ADG918BRM [ROCHESTER]
0 MHz - 4000 MHz RF/MICROWAVE DIVERSITY SWITCH, 1.25 dB INSERTION LOSS, RM-8, MO-187AA, MSOP-8;
| 型号： | ADG918BRM |
| 厂家： | 
Rochester Electronics |
| 描述： | 0 MHz - 4000 MHz RF/MICROWAVE DIVERSITY SWITCH, 1.25 dB INSERTION LOSS, RM-8, MO-187AA, MSOP-8 瞄准线 射频 微波 |
| 文件： | 总17页 (文件大小：1324K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Wideband 4 GHz, 43 dB Isolation at 1 GHz,
CMOS 1.65 V to 2.75 V, 2:1 Mux/SPDT
ADG918/ADG919
FUNCTIONAL BLOCK DIAGRAMS
FEATURES
Wideband switch: −3 dB @ 4 GHz
Absorptive/reflective switches
ADG918
RF1
High off isolation (43 dB @ 1 GHz)
Low insertion loss (0.8 dB @1 GHz)
Single 1.65 V to 2.75 V power supply
CMOS/LVTTL control logic
RFC
50Ω
RF2
CTRL
8-lead MSOP and tiny 3 mm × 3 mm LFCSP packages
Low power consumption (<1 μA)
50Ω
APPLICATIONS
ADG919
Wireless communications
General-purpose RF switching
Dual-band applications
High speed filter selection
Digital transceiver front end switch
IF switching
RF1
RF2
RFC
CTRL
Tuner modules
Figure 1.
Antenna diversity switching
LVTTL compatible. The low power consumption of these
CMOS devices makes them ideally suited to wireless and
general-purpose high frequency switching applications.
GENERAL DESCRIPTION
The ADG918/ADG919 are wideband switches using a CMOS
process to provide high isolation and low insertion loss to
1 GHz. The ADG918 is an absorptive (matched) switch having
50 Ω terminated shunt legs, whereas the ADG919 is a reflective
switch. These devices are designed such that the isolation is
high over the dc to 1 GHz frequency range. They have on-board
CMOS control logic, thus eliminating the need for external
controlling circuitry. The control inputs are both CMOS and
PRODUCT HIGHLIGHTS
1. –43 dB off isolation @ 1 GHz.
2. 0.8 dB insertion loss @ 1 GHz.
3. Tiny 8-lead MSOP/LFCSP packages.
–0.4
–0.6
–0.8
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
–2.4
–2.6
0
V
= 2.5V
DD
= 25°C
–10
–20
–30
–40
–50
–60
–70
–80
T
A
S12
–2.8
–3.0
–3.2
V
T
= 2.5V
= 25°C
DD
S21
–90
A
–100
10k
100k
1M
10M
100M
1G
10G
10k
100k
1M
10M
100M
1G
10G
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 3. Insertion Loss vs. Frequency
Figure 2. Off Isolation vs. Frequency
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 www.analog.com
Fax: 781.461.3113 ©2003–2008 Analog Devices, Inc. All rights reserved.
ADG918/ADG919
TABLE OF CONTENTS
Features .............................................................................................. 1
Terminology.................................................................................... 10
Test Circuits..................................................................................... 11
Applications Information.............................................................. 13
Absorptive vs. Reflective Switch............................................... 13
Wireless Metering....................................................................... 13
Tuner Modules............................................................................ 13
Filter Selection ............................................................................ 13
ADG9xx Evaluation Board ........................................................... 14
Outline Dimensions....................................................................... 15
Ordering Guide .......................................................................... 16
Applications....................................................................................... 1
Functional Block Diagrams............................................................. 1
General Description......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 5
ESD Caution.................................................................................. 5
Pin Configuration and Function Descriptions............................. 6
Typical Performance Characteristics ............................................. 7
REVISION HISTORY
9/08—Rev. B to Rev. C
9/04—Changed from Rev. 0 to Rev. A
Changes to Ordering Guide .......................................................... 16
Updated Format..................................................................Universal
Change to Data Sheet Title...............................................................1
Change to Features............................................................................1
Change to Product Highlights.........................................................1
Changes to Specifications.................................................................3
Change to ADG9xx Evaluation Board section........................... 13
Changes to Ordering Guide.......................................................... 14
8/08—Rev. A to Rev. B
Changes to Table 1, AC Electrical Characteristics, Third Order
Intermodulation Intercept............................................................... 3
Updated Outline Dimensions....................................................... 15
Changes to Ordering Guide .......................................................... 16
8/03 Revision 0: Initial Version
Rev. C | Page 2 of 16
ADG918/ADG919
SPECIFICATIONS
VDD = 1.65 V to 2.75 V, GND = 0 V, input power = 0 dBm, all specifications TMIN to TMAX, unless otherwise noted. Temperature range for
B Version: −40°C to +85°C.
Table 1.
B Version
Parameter
Symbol Conditions
Min
Typ1
Max
Unit
AC ELECTRICAL CHARACTERISTICS
Operating Frequency2
3 dB Frequency3
dc
2
4
7
16
0.7
0.8
1.25
GHz
GHz
dBm
dBm
dB
dB
dB
dB
dB
dB
dB
dB
dB
Input Power3
0 V dc bias
0.5 V dc bias
DC to 100 MHz; VDD = 2.5 V 10%
500 MHz; VDD = 2.5 V 10%
1000 MHz; VDD = 2.5 V 10%
100 MHz
500 MHz
1000 MHz
100 MHz
500 MHz
1000 MHz
100 MHz
500 MHz
1000 MHz
100 MHz
500 MHz
Insertion Loss
S21, S12
S21, S12
S21, S12
S21, S12
S21, S12
S11, S22
S11, S22
0.4
0.5
0.8
60
49
43
60
47
37
58
44
37
57
42
33
27
27
26
23
21
20
6.6
6.5
6.1
6.1
17
36
2.5
Isolation—RFC to RF1/RF2
(CP Package)
57
46
36
55
43
34
55
41
31
54
39
31
21
22
22
18
17
16
Isolation—RFC to RF1/RF2
(RM Package)
Isolation—RF1 to RF2 (Crosstalk)
(CP Package)
Isolation—RF1 to RF2 (Crosstalk)
(RM Package)
1000 MHz
DC to 100 MHz
500 MHz
1000 MHz
DC to 100 MHz
500 MHz
Return Loss (On Channel)3
dB
dB
dB
dB
dB
dB
ns
ns
ns
ns
dBm
dBm
mV p-p
Return Loss (Off Channel)3
ADG918
1000 MHz
On Switching Time3
Off Switching Time3
Rise Time3
Fall Time3
1 dB Compression3
Third Order Intermodulation Intercept
Video Feedthrough4
DC ELECTRICAL CHARACTERISTICS
Input High Voltage
tON
50% CTRL to 90% RF
50% CTRL to 10% RF
10% to 90% RF
90% to 10% RF
1000 MHz
10
9.5
9
tOFF
tRISE
tFALL
P–1 dB
IP3
9
900 MHz/901 MHz, 4 dBm
28.5
VINH
VINH
VINL
VINL
II
VDD = 2.25 V to 2.75 V
VDD = 1.65 V to 1.95 V
VDD = 2.25 V to 2.75 V
VDD = 1.65 V to 1.95 V
0 V ≤ VIN ≤ 2.75 V
1.7
0.65 VCC
V
V
V
V
Input Low Voltage
0.7
0.35 VCC
1
Input Leakage Current
0.1
μA
Rev. C | Page 3 of 16
ADG918/ADG919
B Version
Typ1
Parameter
CAPACITANCE3
Symbol Conditions
Min
Max
Unit
RF On Capacitance
CTRL Input Capacitance
POWER REQUIREMENTS
VDD
CRF ON
CCTRL
f = 1 MHz
f = 1 MHz
1.6
2
pF
pF
1.65
2.75
1
V
μA
Quiescent Power Supply Current
IDD
Digital inputs = 0 V or VDD
0.1
1 Typical values are at VDD = 2.5 V and 25°C, unless otherwise stated.
2 Point at which insertion loss degrades by 1 dB.
3 Guaranteed by design, not subject to production test.
4 The dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 Ω test setup, measured with 1 ns
rise time pulses and 500 MHz bandwidth.
Rev. C | Page 4 of 16
ADG918/ADG919
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 2.
Parameter
Rating
VDD to GND
Inputs to GND
Continuous Current
Input Power
–0.5 V to +4 V
–0.5 V to VDD + 0.3 V1
30 mA
18 dBm
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Junction Temperature
MSOP Package
ESD CAUTION
–40°C to +85°C
–65°C to +150°C
150°C
θJA Thermal Impedance
LFCSP Package
206°C/W
θJA Thermal Impedance (2-layer board) 84°C/W
θJA Thermal Impedance (4-layer board) 48°C/W
Lead Temperature, Soldering (10 sec)
IR Reflow, Peak Temperature (<20 sec)
ESD
300°C
235°C
1 kV
1RF1 and RF2 off port inputs to ground: −0.5 V to VDD – 0.5 V.
Rev. C | Page 5 of 16
ADG918/ADG919
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
4
8
7
6
5
V
RF1
GND
GND
RF2
DD
ADG918/
ADG919
CTRL
GND
RFC
TOP VIEW
(Not to Scale)
Figure 4. 8-Lead MSOP (RM-8) and
8-Lead 3 mm x 3 mm LFCSP (CP-8);
Exposed Pad Tied to Substrate, GND
Table 3. Pin Function Descriptions
Pin No.
Mnemonic
Function
1
VDD
Power Supply Input. These parts can be operated from 1.65 V to 2.75 V, and VDD should be decoupled to GND.
2
CTRL
GND
RFC
RF2
RF1
Logic Control Input. See Table 4.
Ground Reference Point for All Circuitry on the Part.
COMMON RF Port for Switch.
RF2 Port.
3, 6, 7
4
5
8
RF1 Port.
Table 4. Truth Table
CTRL
Signal Path
RF2 to RFC
RF1 to RFC
0
1
Rev. C | Page 6 of 16
ADG918/ADG919
TYPICAL PERFORMANCE CHARACTERISTICS
–0.2
–0.4
–0.6
–0.2
–0.4
–0.6
–0.8
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
–2.4
–2.6
–2.8
–3.0
–3.2
–40°C
+25°C
V
= 2.75V
–0.8
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
–2.4
–2.6
–2.8
–3.0
–3.2
V = 2.5V
DD
DD
+85°C
V
= 2.25V
DD
V
= 2.5V
100k
DD
T
= 25°C
100k
A
10k
1M
10M
100M
1G
10G
10k
1M
10M
100M
1G
10G
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 5. Insertion Loss vs. Frequency over Supplies
(RF1/RF2, S12, and S21)
Figure 8. Insertion Loss vs. Frequency over Temperature
(RF1/RF2, S12, and S21)
–0.30
–0.35
–0.40
–0.45
–0.50
–0.55
–0.60
–0.65
–0.70
–0.75
–0.80
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
V
T
= 1.65V TO 2.75V
DD
= 25°C
V
= 2.75V
DD
A
V
= 2.5V
DD
V
= 2.25V
DD
S12
T
= 25°C
S21
10M
A
10k
100k
1M
10M
100M
1G
10G
10k
100k
1M
100M
1G
10G
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 6. Insertion Loss vs. Frequency over Supplies (RF1/RF2,
S12, and S21) (Zoomed Figure 5 Plot)
Figure 9. Isolation vs. Frequency over Supplies (RF1/RF2, ADG918)
0
–0.2
V
= 1.65V TO 2.75V
DD
= 25°C
–0.4
–0.6
–0.8
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
–2.4
–2.6
–2.8
–10
–20
–30
–40
–50
T
A
V
= 1.95V
DD
V
= 1.8V
DD
V
= 1.65V
DD
S12
–60
–70
–80
–90
S21
T
= 25°C
100k
A
–3.0
–3.2
10k
–100
10k
100k
1M
10M
100M
1G
10G
1M
10M
100M
1G
10G
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 10. Isolation vs. Frequency over Supplies (RF1/RF2, ADG919)
Figure 7. Insertion Loss vs. Frequency over Supplies
(RF1/RF2, S12, and S21)
Rev. C | Page 7 of 16
ADG918/ADG919
–10
V
= 2.5V
DD
–20
–30
–40
–50
–60
–70
–80
–90
–100
CH1
S12 (+85°C)
S12 (+25°C)
CH2/3
S12 (–40°C)
S21
(–40°C, +25°C, +85°C)
CH1 = CTRL = 1V/DIV
CH2 = RF1 = 100mV/DIV
CH3 = RF2 = 100mV/DIV
T
T
= 6.1ns
= 6.1ns
RISE
10k
100k
1M
10M
100M
1G
10G
FREQUENCY (Hz)
FALL
Figure 11. Isolation vs. Frequency over Temperature (RF1/RF2, ADG919)
Figure 14. Switch Timing
0
T
V
= 25°C
A
–5
= 2.5V
DD
–10
–15
–20
–25
OFF SWITCH (ADG918)
CTRL
RFC
–30
ON SWITCH
–35
–40
CH2 p-p
2.002mV
10k
100k
1M
10M
100M
1G
10G
CH1 500mV CH2 1mVΩ
m 10.0ns
FREQUENCY (Hz)
Figure 15. Video Feedthrough
Figure 12. Return Loss vs. Frequency (RF1/RF2, S11)
40
35
–10
–15
–20
–25
–30
–35
–40
–45
–50
–55
–60
–65
–70
–75
–80
T
V
= 25°C
A
= 2.5V
DD
30
25
20
15
10
5
0
V
= 2.5V
DD
= 25°C
T
A
250
350
450
550
650
750
850
10k
100k
1M
10M
100M
1G
10G
FREQUENCY (Hz)
FREQUENCY (MHz)
Figure 13. Crosstalk vs. Frequency (RF1/RF2, S12, S21)
Figure 16. IP3 vs. Frequency
Rev. C | Page 8 of 16
ADG918/ADG919
20
18
16
14
12
10
8
6
4
V
= 2.5V
= 25°C
DD
2
T
A
0
0
250
500
750
1000
1250
1500
FREQUENCY (MHz)
Figure 17. P-1 dB vs. Frequency
Rev. C | Page 9 of 16
ADG918/ADG919
TERMINOLOGY
tFALL
VDD
Fall time; time for the RF signal to fall from 90% to 10% of the
on level.
Most positive power supply potential.
IDD
Off Isolation
Positive supply current.
The attenuation between the input and output ports of the
switch when the switch control voltage is in the off condition.
GND
Ground (0 V) reference.
Insertion Loss
The attenuation between the input and output ports of the
switch when the switch control voltage is in the on condition.
CTRL
Logic control input.
VINL
P–1 dB
Maximum input voltage for Logic 0.
1 dB compression point. The RF input power level at which the
switch insertion loss increases by 1 dB over its low level value. It
is a measure of how much power the on switch can handle
before the insertion loss increases by 1 dB.
VINH
Minimum input voltage for Logic 1.
I
INL (IINH)
Input current of the digital input.
IP3
Third order intermodulation intercept. This is a measure of the
power in false tones that occur when closely spaced tones are
passed through a switch, whereby the nonlinearity of the switch
causes these false tones to be generated.
CIN
Digital input capacitance.
tON
Delay between applying the digital control input and the output
switching on.
Return Loss
The amount of reflected power relative to the incident power at
a port. Large return loss indicates good matching. By measuring
return loss, the VSWR (voltage standing wave ratio) can be
calculated from conversion charts. VSWR indicates the degree
of matching present at a switch RF port.
tOFF
Delay between applying the digital control input and the output
switching off.
tRISE
Rise time; time for the RF signal to rise from 10% to 90% of the
on level.
Video Feedthrough
Spurious signals present at the RF ports of the switch when the
control voltage is switched from high to low or low to high
without an RF signal present.
Rev. C | Page 10 of 16
ADG918/ADG919
TEST CIRCUITS
Setups for the ADG918 are similar.
V
V
DD
DD
0.1µF
V
OUT
V
R
50Ω
DD
L
0.1µF
ADG919
RF1
RF2
NETWORK
ANALYZER
V
50Ω
DD
RFC
V
OUT
V
RFx
RFC
50%
50%
R
50Ω
CTRL
L
CTRL
V
V
S
S
50Ω
CTRL
90%
10%
V
OUT
V
CTRL
GND
GND
V
OUT
INSERTION LOSS = 20log
tON
V
S
tOFF
Figure 21. Insertion Loss
Figure 18. Switch Timing: tON, tOFF
V
DD
0.1µF
V
V
DD
NETWORK
ANALYZER
V
0.1µF
RFC
DD
ADG919
RF1
RF2
50Ω
V
S
DD
RFC
50Ω
V
OUT
RFx
50%
50%
V
OUT
V
CTRL
R
L
CTRL
R
L
50Ω
V
S
90%
90%
50Ω
CTRL
10%
10%
V
OUT
V
CTRL
GND
GND
V
OUT
CROSSTALK = 20log
tRISE
tFALL
V
S
Figure 19. Switch
Figure 22. Crosstalk
V
DD
V
DD
0.1µF
0.1µF
50Ω
V
V
S
DD
ADG919
V
DD
ADG919
V
OUT
NC
NC
RF1
RF2
R
L
50Ω
RF1
RF2
RFC
RFC
OSCILLOSCOPE
NETWORK
ANALYZER
50Ω
CTRL
CTRL
V
CTRL
V
CTRL
GND
GND
V
OUT
OFF ISOLATION = 20log
V
S
Figure 23. Video Feedthrough
Figure 20. Off Isolation
Rev. C | Page 11 of 16
ADG918/ADG919
V
DD
V
DD
DD
0.1µF
0.1µF
V
DD
ADG919
V
ADG919
RF1
RF2
50Ω
RF1
RF2
50Ω
RF
SOURCE
RFC
SPECTRUM
ANALYZER
RFC
SPECTRUM
ANALYZER
RF
COMBINER
SOURCE
CTRL
CTRL
V
S
RF
SOURCE
V
V
CTRL
CTRL
GND
GND
Figure 25. P-1 dB
Figure 24. IP3
Rev. C | Page 12 of 16
ADG918/ADG919
APPLICATIONS INFORMATION
The ADG918/ADG919 are ideal solutions for low power, high
frequency applications. The low insertion loss, high isolation
between ports, low distortion, and low current consumption of
these parts make them excellent solutions for many high
frequency switching applications. The most obvious application
is in a transmit/receive block, as shown in the wireless metering
block diagram in Figure 26.
a utility metering transceiver application, providing the
required isolation between the transmit and receive signals.
The SPDT configuration isolates the high frequency receive
signal from the high frequency transmit.
LNA
ANTENNA
ADG918
Other applications include switching between high frequency
filters, an ASK generator, an FSK generator, and an antenna
diversity switch in many tuner modules.
TX/RX SWITCH
PA
Figure 26. Wireless Metering
ABSORPTIVE VS. REFLECTIVE SWITCH
The ADG918 is an absorptive (matched) switch with 50 Ω
terminated shunt legs, and the ADG919 is a reflective switch
with 0 Ω terminated shunts to ground. The ADG918 absorptive
switch has a good VSWR on each port, regardless of the switch
mode. An absorptive switch should be used when there is a need
for a good VSWR that is looking into the port but not passing
the through signal to the common port. The ADG918 is there-
fore ideal for applications that require minimum reflections
back to the RF source. It also ensures that the maximum power
is transferred to the load.
TUNER MODULES
The ADG918 can be used in a tuner module to switch between
the cable TV input and the off-air antenna. This part is also
ideal for use as an antenna diversity switch, switching different
antenna to the tuner.
VGA
ANTENNA
ADG918/
TUNER
ADG919
CABLE
Figure 27. Tuner Modules
The ADG919 reflective switch is suitable for applications where
high off port VSWR does not matter and the switch has some
other desired performance feature. It can be used in many
applications, including high speed filter selection. In most cases,
an absorptive switch can be used instead of a reflective switch,
but not vice versa.
FILTER SELECTION
The ADG919 can be used as a 2:1 demultiplex to switch high
frequency signals between different filters and also to multiplex
the signal to the output.
RF
RF
IN
OUT
WIRELESS METERING
RF1
RF2
RF1
RF2
RFC ADG919
ADG919
RFC
The ADG918 can be used in wireless metering applications. It
can be used in conjunction with the ADF7020 transceiver IC for
Figure 28. Filter Selection
Rev. C | Page 13 of 16
ADG918/ADG919
ADG9xx EVALUATION BOARD
The ADG9xx evaluation board allows designers to evaluate the
high performance wideband switches with a minimum of effort.
In addition to the evaluation board, the user requires only a
power supply and a network analyzer. An application note is
available with the evaluation board and gives complete
information about operating the evaluation board.
The RFC port (see Figure 29) is connected through a 50 Ω
transmission line to the top left SMA connector J1. RF1 and
RF2 are connected through 50 Ω transmission lines to the top
two SMA connectors, J2 and J3 respectively. A through trans-
mission line connects J4 and J5 and is used to estimate the loss
of the PCB over the environmental conditions being evaluated.
The board is constructed of a 4-layer, FR4 material with a
dielectric constant of 4.3 and an overall thickness of 0.062
inches. Two ground layers with grounded planes provide
ground for the RF transmission lines. The transmission lines
were designed using a coplanar waveguide with ground plane
model using a trace width of 0.052 inches, a clearance to ground
plane of 0.030 inches, a dielectric thickness of 0.029 inches, and
a metal thickness of 0.014 inches.
Figure 29. ADG9xx Evaluation Board Top View
Rev. C | Page 14 of 16
ADG918/ADG919
OUTLINE DIMENSIONS
3.20
3.00
2.80
8
1
5
4
5.15
4.90
4.65
3.20
3.00
2.80
PIN 1
0.65 BSC
0.95
0.85
0.75
1.10 MAX
0.80
0.60
0.40
8°
0°
0.15
0.00
0.38
0.22
0.23
0.08
SEATING
PLANE
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 30. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
3.25
3.00 SQ
2.75
0.60 MAX
0.50
BSC
0.60 MAX
5
8
2.95
2.75 SQ
2.55
1.60
1.45
1.30
EXPOSED
PAD
TOP
VIEW
PIN 1
INDICATOR
(BOTTOM VIEW)
4
1
PIN 1
INDICATOR
0.50
0.40
0.30
1.89
1.74
1.59
12° MAX
0.70 MAX
0.65TYP
0.90 MAX
0.85 NOM
EXPOSED PAD IS CONNECTED INTERNAL LY.
0.05 MAX
0.01 NOM
FOR INCREASED RELIABILIT Y OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY IT
IS RECOMMENDED THAT THE PAD BE SOLDERED
TO THE GROUND PLANE.
0.30
0.23
0.18
SEATING
PLANE
0.20 REF
Figure 31. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
3 mm x 3 mm Body, Very Thin, Dual Lead
(CP-8-2)
Dimensions shown in millimeters
Rev. C | Page 15 of 16
ADG918/ADG919
ORDERING GUIDE
Temperature
Range
Model
Package Description
Package Option
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
Branding
W4B
W4B
W4B
W4B
W4B#
W4B#
W4B#
W4B#
W4B
W4B
W4B#
W4B#
W5B
W5B
W5B
W5B
S1X
ADG918BRM
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Lead Frame Chip Scale Package (LFCSP_VD) CP-8-2
8-Lead Lead Frame Chip Scale Package (LFCSP_VD) CP-8-2
8-Lead Lead Frame Chip Scale Package (LFCSP_VD) CP-8-2
8-Lead Lead Frame Chip Scale Package (LFCSP_VD) CP-8-2
ADG918BRM-500RL7
ADG918BRM-REEL
ADG918BRM-REEL7
ADG918BRMZ1
ADG918BRMZ-500RL71
ADG918BRMZ-REEL1
ADG918BRMZ-REEL71
ADG918BCP-500RL7
ADG918BCP-REEL7
ADG918BCPZ-500RL71
ADG918BCPZ-REEL71
ADG919BRM
ADG919BRM-500RL7
ADG919BRM-REEL
ADG919BRM-REEL7
ADG919BRMZ1
ADG919BRMZ-REEL1
ADG919BRMZ-REEL71
ADG919BCP-500RL7
ADG919BCP-REEL7
ADG919BCPZ-REEL71
EVAL-ADG918EBZ1
EVAL-ADG919EBZ1
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
S1X
S1X
8-Lead Lead Frame Chip Scale Package (LFCSP_VD) CP-8-2
8-Lead Lead Frame Chip Scale Package (LFCSP_VD) CP-8-2
8-Lead Lead Frame Chip Scale Package (LFCSP_VD) CP-8-2
Evaluation Board
W5B
W5B
S1X
Evaluation Board
1 Z = RoHS Compliant Part, # denotes RoHS compliant product, may be top or bottom marked.
©2003–2008 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03335-0-9/08(C)
Rev. C | Page 16 of 16
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