FPF2002 [ROCHESTER]
0.075A BUF OR INV BASED PRPHL DRVR, PDSO5, SC-70, 5 PIN;
| 型号： | FPF2002 |
| 厂家： | 
Rochester Electronics |
| 描述： | 0.075A BUF OR INV BASED PRPHL DRVR, PDSO5, SC-70, 5 PIN 光电二极管 |
| 文件： | 总13页 (文件大小：1019K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
October 2008
FPF2000-FPF2007
IntelliMAX™ Advanced Load Management Products
tm
Features
General Description
1.8 to 5.5V Input Voltage Range
Controlled Turn-On
The FPF2000 through FPF2007 is a family of load switches which
provide full protection to systems and loads which may encounter
large current conditions. These devices contain a 0.7Ω current-
limited P-channel MOSFET which can operate over an input
voltage range of 1.8-5.5V. Switch control is by a logic input (ON)
capable of interfacing directly with low voltage control signals. Each
part contains thermal shutdown protection which shuts off the
switch to prevent damage to the part when a continuous over-
current condition causes excessive heating.
50mA and 100mA Current Limit Options
Undervoltage Lockout
Thermal Shutdown
<1µA Shutdown Current
Auto restart
Fast Current limit Response Time
3µs to Moderate Over Currents
20ns to Hard Shorts
When the switch current reaches the current limit, the part
operates in a constant current mode to prohibit excessive currents
from causing damage. For the FPF2000-FPF2002 and FPF2004-
FPF2006, if the constant current condition still persists after 10ms,
these parts will shut off the switch and pull the fault signal pin
(FLAGB) low. The FPF2000, FPF2001, FPF2004 and FPF2005,
have an auto-restart feature which will turn the switch on again
after 80ms if the ON pin is still active. The FPF2002 and FPF2006
do not have this auto-restart feature so the switch will remain off
until the ON pin is cycled. For the FPF2003 and FPF2007, a
current limit condition will immediately pull the fault signal pin low
and the part will remain in the constant-current mode until the
switch current falls below the current limit. For the FPF2000
through FPF2003, the minimum current limit is 50mA while that for
the FPF2004 through FPF2007 is 100mA.
Fault Blanking
RoHS Compliant
Applications
PDAs
Cell Phones
GPS Devices
MP3 Players
Digital Cameras
Peripheral Ports
Hot Swap Supplies
These parts are available in a space-saving 5 pin SC-70 package.
Ordering Information
Current Limit
Blanking Time
[ms]
Auto-Restart
ON Pin
Current Limit
Part
Time
[ms]
Top Mark
[mA]
Activity
FPF2000
FPF2001
FPF2002
FPF2003
FPF2004
FPF2005
FPF2006
FPF2007
50
50
10
10
10
0
80
80
Active HI
Active LO
Active HI
Active HI
Active HI
Active LO
Active HI
Active HI
200
201
202
203
204
205
206
207
50
NA
NA
80
50
100
100
100
100
10
10
10
0
80
NA
NA
©2008 Fairchild Semiconductor Corporation
FPF2000-FPF2007 Rev. H
1
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Typical Application Circuit
TO LOAD
VOUT
VIN
FPF2000 - FPF2007
OFF ON
ON
FLAGB
GND
Functional Block Diagram
VIN
UVLO
CONTROL
LOGIC
ON
CURRENT
LIMIT
VOUT
FLAGB
THERMAL
SHUTDOWN
GND
Pin Configuration
VOUT
1
5
4
VIN
ON
GND
2
3
FLAGB
SC70-5
Pin Description
Pin
1
Name
VOUT
Function
Switch Output: Output of the power switch
Ground
2
GND
Fault Output: Active LO, open drain output which indicates an over current, supply under
voltage or over temperature state.
3
FLAGB
4
5
ON
VIN
On Control Input
Supply Input: Input to the power switch and the supply voltage for the IC
2
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FPF2000-FPF2007 Rev. H
Absolute Maximum Ratings
Parameter
Min
Max
6
Unit
V
VIN, VOUT, ON, FLAGB to GND
Power Dissipation @ TA = 25°C (note 1)
Operating Junction Temperature
Storage Temperature
-0.3
250
125
150
400
mW
°C
-40
-65
°C
Thermal Resistance, Junction to Ambient
°C/W
V
HBM
MM
4000
400
Electrostatic Discharge Protection
V
Recommended Operating Range
Parameter
Min
1.8
Max
5.5
Unit
V
VIN
Ambient Operating Temperature, TA
-40
85
°C
Electrical Characteristics
VIN = 1.8 to 5.5V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25°C.
Parameter
Symbol
Conditions
Min Typ Max Units
Basic Operation
Operating Voltage
VIN
IQ
1.8
5.5
V
IOUT = 0mA
VON active
VIN = 1.8 to 3.3V
VIN = 3.3 to 5.5V
60
Quiescent Current
µA
100
1
Shutdown Current
ISHDN
µA
µA
Latch-Off Current (note 2)
ILATCHOFF VON = VIN, after an overcurrent fault
VIN = 3.3V, IOUT = 20mA, TA = 25°C
40
0.7
1
On-Resistance
RON
VIN = 3.3V, IOUT = 20mA, TA = 85°C
VIN = 3.3V, IOUT = 20mA, TA = -40°C to +85°C 0.27
0.85
1.2
1.2
Ω
VIN = 1.8V
0.8
1.5
ON Input Logic High Voltage
VIH
VIL
V
V
VIN = 5.5V
VIN = 1.8V
0.5
0.9
1
ON Input Logic Low Voltage
ON Input Leakage
VIN = 5.5V
VON = VIN or GND
µA
µA
VON = 0V, VOUT = 0V
@ VIN = 5.5V, TA = 85°C
1
Off Switch Leakage
ISWOFF
V
ON = 0V, VOUT = 0V
10
100
nA
@ VIN = 3.3V, TA = 25°C
V
V
IN = 5V, ISINK = 10mA
IN = 1.8V, ISINK = 10mA
0.1
0.1
0.2
0.3
1
FLAGB Output Logic Low Voltage
V
FLAGB Output High Leakage Current
VIN = 5V, Switch on
µA
Protections
FPF2000, FPF2001,
FPF2002, FPF2003
50
75
100
200
VIN = 3.3V,
Current Limit
ILIM
mA
°C
V
OUT = 3.0V
FPF2004, FPF2005,
FPF2006, FPF2007
100
150
Shutdown Threshold
140
130
10
Thermal Shutdown
Return from Shutdown
Hysteresis
3
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FPF2000-FPF2007 Rev. H
Electrical Characteristics Cont.
VIN = 1.8 to 5.5V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25°C.
Parameter
Symbol
Conditions
Min Typ Max Units
Protections
Under Voltage Shutdown
Under Voltage Shutdown Hysteresis
Dynamic
UVLO
VIN Increasing
1.5
1.6
50
1.7
V
mV
Turn On Time
tON
tOFF
tR
RL = 500Ω, CL = 0.1µF
RL = 500Ω, CL = 0.1µF
RL = 500Ω, CL = 0.1µF
RL = 500Ω, CL = 0.1µF
50
0.5
10
µs
µs
µs
µs
Turn Off Time
VOUT Rise Time
VOUT Fall Time
tF
0.1
FPF2000, FPF2001, FPF2002, FPF2004,
FPF2005, FPF2006
Over Current Blanking Time
Auto-Restart Time
tBLANK
tRSTRT
5
10
80
3
20
ms
ms
µs
FPF2000, FPF2001, FPF2004, FPF2005
40
160
VIN = VON = 3.3V. Moderate
Over-Current Condition.
Short Circuit Response Time
V
IN = VON = 3.3V. Hard Short.
20
ns
Note 1: Package power dissipation on 1 square inch pad, 2 oz. copper board.
Note 2: Applicable only to FPF2002 and FPF2006. Latchoff current does not include current flowing into FLAGB.
4
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FPF2000-FPF2007 Rev. H
Typical Characteristics
75
90
85
80
75
70
65
60
55
50
45
40
VON = V
IN
VON = VIN
70
65
60
55
50
VIN = 5.5V
VIN = 3.3V
VIN = 1.8V
-40
-15
10
35
60
85
85
6
1
1.5
2
2.5
3
3.5
SUPPLY VOLTAGE (V)
Figure 1. Quiescent Current vs. Input Voltage
4
4.5
5
5.5
6
TJ, JUNCTION TEMPERATURE (oC)
Figure 2. Quiescent Current vs. Temperature
35
30
25
20
15
10
5
35
30
25
20
15
10
5
I_SHDN
VIN = 5V
V
IN = 5V
VIN = 3.3V
V
IN = 3.3V
0
0
-40
-15
10
35
60
85
-40
-15
10
35
60
TJ, JUNCTION TEMPERATURE (oC)
TJ, JUNCTION TEMPERATURE (oC)
Figure 3. ISHUTDOWN Current vs. Temperature
Figure 4. ISWITCH-OFF Current vs. Temperature
52
48
44
40
36
32
28
1.5
V
IN = 3.3V
1.25
1
FPF2000, 2002, 2003, 2004, 2006, 2007
FPF2001, 2005
0.75
0.5
0.25
0
-40
-15
10
35
60
85
1.5
2
2.5
3
3.5
4
4.5
5
5.5
TJ, JUNCTION TEMPERATURE (oC)
VIN , INPUT VOLTAGE (V)
Figure 5. ILATCHOFF vs. Temperature
Figure 6. VIH vs. VIN
5
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FPF2000-FPF2007 Rev. H
Typical Characteristics
160
140
180
160
140
120
100
80
I_LIMIT
FPF2004, 2005, 2006, 2007
120
100
80
60
40
20
0
FPF2004, 2005, 2006, 2007
FPF2000, 2001, 2002, 2003
60
FPF2000, 2001, 2002, 2003
40
20
0
-40
-15
10
35
60
85
85
85
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
3
3.3
VIN - VOUT (V)
TJ, JUNCTION TEMPERATURE (oC)
Figure 7. Current Limit vs. Output Voltage
Figure 8. Current Limit vs. Temperature
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
1.1
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
V
IN = 1.8V
VIN = 3.6V
VIN = 5V
-40
-15
10
35
60
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VIN, INPUT VOLTAGE (V)
TJ, JUNCTION TEMPERATURE (oC)
Figure 9. RON vs. VIN
Figure 10. RON vs. Temperature
100
10
1
100
ILOAD = 10mA
VCC = 3.3V
ILOAD = 10mA
VCC = 3.3V
TON
TRise
10
1
TFall
0.1
TOFF
0.1
0.01
-40
-15
10
35
60
85
-40
-15
10
35
60
TJ, JUNCTION TEMPERATURE (oC)
TJ, JUNCTION TEMPERATURE (oC)
Figure 11. TON/TOFF vs. Temperature
Figure 12. TRISE/TFALL vs. Temperature
6
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FPF2000-FPF2007 Rev. H
Typical Characteristics
12
100
80
11
10
9
60
8
40
-40
-15
10
35
60
85
-40
-15
10
35
60
85
TJ, JUNCTION TEMPERATURE (oC)
TJ, JUNCTION TEMPERATURE (oC)
Figure 13. TBLANK vs. Temperature
Figure 14. TRESTART vs. Temperature
3
3
VDRV
VDRV
2V/DIV
2V/DIV
VOUT
VOUT
2V/DIV
2V/DIV
IOUT
IOUT
50mA/DIV
50mA/DIV
VFLAGB
2V/DIV
VFLAGB
2V/DIV
5mS/DIV
10mS/DIV
Figure 15. TBLANK Response
Figure 16. TRESTART Response
RL = 500Ω, CL = 0.1µF
Active High Devices
RL = 500Ω, CL = 0.1µF
Active High Devices
VON
2V/DIV
VON
2V/DIV
IOUT
10mA/DIV
IOUT
10mA/DIV
50µS/DIV
100nS/DIV
Figure 18. TOFF Response
Figure 17. TON Response
7
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FPF2000-FPF2007 Rev. H
Typical Characteristics
VIN
2V / DIV
CIN = 10µF
COUT = 1µF
Active High Devices
VIN/VON
2V/DIV
IOUT
2A/DIV
IOUT
200mA/DIV
C
C
IN = 10µF
OUT = 1µF
Active High Devices
VOUT
2V/DIV
20µS/DIV
20µS/DIV
Figure 19. Short Circuit Response Time
(Output Shorted to GND)
Figure 20. Current Limit Response
(Switch power up to hard short)
VIN
2V/DIV
C
C
IN = 10µF
OUT = 1µF
VON
2V/DIV
Active High Devices
IOUT
100mA/DIV
VOUT
(SHORTED
TO GND)
20µS/DIV
Figure 21. Current Limit Response Time
Note 3: VDRV signal forces the device to go into overcurrent condition.
8
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FPF2000-FPF2007 Rev. H
Current Limiting
Description of Operation
The current limit ensures that the current through the switch
doesn’t exceed a maximum value while not limiting at less than
a minimum value. For the FPF2000-FPF2003 the minimum
current is 50mA and the maximum current is 100mA and for the
FPF2004-FPF2007 the minimum current is 100mA and the
maximum current is 200mA. The FPF2000-FPF2002 and the
FPF2004-FPF2006, have a blanking time of 10ms, nominally,
during which the switch will act as a constant current source. At
the end of the blanking time, the switch will be turned-off and
the FLAGB pin will activate to indicate that current limiting has
occurred. The FPF2003 and FPF2007 have no current limit
blanking period so immediately upon a current limit condition
FLAGB is activated. These parts will remain in a constant
current state until the ON pin is deactivated or the thermal
shutdown turns-off the switch.
The FPF2000-FPF2007 are current limited switches that protect
systems and loads which can be damaged or disrupted by the
application of high currents. The core of each device is a 0.7Ω
P-channel MOSFET and a controller capable of functioning over
a wide input operating range of 1.8-5.5V. The controller protects
against system malfunctions through current limiting, under-
voltage lockout and thermal shutdown. The current limit is
preset for either 50mA or 100mA.
On/Off Control
The ON pin controls the state of the switch. Active HI and LO
versions are available. Refer to the Ordering Information for
details. Activating ON continuously holds the switch in the on
state so long as there is no fault. For all versions, an under-
voltage on VIN or a junction temperature in excess of 150°C
overrides the ON control to turn off the switch. In addition,
excessive currents will cause the switch to turn off in FPF2000-
FPF2002 and FPF2004-FPF2007. The FPF2000, FPF2001,
FPF2004 and FPF2005 have an Auto-Restart feature which will
automatically turn the switch on again after 80ms. For the
FPF2002 and FPF2006, the ON pin must be toggled to turn-on
the switch again. The FPF2003 and FPF2007 do not turn off in
response to a over current condition but instead remain
operating in a constant current mode so long as ON is active
and the thermal shutdown or under-voltage lockout have not
activated.
Reverse Voltage
If the voltage at the VOUT pin is larger than the VIN pin, large
currents may flow and can cause permanent damage to the
device. FPF2000-FPF2007 is designed to control current flow
from VIN to VOUT
.
Under-Voltage Lockout
The under-voltage lockout turns-off the switch if the input
voltage drops below the under-voltage lockout threshold. With
the ON pin active the input voltage rising above the under-
voltage lockout threshold will cause a controlled turn-on of the
switch which limits current over-shoots.
Fault Reporting
Thermal Shutdown
Upon the detection of an over-current, an input under-voltage,
or an over-temperature condition, the FLAGB signals the fault
mode by activating LO. For the FPF2000-FPF2002 and
FPF2004-FPF2006, the FLAGB goes LO at the end of the
blanking time while FLAGB goes LO immediately for the
FPF2003 and FPF2007. FLAGB remains LO through the Auto-
Restart Time for the FPF2000, FPF2001 FPF2004 and
FPF2005. For the FPF2002 and FPF2006, FLAGB is latched
LO and ON must be toggled to release it. With the FPF2003 and
FPF2007, FLAGB is LO during the faults and immediately
returns HI at the end of the fault condition. FLAGB is an open-
drain MOSFET which requires a pull-up resistor between VIN
and FLAGB. During shutdown, the pull-down on FLAGB is
disabled to reduce current draw from the supply.
The thermal shutdown protects the die from internally or
externally generated excessive temperatures. During an over-
temperature condition the FLAGB is activated and the switch is
turned-off. The switch automatically turns-on again if
temperature of the die drops below the threshold temperature.
9
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FPF2000-FPF2007 Rev. H
Application Information
Typical Application
LOAD
VOUT
VIN
R1 = 100KΩ
FPF2000 - FPF2007
R2 = 500Ω
OFF ON
C1 = 4.7µF
ON
FLAGB
1.8V-5.5V
GND
C2 = 0.1µF
Input Capacitor
If the part goes into current limit the maximum power dissipation
will occur when the output is shorted to ground. For the
FPF2000, FPF2001, FPF2004 and FPF2005, the power
dissipation will scale by the Auto-Restart Time, tRESTART, and
the Over Current Blanking Time, tBLANK, so that the maximum
power dissipated is,
To limit the voltage drop on the input supply caused by transient
in-rush currents when the switch turns-on into a discharged load
capacitor or a short-circuit, a capacitor needs to be placed
between VIN and GND. A 4.7µF ceramic capacitor, CIN, must be
placed close to the VIN pin. A higher value of CIN can be used to
further reduce the voltage drop experienced as the switch is
turned on into a large capacitive load.
tBLANK
P(max) = --------------------------------------------------x(VIN(max))xILIM(max)
=
tRESTART + tBLANK
Output Capacitor
A 0.1µF capacitor COUT, should be placed between VOUT and
GND. This capacitor will prevent parasitic board inductances
from forcing VOUT below GND when the switch turns-off. For the
FPF2000-FPF2002 and the FPF2004-FPF2006, the total output
capacitance needs to be kept below a maximum value,
10
80 + 10
-------------------
× 5.5 × 0.2 = 1.22mW
=
(3)
When using the FPF2002 and FPF2006 attention must be given
to the manual resetting of the part. Continuously resetting the
part at a high duty cycle when a short on the output is present
can cause the temperature of the part to increase. The junction
temperature will only be allowed to increase to the thermal
shutdown threshold. Once this temperature has been reached,
toggling ON will not turn-on the switch until the junction
temperature drops. For the FPF2003 and FPF2007, a short on
the output will cause the part to operate in a constant current
state dissipating a worst case power as calculated in (3) until
the thermal shutdown activates. It will then cycle in and out of
thermal shutdown so long as the ON pin is active and the short
is present.
COUT(max), to prevent the part from registering an over-current
condition and turning-off the switch. The maximum output
capacitance can be determined from the following formula,
ILIM(max) × tBLANK(min)
COUT
=
(1)
-------------------------------------------------------------------
VIN
Due to the integral body diode in the PMOS switch, a CIN
greater than COUT is highly recommended. A COUT greater than
CIN can cause VOUT to exceed VIN when the system supply is
removed. This could result in current flow through the body
diode from VOUT to VIN
.
Board Layout
Power Dissipation
For best performance, all traces should be as short as possible.
To be most effective, the input and output capacitors should be
placed close to the device to minimize the effects that parasitic
trace inductances may have on normal and short-circuit
operation. Using wide traces for VIN, VOUT and GND will help
minimize parasitic electrical effects along with minimizing the
case to ambient thermal impedance.
During normal operation as a switch, the power dissipation is
small and has little effect on the operating temperature of the
part. The parts with the higher current limits will dissipate the
most power and that will only be,
P = (ILIM)2 × RDS = (0.2)2 × 0.7 = 28mW
(2)
10
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FPF2000-FPF2007 Rev. H
Dimensional Outline and Pad Layout
11
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FPF2000-FPF2007 Rev. H
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®
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™
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MicroFET™
MicroPak™
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®
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Definition of Terms
Datasheet Identification
Product Status
Definition
Datasheet contains the design specifications for product development. Specifications may change
in any manner without notice.
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Semiconductor reserves the right to make changes at any time without notice to improve design.
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First Production
Full Production
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Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve the design.
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Obsolete
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Rev. I37
12
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