SF1056B [RFM]

Hermetic 5 X 7 mm Surface Mount Case; 密封5 ×7 mm表面贴装案例
SF1056B
型号: SF1056B
厂家: RF MONOLITHICS, INC    RF MONOLITHICS, INC
描述:

Hermetic 5 X 7 mm Surface Mount Case
密封5 ×7 mm表面贴装案例

文件: 总5页 (文件大小:826K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Preliminary  
SF1056B  
• 110.592 MHz Narrow-band SAW Filter  
• Steep Transition to Stopband  
• Hermetic 5 X 7 mm Surface Mount Case  
• Complies with Directive 2002/95/EC (RoHS)  
110.592 MHz  
SAW Filter  
Pb  
Absolute Maximum Ratings  
Rating  
Value  
+10  
Units  
dBm  
VDC  
°C  
Incident Power in Passband  
DC Voltage on any Non-ground Terminal  
Operating Temperature Range  
Storage Temperature Range in Tape and Reel  
Soldering Profile, 5 Cycles Maximum  
3
-40 to +80  
-40 to +85  
°C  
265 °C for 10 s  
SMP-03  
Electrical Characteristics  
Characteristic  
Sym  
Notes  
Min  
Typ  
Max  
Units  
F
Center Frequency  
110.592  
8.6  
MHz  
dB  
C
Insertion Loss  
IL  
10.0  
BW  
3 dB Bandwidth  
1.152  
1.44  
150  
MHz  
3
ns  
Group Delay Ripple, 110.016 to 111.168 MHz  
40 dB Bandwidth  
200  
7.0  
P-P  
BW  
6.7  
MHz  
40  
Rejection:  
DC to 107.192 MHz  
38  
28  
28  
38  
42  
42  
34  
42  
50  
50  
107.192 to 108.864 MHz  
112.320 to 113.992 MHz  
113.992 to 200 MHz  
dB  
Source Impedance for L-L Matching Network  
Load Impedance for L-L Matching Network  
ohm  
ohm  
Case Style  
SMP-03 5 x 7 mm Nominal Footprint  
RFM SF1056B YWWS  
Lid Symbolization (Y=year, WW=week, S=shift) See note 3  
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.  
Notes:  
1.  
Unless noted otherwise, all specifications apply over the operating temper-  
ature range with filter soldered to the specified demonstration board with  
impedance matching to 50 and measured with 50 network analyzer. A  
dB offset exists for RFM because of the loss introduced by using trans-  
formers on the Input and Output.  
Rejection is measured as attenuation below the minimum IL point in the  
passband. Rejection in final user application is dependent on PCB layout  
and external impedance matching design. See Application Note No. 42  
for details.  
4.  
5.  
The design, manufacturing process, and specifications of this filter are  
subject to change.  
Either Port 1 or Port 2 may be used for either input or output in the design.  
However, impedances and impedance matching may vary between Port 1  
and Port 2, so that the filter must always be installed in one direction per  
the circuit design.  
US and international patents may apply.  
RFM, stylized RFM logo, and RF Monolithics, Inc. are registered  
trademarks of RF Monolithics, Inc.  
2.  
3.  
6.  
7.  
"LRIP" or "L" after the part number indicates "low rate initial production"  
and "ENG" or "E" indicates "engineering prototypes."  
www.RFM.com E-mail: info@rfm.com  
©2011 by RF Monolithics, Inc.  
Page 1 of 5  
SF1056B - 3/16/11  
Filter Passband Plot  
Filter Transition Bandwidth Plot  
www.RFM.com E-mail: info@rfm.com  
©2011 by RF Monolithics, Inc.  
Page 2 of 5  
SF1056B - 3/16/11  
Filter Group Delay Plot  
D
e
m
o
n
s
t
r
a
t
i
o
n
C
i
r
c
u
i
t
9
8
7
5
0
o
h
m
s
1
0
6
2
7
0
+
1
5
n
H
S
F
1
0
5
6
B
2
2
0
+
2
2
n
H
5
6
n
H
1
5
0
o
h
m
s
5
4
3
2
5
6
n
H
www.RFM.com E-mail: info@rfm.com  
©2011 by RF Monolithics, Inc.  
Page 3 of 5  
SF1056B - 3/16/11  
SMP-03 Case  
10-Terminal Ceramic Surface-Mount Case  
5 x 7 mm Nominal Footprint  
Case Dimensions  
mm  
Dimension  
Inches  
Min Nom Max  
Min  
0.268  
0.189  
Nom  
0.276  
0.197  
0.065  
0.024  
0.100  
0.039  
0.039  
0.197  
0.118  
Max  
0.283  
0.205  
0.079  
0.029  
0.105  
0.044  
0.044  
0.202  
0.123  
A
B
C
D
E
H
J
6.80  
4.80  
7.00  
5.00  
1.65  
0.60  
2.54  
1.0  
7.20  
5.20  
2.00  
.73  
.47  
0.019  
0.095  
0.034  
0.034  
0.192  
0.113  
2.41  
0.87  
0.87  
4.87  
2.87  
2.67  
1.13  
1.13  
5.13  
3.13  
1.0  
K
P
5.00  
3.00  
Recommended PCB Footprint  
Electrical Connections  
Connection  
Terminals  
Balanced Input  
1
Port 1  
Port 2  
Balanced Input  
Balanced Output  
Balanced Output  
Ground  
10  
5
6
All others  
Case Materials  
Materials  
Solder Pad  
Plating  
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel  
Lid Plating  
Body  
2.0 to 3.0 µm Nickel  
Al O Ceramic  
2
3
Pb Free  
C
E
B
H
1
1
10  
10  
9
8
9
2
3
2
3
D
8
7
A
P
4
7
4
6
5
5
6
TOP VIEW  
BOTTOM VIEW  
www.RFM.com E-mail: info@rfm.com  
©2011 by RF Monolithics, Inc.  
Page 4 of 5  
SF1056B - 3/16/11  
Tape and Reel Specifications  
“B“  
Nominal Size  
Quantity Per Reel  
Inches  
millimeters  
7
178  
330  
500  
13  
2000  
See Detail "A"  
12.0  
2.0  
COMPONENT ORIENTATION and DIMENSIONS  
Carrier Tape Dimensions  
Ao  
9.4 mm  
7.4 mm  
2.0 mm  
8.0 mm  
16.0 mm  
Bo  
Ko  
Pitch  
W
PIN #1  
USER DIRECTION OF FEED  
www.RFM.com E-mail: info@rfm.com  
©2011 by RF Monolithics, Inc.  
Page 5 of 5  
SF1056B - 3/16/11  

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