1MDL06-031-03AN05 [RMT]

Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper; 空白陶瓷(没有金属)金属化(镀金)空白,镀锡铜
1MDL06-031-03AN05
型号: 1MDL06-031-03AN05
厂家: RMT Ltd.    RMT Ltd.
描述:

Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
空白陶瓷(没有金属)金属化(镀金)空白,镀锡铜

文件: 总8页 (文件大小:2794K)
中文:  中文翻译
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Thermoelectric Cooling Solutions  
Performance Parameters  
1MDL06-031-xxAN05  
ΔTmax Qmax  
Imax  
A
Umax AC R  
H
Type  
K
W
V
Ohm mm  
1MDL06-031-xxAN05 (N=31)  
1MDL06-031-03AN05  
1MDL06-031-05AN05  
1MDL06-031-07AN05  
1MDL06-031-09AN05  
1MDL06-031-12AN05  
1MDL06-031-15AN05  
69  
72  
72  
73  
73  
73  
12.59  
7.89  
5.74  
4.52  
3.41  
2.74  
5.3  
3.3  
2.4  
1.9  
1.4  
1.1  
0.55  
0.89  
1.23  
1.57  
2.08  
2.59  
1.4  
1.6  
1.8  
2.0  
2.3  
2.6  
3.9  
Performance data are given for 300K, vacuum  
Dimensions  
Manufacturing options  
A. TEC Assembly:  
C. Ceramics Surface Options:  
D. Thermistor (optional)  
Can be mounted to cold side  
ceramics edge. Calibration is  
* 1. Solder SnSb (Tmelt=230°C)  
2. Solder AuSn (Tmelt=280°C)  
1. Blank ceramics (not metallized)  
2. Metallized (Au plating)  
available by request.  
3. Metallized and pre-tinned with:  
3.1 Solder 117 (In-Sn, Tmelt =117°C)  
3.2 Solder 138 (Sn-Bi, Tmelt = 138°C)  
3.3 Solder 143 (In-Ag, Tmelt = 143°C)  
B. Ceramics:  
E. Terminal contacts  
1. Blank, tinned Copper  
2. Insulated Wires  
1.Pure Al2O3(100%)  
2.Alumina (Al2O3- 96%)  
* 3.Aluminum Nitride (AlN)  
* - used by default  
3.4 Solder 157 (In, Tmelt = 157°C)  
3.5 Solder 183 (Pb-Sn, Tmelt =183°C)  
3.6 Optional (specified by Customer)  
3. Insulated, color coded  
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru  
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.  
Page 1 of 8  
Thermoelectric Cooling Solutions  
1MDL06-031-03AN05  
Performance Data  
ΔTmax Qmax  
Imax  
A
Umax  
V
ΔTmax Qmax  
Imax  
A
Umax  
V
@ 27ºC, Vacuum  
@50ºC, N2  
K
W
K
W
1MDL06-031-03AN05  
1MDL06-031-03AN05  
69  
12.59  
5.3  
3.9  
75  
13.79  
5.3  
4.3  
Note: Performance data is specified at optimal conditions (TEC hot side is stabilized at ambient temperature). Heatsink  
thermal resistance is not included into estimations. Use TECCad Software for estimations under different conditions.  
1MDL06-031-05AN05  
Performance Data  
ΔTmax Qmax  
Imax  
A
Umax  
V
ΔTmax Qmax  
Imax  
A
Umax  
V
@ 27ºC, Vacuum  
@50ºC, N2  
K
W
K
W
1MDL06-031-05AN05  
1MDL06-031-05AN05  
72  
7.89  
3.3  
3.9  
77  
8.62  
3.3  
4.3  
Note: Performance data is specified at optimal conditions (TEC hot side is stabilized at ambient temperature). Heatsink  
thermal resistance is not included into estimations. Use TECCad Software for estimations under different conditions.  
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru  
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.  
Page 2 of 8  
Thermoelectric Cooling Solutions  
1MDL06-031-07AN05  
Performance Data  
ΔTmax Qmax  
Imax  
A
Umax  
V
ΔTmax Qmax  
Imax  
A
Umax  
V
@ 27ºC, Vacuum  
@50ºC, N2  
K
W
K
W
1MDL06-031-07AN05  
1MDL06-031-07AN05  
72  
5.74  
2.4  
3.9  
78  
6.27  
2.4  
4.3  
Note: Performance data is specified at optimal conditions (TEC hot side is stabilized at ambient temperature). Heatsink  
thermal resistance is not included into estimations. Use TECCad Software for estimations under different conditions.  
1MDL06-031-09AN05  
Performance Data  
ΔTmax Qmax  
Imax  
A
Umax  
V
ΔTmax Qmax  
Imax  
A
Umax  
V
@ 27ºC, Vacuum  
@50ºC, N2  
K
W
K
W
1MDL06-031-09AN05  
1MDL06-031-09AN05  
73  
4.52  
1.9  
3.9  
78  
4.94  
1.9  
4.3  
Note: Performance data is specified at optimal conditions (TEC hot side is stabilized at ambient temperature). Heatsink  
thermal resistance is not included into estimations. Use TECCad Software for estimations under different conditions.  
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru  
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.  
Page 3 of 8  
Thermoelectric Cooling Solutions  
1MDL06-031-12AN05  
Performance Data  
ΔTmax Qmax  
Imax  
A
Umax  
V
ΔTmax Qmax  
Imax  
A
Umax  
V
@ 27ºC, Vacuum  
@50ºC, N2  
K
W
K
W
1MDL06-031-12AN05  
1MDL06-031-12AN05  
73  
3.41  
1.4  
3.9  
78  
3.74  
1.4  
4.3  
Note: Performance data is specified at optimal conditions (TEC hot side is stabilized at ambient temperature). Heatsink  
thermal resistance is not included into estimations. Use TECCad Software for estimations under different conditions.  
1MDL06-031-15AN05  
Performance Data  
ΔTmax Qmax  
Imax  
A
Umax  
V
ΔTmax Qmax  
Imax  
A
Umax  
V
@ 27ºC, Vacuum  
@50ºC, N2  
K
W
K
W
1MDL06-031-15AN05  
1MDL06-031-15AN05  
73  
2.74  
1.1  
3.9  
77  
3.00  
1.1  
4.3  
Note: Performance data is specified at optimal conditions (TEC hot side is stabilized at ambient temperature). Heatsink  
thermal resistance is not included into estimations. Use TECCad Software for estimations under different conditions.  
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru  
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.  
Page 4 of 8  
Thermoelectric Cooling Solutions  
Additional Options  
TEC Polarity  
TEC Polarity can be modified by request. The  
specified polarity in this datasheet is typical.  
It can be reversed in accordance to Customer  
application requirements.  
+
-
-
Standard polarity  
Reversed polarity  
+
Terminal Wires Options  
The standard solution is with terminal wires. TEC  
can be modified for WB process by request. In this  
case terminal wires are not mounted, TEC has Au  
plated WB pads.  
Standard solution,  
terminal wires  
WB Solution, Au  
played WB pads  
Optimization for WB process  
In case of WB optimization, the standard WB  
solution is with WB pads (no posts) by default. WB  
posts are available by request. The dimensions of  
WB posts can be modified and optimized for  
Customers application. WB posts are made of  
Copper, Au plated.  
WB posts  
WB pads  
Customized Au Patterns  
Customized Au patterns on thermoelectric cooler  
cold side are available by request. Selective Pre-  
tinning over pattern is also available. Please,  
contact RMT Ltd for additional information about  
customized Au patterns requirements.  
Customized Au pattern  
on cold side  
Selective pre-tinning  
over pattern  
TEC Height modification  
Standard TEC height can be modified without  
performance changes by using ceramics of  
different thickness. Standard thermoelectric cooler  
height (specified in this datasheet) can be modified  
in a range -0.5..+1.0 mm by request.  
Modified height,  
another ceramics  
Standard height  
thickness  
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru  
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.  
Page 5 of 8  
Thermoelectric Cooling Solutions  
Thermoelectric Cooler Overview  
Cold side Ceramics  
(top side)  
AlN Ceramics by default  
(Al2O3 solution is available  
by request)  
TE Cooler Lead Free  
Internal Assembly  
(Lead-Free Solder 230,  
Sn-Sb)  
Pellets (BiTe posts)  
TEC Polarity  
(can be modified by  
request)  
Hot Side Ceramics  
(bottom side)  
-
+
Terminal Wires  
(or WB pads by request)  
Application Tips  
1. Never heat TE module more than 200˚C (TEC  
assembled at 230˚C).  
1. Connect TE module to DC power supply according  
to polarity.  
2. Never use TE module without an attached heat sink  
at hot (bottom) side.  
2. Do not apply DC current higher than Imax.  
Installation  
1. Mechanical Mounting. TEC is placed between two heat exchangers . This construction is fixed by screws or in  
another mechanical way. It is suitable for large modules (with dimensions 30x30mm and larger). Miniature types  
require other assembling methods in most cases.  
1. Soldering. This method is suitable for a TE module with metallized outside surfaces. RMT provides this option  
and also makes pre-tinning for TE modules.  
2. Glueing. It is an up-to-date method that is used by many customers due to availability of glues with good  
thermoconductive properties. A glue is usually based on some epoxy compound filled with some  
thermoconductive material such as graphite or diamond powders, silver, SiN and others. The application of a  
specific type depends on application features and the type of a TE module.  
Object being cooled  
Object being cooled  
TEC  
TEC  
3
1
2
Screw mounting  
Heatsink  
Soldering  
Heatsink  
Gluing  
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru  
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.  
Page 6 of 8  
Thermoelectric Cooling Solutions  
Contacts  
RMT Ltd. Headquarters  
Warshavskoe sh. 46, 115230, Moscow  
Russia  
Phone: +7-499-678-2082  
Fax: +7-499-678-2083  
Web: www.rmtltd.ru  
Email: info@rmtltd.ru  
EUROPE/USA - TEC Microsystems GmbH  
Schwarzschildstrasse 3, 12489 Berlin  
Germany  
Tel. +49 30 6789 3314  
Fax+49 30 6789 3315  
Web: www.tec-microsystems.com  
Email: info@tec-microsystems.com  
CHINA - ProTEC Ltd.  
圳 良 路恒裕 中 心B207  
市南区登  
ꢀꢁ+86-755-61596066  
+86-755-61596036  
ꢃꢄ518054  
Web: www.protecltd.com  
Email: info@protecltd.com  
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru  
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.  
Page 7 of 8  
Thermoelectric Cooling Solutions  
Legal Notice  
All logos, images, trademarks and product names (collectively Materials) are proprietary to RMT Ltd and/ or any  
of its affiliates, or subsidiaries, or other respective owners that have granted RMT Ltd the permission and/or  
license to use such Materials. All images are provided by RMT Ltd. and are subjects of copyright protection.  
RMT Ltd, TEC Microsystems GmbH and ProTEC Ltd do not grant a copyright license (express or implied) to the  
Recipient, except that Recipient may reproduce the logos, images and text materials in this press-release  
without any alteration for non-promotional or editorial purposes only with a written note about materials owner.  
Copyright protection warning  
Graphic materials and text from this datasheet may not be used commercially without a prior response in  
writing on company letterhead and signed by RMT Ltd authority. Thank you for respecting the intellectual  
property rights protected by the International Copyright laws.  
Warning: All datasheet images contain RMT Ltd hidden watermark for the immediate proof of their origin.  
RMT Image  
Hidden Watermark  
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru  
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.  
Page 8 of 8  

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