MOC3021TV-M [ROCHESTER]
1 CHANNEL TRIAC OUTPUT OPTOCOUPLER, 0.400 INCH, DIP-6;
| 型号： | MOC3021TV-M |
| 厂家： | 
Rochester Electronics |
| 描述： | 1 CHANNEL TRIAC OUTPUT OPTOCOUPLER, 0.400 INCH, DIP-6 三端双向交流开关 输出元件 光电 |
| 文件： | 总11页 (文件大小：246K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
September 2009
MOC3010M, MOC3011M, MOC3012M,
MOC3020M, MOC3021M, MOC3022M, MOC3023M
6-Pin DIP Random-Phase Optoisolators Triac Driver Output
(250/400 Volt Peak)
Features
Description
■ Excellent I stability—IR emitting diode has low
The MOC301XM and MOC302XM series are optically
isolated triac driver devices. These devices contain a
GaAs infrared emitting diode and a light activated silicon
bilateral switch, which functions like a triac. They are
designed for interfacing between electronic controls and
power triacs to control resistive and inductive loads for
115 VAC operations.
FT
degradation
■ High isolation voltage—minimum 5300 VAC RMS
■ Underwriters Laboratory (UL) recognized—
File #E90700
■ Peak blocking voltage
– 250V-MOC301XM
– 400V-MOC302XM
■ VDE recognized (File #94766)
– Ordering option V (e.g. MOC3023VM)
Applications
■ Industrial controls
■ Solenoid/valve controls
■ Traffic lights
■ Static AC power switch
■ Vending machines
■ Incandescent lamp dimmers
■ Solid state relay
■ Motor control
■ Lamp ballasts
Schematic
Package Outlines
ANODE 1
6
MAIN TERM.
CATHODE
N/C
NC*
2
3
5
4
MAIN TERM.
*DO NOT CONNECT
(TRIAC SUBSTRATE)
©2005 Fairchild Semiconductor Corporation
MOC301XM, MOC302XM Rev. 1.0.2
www.fairchildsemi.com
Absolute Maximum Ratings (T = 25°C unless otherwise noted)
A
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameters
Device
Value
Units
TOTAL DEVICE
T
Storage Temperature
All
All
All
All
All
-40 to +150
-40 to +85
260 for 10 sec
-40 to +100
7500
°C
°C
STG
T
Operating Temperature
OPR
T
Lead Solder Temperature
Junction Temperature Range
°C
SOL
T
°C
J
(1)
V
Isolation Surge Voltage
Vac(pk)
ISO
(peak AC voltage, 60Hz, 1 sec. duration)
Total Device Power Dissipation @ 25°C Ambient
Derate above 25°C
P
All
330
4.4
mW
D
mW/°C
EMITTER
I
Continuous Forward Current
Reverse Voltage
All
All
All
60
3
mA
V
F
V
P
R
Total Power Dissipation @ 25°C Ambient
Derate above 25°C
100
1.33
mW
D
mW/°C
DETECTOR
V
Off-State Output Terminal Voltage
MOC3010M/1M/2M
MOC3020M/1M/2M/3M
All
250
400
1
V
A
DRM
I
Peak Repetitive Surge Current
(PW = 1ms, 120pps)
TSM
P
Total Power Dissipation @ 25°C Ambient
Derate above 25°C
All
300
4
mW
D
mW/°C
Note:
1. Isolation surge voltage, V , is an internal device dielectric breakdown rating. For this test, Pins 1 and 2 are
ISO
common, and Pins 4, 5 and 6 are common.
©2005 Fairchild Semiconductor Corporation
MOC301XM, MOC302XM Rev. 1.0.2
www.fairchildsemi.com
2
Electrical Characteristics (T = 25°C Unless otherwise specified)
A
Individual Component Characteristics
Symbol
Parameters
Test Conditions
Device
Min.
Typ.
Max. Units
EMITTER
V
Input Forward Voltage
I = 10mA
All
All
1.15
0.01
1.5
V
F
F
I
Reverse Leakage Current
V = 3V, T = 25°C
100
µA
R
R
A
DETECTOR
Peak Blocking Current,
I
(2)
DRM
Rated V
, I = 0
All
All
10
100
3
nA
V
DRM
F
Either Direction
V
Peak On-State Voltage,
Either Direction
TM
I
= 100 mA peak, I = 0
1.8
TM
F
Transfer Characteristics
Symbol DC Characteristics
Test Conditions
Device
Min.
Typ.
Max. Units
(3)
I
LED Trigger Current
Voltage = 3V
MOC3020M
MOC3010M
MOC3021M
MOC3011M
MOC3022M
MOC3012M
MOC3023M
All
30
15
mA
FT
10
5
I
Holding Current, Either
Direction
100
µA
H
Notes:
2. Test voltage must be applied within dv/dt rating.
3. All devices are guaranteed to trigger at an I value less than or equal to max I . Therefore, recommended operating
F
FT
I lies between max I (30mA for MOC3020M, 15mA for MOC3010M and MOC3021M, 10mA for MOC3011M and
F
FT
MOC3022M, 5mA for MOC3012M and MOC3023M) and absolute max I (60mA).
F
©2005 Fairchild Semiconductor Corporation
MOC301XM, MOC302XM Rev. 1.0.2
www.fairchildsemi.com
3
Safety and Insulation Ratings
As per IEC 60747-5-2, this optocoupler is suitable for “safe electrical insulation” only within the safety limit data.
Compliance with the safety ratings shall be ensured by means of protective circuits.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Installation Classifications per DIN VDE 0110/1.89
Table 1
For Rated Main Voltage < 150Vrms
For Rated Main voltage < 300Vrms
Climatic Classification
I-IV
I-IV
55/100/21
2
Pollution Degree (DIN VDE 0110/1.89)
Comparative Tracking Index
CTI
175
V
Input to Output Test Voltage, Method b,
1594
V
V
PR
peak
V
x 1.875 = V , 100% Production Test
IORM
PR
with tm = 1 sec, Partial Discharge < 5pC
Input to Output Test Voltage, Method a,
1275
peak
V
x 1.5 = V , Type and Sample Test
PR
IORM
with tm = 60 sec, Partial Discharge < 5pC
Max. Working Insulation Voltage
Highest Allowable Over Voltage
External Creepage
V
850
6000
7
V
V
IORM
peak
V
IOTM
peak
mm
mm
mm
Ω
External Clearance
7
Insulation Thickness
0.5
9
RIO
Insulation Resistance at Ts, V = 500V
10
IO
©2005 Fairchild Semiconductor Corporation
MOC301XM, MOC302XM Rev. 1.0.2
www.fairchildsemi.com
4
Typical Performance Curves
Figure 2. On-State Characteristics
Figure 1. LED Forward Voltage vs. Forward Current
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
800
600
400
200
0
TA = -55oC
-200
-400
-600
-800
T
A = 25oC
TA = 100oC
-3
-2
-1
0
1
2
3
1
10
IF - LED FORWARD CURRENT (mA)
100
ON-STATE VOLTAGE - VTM (V)
Figure 4. LED Current Required to Trigger vs. LED Pulse Width
Fig ure 3.Trigger Current vs. Ambient Temperature
1.4
25
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
NORMALIZED TO:
20
15
PW ≥ 100 µs
in
10
5
0
1
2
5
10
20
50
100
NORMALIZED TO T = 25°C
A
LED TRIGGER WIDTH - PW (µs)
in
-40
-20
0
20
40
60
80
100
AMBIENT TEMPERATURE - TA (oC)
Figure 6. Leakage Current, IDRM vs.Temperature
10000
1000
100
10
Figure 5. dv/dt vs.Temperature
12
STATIC dv/dt
CIRCUIT IN FIGURE 5
10
8
6
4
2
0
1
25 30
40
50
60
70
80
90
100
Ambient Temperature - TA (oC)
0.1
-40
-20
0
20
40
60
80
100
T , AMBIENT TEMPERATURE ( oC)
A
©2005 Fairchild Semiconductor Corporation
MOC301XM, MOC302XM Rev. 1.0.2
www.fairchildsemi.com
5
1. The mercury wetted relay provides a high speed
repeated pulse to the D.U.T.
400V (MOC302X)
250V (MOC301X)
Vdc
2. 100x scope probes are used, to allow high
speeds and voltages.
RTEST
R = 10 kΩ
3. The worst-case condition for static dv/dt is
established by triggering the D.U.T. with a normal
LED input current, then removing the current. The
CTEST
PULSE
INPUT
MERCURY
WETTED
RELAY
X100
SCOPE
PROBE
variable R
allows the dv/dt to be gradually
TEST
D.U.T.
increased until the D.U.T. continues to trigger in
response to the applied voltage pulse, even after
the LED current has been removed. The dv/dt is
then decreased until the D.U.T. stops triggering.
τ
is measured at this point and recorded.
RC
V
= 400 V (MOC302X)
= 250 V (MOC301X)
max
APPLIED VOLTAGE
WAVEFORM
252 V (MOC302X)
158 V (MOC301X)
0.63 V
252
RC
max
dv/dt =
=
=
(MOC302X)
(MOC301X)
0 VOLTS
RC
RC
158
RC
Figure 5. Static dv/dt Test Circuit
Note:
This optoisolator should not be used to drive a load directly. It is intended to be a trigger device only.
RL
Rin
180Ω
1
2
6
5
VCC
120 V
60 Hz
MOC3010M
MOC3011M
MOC3012M
3
4
Figure 6. Resistive Load
ZL
Rin
180Ω
2.4kΩ
1
2
6
5
VCC
120 V
60 Hz
MOC3010M
MOC3011M
MOC3012M
C1
0.1
F
3
4
Figure 7. Inductive Load with Sensitive Gate Triac (IGT 15 mA)
©2005 Fairchild Semiconductor Corporation
MOC301XM, MOC302XM Rev. 1.0.2
www.fairchildsemi.com
6
ZL
Rin
180Ω
1.2 kΩ
1
2
6
5
VCC
120 V
60 Hz
MOC3010M
MOC3011M
MOC3012M
C1
0.2 µF
3
4
Figure 8. Inductive Load with Sensitive Gate Triac (IGT ≤ 15 mA)
Rin
360Ω
470Ω
1
2
6
5
HOT
VCC
MOC3020M
MOC3021M
MOC3022M
MOC3023M
39
0.05 µF
240
VAC
3
4
0.01 µF
LOAD
GROUND
In this circuit the “hot” side of the line is switched and the load connected to the cold or ground side.
The 39Ω resistor and 0.01µF capacitor are for snubbing of the triac, and the 470Ω resistor and 0.05µF
capacitor are for snubbing the coupler. These components may or may not be necessary depending upon
the particular and load used.
Figure 9.Typical Application Circuit
©2005 Fairchild Semiconductor Corporation
MOC301XM, MOC302XM Rev. 1.0.2
www.fairchildsemi.com
7
Package Dimensions
Through Hole
0.4" Lead Spacing
8.13–8.89
6
4
8.13–8.89
6
4
6.10–6.60
6.10–6.60
Pin 1
1
3
Pin 1
1
3
5.08 (Max.)
3.28–3.53
0.25–0.36
7.62 (Typ.)
5.08 (Max.)
3.28–3.53
0.25–0.36
0.38 (Min.)
2.54–3.81
2.54 (Bsc)
0.38 (Min.)
2.54–3.81
2.54 (Bsc)
0.20–0.30
(0.86)
15° (Typ.)
(0.86)
0.41–0.51
0.76–1.14
0.20–0.30
10.16–10.80
1.02–1.78
0.41–0.51
0.76–1.14
1.02–1.78
Surface Mount
(1.78)
8.13–8.89
6
4
(1.52)
(2.54)
(7.49)
6.10–6.60
8.43–9.90
(10.54)
1
3
(0.76)
Pin 1
Rcommended Pad Layout
0.25–0.36
3.28–3.53
5.08
(Max.)
0.20–0.30
0.38 (Min.)
0.16–0.88
(8.13)
2.54 (Bsc)
(0.86)
0.41–0.51
0.76–1.14
1.02–1.78
Note:
All dimensions in mm.
©2005 Fairchild Semiconductor Corporation
MOC301XM, MOC302XM Rev. 1.0.2
www.fairchildsemi.com
8
Ordering Information
Order Entry Identifier
(Example)
Option
Description
No option
MOC3010M
MOC3010SM
Standard Through Hole Device
Surface Mount Lead Bend
Surface Mount; Tape and Reel
0.4" Lead Spacing
S
SR2
T
MOC3010SR2M
MOC3010TM
V
MOC3010VM
VDE 0884
TV
MOC3010TVM
MOC3010SVM
MOC3010SR2VM
VDE 0884, 0.4" Lead Spacing
VDE 0884, Surface Mount
VDE 0884, Surface Mount, Tape and Reel
SV
SR2V
Marking Information
1
2
MOC3010
X YY Q
6
V
5
3
4
Definitions
1
2
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
3
4
5
6
One digit year code, e.g., ‘3’
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
*Note – Parts that do not have the ‘V’ option (see definition 3 above) that are
marked with date code ‘325’ or earlier are marked in portrait format.
©2005 Fairchild Semiconductor Corporation
MOC301XM, MOC302XM Rev. 1.0.2
www.fairchildsemi.com
9
Carrier Tape Specification
12.0 ± 0.1
2.0 ± 0.05
4.5 ± 0.20
Ø1.5 MIN
1.75 ± 0.10
0.30 ± 0.05
4.0 ± 0.1
11.5 ± 1.0
24.0 ± 0.3
9.1 ± 0.20
21.0 ± 0.1
Ø1.5 ± 0.1/-0
10.1 ± 0.20
0.1 MAX
User Direction of Feed
Reflow Profile
300
280
260
240
220
200
180
160
140
120
100
80
260°C
>245°C = 42 Sec
Time above
183°C = 90 Sec
°C
1.822°C/Sec Ramp up rate
60
40
33 Sec
20
0
0
60
120
180
270
360
Time (s)
©2005 Fairchild Semiconductor Corporation
MOC301XM, MOC302XM Rev. 1.0.2
www.fairchildsemi.com
10
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
PowerTrench®
PowerXS™
The Power Franchise®
Auto-SPM™
Build it Now™
CorePLUS™
CorePOWER™
CROSSVOLT™
CTL™
Current Transfer Logic™
EcoSPARK®
EfficentMax™
EZSWITCH™*
™*
F-PFS™
FRFET®
Global Power ResourceSM
Green FPS™
Green FPS™ e-Series™
Gmax™
GTO™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
Programmable Active Droop™
QFET®
TinyBoost™
TinyBuck™
QS™
Quiet Series™
RapidConfigure™
TinyLogic®
TINYOPTO™
TinyPower™
TinyPWM™
™
Saving our world, 1mW/W/kW at a time™
SmartMax™
TinyWire™
TriFault Detect™
TRUECURRENT™*
µSerDes™
SMART START™
SPM®
®
MicroPak™
MillerDrive™
MotionMax™
Motion-SPM™
OPTOLOGIC®
STEALTH™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SupreMOS™
SyncFET™
Fairchild®
Fairchild Semiconductor®
FACT Quiet Series™
FACT®
UHC®
Ultra FRFET™
UniFET™
VCX™
VisualMax™
XS™
OPTOPLANAR®
FAST®
®
FastvCore™
FETBench™
PDP SPM™
Power-SPM™
Sync-Lock™
FlashWriter®
®
*
*
FPS™
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR
CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,
WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,
under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts.
Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications,
and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of
counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are
listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have
full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information.
Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide
any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our
customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status
Definition
Datasheet contains the design specifications for product development. Specifications may change in
any manner without notice.
Advance Information
Preliminary
Formative / In Design
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
First Production
Full Production
Not In Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes
at any time without notice to improve the design.
No Identification Needed
Obsolete
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Rev. I40
©2005 Fairchild Semiconductor Corporation
MOC301XM, MOC302XM Rev. 1.0.2
www.fairchildsemi.com
11
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