RT9004AGQV [RICHTEK]
300mA, Low Noise, Ultra-Fast CMOS Triple LDOs Regulator; 300mA，低噪音，超高速CMOS三路的LDO稳压器
| 型号： | RT9004AGQV |
| 厂家： | 
RICHTEK TECHNOLOGY CORPORATION |
| 描述： | 300mA, Low Noise, Ultra-Fast CMOS Triple LDOs Regulator |
| 文件： | 总12页 (文件大小：262K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Preliminary
RT9004
300mA, Low Noise, Ultra-Fast CMOS Triple LDOs Regulator
General Description
Features
z Short Circuit Thermal Folded Back Protection
The RT9004 is designed for portable RF and wireless
applications with demanding performance and space
requirements. The RT9004 performance is optimized for
battery-powered systems to deliver ultra low noise and
low quiescent current. Regulator ground current increases
only slightly in dropout, further prolonging the battery life.
The RT9004 also works with low-ESR ceramic capacitors,
reducing the amount of board space necessary for power
applications, critical in hand-held wireless devices. The
RT9004 consumes less than 0.01uA in shutdown mode
and has fast turn-on time less than 50us. RT9004 is short
circuit thermal folded back protected. RT9004 lowers its
OTP trip point from 165°C to 110°C when output short
circuit occurs (VOUT < 0.4V) providing maximum safety to
end users. The other features include ultra low dropout
voltage, high output accuracy, current limiting protection,
and high ripple rejection ratio. Available in the VDFN-10L
3x3 and WDFN-10L 3x3 packages, the RT9004 also offers
custom voltage, range of 1.5V to 3.5V with 0.1V per step.
z Low-Noise for RF Application
z Fast Response in Line/Load Transient
z Quick Start-Up (Typically 50us)
z Low Dropout : 220mV @ 300mA
z Wide Operating Voltage Ranges : 2.5V to 5.5V
z TTL-Logic-Controlled Shutdown Input
z Low Temperature Coefficient
z Thermal Shutdown Protection
z Only 1uF Output Capacitor Required for Stability
z High Power Supply Rejection Ratio
z Custom Voltage Available
z Small 10-Lead VDFN and WDFN Packages
z RoHS Compliant and 100% Lead (Pb)-Free
Applications
z CDMA/GSM Cellular Handsets
z Battery-Powered Equipment
z Laptop, Palmtops, Notebook Computers
z Hand-Held Instruments
Ordering Information
z PCMCIA Cards
RT9004
Package Type
z Portable InformationAppliances
QV : VDFN-10L 3x3 (V-Type)
QW : WDFN-10L 3x3 (W-Type)
Pin Configurations
Operating Temperature Range
P : Pb Free with Commercial Standard
G : Green (Halogen Free with Commer-
cial Standard)
(TOP VIEW)
1
2
3
4
5
10
9
Voltage Version : VOUT1/VOUT2/VOUT3
A : 2.8V/2.5V/1.8V
B : 3.0V/2.5V/1.8V
C : 2.8V/2.8V/1.8V
D : 2.8V/1.8V/1.8V
VOUT1
VOUT2
GND
VIN1
EN1
VIN2
EN2
VIN3
GND
8
7
9
VOUT3
EN3
11
E : 3.3V/2.8V/1.8V
F : 3.3V/2.8V/2.8V
V/WDFN-10L 3x3
G : 2.5V/2.8V/2.5V
H : 2.8V/2.8V/1.5V
J : 1.5V/3.3V/3.3V
Marking Information
K : 3.0V/3.0V/1.8V
For marking information, contact our sales representative
directly or through a Richtek distributor located in your
area, otherwise visit our website for detail.
Note :
Richtek Pb-free and Green products are :
`RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
`Suitable for use in SnPb or Pb-free soldering processes.
`100% matte tin (Sn) plating.
DS9004-00 February 2008
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1
Preliminary
RT9004
Typical Application Circuit
RT9004
V
V
VIN1
VIN2
VIN3
VOUT1
VOUT2
VOUT3
V
OUT1
OUT2
IN
V
OUT3
C
2.2uF
IN
C
1uF
Chip Enable
OUT
EN1
EN2
EN3
GND
Chip Shutdown
RT9004
V
V
V
VIN1
VIN2
VIN3
VOUT1
VOUT2
VOUT3
IN1
OUT1
OUT2
V
IN2
V
V
IN3
OUT3
C
1uF
IN
C
1uF
OUT
Chip Enable
EN1
EN2
EN3
GND
Chip Shutdown
Functional Pin Description
Pin Number
Pin Name
Pin Function
1
VOUT1
Output Voltage 1.
Output Voltage 2.
2
VOUT2
3
Ground. The exposed pad must be soldered to a large PCB and connected to GND
for maximum power dissipation.
GND
VOUT3
EN3
Exposed Pad (11)
4
Output Voltage 3.
Chip Enable 3 (Active High). Note that this pin is high impedance. There should be a
pull low 100kΩ resistor connected to GND when the control signal is floating.
Input Voltage 3.
5
6
VIN3
EN2
Chip Enable 2 (Active High). Note that this pin is high impedance. There should be a
pull low 100kΩ resistor connected to GND when the control signal is floating.
Input Voltage 2.
7
8
VIN2
EN1
Chip Enable 1 (Active High). Note that this pin is high impedance. There should be a
pull low 100kΩ resistor connected to GND when the control signal is floating.
Input Voltage 1.
9
10
VIN1
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Preliminary
RT9004
Function Block Diagram
EN1
Shutdown
VIN1
and
Logic Control
V
REF
V
REF
V
REF
-
MOS Driver
Error
Amplifier
VOUT1
Current-Limit
and
Thermal
Protection
GND
VIN2
EN2
Shutdown
and
Logic Control
-
MOS Driver
Error
Amplifier
VOUT2
Current-Limit
and
Thermal
Protection
EN3
Shutdown
VIN3
and
Logic Control
-
MOS Driver
Error
Amplifier
VOUT3
Current-Limit
and
Thermal
Protection
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3
Preliminary
RT9004
Absolute Maximum Ratings (Note 1)
z Supply Input Voltage------------------------------------------------------------------------------------------------------ 6.0V
z Power Dissipation, PD @ TA = 25°C
V/WDFN-10L 3x3 ---------------------------------------------------------------------------------------------------------- 0.952 W
z Package Thermal Resistance (Note 4)
V/WDFN-10L 3x3, θJA ---------------------------------------------------------------------------------------------------- 105°C/W
z Junction Temperature ----------------------------------------------------------------------------------------------------- 150°C
z Lead Temperature (Soldering, 10sec.)-------------------------------------------------------------------------------- 260°C
z Storage Temperature Range -------------------------------------------------------------------------------------------- −65°C to 125°C
z ESD Susceptibility (Note 2)
HBM (Human Body Mode) ---------------------------------------------------------------------------------------------- 2kV
MM (Machine Mode) ------------------------------------------------------------------------------------------------------ 200V
Recommended Operating Conditions (Note 3)
z Supply Input Voltage------------------------------------------------------------------------------------------------------ 2.5V to 5.5V
z OperationAmbient Temperature Range ------------------------------------------------------------------------------ −40°C to 85°C
z Operation Junction Temperature Range ------------------------------------------------------------------------------ −40°C to 125°C
Electrical Characteristics
(VIN = VOUT + 1V, CIN = COUT = 1μF, TA = 25°C, unless otherwise specified)
Parameter
Output Voltage Accuracy
Current Limit
Symbol
Test Conditions
= 1mA
OUT
Min
−2
360
--
Typ
--
Max Units
ΔV
I
+2
--
%
mA
μA
OUT
I
R
= 1Ω
LOAD
400
90
LIM
Quiescent Current
I
Q
--
V
EN
>= 1.2V, I = 0mA
OUT
I
= 200mA
--
170
220
--
OUT
Dropout Voltage (Note 4)
Line Regulation
V
mV
%
DROP
I
= 300mA
--
--
OUT
V
= (V
= 1mA
+ 1V) to 5.5V,
< 300mA
OUT
IN
OUT
ΔV
--
--
0.3
LINE
I
OUT
Load Regulation
ΔV
1mA < I
--
--
--
0.01
0
0.6
1
%
LOAD
Standby Current
I
V
V
V
V
= GND, Shutdown
= GND or VIN
μA
nA
STBY
IBSD
EN
EN
IN
EN Input Bias Current
I
--
100
0.4
--
Logic-Low Voltage
V
Logic-High Voltage V
f = 100Hz
= 3V to 5.5V, Shutdown
= 3V to 5.5V, Start-Up
--
--
IL
EN Threshold
V
1.2
--
--
IH
IN
−60
−30
165
30
--
Power Supply
Rejection Rate
PSRR
C
= 1μF, I
= 100mA
dB
OUT
OUT
f = 10kHz
--
--
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
Thermal Folded Back Temperature
T
--
--
°C
°C
°C
SD
ΔT
--
--
SD
ΔT
--
110
--
TFB
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Preliminary
RT9004
Note 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. Devices are ESD sensitive. Handling precaution is recommended.
Note 3. The device is not guaranteed to function outside its operating conditions.
Note 4. θJA is measured in the natural convection at TA = 25°C on a low effective thermal conductivity test board (single-later,
1s) of JEDEC 51-3 thermal measurement standard.
DS9004-00 February 2008
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5
Preliminary
RT9004
Typical Operating Characteristics
Quiesent Current vs. Temperature
Output Voltage vs. Temperature
100
95
90
85
80
75
70
65
60
2
VIN = 3.3V
VOUT = 1.5V
CIN = COUT = 1uF
VIN = 5V
CIN = COUT = 1uF
1.9
1.8
No Load
1.7
1.6
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Temperature (°C)
Temperature (°C)
EN Pin Shutdown Threshold vs. Temperature
Current Limit vs. Input Voltage
1.5
600
550
500
450
400
350
300
VIN = 3.3V
VOUT = 1.5V
VOUT = 1.5V
CIN = COUT = 1uF
CIN = COUT = 1uF
1.25
1
0.75
0.5
0.25
-50
-25
0
25
50
75
100
125
2
2.5
3
3.5
4
4.5
5
5.5
6
6.5
(°C)
Temperature
Input Voltage (V)
Dropout Voltage vs. Load Current
PSRR
300
250
200
150
100
50
20
0
VOUT = 3.3V
CIN = COUT = 1uF
VOUT = 2.5V
CIN = COUT = 1uF, X7R
TJ = 125°C
TJ = 25°C
-20
-40
-60
-80
TJ = -40°C
ILOAD = 100mA
ILOAD = 10mA
0
10
1
100
1K
10K
100K
1M
1
0
0.05
0.1
0.15
0.2
0.25
0.3
Load Current (A)
(Hz)
Frequency (kH)
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Preliminary
RT9004
Line Transient Response
Line Transient Response
CIN = COUT = 1uF
ILOAD = 50mA
CIN = COUT = 1uF
ILOAD = 250mA
5
4
3
5
4
3
20
0
50
0
-20
-50
Time (100μs/Div)
Time (100μs/Div)
Load Transient Response
Load Transient Response
VIN = 3.3V
CIN = COUT = 1uF
VOUT = 1.5V
ILOAD= 1mA to 50mA
VIN = 3.3V
CIN = COUT = 1uF
VOUT = 1.5V
ILOAD = 1mA to 250mA
100
50
0
400
200
0
50
0
50
0
-50
-50
Time (100μs/Div)
Time (100μs/Div)
Start Up
Start Up
VIN = 3.3V, CIN = 2.2μF
VIN = 3.3V, CIN = 2.2μF
EN
(2V/Div)
EN
(2V/Div)
VOUT1
(2V/Div)
VOUT1
(2V/Div)
VOUT2
(2V/Div)
VOUT2
(2V/Div)
VOUT3
(200mV/Div)
VOUT3
(2V/Div)
Time (10μs/Div)
Time (25μs/Div)
DS9004-00 February 2008
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7
Preliminary
RT9004
Noise
Noise
VOUT = 2.8V, ILOAD = 150mA
VOUT = 2.5V, ILOAD = 150mA
600
400
200
0
600
400
200
0
-200
-400
-600
-200
-400
-600
Time (1ms/Div)
Time (1ms/Div)
Noise
VOUT = 1.8V, ILOAD = 150mA
600
400
200
0
-200
-400
-600
Time (1ms/Div)
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Preliminary
RT9004
Applications Information
Like any low-dropout regulator, the external capacitors used
with the RT9004 must be carefully selected for regulator
stability and performance. Using a capacitor whose value
is > 2.2μF on the RT9004 input and the amount of
capacitance can be increased without limit. The input
capacitor must be located a distance of not more than
0.5 inch from the input pin of the IC and returned to a
clean analog ground.Any good quality ceramic or tantalum
can be used for this capacitor. The capacitor with larger
value and lower ESR (equivalent series resistance) provides
better PSRR and line-transient response.
Enable Function
The RT9004 features an LDO regulator enable/disable
function. To assure the LDO regulator will switch on, the
EN turn on control level must be greater than 1.2 volts.
The LDO regulator will go into the shutdown mode when
the voltage on the EN pin falls below 0.4 volts. For to
protecting the system, the RT9004 have a quick-discharge
function. If the enable function is not needed in a specific
application, it may be tied to VIN to keep the LDO
regulator in a continuously on state.
Thermal Considerations
The output capacitor must meet both requirements for
minimum amount of capacitance and ESR in all LDOs
application. The RT9004 is designed specifically to work
with low ESR ceramic output capacitor in space-saving
and performance consideration. Using a ceramic capacitor
whose value is at least 1μF with ESR is > 20mΩ on the
RT9004 output ensures stability. The RT9004 still works
well with output capacitor of other types due to the wide
stable ESR range. Figure 1 shows the curves of allowable
ESR range as a function of load current for various output
capacitor values. Output capacitor of larger capacitance
can reduce noise and improve load transient response,
stability, and PSRR. The output capacitor should be located
not more than 0.5 inch from the VOUT pin of the RT9004
and returned to a clean analog ground.
Thermal protection limits power dissipation in RT9004.
When the operation junction temperature exceeds 165°C,
the OTP circuit starts the thermal shutdown function and
turns the pass element off. The pass element turn on again
after the junction temperature cools by 30°C.
RT9004 lowers its OTP trip level from 165°C to 110°C
when output short circuit occurs (VOUT < 0.4V) as shown
in Figure 2. This limits IC case temperature under 100°C
and provides maximum safety to end users when output
short circuit occurs.
V
Short to GND
OUT
0.4V
V
I
OUT
Region of Stable COUT ESR vs. Load Current
100
OUT
Instable
10
TSD
COUT = 1uF
1
165 °C
OTP Trip Point
110 C
°
Stable
110 °C
0.10
0.01
0.00
80 °C
IC Temperature
COUT = 1μF, X7R
50 100
Instable
Figure 2. Short Circuit Thermal Folded Back Protection
when Output Short Circuit Occurs
0
150
200
250
300
Load Current (mA)
Figure 1
DS9004-00 February 2008
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9
Preliminary
RT9004
For continuous operation, do not exceed absolute
maximum operation junction temperature 125°C. The
power dissipation definition in device is :
1500
1350
1200
1050
900
750
600
450
300
150
0
4-Layers Board
PD = (VIN-VOUT) x IOUT + VIN x IQ
The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junction to ambient. The maximum power dissipation can
be calculated by following formula :
Single-Layer Board
PD(MAX) = ( TJ(MAX) - TA ) /θJA
0
25
50
75
100
125
Where TJ(MAX) is the maximum operation junction
temperature 125°C, TAis the ambient temperature and the
θJA is the junction to ambient thermal resistance.
(°C)
Ambient Temperature
Figure 3. Derating Curves for RT9004 Package
For recommended operating conditions specification of
RT9004, where TJ(MAX) is the maximum junction
temperature of the die (125°C) and TA is the maximum
ambient temperature. The junction to ambient thermal
resistance θJA is layout dependent. For VDFN-10L 3x3
and WDFN-10L 3x3 packages, the thermal resistance θJA
is 105°C/W on the standard JEDEC 51-3 single-layer 1s
thermal test board and 70°C/W on the standard JEDEC
51-7 4-layers 2S2P thermal test board. The maximum
power dissipation at TA = 25°C can be calculated by
following formula :
PD(MAX) = ( 125°C - 25°C ) / 105 = 0.952 W for single-layer
1s board
PD(MAX) = ( 125°C - 25°C ) / 70 = 1.428 W for 4-layers
2S2P board
The maximum power dissipation depends on operating
ambient temperature for fixed TJ(MAX) and thermal
resistance θJA. For RT9004 packages, the Figure 3 of
derating curves allows the designer to see the effect of
rising ambient temperature on the maximum power
allowed.
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Preliminary
RT9004
Outline Dimension
D2
D
L
E
E2
SEE DETAIL A
1
2
1
2
1
e
b
DETAILA
A
Pin #1 ID and Tie Bar Mark Options
A3
A1
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
A1
A3
b
0.800
0.000
0.175
0.180
2.950
2.300
2.950
1.500
1.000
0.050
0.250
0.300
3.050
2.650
3.050
1.750
0.031
0.000
0.007
0.007
0.116
0.091
0.116
0.059
0.039
0.002
0.010
0.012
0.120
0.104
0.120
0.069
D
D2
E
E2
e
0.500
0.020
L
0.350
0.450
0.014
0.018
V-Type 10L DFN 3x3 Package
DS9004-00 February 2008
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11
Preliminary
RT9004
D2
D
L
E
E2
SEE DETAIL A
1
2
1
2
1
e
b
DETAILA
A
Pin #1 ID and Tie Bar Mark Options
A3
A1
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
A1
A3
b
0.700
0.000
0.175
0.180
2.950
2.300
2.950
1.500
0.800
0.050
0.250
0.300
3.050
2.650
3.050
1.750
0.028
0.000
0.007
0.007
0.116
0.091
0.116
0.059
0.031
0.002
0.010
0.012
0.120
0.104
0.120
0.069
D
D2
E
E2
e
0.500
0.020
L
0.350
0.450
0.014
0.018
W-Type 10L DFN 3x3 Package
Richtek Technology Corporation
Headquarter
Richtek Technology Corporation
Taipei Office (Marketing)
5F, No. 20, Taiyuen Street, Chupei City
Hsinchu, Taiwan, R.O.C.
8F, No. 137, Lane 235, Paochiao Road, Hsintien City
Taipei County, Taiwan, R.O.C.
Tel: (8863)5526789 Fax: (8863)5526611
Tel: (8862)89191466 Fax: (8862)89191465
Email: marketing@richtek.com
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DS9004-00 February 2008
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