CY7C1354A-133BGC [ROCHESTER]
ZBT SRAM, 256KX36, 4.2ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119;
| 型号： | CY7C1354A-133BGC |
| 厂家： | 
Rochester Electronics |
| 描述： | ZBT SRAM, 256KX36, 4.2ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 静态存储器 内存集成电路 |
| 文件： | 总29页 (文件大小：1083K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CY7C1354A
CY7C1356A
256K x 36/512K x 18 Pipelined SRAM
with NoBL™ Architecture
All synchronous inputs are gated by registers controlled by a
positive-edge-triggered clock input (CLK). The synchronous
Features
• Zero Bus Latency™, no dead cycles between Write and
inputs include all addresses, all data inputs, depth-expansion
Chip Enables (CE, CE2, and CE3), Cycle Start Input (ADV/LD),
Clock Enable (CEN), Byte Write Enables (BWa, BWb, BWc,
and BWd), and Read-Write Control (WEN). BWc and BWd
apply to CY7C1354A only.
Address and control signals are applied to the SRAM during
one clock cycle, and two cycles later, its associated data
occurs, either Read or Write.
Read cycles
• Fast clock speed: 200, 166, 133, 100 MHz
• Fast access time: 3.2, 3.6, 4.2, 5.0 ns
• Internally synchronized registered outputs eliminate
the need to control OE
• Single 3.3V –5% and +5% power supply VCC
• Separate VCCQ for 3.3V or 2.5V I/O
A
clock enable (CEN) pin allows operation of the
CY7C1354A/CY7C1356A to be suspended as long as
necessary. All synchronous inputs are ignored when (CEN) is
HIGH and the internal device registers will hold their previous
values.
• Single WEN (Read/Write) control pin
• Positive clock-edge triggered, address, data, and
control signal registers for fully pipelined applications
• Interleaved or linear four-word burst capability
There are three chip enable pins (CE, CE2, CE3) that allow the
user to deselect the device when desired. If any one of these
three are not active when ADV/LD is LOW, no new memory
operation can be initiated and any burst cycle in progress is
stopped. However, any pending data transfers (Read or Write)
will be completed. The data bus will be in high-impedance
state two cycles after chip is deselected or a Write cycle is
initiated.
The CY7C1354A and CY7C1356A have an on-chip two-bit
burst counter. In the burst mode, the CY7C1354A and
CY7C1356A provide four cycles of data for a single address
presented to the SRAM. The order of the burst sequence is
defined by the MODE input pin. The MODE pin selects
between linear and interleaved burst sequence. The ADV/LD
signal is used to load a new external address (ADV/LD = LOW)
or increment the internal burst counter (ADV/LD = HIGH)
Output Enable (OE), Sleep Enable (ZZ) and burst sequence
select (MODE) are the asynchronous signals. OE can be used
to disable the outputs at any given time. ZZ may be tied to
LOW if it is not used.
Four pins are used to implement JTAG test capabilities. The
JTAG circuitry is used to serially shift data to and from the
device. JTAG inputs use LVTTL/LVCMOS levels to shift data
during this testing mode of operation.
• Individual byte Write (BWa–BWd) control (may be tied
LOW)
• CEN pin to enable clock and suspend operations
• Three chip enables for simple depth expansion
• Automatic power-down feature available using ZZ
mode or CE select
• JTAG boundary scan
• Low-profile 119-bump, 14-mm × 22-mm BGA (Ball Grid
Array), and 100-pin TQFP packages
Functional Description
The CY7C1354A and CY7C1356A SRAMs are designed to
eliminate dead cycles when transitioning from Read to Write
or vice versa. These SRAMs are optimized for 100% bus utili-
zation and achieve Zero Bus Latency (ZBL)/No Bus
Latency (NoBL). They integrate 262,144 × 36 and 524,288
× 18 SRAM cells, respectively, with advanced synchronous
peripheral circuitry and a two-bit counter for internal burst
operation. These employ high-speed, low-power CMOS
designs using advanced triple-layer polysilicon, double-layer
metal technology. Each memory cell consists of four
transistors and two high-valued resistors.
Selection Guide
7C1354A-166
7C1356A-166
7C1354A-133
7C1356A-133
7C1354A-200
3.2
7C1356A-100 Unit
Maximum Access Time
3.6
480
30
4.2
410
30
5.0
350
30
ns
mA
mA
Maximum Operating Current
Commercial
560
30
Maximum CMOS Standby Current Commercial
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose, CA 95134
•
408-943-2600
Document #: 38-05161Rev. *E
Revised April 5, 2004
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CY7C1354A
CY7C1356A
.
Functional Block Diagram—256K × 36[1]
ZZ
MODE
CKE#
CEN
Address
Control
ADV/LD
WEN
BWa, BWb,
BWc, BWd
Input
Registers
C2
CE, CE , CE
2
3
CEN
Control Logic
Mux
A0, A1, A
Sel
CLK
Output Registers
Output Buffers
OE
DQa-DQd
Functional Block Diagram—512K × 18[1]
ZZ
MODE
Address
CKE#
CEN
ADV/LD
WEN
Control
BWa, BWb
Input
Registers
2
CE, CE , CE
2
3
CEN
Control Logic
A0, A1, A
Sel
Mux
CLK
Output Registers
Output Buffers
OE
DQa, DQb
Note:
1. The Functional Block Diagram illustrates simplified device operation. See Truth Table, pin descriptions, and timing diagrams for detailed information.
Document #: 38-05161Rev. *E
Page 2 of 28
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CY7C1354A
CY7C1356A
Pin Configurations
100-lead TQFP Packages
DQc
DQc
DQc
1
DQb
NC
NC
NC
CCQ
1
A
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
80
2
2
NC
DQb
79
3
DQb
3
NC
78
V
V
CCQ
4
4
VCCQ
VSS
V
V
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
CCQ
SS
V
SS
DQc
DQc
DQc
DQc
5
V
5
SS
6
NC
6
NC
DQb
7
DQb
NC
7
DQa
DQa
DQa
8
DQb
DQb
VSS
DQb
DQb
8
9
9
V
V
SS
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
SS
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
V
SS
V
V
V
CCQ
DQc
DQc
CCQ
VDDQ
DQb
DQb
VSS
VCC
VCC
ZZ
DQa
DQa
CCQ
DQb
DQb
V
DQa
DQa
V
CC
VCC
V
CY7C1356A
(512K × 18)
CY7C1354A
(256K × 36)
SS
V
CC
CC
V
CC
V
V
V
CC
SS
VCC
CC
V
SS
ZZ
DQd
DQd
DQb
DQb
CCQ
DQa
DQa
V
V
V
CCQ
VCCQ
VSS
CCQ
V
V
SS
SS
V
SS
DQd
DQa
DQa
DQa
DQa
VSS
DQb
DQb
DPb
NC
DQa
DQa
NC
DQd
DQd
DQd
NC
V
SS
V
V
CCQ
SS
SS
V
V
DDQ
DQd
DQd
DQd
VCCQ
CCQ
V
DQa
DQa
DQa
NC
NC
NC
NC
NC
NC
Document #: 38-05161Rev. *E
Page 3 of 28
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CY7C1354A
CY7C1356A
Pin Configurations (continued)
119-ball Bump BGA
CY7C1354A (256K × 36)–7 × 17 BGA
Table 1.
1
2
A
3
A
4
NC
5
A
6
7
A
B
C
D
E
F
G
H
J
VCCQ
NC
NC
A
VCCQ
CE2
A
A
A
ADV/LD
VCC
NC
CE
OE
A
A
CE3
A
NC
NC
DQc
DQc
VCCQ
DQc
DQc
VCCQ
DQd
DQd
VCCQ
DQd
DQd
NC
DQc
DQc
DQc
DQc
DQc
VCC
DQd
DQd
DQd
DQd
DQd
A
VSS
VSS
VSS
BWc
VSS
NC
VSS
BWd
VSS
VSS
VSS
MODE
A
VSS
VSS
VSS
BWb
VSS
NC
VSS
BWa
VSS
VSS
VSS
VSS
A
DQb
DQb
DQb
DQb
DQb
VCC
DQa
DQa
DQa
DQa
DQa
A
DQb
DQb
VCCQ
DQb
DQb
VCCQ
DQa
DQa
VCCQ
DQa
DQa
NC
A
WEN
VCC
CLK
NC
CEN
A1
A0
VCC
A
K
L
M
N
P
R
T
NC
NC
NC
ZZ
U
VCCQ
TMS
TDI
TCK
TDO
NC
VCCQ
CY7C1356A (512K × 18)–7 × 17 BGA
Table 1.
1
2
A
3
A
4
NC
5
A
6
A
7
A
B
C
D
E
F
G
H
J
VCCQ
VCCQ
NC
NC
DQb
NC
VCCQ
NC
DQb
VCCQ
NC
DQb
VCCQ
DQb
NC
CE2
A
A
A
ADV/LD
VCC
NC
CE
OE
A
A
CE3
A
NC
NC
NC
NC
DQb
NC
DQb
NC
VCC
DQb
NC
DQb
NC
DQb
A
VSS
VSS
VSS
BWb
VSS
NC
VSS
VSS
VSS
VSS
VSS
MODE
A
VSS
VSS
VSS
VSS
VSS
NC
VSS
BWa
VSS
VSS
VSS
VCC
A
DQa
NC
DQa
NC
DQa
VCC
NC
DQa
NC
DQa
NC
A
DQa
VCCQ
DQa
NC
VCCQ
DQa
NC
VCCQ
NC
DQa
NC
A
WEN
VCC
CLK
NC
CEN
A1
A0
VCC
NC
K
L
M
N
P
R
T
NC
NC
A
A
ZZ
U
VCCQ
TMS
TDI
TCK
TDO
NC
VCCQ
Document #: 38-05161Rev. *E
Page 4 of 28
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CY7C1354A
CY7C1356A
Pin Descriptions—256K × 36
256K × 36
256K × 36
Pin
TQFP Pins
PBGA Pins Name
Type
Input-
Pin Description
Synchronous Address Inputs: The address register is triggered by a
37,
36,
4P
4N
A0,
A1, Synchronous combination of the rising edge of CLK, ADV/LD LOW, CEN LOW and
32, 33, 34, 35, 2A, 3A, 5A, 6A,
44, 45, 46, 47, 3B, 5B, 2C, 3C,
48, 49, 50, 81, 5C, 6C, 4G, 2R,
82, 83, 99, 100 6R, 3T, 4T, 5T
A
true chip enables. A0 and A1 are the two least significant bits (LSBs) of
the address field and set the internal burst counter if burst cycle is
initiated.
93,
94,
95,
96
5L
5G
3G
3L
BWa,
Input-
Synchronous Byte Write Enables: Each nine-bit byte has its own
BWb, Synchronous active LOW byte Write enable. On load Write cycles (when WEN and
BWc,
BWd
ADV/LD are sampled LOW), the appropriate byte Write signal (BWx)
must be valid. The byte Write signal must also be valid on each cycle of
a burst Write. Byte Write signals are ignored when WEN is sampled
HIGH. The appropriate byte(s) of data are written into the device two
cycles later. BWa controls DQa pins; BWb controls DQb pins; BWc
controls DQc pins; BWd controls DQd pins. BWx can all be tied LOW if
always doing Writes to the entire 36-bit word.
87
88
4M
4H
CEN
Input-
Synchronous Clock Enable Input: When CEN is sampled HIGH, all
Synchronous other synchronous inputs, including clock are ignored and outputs
remain unchanged. The effect of CEN sampled HIGH on the device
outputs is as if the LOW-to-HIGH clock transition did not occur. For
normal operation, CEN must be sampled LOW at rising edge of clock.
WEN
Input-
Read Write: WEN signal is a synchronous input that identifies whether
Synchronous the current loaded cycle and the subsequent burst cycles initiated by
ADV/LD is a Read or Write operation. The data bus activity for the
current cycle takes place two clock cycles later.
89
4K
CLK
CE,
Input-
Clock: This is the clock input to CY7C1354A. Except for OE, ZZ and
Synchronous MODE, all timing references for the device are made with respect to the
rising edge of CLK.
98, 92
4E, 6B
Input-
Synchronous Active LOW Chip Enable: CE and CE3 are used with
CE3 Synchronous CE2 to enable the CY7C1354A. CE or CE3 sampled HIGH or CE2
sampled LOW, along with ADV/LD LOW at the rising edge of clock,
initiates a deselect cycle. The data bus will be High-Z two clock cycles
after chip deselect is initiated.
97
86
2B
4F
CE2
Input-
Synchronous Active High Chip Enable: CE2 is used with CE and CE3
Synchronous to enable the chip. CE2 has inverted polarity but otherwise is identical
to CE and CE3.
OE
Input
Asynchronous Output Enable: OE must be LOW to Read data. When
OE is HIGH, the I/O pins are in high-impedance state. OE does not need
to be actively controlled for Read and Write cycles. In normal operation,
OE can be tied LOW.
85
4B
ADV/
Input-
Advance/Load: ADV/LD is a synchronous input that is used to load the
LD Synchronous internal registers with new address and control signals when it is
sampled LOW at the rising edge of clock with the chip is selected. When
ADV/LD is sampled HIGH, then the internal burst counter is advanced
for any burst that was in progress. The external addresses and WEN
are ignored when ADV/LD is sampled HIGH.
31
64
3R
7T
MOD
Input-
Burst Mode: When MODE is HIGH or NC, the interleaved burst
sequence is selected. When MODE is LOW, the linear burst sequence
is selected. MODE is a static DC input.
Sleep Enable: This active HIGH input puts the device in low power
E
Static
ZZ
Input-
Asynchronous consumption standby mode. For normal operation, this input has to be
either LOW or NC.
Document #: 38-05161Rev. *E
Page 5 of 28
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CY7C1354A
CY7C1356A
Pin Descriptions—256K × 36 (continued)
256K × 36
256K × 36
Pin
TQFP Pins
PBGA Pins Name
Type
Pin Description
51, 52, 53,
(a) 6P, 7P, 7N, DQa
Input/
Data Inputs/Outputs: Both the data input path and data output path are
registered and triggered by the rising edge of CLK. Byte “a” is DQa pins;
Byte “b” is DQb pins; Byte “c” is DQc pins; Byte “d” is DQd pins.
56-59, 62, 63 6N, 6M, 6L, 7L, DQb
Output
68, 69, 72-75,
78, 79, 80
6K, 7K,
DQc
(b) 7H, 6H, 7G, DQd
1, 2, 3, 6-9, 12, 6G, 6F, 6E, 7E,
13
7D, 6D,
18, 19, 22-25, (c) 2D, 1D, 1E,
28, 29, 30
2E, 2F, 1G, 2G,
1H, 2H,
(d) 1K, 2K, 1L,
2L, 2M, 1N, 2N,
1P, 2P
38
39
43
2U
3U
4U
TMS
TDI
Input
IEEE 1149.1 Test Inputs: LVTTL-level inputs. If Serial Boundary Scan
(JTAG) is not used, these pins can be floating (i.e., No Connect) or be
TCK
connected to VCC.
42
5U
TDO
Output
Supply
Ground
IEEE 1149.1 Test Output: LVTTL-level output. If Serial Boundary Scan
(JTAG) is not used, these pins can be floating (i.e., No Connect).
14, 15, 16, 41, 4C, 2J, 4J, 6J, VCC
65, 66, 91 4R, 5R
Power Supply: +3.3V –5% and +5%.
5, 10, 17, 21, 3D, 5D, 3E, 5E, VSS
Ground: GND.
26, 40, 55, 60, 3F, 5F, 3H, 5H,
67, 71, 76, 90
3K, 5K, 3M,
5M, 3N, 5N, 3P,
5P
4, 11, 20, 27, 1A, 7A, 1F, 7F, VCCQ I/O Supply Output Buffer Supply: +3.3V –0.165V and +0.165V for 3.3V I/O. +2.5V
54, 61, 70, 77 1J, 7J, 1M, 7M,
1U, 7U
–0.125V and +0.4V for 2.5V I/O.
84
4A, 1B, 7B, 1C, NC
–
No Connect: These signals are not internally connected. It can be left
7C, 4D, 3J, 5J,
4L, 1R, 7R, 1T,
2T, 6T, 6U
floating or be connected to VCC or to GND.
Pin Descriptions—512K × 18
512K × 18
512K × 18
Pin
TQFP Pins
PBGA Pins Name
Type
Pin Description
37,
36,
4P
4N
A0,
Input-
Synchronous Address Inputs: The address register is triggered by a
A1, Synchronous combination of the rising edge of CLK, ADV/LD LOW, CEN LOW, and
32, 33, 34, 35, 2A, 3A, 5A, 6A,
44, 45, 46, 47, 3B, 5B, 6B, 2C,
48, 49, 50, 80, 3C, 5C, 6C, 4G,
81, 82, 83, 99, 2R, 6R, 2T, 3T,
A
true chip enables. A0 and A1 are the two least significant bits of the
address field and set the internal burst counter if burst cycle is initiated.
100
5T, 6T
93,
5L
BWa,
Input-
Synchronous Byte Write Enables: Each nine-bit byte has its own
94,
3G
BWb Synchronous active LOW byte Write enable. On load Write cycles (when WEN and
ADV/LD are sampled LOW), the appropriate byte Write signal (BWx)
must be valid. The byte Write signal must also be valid on each cycle of
a burst Write. Byte Write signals are ignored when WEN is sampled
HIGH. The appropriate byte(s) of data are written into the device two
cycles later. BWa controls DQa pins; BWb controls DQb pins. BWx can
all be tied LOW if always doing Write to the entire 18-bit word.
87
4M
CEN
Input-
Synchronous Clock Enable Input: When CEN is sampled HIGH, all
Synchronous other synchronous inputs, including clock are ignored and outputs
remain unchanged. The effect of CEN sampled HIGH on the device
outputs is as if the LOW-to-HIGH clock transition did not occur. For
normal operation, CEN must be sampled LOW at rising edge of clock.
Document #: 38-05161Rev. *E
Page 6 of 28
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CY7C1354A
CY7C1356A
Pin Descriptions—512K × 18 (continued)
512K × 18
512K × 18
Pin
TQFP Pins
PBGA Pins Name
Type
Pin Description
88
89
4H
WEN
Input-
Read Write: WEN signal is a synchronous input that identifies whether
Synchronous the current loaded cycle and the subsequent burst cycles initiated by
ADV/LD is a Read or Write operation. The data bus activity for the current
cycle takes place two clock cycles later.
4K
CLK
CE,
Input-
Clock: This is the clock input to CY7C1356A. Except for OE, ZZ, and
Synchronous MODE, all timing references for the device are made with respect to the
rising edge of CLK.
98,
92
4E, 6B
Input-
Synchronous Active LOW Chip Enable: CE and CE3 are used with
CE3 Synchronous CE2 to enable the CY7C1356A. CE or CE3 sampled HIGH or CE2
sampled LOW, along with ADV/LD LOW at the rising edge of clock,
initiates a deselect cycle. The data bus will be High-Z two clock cycles
after chip deselect is initiated.
97
86
2B
4F
CE2
Input-
Synchronous Active HIGH Chip Enable: CE2 is used with CE and CE3
Synchronous to enable the chip. CE2 has inverted polarity but otherwise is identical to
CE and CE3.
OE
Input
Asynchronous Output Enable: OE must be LOW to Read data. When
OE is HIGH, the I/O pins are in high-impedance state. OE does not need
to be actively controlled for Read and write cycles. In normal operation,
OE can be tied LOW.
85
4B
ADV
Input-
Advance/Load: ADV/LD is a synchronous input that is used to load the
/LD Synchronous internal registers with new address and control signals when it is
sampled LOW at the rising edge of clock with the chip is selected. When
ADV/LD is sampled HIGH, then the internal burst counter is advanced
for any burst that was in progress. The external addresses and WEN are
ignored when ADV/LD is sampled HIGH.
31
64
3R
7T
MOD
Input-
Burst Mode: When MODE is HIGH or NC, the interleaved burst
sequence is selected. When MODE is LOW, the linear burst sequence
is selected. MODE is a static DC input.
Sleep Enable: This active HIGH input puts the device in low power
E
Static
ZZ
Input-
Asynchronou consumption standby mode. For normal operation, this input has to be
s
either LOW or NC.
58, 59, 62, 63, (a) 6D, 7E, 6F, DQa
68, 69, 72, 73, 7G, 6H, 7K, 6L, DQb
Input/
Data Inputs/Outputs: Both the data input path and data output path are
registered and triggered by the rising edge of CLK. Byte “a” is DQa pins;
Byte “b” is DQb pins.
Output
74
6N, 7P
8, 9, 12, 13, 18, (b) 1D, 2E, 2G,
19, 22, 23, 24 1H, 2K, 1L, 2M,
1N, 2P
38
39
43
2U
3U
4U
TMS
TDI
Input
IEEE 1149.1 Test Inputs: LVTTL-level inputs. If Serial Boundary Scan
(JTAG) is not used, these pins can be floating (i.e., No Connect) or be
TCK
connected to VCC.
42
5U
TDO
Output
Supply
Ground
IEEE 1149.1 Test Inputs: LVTTL-level output. If Serial Boundary Scan
(JTAG) is not used, these pins can be floating (i.e., No Connect).
14, 15, 16, 41, 4C, 2J, 4J, 6J, VCC
65, 66, 91 4R, 5R
5, 10, 17, 21, 3D, 5D, 3E, 5E, VSS
26, 40, 55, 60, 3F, 5F, 5G, 3H,
67, 71, 76, 90 5H, 3K, 5K, 3L,
3M, 5M, 3N,
Power Supply: +3.3V –5% and +5%.
Ground: GND.
5N, 3P, 5P
4, 11, 20, 27, 1A, 7A, 1F, 7F, VCCQ I/O Supply Output Buffer Supply: +3.3V –0.165V and +0.165V for 3.3V I/O. +2.5V
54, 61, 70, 77 1J, 7J, 1M, 7M,
1U, 7U
–0.125V and +0.4V for 2.5V I/O.
Document #: 38-05161Rev. *E
Page 7 of 28
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CY7C1354A
CY7C1356A
Pin Descriptions—512K × 18 (continued)
512K × 18
512K × 18
Pin
TQFP Pins
PBGA Pins Name
Type
Pin Description
1-3, 6, 7, 25, 4A, 1B, 7B, 1C, NC
–
No Connect: These signals are not internally connected. It can be left
28-30,
7C, 2D, 4D, 7D,
floating or be connected to VCC or to GND.
51-53, 56, 57, 1E, 6E, 2F, 1G,
75, 78, 79, 84, 6G, 2H, 7H, 3J,
95, 96
5J, 1K, 6K, 2L,
4L, 7L, 6M, 2N,
7N, 1P, 6P, 1R,
7R, 1T, 4T, 6U
Partial Truth Table for Read/Write[2]
Function
Read
WEN
BWa
X
H
L
H
H
H
L
BWb
X
H
H
L
H
H
L
BWc[4]
BWd[4]
H
L
L
L
L
L
L
X
H
H
H
L
X
H
H
H
H
L
No Write
Write Byte a (DQa)[3]
Write Byte b (DQb)[3]
Write Byte c (DQc)[3]
Write Byte d (DQd}[3]
Write all bytes
H
L
L
Interleaved Burst Address Table
(MODE = VCC or NC)
Linear Burst Address Table
(MODE = VSS)
First
Second
Address
(internal)
Third
Fourth
(internal)[5]
First
Second
Address
(internal)
Third
Fourth
Address
Address
(external)
Address
(internal)
Address
Address
(external)
Address
(internal)
(internal)[5]
A...A00
A...A01
A...A10
A...A11
A...A01
A...A00
A...A11
A...A10
A...A10
A...A11
A...A00
A...A01
A...A11
A...A10
A...A01
A...A00
A...A00
A...A01
A...A10
A...A11
A...A01
A...A10
A...A11
A...A00
A...A10
A...A11
A...A00
A...A01
A...A11
A...A00
A...A01
A...A10
Notes:
2. L means logic LOW. H means logic HIGH. X means Don’t Care.
3. Multiple bytes may be selected during the same cycle.
4. BWc and BWd apply to 256K × 36 device only.
5. Upon completion of the Burst sequence, the counter wraps around to its initial state and continues counting.
Document #: 38-05161Rev. *E
Page 8 of 28
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CY7C1354A
CY7C1356A
Sleep Mode
The ZZ input pin is an asynchronous input. Asserting ZZ
places the SRAM in a power conservation “sleep” mode. Two
clock cycles are required to enter into or exit from this “sleep”
mode. While in this mode, data integrity is guaranteed.
Accesses pending when entering the “sleep” mode are not
considered valid nor is the completion of the operation
guaranteed. The device must be deselected prior to entering
the “sleep” mode. CEs must remain inactive for the duration of
tZZREC after the ZZ input returns LOW. CEN needs to active
before going into the ZZ mode and before you want to come
back out of the ZZ mode.
ZZ Mode Electrical Characteristics
Parameter
Description
Sleep mode standby current
Device operation to ZZ
ZZ recovery time
Test Conditions
ZZ > VDD – 0.2V
ZZ > VDD – 0.2V
ZZ < 0.2V
Min.
Max.
10
2tCYC
Unit
mA
ns
IDDZZ
tZZS
tZZREC
2tCYC
ns
Truth Table[9, 10, 11, 12, 13, 14, 15, 16, 17]
Previous Address
DQ
OE (2 cycles later)
Operation
Cycle
Used
X
WEN ADV/LD CE CEN
BWx
X
X
X
X
X
X
L
L
Deselect Cycle
X
Deselect
X
Read
X
Read
X
Write
X
X
X
H
X
H
X
L
L
H
L
H
L
H
X
L
X
L
L
L
L
L
L
L
L
L
L
L
H
X
X
X
X
H
H
X
X
X
X
X
High-Z
High-Z
Q
Continue Deselect/NOP[18]
X
Read Cycle (Begin Burst)
External
Next
External
Next
External
Next
External
Next
Read Cycle (Continue Burst)[18]
Dummy Read (Begin Burst)[19]
Dummy Read (Continue Burst)[18, 19]
Write Cycle (Begin Burst)
Q
High-Z
High-Z
D
H
L
X
L
Write Cycle (Continue Burst)[18]
Abort Write (Begin Burst)[19]
Abort Write (Continue Burst)[18, 19]
Ignore Clock Edge/NOP[20]
X
L
H
L
X
L
D
H
H
X
High-Z
High-Z
–
Write
X
X
X
H
H
X
X
X
Notes:
6. This assumes that CEN, CE, CE and CE are all True.
2
3
7. All addresses, control and data-in are only required to meet set-up and hold time with respect to the rising edge of clock. Data out is valid after a clock-to-data
delay from the rising edge of clock.
8. DQc and DQd apply to 256K × 36 device only.
9. L means logic LOW. H means logic HIGH. X means Don’t Care. High-Z means High Impedance. BWx = L means [BWa*BWb*BWc*BWd] = LOW. BWx = H means
[BWa*BWb*BWc*BWd] = HIGH. BWc and BWd apply to 256K × 36 device only.
10. CE = H means CE and CE are LOW along with CE HIGH. CE = L means CE or CE are HIGH or CE is LOW. CE = X means CE, CE , and CE are Don’t Care.
3
2
3
2
3
2
11. BWa enables Write to byte “a” (DQa pins). BWb enables Write to byte “b” (DQb pins). BWc enables Write to byte “c” (DQc pins). BWd enables Write to byte “d”
(DQd pins). DQc, DQd, BWc, and BWd apply to 256K × 36 device only.
12. The device is not in Sleep Mode, i.e., the ZZ pin is LOW.
13. During Sleep Mode, the ZZ pin is HIGH and all the address pins and control pins are “Don’t Care.” The SNOOZE MODE can only be entered two cycles after the
Write cycle, otherwise the Write cycle may not be completed.
14. All inputs, except OE, ZZ, and MODE pins, must meet set-up time and hold time specification against the clock (CLK) LOW-to-HIGH transition edge.
15. OE may be tied to LOW for all the operation. This device automatically turns off the output driver during Write cycle.
16. Device outputs are ensured to be in High-Z during device power-up.
17. This device contains a two-bit burst counter. The address counter is incremented for all Continue Burst cycles. Address wraps to the initial address every fourth
burst cycle.
18. Continue Burst cycles, whether Read or Write, use the same control signals. The type of cycle performed, Read or Write, depends upon the WEN control signal
at the Begin Burst cycle. A Continue Deselect cycle can only be entered if a DESELECT cycle is executed first.
19. Dummy Read and Abort Write cycles can be entered to set up subsequent Read or Write cycles or to increment the burst counter.
20. When an Ignore Clock Edge cycle enters, the output data (Q) will remain the same if the previous cycle is Read cycle or remain High-Z if the previous cycle is
Write or DESELECT cycle.
Document #: 38-05161Rev. *E
Page 9 of 28
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CY7C1354A
CY7C1356A
Performing a TAP Reset
IEEE 1149.1 Serial Boundary Scan (JTAG)
Overview
The TAP circuitry does not have a reset pin (TRST, which is
optional in the IEEE 1149.1 specification). A RESET can be
This device incorporates a serial boundary scan access port
(TAP). This port is designed to operate in a manner consistent
with IEEE Standard 1149.1–1990 (commonly referred to as
JTAG), but does not implement all of the functions required for
IEEE 1149.1 compliance. Certain functions have been
modified or eliminated because their implementation places
extra delays in the critical speed path of the device. Never-
theless, the device supports the standard TAP controller archi-
tecture (the TAP controller is the state machine that controls
the TAPs operation) and can be expected to function in a
manner that does not conflict with the operation of devices with
IEEE Standard 1149.1-compliant TAPs. The TAP operates
using LVTTL/LVCMOS logic level signaling.
performed for the TAP controller by forcing TMS HIGH (VCC)
for five rising edges of TCK and pre-loads the instruction
register with the IDCODE command. This type of reset does
not affect the operation of the system logic. The reset affects
test logic only.
At power-up, the TAP is reset internally to ensure that TDO is
in a High-Z state.
TAP Registers
Overview
The various TAP registers are selected (one at a time) via the
sequences of ones and zeros input to the TMS pin as the TCK
is strobed. Each of the TAP registers is a serial shift register
that captures serial input data on the rising edge of TCK and
pushes serial data out on subsequent falling edge of TCK.
When a register is selected, it is connected between the TDI
and TDO pins.
Disabling the JTAG Feature
It is possible to use this device without using the JTAG feature.
To disable the TAP controller without interfering with normal
operation of the device, TCK should be tied LOW (VSS) to
prevent clocking the device. TDI and TMS are internally pulled
up and may be unconnected. They may alternately be pulled
up to VCC through a resistor. TDO should be left unconnected.
Upon power-up the device will come up in a reset state which
will not interfere with the operation of the device.
Instruction Register
The instruction register holds the instructions that are
executed by the TAP controller when it is moved into the run
test/idle or the various data register states. The instructions
are three bits long. The register can be loaded when it is
placed between the TDI and TDO pins. The parallel outputs of
the instruction register are automatically preloaded with the
IDCODE instruction upon power-up or whenever the controller
is placed in the test-logic reset state. When the TAP controller
is in the Capture-IR state, the two least significant bits of the
serial instruction register are loaded with a binary “01” pattern
to allow for fault isolation of the board-level serial test data
path.
Test Access Port
TCK–Test Clock (INPUT)
Clocks all TAP events. All inputs are captured on the rising
edge of TCK and all outputs propagate from the falling edge
of TCK.
TMS–Test Mode Select (INPUT)
The TMS input is sampled on the rising edge of TCK. This is
the command input for the TAP controller state machine. It is
allowable to leave this pin unconnected if the TAP is not used.
The pin is pulled up internally, resulting in a logic HIGH level.
Bypass Register
The bypass register is a single-bit register that can be placed
between TDI and TDO. It allows serial test data to be passed
through the device TAP to another device in the scan chain
TDI–Test Data In (INPUT)
with minimum delay. The bypass register is set LOW (VSS
)
The TDI input is sampled on the rising edge of TCK. This is the
input side of the serial registers placed between TDI and TDO.
The register placed between TDI and TDO is determined by
the state of the TAP controller state machine and the
instruction that is currently loaded in the TAP instruction
register (refer to Figure 1, TAP Controller State Diagram). It is
allowable to leave this pin unconnected if it is not used in an
application. The pin is pulled up internally, resulting in a logic
HIGH level. TDI is connected to the most significant bit (MSB)
of any register (see Figure 2).
when the BYPASS instruction is executed.
Boundary Scan Register
The Boundary Scan register is connected to all the input and
bidirectional I/O pins (not counting the TAP pins) on the device.
This also includes a number of NC pins that are reserved for
future needs. There are a total of 70 bits for x36 device and 51
bits for x18 device. The boundary scan register, under the
control of the TAP controller, is loaded with the contents of the
device I/O ring when the controller is in Capture-DR state and
then is placed between the TDI and TDO pins when the
controller is moved to Shift-DR state. The EXTEST, SAMPLE/
PRELOAD and SAMPLE-Z instructions can be used to
capture the contents of the I/O ring.
The Boundary Scan Order table describes the order in which
the bits are connected. The first column defines the bit’s
position in the boundary scan register. The MSB of the register
is connected to TDI, and LSB is connected to TDO. The
second column is the signal name and the third column is the
bump number. The third column is the TQFP pin number and
the fourth column is the BGA bump number.
TDO–Test Data Out (OUTPUT)
The TDO output pin is used to serially clock data-out from the
registers. The output that is active depending on the state of
the TAP state machine (refer to Figure 1, TAP Controller State
Diagram). Output changes in response to the falling edge of
TCK. This is the output side of the serial registers placed
between TDI and TDO. TDO is connected to the LSB of any
register (see Figure 2).
Document #: 38-05161Rev. *E
Page 10 of 28
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CY7C1354A
CY7C1356A
Identification (ID) Register
IDCODE
The ID Register is a 32-bit register that is loaded with a device
and vendor specific 32-bit code when the controller is put in
Capture-DR state with the IDCODE command loaded in the
instruction register. The register is then placed between the
TDI and TDO pins when the controller is moved into Shift-DR
state. Bit 0 in the register is the LSB and the first to reach TDO
when shifting begins. The code is loaded from a 32-bit on-chip
ROM. It describes various attributes of the device as described
in the Identification Register Definitions table.
The IDCODE instruction causes a vendor-specific, 32-bit code
to be loaded into the ID register when the controller is in
Capture-DR mode and places the ID register between the TDI
and TDO pins in Shift-DR mode. The IDCODE instruction is
the default instruction loaded in the instruction upon power-up
and at any time the TAP controller is placed in the test-logic
reset state.
SAMPLE-Z
If the High-Z instruction is loaded in the instruction register, all
output pins are forced to a High-Z state and the boundary scan
register is connected between TDI and TDO pins when the
TAP controller is in a Shift-DR state.
TAP Controller Instruction Set
Overview
There are two classes of instructions defined in the IEEE
Standard 1149.1-1990; the standard (public) instructions and
device specific (private) instructions. Some public instructions
are mandatory for IEEE 1149.1 compliance. Optional public
instructions must be implemented in prescribed ways.
Although the TAP controller in this device follows the IEEE
1149.1 conventions, it is not IEEE 1149.1-compliant because
some of the mandatory instructions are not fully implemented.
The TAP on this device may be used to monitor all input and
I/O pads, but can not be used to load address, data, or control
signals into the device or to preload the I/O buffers. In other
words, the device will not perform IEEE 1149.1 EXTEST,
INTEST, or the preload portion of the SAMPLE/PRELOAD
command.
When the TAP controller is placed in Capture-IR state, the two
least significant bits of the instruction register are loaded with
01. When the controller is moved to the Shift-IR state the
instruction is serially loaded through the TDI input (while the
previous contents are shifted out at TDO). For all instructions,
the TAP executes newly loaded instructions only when the
controller is moved to Update-IR state. The TAP instruction
sets for this device are listed in the following tables.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is an IEEE 1149.1-mandatory
instruction. The PRELOAD portion of the command is not
implemented in this device, so the device TAP controller is not
fully IEEE 1149.1-compliant.
When the SAMPLE/PRELOAD instruction is loaded in the
instruction register and the TAP controller is in the Capture-DR
state, a snap shot of the data in the device’s input and I/O
buffers is loaded into the boundary scan register. Because the
device system clock(s) are independent from the TAP clock
(TCK), it is possible for the TAP to attempt to capture the input
and I/O ring contents while the buffers are in transition (i.e., in
a metastable state). Although allowing the TAP to sample
metastable inputs will not harm the device, repeatable results
can not be expected. To guarantee that the boundary scan
register will capture the correct value of a signal, the device
input signals must be stabilized long enough to meet the TAP
controller’s capture set-up plus hold time (tCS plus tCH). The
device clock input(s) need not be paused for any other TAP
operation except capturing the input and I/O ring contents into
the boundary scan register.
Moving the controller to Shift-DR state then places the
boundary scan register between the TDI and TDO pins.
Because the PRELOAD portion of the command is not imple-
mented in this device, moving the controller to the Update-DR
state with the SAMPLE/PRELOAD instruction loaded in the
instruction register has the same effect as the Pause-DR
command.
EXTEST
EXTEST is an IEEE 1149.1 mandatory public instruction. It is
to be executed whenever the instruction register is loaded with
all 0s. EXTEST is not implemented in this device.
The TAP controller does recognize an all-0 instruction. When
an EXTEST instruction is loaded into the instruction register,
the device responds as if a SAMPLE/PRELOAD instruction
has been loaded. There is one difference between two instruc-
tions. Unlike SAMPLE/PRELOAD instruction, EXTEST places
the device outputs in a High-Z state.
BYPASS
When the BYPASS instruction is loaded in the instruction
register and the TAP controller is in the Shift-DR state, the
bypass register is placed between TDI and TDO. This allows
the board level scan path to be shortened to facilitate testing
of other devices in the scan path.
Reserved
Do not use these instructions. They are reserved for future
use.
Document #: 38-05161Rev. *E
Page 11 of 28
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CY7C1354A
CY7C1356A
TEST-LOGIC
RESET
1
0
0
1
1
1
REUN-TEST/
IDLE
SELECT
SELECT
DR-SCAN
IR-SCAN
0
0
1
1
CAPTURE-DR
CAPTURE-IR
0
0
SHIFT-DR
0
SHIFT-IR
0
1
1
EXIT1-DR
0
1
EXIT1-IR
0
1
0
0
PAUSE-DR
1
PAUSE-IR
1
0
0
EXIT2-DR
1
EXIT2-IR
1
UPDATE-DR
UPDATE-IR
1
1
0
0
Figure 1. TAP Controller State Diagram[21]
Note:
21. The “0”/”1” next to each state represents the value at TMS at the rising edge of TCK.
Document #: 38-05161Rev. *E
Page 12 of 28
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CY7C1354A
CY7C1356A
0
Bypass Register
Selection
Circuitry
Selection
Circuitry
2
1
0
TDO
TDI
Instruction Register
29
Identification Register
31 30
.
.
2
1
1
0
0
.
x
.
.
.
2
[22]
Boundary Scan Register
TDI
TDI
TAP Controller
Figure 2. TAP Controller Block Diagram
TAP Electrical Characteristics (20°C < Tj < 110°C; VCC = 3.3V –0.2V and +0.3V unless otherwise noted)
Parameter
VIH
VIl
ILI
ILI
ILO
Description
Test Conditions
Min.
2.0
–0.3
–5.0
–30
–5.0
Max.
VCC + 0.3
0.8
Unit
V
V
µA
µA
µA
Input High (Logic 1) Voltage[23, 24]
Input Low (Logic 0) Voltage[23, 24]
Input Leakage Current
0V < VIN < VCC
5.0
30
5.0
TMS and TDI Input Leakage Current 0V < VIN < VCC
Output Leakage Current
Output disabled,
0V < VIN < VCCQ
VOLC
VOHC
VOLT
LVCMOS Output Low Voltage[23, 25] IOLC = 100 µA
LVCMOS Output High Voltage[23, 25] IOHC = 100 µA
0.2
0.4
V
V
V
V
VCC – 0.2
2.4
LVTTL Output Low Voltage[23]
LVTTL Output High Voltage[23]
IOLT = 8.0 mA
IOHT = 8.0 mA
VOHT
Notes:
22. X = 69 for the x36 configuration;
X = 50 for the x18 configuration.
23. All voltage referenced to V (GND).
SS
24. Overshoot: V (AC) < V + 1.5V for t < t
/2; undershoot: V (AC) <–0.5V for t < t
/2; power-up: V < 3.6V and V < 3.135V and V < 1.4V for t <
CCQ
IH
CC
KHKH
IL
KHKH
IH
CC
200 ms. During normal operation, V
25. This parameter is sampled.
must not exceed V . Control input signals (such as WEN and ADV/LD) may not have pulse widths less than t
(min.).
KHKL
CCQ
CC
Document #: 38-05161Rev. *E
Page 13 of 28
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CY7C1354A
CY7C1356A
TAP AC Switching Characteristics Over the Operating Range[26, 27]
Parameter
Description
Min.
Max.
Unit
Clock
tTHTH
fTF
tTHTL
tTLTH
Clock Cycle Time
Clock Frequency
Clock HIGH Time
Clock LOW Time
20
ns
MHz
ns
50
8
8
ns
Output Times
tTLQX
tTLQV
tDVTH
tTHDX
TCK LOW to TDO Unknown
TCK LOW to TDO Valid
TDI Valid to TCK HIGH
TCK HIGH to TDI Invalid
0
ns
ns
ns
ns
10
5
5
Set-up Times
tMVTH
tTDIS
TMS Set-up
TDI Set-up
Capture Set-up
5
5
5
ns
ns
ns
tCS
Hold Times
tTHMX
tTDIH
TMS Hold
TDI Hold
Capture Hold
5
5
5
ns
ns
ns
tCH
Notes:
26. t and t refer to the set-up and hold time requirements of latching data from the boundary scan register.
CS
CH
27. Test conditions are specified using the load in TAP AC test conditions.
Document #: 38-05161Rev. *E
Page 14 of 28
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CY7C1354A
CY7C1356A
TAP Timing and Test Conditions
1.5V
50Ω
ALL INPUT PULSES
1.5V
TDO
3.0V
1.5 ns
Z = 50Ω
0
C = 20 pF
L
VSS
1.5 ns
GND
(a)
t
t
THTL
TLTH
t
THTH
TEST CLOCK
(TCK)
t
t
MVTH
THMX
TEST MODE SELECT
(TMS)
t
t
DVTH
THDX
TEST DATA IN
(TDI)
t
TLQV
t
TLQX
TEST DATA OUT
(TDO)
Identification Register Definitions
Instruction Field
Revision Number(31:28)
Device Depth (27:23)
Device Width (22:18)
Reserved (17:12)
256K x 36
XXXX
00110
00100
XXXXXX
00011100100
1
512K x 18
XXXX
00111
00011
XXXXXX
Description
Reserved for revision number.
Defines depth of 256K or 512K words.
Defines width of x36 or x18 bits.
Reserved for future use.
Cypress Jedec ID Code (11:1)
ID Register Presence Indicator (0)
00011100100 Allows unique identification of DEVICE vendor.
Indicates the presence of an ID register.
1
Scan Register Sizes
Register Name
Instruction
Bypass
Bit Size (x36)
Bit Size (x18)
3
1
3
1
ID
32
70
32
51
Boundary Scan
Document #: 38-05161Rev. *E
Page 15 of 28
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CY7C1354A
CY7C1356A
Instruction Codes
Instruction
Code
Description
EXTEST
000
Captures I/O ring contents. Places the boundary scan register between TDI
and TDO. Forces all device outputs to High-Z state. This instruction is not
IEEE 1149.1-compliant.
IDCODE
001
010
Preloads ID register with vendor ID code and places it between TDI and
TDO. This instruction does not affect device operations.
SAMPLE-Z
Captures I/O ring contents. Places the boundary scan register between TDI
and TDO. Forces all device outputs to High-Z state.
RESERVED
SAMPLE/PRELOAD
011
100
Do not use these instructions; they are reserved for future use.
Captures I/O ring contents. Places the boundary scan register between TDI
and TDO. This instruction does not affect device operations. This instruction
does not implement IEEE 1149.1 PRELOAD function and is therefore not
1149.1-compliant.
RESERVED
RESERVED
BYPASS
101
110
111
Do not use these instructions; they are reserved for future use.
Do not use these instructions; they are reserved for future use.
Places the bypass register between TDI and TDO. This instruction does
not affect device operations.
Boundary Scan Order (256K × 36)
Boundary Scan Order (256K × 36) (continued)
Bit#
1
2
3
4
5
6
7
Signal Name
TQFP
44
45
46
47
48
49
50
51
52
53
56
57
58
59
62
63
64
68
69
72
73
74
75
78
79
80
81
82
Bump ID
2R
3T
Bit#
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
Signal Name
TQFP
83
84
85
86
87
88
89
92
93
94
95
96
97
98
99
100
1
2
3
6
7
8
9
12
13
14
18
19
Bump ID
4G
4A
4B
4F
A
A
A
A
A
A
A
A
NC
ADV/LD
OE
4T
5T
6R
3B
5B
6P
7N
6M
7L
6K
7P
6N
6L
7K
7T
6H
7G
6F
7E
6D
7H
6G
6E
7D
6A
5A
CEN
WEN
CLK
CE3
BWa
BWb
BWc
BWd
CE2
CE
4M
4H
4K
6B
5L
5G
3G
3L
2B
4E
3A
2A
2D
1E
2F
1G
2H
1D
2E
2G
1H
5R
2K
1L
8
9
DQa
DQa
DQa
DQa
DQa
DQa
DQa
DQa
DQa
ZZ
DQb
DQb
DQb
DQb
DQb
DQb
DQb
DQb
DQb
A
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
A
A
DQc
DQc
DQc
DQc
DQc
DQc
DQc
DQc
DQc
NC
DQd
DQd
A
Document #: 38-05161Rev. *E
Page 16 of 28
[+] Feedback
CY7C1354A
CY7C1356A
Boundary Scan Order (256K × 36) (continued)
Boundary Scan Order (512K × 18) (continued)
Bit#
57
58
59
60
61
62
63
64
65
66
67
68
69
70
Signal Name
TQFP
22
23
24
25
28
29
30
31
32
33
34
35
36
37
Bump ID
2M
1N
Bit#
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
Signal Name
CE3
BWa
BWb
CE2
CE
TQFP
92
93
94
97
98
99
100
8
Bump ID
DQd
DQd
DQd
DQd
DQd
DQd
DQd
MODE
A
A
A
A
A1
6B
5L
3G
2B
4E
2P
1K
2L
2N
1P
3R
2C
3C
5C
6C
4N
4P
A
A
3A
2A
DQb
DQb
DQb
DQb
NC
DQb
DQb
DQb
DQb
DQb
MODE
A
1D
2E
2G
1H
5R
2K
9
12
13
14
18
19
22
23
24
31
32
33
34
35
36
37
A0
1L
2M
1N
2P
3R
2C
3C
5C
6C
4N
4P
Boundary Scan Order (512K × 18)
Bit#
1
2
3
4
5
6
7
Signal Name
TQFP
44
45
46
47
48
49
50
58
59
62
63
64
68
69
72
73
74
80
81
82
83
84
85
86
87
88
89
Bump ID
2R
2T
A
A
A
A
A
A
A
DQa
DQa
DQa
DQa
ZZ
DQa
DQa
DQa
DQa
DQa
A
3T
5T
A
A
A
A1
6R
3B
5B
7P
6N
6L
7K
7T
6H
7G
6F
7E
6D
6T
6A
5A
4G
4A
4B
4F
A0
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
A
A
A
NC
ADV/LD
OE
CEN
WEN
CLK
4M
4H
4K
Document #: 38-05161Rev. *E
Page 17 of 28
[+] Feedback
CY7C1354A
CY7C1356A
Short Circuit Output Current ....................................... 50 mA
Maximum Ratings
Static Discharge Voltage.......................................... > 2001V
(Above which the useful life may be impaired. For user guide-
(per MIL-STD-883, Method 3015)
lines, not tested.)
Latch-up Current.................................................... > 200 mA
Voltage on VCC Supply Relative to VSS ......... –0.5V to +4.6V
Operating Range
V
IN ...........................................................–0.5V to VCC+0.5V
Storage Temperature (plastic) ...................... –55°C to +125°
Junction Temperature ..................................................+125°
Power Dissipation .........................................................2.0W
Ambient
Temperature[28]
0°C to +70°C
–40°C to +85°C
VCC
VCCQ
[29,30]
[29,30]
Range
Commercial
Industrial
3.3V ± 5% 2.5V-5%/
3.3V+10%
Electrical Characteristics Over the Operating Range
Parameter
VIHD
VIH
Description
Test Conditions
All other Inputs
Min.
2.0
2.0
1.7
–0.3
–0.3
-
Max.
VCC + 0.3
Unit
V
V
V
V
Input High (Logic 1) Voltage[23, 31]
3.3V I/O
2.5V I/O
3.3V I/O
2.5V I/O
VIL
Input Low (Logic 0) Voltage[23, 31]
Input Leakage Current
0.8
0.7
5
30
5
V
ILI
ILI
ILO
VOH
0V < VIN < VCC
µA
µA
µA
V
V
V
V
V
V
V
MODE and ZZ Input Leakage Current[32] 0V < VIN < VCC
-
-
Output Leakage Current
Output(s) disabled, 0V < VOUT < VCC
Output High Voltage[23]
I0H = –5.0 mA for 3.3V I/O
I0H = –1.0 mA for 2.5V I/O
I0L=8.0 mA for 3.3V I/O
I0L = 1.0 mA for 2.5V I/O
I0H=1.0 mA
2.4
2.0
VOL
Output Low Voltage[23]
0.4
0.4
3.465
3.465
2.9
VCC
VCCQ
Supply Voltage[23]
3.135
3.135
2.375
I/O Supply Voltage[23]
3.3V I/O
2.5V I/O
200
MHz/
-5
560
166
133
100
MHz/
-10
350
MHz/
-6
MHz/
-7.5
Parameter
ICC
Description
Conditions
Typ.
Unit
mA
Power Supply Current: Device selected; all inputs < VILor > 200
480
410
Operating[33, 34, 35, 36]
VIH; cycle time > tKC min.; VCC =Max.;
2
outputs open, ADV/LD = X, f = fMAX
ISB1
ISB2
ISB3
Automatic CE
Device deselected;
mA
mA
mA
mA
Power-down
all inputs < VIL or > VIH; VCC = Max.;
CLK cycle time > tKC Min.
Current—TTL Inputs
CMOS Standby[34, 35, 36] Device deselected; VCC = Max.;
all inputs < VSS + 0.2 or > VCC – 0.2;
15
20
50
30
50
30
50
30
50
30
50
all inputs static; CLK frequency = 0
TTL Standby[34, 35, 36]
Device deselected; all inputs < VIL
or > VIH; all inputs static;
VCC = Max.; CLK frequency = 0
ISB4
Clock Running[34, 35, 36] Device deselected;
all inputs < VIL or > VIH; VCC = MAX;
CLK cycle time > tKC Min.
230
200
190
170
Notes:
28. T is the case temperature.
A
29. Please refer to waveform (d).
30. Power Supply ramp up should be monotonic.
31. Overshoot: V < +6.0V for t < t /2; undershoot: V < –2.0V for t < t /2.
IH
KC
IL
KC
32. MODE pin has an internal pull-up and ZZ pin has an internal pull-down. These two pins exhibit an input leakage current of ±50 µA.
33. I is given with no output current. I increases with greater output loading and faster cycle times.
CC
CC
34. “Device Deselected” means the device is in power-down mode as defined in the truth table. “Device Selected” means the device is active.
35. Typical values are measured at 3.3V, 25°C, and 20-ns cycle time.
36. At f = f
, inputs are cycling at the maximum frequency of Read cycles of 1/t
; f = 0 means no input lines are changing.
CYC
MAX
Document #: 38-05161Rev. *E
Page 18 of 28
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CY7C1354A
CY7C1356A
Capacitance[25]
Parameter
Description
Input Capacitance
Input/Output Capacitance (DQ)
Test Conditions
Typ.
4
7
Max.
4
6.5
Unit
pF
pF
CI
CI/O
TA = 25°C, f = 1 MHz,
VCC = 3.3V
Thermal Resistance
Parameter
Description
Test Conditions
TQFP Typ.
Unit
ΘJA
Thermal Resistance
Still Air, soldered on a 4.25 x 1.125 inch,
4-layer PCB
25
°C/W
(Junction to Ambient)
ΘJC
Thermal Resistance
(Junction to Case)
9
°C/W
AC Test Loads and Waveforms
tPU
=
200us
317Ω
DQ
ALL INPUT PULSES
90%
VCCQ
Vcctyp
Vccmin
VCCQ
DQ
For proper RESET
bring Vcc down to 0V
90%
10%
Z0 = 50
Ω
50
Ω
10%
0V
5 pF
351Ω
≤
1.0 ns
V = 1.5V
t
≤
1.0 ns
(a)
(c)
(b)
(d)
Switching Characteristics Over the Operating Range[17]
-5/
-6/
-7.5/
-10/
100 MHz
200 MHz
166 MHz
133 MHz
Parameter
Clock
tKC
tKH
Description
Clock Cycle Time
Clock HIGH Time
Clock LOW Time
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Unit
5.0
1.8
1.8
6.0
2.1
2.1
7.5
2.6
2.6
10
3.5
3.5
ns
ns
ns
tKL
Output Times
tKQ
tKQX
Clock to Output Valid
Clock to Output Invalid
3.2
3.6
4.2
5.0
ns
ns
ns
ns
ns
ns
ns
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
tKQLZ
tKQHZ
tOEQ
tOELZ
tOEHZ
Set-up Times
tS
Clock to Output in Low-Z[25, 38, 39]
Clock to Output in High-Z[25, 38, 39]
OE to Output Valid
3.0
3.2
3.0
3.6
3.0
4.2
3.0
5.0
OE to Output in Low-Z[25, 38, 39]
OE to Output in High-Z[25, 38, 39]
0
0
0
0
3.5
3.5
3.5
3.5
Address and Controls[40]
Data In[40]
1.5
1.5
1.5
1.5
1.8
1.8
2.0
2.0
ns
ns
tSD
Hold Times
tH
tHD
Address and Controls[40]
Data In[40]
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
ns
ns
Notes:
37. Test conditions as specified with the output loading as shown in (a) of AC Test Loads unless otherwise noted.
38. Output loading is specified with C =5 pF as in (a) of AC Test Loads.
L
39. At any given temperature and voltage condition, t
is less than t
and t
is less than t
.
KQHZ
KQLZ
OEHZ
OELZ
40. This is a synchronous device. All synchronous inputs must meet specified set-up and hold time, except for “don’t care” as defined in the truth table.
Document #: 38-05161Rev. *E
Page 19 of 28
[+] Feedback
CY7C1354A
CY7C1356A
Switching Waveforms
Read Timing[41, 42, 43, 44, 45]
tKC
tKH
tKL
CLK
tS
tH
tH
tH
CEN
tS
WEN
tS
ADDRESS A1
A2
BWa, BWb,
BWc, BWd
tS
tH
CE
tS
tH
V#
ADV/LD
OE
tKQHZ
(Burst Wraps around
to initial state)
(CKE#HIGH, eliminates
current L-H clock edge)
tKQ
tKQX
tKQLZ
Q(A)
Q(A)
Q(A+1)
Q(A+2)
Q(A+3)
Q(A)
2
DQ
1
2
2
2
2
Pipeline Read
Pipeline Read
BURST PIPELINE READ
Notes:
41. Q(A ) represents the first output from the external address A . Q(A ) represents the first output from the external address A ; Q(A +1) represents the next output
1
1
2
2
2
data in the burst sequence of the base address A , etc., where address bits A0 and A1 are advancing for the four word burst in the sequence defined by the state
2
of the MODE input.
42. CE timing transitions are identical to the CE signal. For example, when CE is LOW on this waveform, CE is LOW. CE timing transitions are identical but inverted
3
3
2
to the CE signal. For example, when CE is LOW on this waveform, CE is HIGH.
2
43. Burst ends when new address and control are loaded into the SRAM by sampling ADV/LD LOW.
44. WEN is “Don’t Care” when the SRAM is bursting (ADV/LD sampled HIGH). The nature of the burst access (Read or Write) is fixed by the state of the WEN signal
when new address and control are loaded into the SRAM.
45. BWc and BWd apply to 256K × 36 device only.
Document #: 38-05161Rev. *E
Page 20 of 28
[+] Feedback
CY7C1354A
CY7C1356A
Switching Waveforms (continued)
Write Timing[42, 43, 44, 45, 46, 47]
tKC
tKH
tKL
CLK
tS
tH
CEN
tS
tS
tS
tS
tS
tH
tH
tH
tH
tH
WEN
ADDRESS A1
A2
BW(A)
BW(A)
BW(A+1)
BW(A+2)
BW(A+3)
BW(A)
BWa, BWb,
1
2
2
2
2
2
#
BWc, BWd
CE
ADV/LD
OE#
OE
(CKE#HIGH, eliminates
current L-H clock edge)
(Burst Wraps around
to initial state)
tHD
tSD
D(A)
D(A)
D(A+1)
D(A+2)
D(A+3)
D(A)
2
DQ
1
2
2
2
2
Pipeline Write
Pipeline Write
Burst Pipeline Write
Notes:
46. D(A ) represents the first input to the external address A1. D(A ) represents the first input to the external address A ; D(A + 1) represents the next input data in
1
2
2
2
the burst sequence of the base address A , etc., where address bits A0 and A1 are advancing for the four-word burst in the sequence defined by the state of the
2
MODE input.
47. Individual Byte Write signals (BWx) must be valid on all Write and burst-Write cycles. A Write cycle is initiated when WEN signal is sampled LOW when ADV/LD
is sampled LOW. The byte Write information comes in one cycle before the actual data is presented to the SRAM.
Document #: 38-05161Rev. *E
Page 21 of 28
[+] Feedback
CY7C1354A
CY7C1356A
Switching Waveforms (continued)
Read/Write Timing[42, 45, 47, 48]
tKC
tKH
tKL
CLK
tS
tH
CEN
tS
tS
tS
tS
tS
tH
tH
tH
tH
tH
WEN
ADDRESS A1
A2
A3
A
A
A
A
A
A
9
4
5
6
7
8
BW(A)
BW(A)
BW(A)
5
BWa, BWb,
2
4
BWc, BWd
CE
ADV/LD
E
OE
tKQ
tKQHZ
tKQLZ
Q(A)
tKQX
Q(A)
Q(A)
Q(A)
7
DATA Out (Q)
DATA In (D)
1
3
6
Read
Read
Read
D(A)
D(A)
D(A)
5
2
4
Write
Write
Note:
48. Q(A ) represents the first output from the external address A . D(A ) represents the input data to the SRAM corresponding to address A .
1
1
2
2
Document #: 38-05161Rev. *E
Page 22 of 28
[+] Feedback
CY7C1354A
CY7C1356A
Switching Waveforms (continued)
CEN Timing[42, 45, 47, 48, 49]
tKC
tKH
tKL
CLK
tS
tH
CEN
tS
tH
WEN
tS
tH
ADDRESS
A
A2
A
A4
A5
1
3
tS
tS
tS
tH
tH
tH
BWa, BWb,
BWc, BWd
CE
ADV/LD
OE
tKQ
tKQHZ
Q(A)
Q(A)
DATA Out (Q)
1
3
tSD tHD
tKQLZ
tKQX
D(A)
DATA In (D)
2
Note:
49. CEN when sampled HIGH on the rising edge of clock will block that L-H transition of the clock from propagating into the SRAM. The part will behave as if the L-H
clock transition did not occur. All internal registers in the SRAM will retain their previous states.
Document #: 38-05161Rev. *E
Page 23 of 28
[+] Feedback
CY7C1354A
CY7C1356A
Switching Waveforms (continued)
CE Timing[42, 45, 47, 50, 51]
tKC
tKH
tKL
CLK
tS
tH
CEN
tS
tH
WEN
tS
tH
ADDRESS
A
A
A
A4
A
1
2
3
5
tS
tH
BWa, BWb,
BWc, BWd
tS
tH
CE
tS
tH
ADV/LD
tOEQ
OE
tKQHZ
tOEHZ
tOELZ
Q(A)
Q(A)
Q(A)
4
DATA Out (Q)
DATA In (D)
1
2
tKQLZ
tSD tHD
tKQX
tKQ
D(A)
3
Notes:
50. Q(A ) represents the first output from the external address A . D(A ) represents the input data to the SRAM corresponding to address A , etc.
1
1
3
3
51. When either one of the Chip Enables (CE, CE , or CE ) is sampled inactive at the rising clock edge, a chip deselect cycle is initiated. The data-bus High-Z one
2
3
cycle after t
Document #: 38-05161Rev. *E
Page 24 of 28
[+] Feedback
CY7C1354A
CY7C1356A
Switching Waveforms (continued)
ZZ Mode Timing [ 50, 51]
CLK
CE
1
LOW
HIGH
CE
2
CE
ZZ
3
tZZS
I
DD
I
(active)
DD
tZZREC
I/Os
I
DDZZ
Three-state
Ordering Information
Speed
Package
Operating
Range
Commercial
(MHz)
Ordering Code
CY7C1354A-200AC[52]
CY7C1354A-200BGC[52]
CY7C1354A-166AC[52]
CY7C1354A-166BGC[52]
CY7C1356A-166AC
Name
A101
Package Type
100-lead 14 x 20 x 1.4 mm Thin Quad Flat Pack
119-ball BGA (14 x 22 x 2.4 mm)
100-lead 14 x 20 x 1.4 mm Thin Quad Flat Pack
119-ball BGA (14 x 22 x 2.4 mm)
100-lead 14 x 20 x 1.4 mm Thin Quad Flat Pack
119-ball BGA (14 x 22 x 2.4 mm)
100-lead 14 x 20 x 1.4 mm Thin Quad Flat Pack
100-lead 14 x 20 x 1.4 mm Thin Quad Flat Pack
119-ball BGA (14 x 22 x 2.4 mm)
200
BG119
A101
BG119
A101
BG119
A101
A101
166
133
100
CY7C1354A-133BGC[52]
CY7C1356A-133AC
CY7C1356A-100AC
CY7C1356A-100BGC
BG119
Speed
(MHz)
166
Package
Name
BG119
BG119
A101
Operating
Range
Industrial
Ordering Code
CY7C1354A-166BGI[52]
CY7C1354A-133BGI
CY7C1356A-133AI
Package Type
119-ball BGA (14 x 22 x 2.4 mm)
119-ball BGA (14 x 22 x 2.4 mm)
100-lead 14 x 20 x 1.4 mm Thin Quad Flat Pack
133
Shaded areas contain advance information. Please contact your local Cypress sales representative for availability of these parts.
Notes:
50.Device must be deselected when entering ZZ mode. See Cycle Descriptions Table for all possible signal conditions to deselect the device.
51. I/Os are in three-state when exiting ZZ sleep mode
52. EOL (End of Life)
Document #: 38-05161Rev. *E
Page 25 of 28
[+] Feedback
CY7C1354A
CY7C1356A
Package Diagrams
100-lead Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm) A101
51-85050-A
Document #: 38-05161Rev. *E
Page 26 of 28
[+] Feedback
CY7C1354A
CY7C1356A
Package Diagrams (continued)
119-Lead PBGA (14 x 22 x 2.4 mm) BG119
51-85115-*B
No Bus Latency, NoBL, Zero Bus Latency, and ZBL are trademarks of Cypress Semiconductor Corporation. All product and
company names mentioned in this document are the trademarks of their respective holders.
Document #: 38-05161Rev. *E
Page 27 of 28
© Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
[+] Feedback
CY7C1354A
CY7C1356A
Document History Page
Document Title: CY7C1354A/CY7C1356A 256K x 36/512K x 18 Pipelined SRAM
with NoBL™ Architecture
Document Number: 38-05161
Orig. of
REV.
**
*A
ECN No. Issue Date Change
Description of Change
3000
4/21/00
03/12/02
05/30/02
CXV
GLC
GLC
New Data Sheet
114095
114095
Updated VIH, VIL, separate VIH and VIL for 3.3V and 2.5V I/O.
*B
Added “I” temp
Added automatic power down to features
Added ZZ mode to characteristics
Added ZZ mode timing waveform
Changed nomenclature for ISB
Updated latch-up current
Added static discharge voltage
*C
*D
121473
123143
11/14/02
01/18/03
DSG
RBI
Updated package diagram 51-85115 (BG119) to rev. *B
Added power-up requirements to AC Test Loads and Waveforms and
Operating Range
*E
216628
03/24/04
VBL
Deleted Galvantech info–Title and contents
Updated ordering info to match devmaster
Document #: 38-05161Rev. *E
Page 28 of 28
[+] Feedback
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