output connected to INT0.
// P3.7 = Conversion control.
// Timer0 is used in gate mode to measure the high time.
// Timer1 is triggered on a high-to-low transition of INT0 and is used to measure
// the low time.
//=============================================================================================
Rev. B | Page 21 of 28
TWꢀ±./TWꢀ±6C
#include <stdio.h>
#include <ADuC812.h>
void delay(int);
//ADuC812 SFR definitions
//Daisy_Start_Pulse = P3.7
sbit Daisy_Start_Pulse = 0xB7;
sbit P3_4 = 0xB4;
long temp_high0,temp_low0,temp_high1,temp_low1,temp_high2,th,tl; //Global variables to allow
//access during ISR.
//See Figure 32.
int timer0_count=0,timer1_count=0,tempsegment=0;
void int0 () interrupt 0
//INT0 Interrupt Service Routine
{
if (TR1 == 1)
{
th = TH1;
tl = TL1;
th = TH1;
TL1 = 0;
TH1 = 0;
}
//To avoid misreading timer
TR1=1;
Already
//Start timer1 running, if not running
if (tempsegment == 1)
{
temp_high0 = (TH0*0x100+TL0)+(timer0_count*65536); //Convert to integer
TH0=0x00;
//Reset count
TL0=0x00;
timer0_count=0;
}
if (tempsegment == 2)
{
temp_low0 = (th*0x100+tl)+(timer1_count*65536);
//Convert to integer
temp_high1 = (TH0*0x100+TL0)+(timer0_count*65536); //Convert to integer
TH0=0x00;
TL0=0x00;
//Reset count
timer0_count=0;
timer1_count=0;
}
if (tempsegment == 3)
{
temp_low1 = (th*0x100+tl)+(timer1_count*65536);
//Convert to integer
//Reset count
temp_high2 = (TH0*0x100+TL0)+(timer0_count*65536);
TH0=0x00;
TL0=0x00;
timer0_count=0;
timer1_count=0;
}
tempsegment++;
}
void timer0 () interrupt 1
{
timer0_count++;
//Keep a record of timer0 overflows
//Keep a record of timer1 overflows
}
void timer1 () interrupt 3
{
timer1_count++;
Rev. B | Page 22 of 28
C
TWꢀ±./TWꢀ±6
}
void main(void)
{
double temp1=0,temp2=0;
double T1,T2,T3,T4,T5;
// Initialization
TMOD = 0x19;
// Timer1 in 16-bit counter mode
// Timer0 in 16-bit counter mode
// with gate on INT0. Timer0 only counts when INTO pin // is high.
ET0 = 1;
// Enable timer0 interrupts
ET1 = 1;
// Enable timer1 interrupts
// Initialize segment
tempsegment = 1;
Daisy_Start_Pulse = 0;
// Pull P3.7 low
// Start Pulse
Daisy_Start_Pulse = 1;
Daisy_Start_Pulse = 0;
// Set T0 to count the high period
TR0 = 1;
//Toggle P3.7 to give start pulse
// Start timer0 running
IT0 = 1;
// Interrupt0 edge triggered
EX0 = 1;
// Enable interrupt
EA = 1;
// Enable global interrupts
for(;;)
{
if (tempsegment == 4)
break;
}
//CONFIGURE UART
SCON = 0x52 ;
TMOD = 0x20 ;
TH1 = 0xFD ;
TR1 = 1;
// 8-bit, no parity, 1 stop bit
// Configure timer1..
// ..for 9600baud..
// ..(assuming 11.0592MHz crystal)
//Convert variables to floats for calculation
T1= temp_high0;
T2= temp_low0;
T3= temp_high1;
T4= temp_low1;
T5= temp_high2;
temp1=421-(751*(T1/(T2-T3)));
temp2=421-(751*(T3/(T4-T5)));
printf("Temp1 = %f\nTemp2 = %f\n",temp1,temp2);
//Sends temperature result out UART
// END of program
while (1);
}
// Delay routine
void delay(int length)
{
while (length >=0)
length--;
}
Rev. B | Page 23 of 28
TWꢀ±./TWꢀ±6C
CONTINUOUSLY CONVERTING APPLICATION
FIRST TEMP
MEASUREMENT
SECOND TEMP
MEASUREMENT
This section provides an example of how to connect one
TMP05 in continuously converting mode to a microchip
PIC16F876 microcontroller. Figure 37 shows how to interface
to the PIC16F876.
T
The TMP05 Program Code ꢀxample 2 shows how to
communicate from the microchip device to the TMP05. This
code can also be used with other PICs by changing the include
file for the part.
0
TIME
3.3V
PIC16F876
PA.0
TMP05
V
OUT
DD
CONV/IN
0.1µF
FUNC GND
Figure 37. Typical Continuously Converting Application Circuit
TMP05 Program Code Example 2
//=============================================================================================
//
// Description : This program reads the temperature from a TMP05 part set up in continuously
// converting mode.
// This code was written for a PIC16F876, but can be easily configured to function with other
// PICs by simply changing the include file for the part.
//
//
//
//
//
Fosc = 4MHz
Compiled under CCS C compiler IDE version 3.4
PWM output from TMP05 connected to PortA.0 of PIC16F876
//============================================================================================
#include <16F876.h>
#device adc=8
// Insert header file for the particular PIC being used
#use delay(clock=4000000)
#fuses NOWDT,XT, PUT, NOPROTECT, BROWNOUT, LVP
//_______________________________Wait for high function_____________________________________
void wait_for_high() {
while(input(PIN_A0)) ;
while(!input(PIN_A0));
/* while high, wait for low */
/* wait for high */
}
//______________________________Wait for low function_______________________________________
void wait_for_low() {
while(input(PIN_A0));
/* wait for high */
}
//_______________________________Main begins here____________________________________________
void main(){
long int high_time,low_time,temp;
setup_adc_ports(NO_ANALOGS);
setup_adc(ADC_OFF);
setup_spi(FALSE);
setup_timer_1 ( T1_INTERNAL | T1_DIV_BY_2);
//Sets up timer to overflow after 131.07ms
Rev. B | Page 24 of 28
C
TWꢀ±./TWꢀ±6
do{
wait_for_high();
set_timer1(0);
//Reset timer
//Reset timer
wait_for_low();
high_time = get_timer1();
set_timer1(0);
wait_for_high();
low_time = get_timer1();
temp = 421 – ((751 * high_time)/low_time));
}while (TRUE);
//Temperature equation for the high state
//conversion rate.
//Temperature value stored in temp as a long int
}
Rev. B | Page 25 of 28
TWꢀ±./TWꢀ±6C
OUTLINECDIWENSIONSC
2.90 BSC
2.20
2.00
1.80
5
1
4
3
1.35
1.25
1.15
2.40
2.10
1.80
5
1
4
3
2.80 BSC
1.60 BSC
2
2
PIN 1
PIN 1
1.00
0.90
0.70
0.95 BSC
0.65 BSC
0.40
0.10
1.90
BSC
1.10
0.80
1.30
1.15
0.90
0.46
0.36
0.26
1.45 MAX
0.22
0.08
0.30
0.15
0.22
0.08
0.10 MA
X
SEATING
PLANE
10°
5°
0°
0.10 COPLANARITY
0.15 MAX
0.50
0.30
0.60
0.45
0.30
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-203-AA
COMPLIANT TO JEDEC STANDARDS MO-178-AA
Figure 38. 5-Lead Thin Shrink Small Outline Transistor Package [SC-70]
Figure 39. 5-Lead Small Outline Transistor Package [SOT-23]
(KS-5)
(RJ-5)
Dimensions shown in millimeters
Dimensions shown in millimeters
ORDERING GUIDE
Minimum
Temperature
Temperature Package
Package
Option
Model
Quantities/Reel Range1
Accuracy2
2°C
2°C
2°C
2°C
2°C
2°C
2°C
2°C
2°C
2°C
2°C
2°C
1°C
1°C
1°C
1°C
1°C
1°C
1°C
1°C
1°C
1°C
1°C
1°C
Description
Branding
T8A
T8A
T8A
T8C
T8C
T8C
T8A
T8A
T8A
T8C
T8C
T8C
T8B
T8B
T8B
T8D
T8D
T8D
T8B
TMP05AKS-500RL7
TMP05AKS-REEL
500
–40°C to +150°C
5-Lead SC-70
5-Lead SC-70
5-Lead SC-70
5-Lead SC-70
5-Lead SC-70
5-Lead SC-70
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SC-70
5-Lead SC-70
5-Lead SC-70
5-Lead SC-70
5-Lead SC-70
5-Lead SC-70
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
KS-5
KS-5
KS-5
KS-5
KS-5
KS-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
KS-5
KS-5
KS-5
KS-5
KS-5
KS-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
10,000
3,000
500
10,000
3,000
500
10,000
3,000
500
10,000
3,000
500
10,000
3,000
500
10,000
3,000
500
10,000
3,000
500
10,000
3,000
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
TMP05AKS-REEL7
TMP05AKSZ-500RL73
TMP05AKSZ-REEL3
TMP05AKSZ-REEL73
TMP05ART-500RL7
TMP05ART-REEL
TMP05ART-REEL7
TMP05ARTZ-500RL73
TMP05ARTZ-REEL3
TMP05ARTZ-REEL73
TMP05BKS-500RL7
TMP05BKS-REEL
TMP05BKS-REEL7
TMP05BKSZ-500RL73
TMP05BKSZ-REEL3
TMP05BKSZ-REEL73
TMP05BRT-500RL7
TMP05BRT-REEL
TMP05BRT-REEL7
TMP05BRTZ-500RL73
TMP05BRTZ-REEL3
TMP05BRTZ-REEL73
T8B
T8B
T8D
T8D
T8D
Rev. B | Page 26 of 28
C
TWꢀ±./TWꢀ±6
Minimum
Temperature
Temperature Package
Description
Package
Model
Quantities/Reel Range1
Accuracy2
2°C
2°C
2°C
2°C
2°C
2°C
2°C
2°C
2°C
2°C
2°C
2°C
1°C
1°C
1°C
1°C
1°C
1°C
1°C
1°C
1°C
1°C
1°C
1°C
Option
KS-5
KS-5
KS-5
KS-5
KS-5
KS-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
KS-5
KS-5
KS-5
KS-5
KS-5
KS-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
Branding
T9A
T9A
T9A
T9C
T9C
T9C
T9A
T9A
T9A
T9C
T9C
T9C
T9B
T9B
T9B
T9D
T9D
T9D
T9B
TMP06AKS-500RL7
TMP06AKS-REEL
500
–40°C to +150°C
5-Lead SC-70
5-Lead SC-70
5-Lead SC-70
5-Lead SC-70
5-Lead SC-70
5-Lead SC-70
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SC-70
5-Lead SC-70
5-Lead SC-70
5-Lead SC-70
5-Lead SC-70
5-Lead SC-70
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
10,000
3,000
500
10,000
3,000
500
10,000
3,000
500
10,000
3,000
500
10,000
3,000
500
10,000
3,000
500
10,000
3,000
500
10,000
3,000
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
–40°C to +150°C
TMP06AKS-REEL7
TMP06AKSZ-500RL73
TMP06AKSZ-REEL3
TMP06AKSZ-REEL73
TMP06ART-500RL7
TMP06ART-REEL
TMP06ART-REEL7
TMP06ARTZ-500RL73
TMP06ARTZ-REEL3
TMP06ARTZ-REEL73
TMP06BKS-500RL7
TMP06BKS-REEL
TMP06BKS-REEL7
TMP06BKSZ-500RL73
TMP06BKSZ-REEL3
TMP06BKSZ-REEL73
TMP06BRT-500RL7
TMP06BRT-REEL
TMP06BRT-REEL7
TMP06BRTZ-500RL73
TMP06BRTZ-REEL3
TMP06BRTZ-REEL73
T9B
T9B
T9D
T9D
T9D
1 It is not recommended to operate the device at temperatures above 125°C for more than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure beyond
this limit affects device reliability.
2 A-grade and B-grade temperature accuracy is over the 0°C to 70°C temperature range.
3 Z = Pb-free part.
Rev. B | Page 27 of 28
TWꢀ±./TWꢀ±6C
NOTESC
©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03340-0-4/06(B)
Rev. B | Page 28 of 28
相关型号：
TMP06ART-REEL7
DIGITAL TEMP SENSOR-SERIAL, 12BIT(s), 2Cel, RECTANGULAR, SURFACE MOUNT, MO-178AA, SOT-23, 5 PIN
ROCHESTER
TMP06ARTZ-500RL7
DIGITAL TEMP SENSOR-SERIAL, 12BIT(s), 2Cel, RECTANGULAR, SURFACE MOUNT, LEAD FREE, MO-178AA, SOT-23, 5 PIN
ROCHESTER
TMP06BKS-500REEL7
Switch/Digital Output Temperature Sensor, DIGITAL TEMP SENSOR-SERIAL, 12BIT(s), 4Cel, RECTANGULAR, SURFACE MOUNT, MO-203AA, SC-70, 5 PIN
ADI
TMP06BKS-500RL7
DIGITAL TEMP SENSOR-SERIAL, 12BIT(s), 1Cel, RECTANGULAR, SURFACE MOUNT, MO-203AA, SC-70, 5 PIN
ROCHESTER
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