SF2242B [RFM]

Compact 40 MHz SAW Filter Design; 紧凑型40 MHz的SAW滤波器的设计
SF2242B
型号: SF2242B
厂家: RF MONOLITHICS, INC    RF MONOLITHICS, INC
描述:

Compact 40 MHz SAW Filter Design
紧凑型40 MHz的SAW滤波器的设计

文件: 总5页 (文件大小:895K)
中文:  中文翻译
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SF2242B  
Compact 40 MHz SAW Filter Design  
Hermetic 5 x 7 mm Surface-mount Case  
Complies with Directive 2002/95/EC (RoHS)  
Pb  
40 MHz  
SAW Filter  
Absolute Maximum Ratings  
Rating  
Value  
+10  
Units  
dBm  
VDC  
°C  
Maximum Incident Power in Passband  
DC Voltage on any Non-ground Terminal  
Storage Temperature Range in Tape and Reel  
Suitable for Lead-free Soldering - Maximum Soldering Profile  
5
-40 to +85  
260 °C for 30 s  
SMP-03  
Electrical Characteristics  
Characteristic  
Sym  
Notes  
1
Min  
Typ  
Max  
Units  
f
Center Frequency  
40  
9.5  
5.0  
1.4  
190  
MHz  
dB  
C
IL  
Minimum insertion Loss  
3 dB Bandwidth  
1, 2  
12.0  
MIN  
3.5  
MHz  
Amplitude Ripple, (f - 1.75 MHz to f + 1.75 MHz)  
dB  
2.0  
C
C
P-P  
Group Delay Ripple, (f - 1.75 MHz to f + 1.75 MHz)  
ns  
250  
C
C
P-P  
Attenuation Relative to IL  
:
MIN  
f
- 5 MHz to f + 5 MHz  
C
20  
31  
31  
35  
35  
-20  
26  
40  
46  
64  
40  
C
27.5 to 32.5 MHz  
47.5 to 52.5 MHz  
0 to 30.0 MHz  
dB  
°C  
50.0 to 70.0 MHz  
T
Operating Temperature Range  
1
6
+85  
A
Terminating Source Impedance (through matching network)  
Terminating Source Impedance (through matching network)  
Case Style  
Z = 50 ohms  
S
Z
= 50 ohms  
L
SMP-03 7 x 5 mm Nominal Footprint  
RFM/SF2242B/YYWW  
Lid Symbolization (YY = year, WW = week)  
Notes:  
1.  
Unless noted otherwise, all specifications apply over the operating temperature range with filter soldered to the specified demonstration board with impedance matching to  
50 and measured with 50 network analyzer.  
2.  
3.  
Unless noted otherwise, all frequency specifications are referenced to the nominal center frequency, fc.  
Rejection is measured as attenuation below the minimum IL point in the passband. Rejection in final user application is dependent on PCB layout and external impedance  
matching design. See Application Note No. 42 for details.  
4.  
5.  
6.  
7.  
"LRIP" or "L" after the part number indicates "low rate initial production" and "ENG" or "E" indicates "engineering prototypes."  
The design, manufacturing process, and specifications of this filter are subject to change.  
Tape and Reel Standard ANSI / EIA 481.  
Either Port 1 or Port 2 may be used for either input or output in the design. However, impedances and impedance matching may vary between Port 1 and Port 2, so that  
the filter must always be installed in one direction per the circuit design.  
8.  
9.  
US and international patents may apply.  
Electrostatic Sensitive Device. Observe precautions for handling.  
www.RFM.com E-mail: info@rfm.com  
© 2010-2011 by RF Monolithics, Inc.  
Page 1 of 5  
SF2242B - 10/28/11  
Filter Response Plots  
www.RFM.com E-mail: info@rfm.com  
© 2010-2011 by RF Monolithics, Inc.  
Page 2 of 5  
SF2242B - 10/28/11  
Filter Input/Output Impedance Plots  
www.RFM.com E-mail: info@rfm.com  
© 2010-2011 by RF Monolithics, Inc.  
Page 3 of 5  
SF2242B - 10/28/11  
SMP-03 10-Terminal Ceramic Surface-mount Case  
5 x 7 mm Nominal Footprint  
Case Dimensions  
Dimension  
mm  
Nom  
7.00  
5.00  
1.65  
0.60  
2.54  
1.0  
Inches  
Nom  
Min  
6.80  
4.80  
-
Max  
7.20  
5.20  
2.00  
0.73  
2.67  
1.13  
5.13  
3.13  
1.40  
Min  
0.268  
0.189  
-
Max  
A
B
C
D
E
H
J
0.276  
0.197  
0.065  
0.024  
0.100  
0.039  
0.197  
0.118  
0.050  
0.283  
0.205  
0.079  
0.029  
0.105  
0.044  
0.202  
0.123  
0.055  
Recommended PCB Footprint  
0.47  
2.41  
0.87  
4.87  
2.87  
1.14  
0.019  
0.095  
0.034  
0.192  
0.113  
0.045  
5.00  
3.00  
1.27  
K
P
Electrical Connections  
Connection  
Terminals  
Port 1  
Input or Balanced Input  
Output or Balanced Output  
Ground  
Single-ended or Differential Operation  
10  
5
Port 2  
All others  
M
a
t
c
h
i
n
g
C
i
r
c
u
i
t
Case Materials  
2
2
p
F
2
2
p
F
O
u t p u t  
h
I n p u t  
0 o h m  
Solder Pad  
Plating  
1
0
5
5
0
o
m
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel  
5
4
7 0  
H
4
7
0
S
F
2
2
4
2
B
n
n
H
Lid Plating  
Body  
2.0 to 3.0 µm Nickel  
Al O Ceramic  
A
l
l
O
t
h
e
r
P
i
n
s
2
3
Pb Free  
C
E
B
H
H
J
D
A
P
K
www.RFM.com E-mail: info@rfm.com  
© 2010-2011 by RF Monolithics, Inc.  
Page 4 of 5  
SF2242B - 10/28/11  
Tape and Reel Specifications  
“B”  
Nominal Size  
Quantity Per Reel  
Inches  
millimeters  
178  
7
500  
13  
330  
2000  
See Detail "A"  
16.0  
2.0  
COMPONENT ORIENTATION and DIMENSIONS  
Carrier Tape Dimensions  
Ao  
Bo  
5.6 mm  
7.6 mm  
2.0 mm  
8.0 mm  
16.0 mm  
Ko  
Pitch  
W
PIN #1  
USER DIRECTION OF FEED  
www.RFM.com E-mail: info@rfm.com  
© 2010-2011 by RF Monolithics, Inc.  
Page 5 of 5  
SF2242B - 10/28/11  

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