EEU-FC2A100 [RFMD]
380W GaN WIDEBAND PULSED; 380W氮化镓WIDEBAND脉冲型号: | EEU-FC2A100 |
厂家: | RF MICRO DEVICES |
描述: | 380W GaN WIDEBAND PULSED |
文件: | 总11页 (文件大小:773K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
RF3928B
380W GaN
WIDEBAND
PULSED
POWER AMPLI-
FIER
RF3928B
380W GaN WIDEBAND PULSED
POWER AMPLIFIER
Package: Hermetic 2-Pin, Flanged Ceramic
Features
Wideband Operation 2.8GHz to
3.4GHz
RF IN
VG
Pin 1 (CUT)
RF OUT
VD
Pin 2
Advanced GaN HEMT Technology
Advanced Heat-Sink Technology
Supports Multiple Pulse
Conditions
GND
BASE
10% to 20% Duty Cycle
100s to 300s Pulse Width
Integrated Matching
Components for High Terminal
Impedances
Functional Block Diagram
65V Operation Typical
Performance
Product Description
Pulsed Output Power 380W
Small Signal Gain 13dB
Drain Efficiency 50%
-40°C to 85°C Operating
Temperature
The RF3928B is a 65V 380W high power discrete amplifier designed for S-Band
pulsed radar, Air Traffic Control and Surveillance, and general purpose broadband
amplifier applications. Using an advanced high power density Gallium Nitride (GaN)
semiconductor process, these high-performance amplifiers achieve high output
power, high efficiency and flat gain over a broad frequency range in a single pack-
age. The RF3928B is a matched GaN transistor packaged in a hermetic, flanged
ceramic package. This package provides excellent thermal stability through the use
of advanced heat sink and power dissipation technologies. Ease of integration is
accomplished through the incorporation of simple, optimized matching networks
external to the package that provide wideband gain and power performance in a
single amplifier.
Applications
Radar
Air Traffic Control and
Surveillance
General Purpose Broadband
Amplifiers
Ordering Information
RF3928BS2
RF3928BSB
RF3928BSQ
RF3928BSR
RF3928BTR13
2-Piece sample bag
5-Piece bag
25-Piece reel
50 Pieces on 7” short reel
250 Pieces on 13” reel
RF3928B99PCBA-410 Fully assembled evaluation board 2.8GHz to 3.4GHz;
65V operation
Optimum Technology Matching® Applied
GaAs HBT
GaAs MESFET
InGaP HBT
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
BiFET HBT
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2012, RF Micro Devices, Inc.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.
DS120503
1 of 11
RF3928B
Absolute Maximum Ratings
Parameter
Caution! ESD sensitive device.
Rating
Unit
V
Exceeding any one or a combination of the Absolute Maximum Rating conditions may
cause permanent damage to the device. Extended application of Absolute Maximum
Rating conditions to the device may reduce device reliability. Specified typical perfor-
mance or functional operation of the device under Absolute Maximum Rating condi-
tions is not implied.
Drain Source Voltage
150
-8 to +2
155
V
mA
V
Gate Source Voltage
The information in this publication is believed to be accurate and reliable. However, no
responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any
infringement of patents, or other rights of third parties, resulting from its use. No
license is granted by implication or otherwise under any patent or patent rights of
RFMD. RFMD reserves the right to change component circuitry, recommended appli-
cation circuitry and specifications at any time without prior notice.
Gate Current (I )
G
Operational Voltage
65
Ruggedness (VSWR)
3:1
RoHS (Restriction of Hazardous Substances): Compliant per EU Directive
2002/95/EC.
°C
°C
°C
Storage Temperature Range
-55 to +125
-40 to +85
250
Operating Temperature Range (T )
L
Operating Junction Temperature (T )
J
Human Body Model
Class 1A
Hours
°C/W
MTTF (T < 200°C)
3.0E + 06
1.4E + 05
J
MTTF (T < 250°C)
J
Thermal Resistance, Rth (junction to case)
T =85°C, DC bias only
0.90
0.18
0.25
C
T =85°C, 100s pulse, 10% duty cycle
C
T =85°C, 300s pulse, 10% duty cycle
C
* MTTF – median time to failure for wear-out failure mode (30% Idss degradation) which is determined by the technology process reliability.
Refer to product qualification report for FIT (random) failure rate.
Operation of this device beyond any one of these limits may cause permanent damage. For reliable continuous operation, the device
voltage and current must not exceed the maximum operating values specified in the table on page two.
Bias Conditions should also satisfy the following expression: P
<(T –T )/R J-C and T =T
DISS
J C TH C CASE
Specification
Typ.
Parameter
Unit
Condition
Min.
Max.
Recommended Operating
Condition
Drain Voltage (V
)
65
-3
V
V
DSQ
Gate Voltage (V
)
-8
-2
GSQ
Drain Bias Current
440
mA
Frequency of Operation
2800
3400
MHz
DC Functional Test
I
– Gate Leakage
2
2
mA
mA
V
V =-8V, V =0V
G D
G (OFF)
D (OFF)
I
– Drain Leakage
V =-8V, V =65V
G D
V
V
(th) – Threshold Voltage
(on) – Drain Voltage at high
-3.5
V =65V, I =40mA
D D
GS
0.22
V
V =0V, I =1.5A
DS
G
D
current
[1, 2]
RF Functional Test
Small Signal Gain
Power Gain
13
dB
dB
dB
F=2900MHz, P =30dBm
IN
11.2
11.8
F=2900MHz, P =44dBm
IN
Input Return Loss
-6
F=2900MHz, P =30dBm
IN
Output Power
55.3
45
56
50
13
dBm
%
F=2900MHz, P =44dBm
IN
Drain Efficiency
Small Signal Gain
dB
F=3150MHz, P =30dBm
IN
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support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.
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DS120503
RF3928B
Specification
Typ.
Parameter
Unit
Condition
Min.
Max.
RF Functional Test
(continued)
Power Gain
11.2
11.8
dB
dB
F=3150MHz, P =44dBm
IN
Input Return Loss
-6
F=3150MHz, P =30dBm
IN
Output Power
55.5
45
56
50
13
dBm
%
F=3150MHz, P =44dBm
IN
Drain Efficiency
Small Signal Gain
dB
F=3400MHz, P =30dBm
IN
Power Gain
11.3
11.8
dB
dB
F=3400MHz, P =44dBm
IN
Input Return Loss
-6
F=3400MHz, P =30dBm
IN
Output Power
55.5
45
56
50
dBm
%
F=3400MHz, P =44dBm
IN
Drain Efficiency
[1, 2]
RF Typical Performance
Frequency Range
Small Signal Gain
2800
3400
MHz
dB
13
F=3100MHz, P =30dBm
IN
Power Gain
11.8
dB
P
=55.8dBm
OUT
Gain Variation with Temperature
-0.015
dB/°C
dBm
W
At peak output power
Peak output power
Peak output power
At peak output power
Output Power (P
)
55.8
380
50
SAT
Drain Efficiency
%
[1] Test Conditions: Pulsed Operation, PW=100s, DC=10%, V =65V, I =440mA, T=25ºC
DS
DQ
[2] Performance in a standard tuned test fixture
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RF3928B
Typical Performance in Standard Fixed Tuned Test Fixture over Temperature
(Pulsed at Center Band Frequency)
GainꢀversusꢀOutputꢀPowerꢀ(fꢀ=ꢀ3200MHz)
EfficiencyꢀversusꢀOutputꢀPowerꢀ(fꢀ=ꢀ3200MHz)
(Pulsedꢀ10%ꢀdutyꢀcycle,ꢀ100μS,ꢀVD =ꢀ65V,ꢀIDQ =ꢀ440mA)
(Pulsedꢀ10%ꢀdutyꢀcycle,ꢀ100μS,ꢀVD =ꢀ65V,ꢀIDQ=ꢀ440mA)
17
16
15
14
13
12
11
10
70
60
50
40
30
20
10
Effꢀ85°C
Effꢀ25°C
Effꢀꢁ40°C
Gainꢀ85°C
Gainꢀ25°C
Gainꢀꢁ40°C
45
46
47
48
49
50
51
52
53
54
55
56
57
45
46
47
48
49
50
51
52
53
54
55
56
57
OutputꢀPowerꢀ(dBm)
OutputꢀPowerꢀ(dBm)
InputꢀReturnꢀLossꢀversusꢀOutputꢀPowerꢀ(fꢀ=ꢀ3200MHz)
(Pulsedꢀ10%ꢀdutyꢀcycle,ꢀ100μS,ꢀVD =ꢀ65V,ꢀIDQ =ꢀ440mA)
ꢁ6
ꢁ7
IRLꢀ85°C
IRLꢀ25°C
IRLꢀꢁ40°C
ꢁ8
ꢁ9
ꢁ10
ꢁ11
ꢁ12
45
46
47
48
49
50
51
52
53
54
55
56
57
OutputꢀPowerꢀ(dBm)
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DS120503
RF3928B
Typical Performance in Standard Fixed-tuned Test Fixture (T=25°C, Unless
Noted)
SmallꢀSignalꢀPerformanceꢀversusꢀFrequency,ꢀPIN =ꢀ30dBm
Gain/IRLꢀversusꢀFrequency,ꢀPIN =ꢀ44dBm
(Pulsedꢀ10%ꢀdutyꢀcycle,100μS,VD =ꢀ65V,ꢀIDQ =ꢀ440mA)
(Pulsedꢀ10%ꢀdutyꢀcylce,ꢀ100μS,ꢀVD =ꢀ65V,ꢀIDQ =ꢀ440mA)
15
14
13
12
11
10
9
0
13
12
11
10
0
Fixedꢀtuned testꢀcircuit
Fixedꢀtuned testꢀcircuit
ꢁ2
ꢁ4
ꢁ4
ꢁ8
ꢁ12
ꢁ6
ꢁ8
ꢁ10
ꢁ12
ꢁ14
Gain
IRL
Gain
IRL
8
2800
2900
3000
3100
3200
3300
3400
3500
3600
2800
2900
3000
3100
3200
3300
3400
3500
Frequencyꢀ(MHz)
Frequencyꢀ(MHz)
Gain/ꢀEfficiencyꢀversusꢀPOUT ,ꢀfꢀ=ꢀ3200MHz
DrainꢀEfficiencyꢀversusꢀFrequency,ꢀPIN =ꢀ44dBm
(Pulsedꢀ10%ꢀdutyꢀcycle,ꢀ100μS,ꢀVD =ꢀ65V,ꢀIDQ =ꢀ440mA)
(Pulsedꢀ10%ꢀdutyꢀcycle,ꢀ100μS,ꢀVDꢀ=ꢀ65V,ꢀIDQ =ꢀ440mA)
15
70
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
Fixedꢀtuned testꢀcircuit
14
13
12
11
10
9
60
50
40
30
20
10
Gain
DrainꢀEff
Eff
45
46
47
48
49
50
51
52
53
54
55
56
2800
2900
3000
3100
3200
Frequencyꢀ(MHz)
3300
3400
3500
3600
OutputꢀPowerꢀ(dBm)
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RF3928B
Typical Performance in Standard Fixed-tuned Test Fixture (T=25°C, Unless
Noted)
Pout/DEꢀversusꢀPulseꢀWidth,ꢀfꢀ=ꢀ3200MHz
Pout/DEꢀversusꢀDutyꢀCycle,ꢀfꢀ=ꢀ3200MHz
(Pulsedꢀ10%ꢀdutyꢀcycle,ꢀVD =ꢀ65V,ꢀIDQ =ꢀ440mA)
(Pulsedꢀ,100μsꢀpulse,ꢀVD =ꢀ65V,ꢀIDQ =ꢀ440mA)
60
55
50
45
40
35
30
25
20
400
380
360
340
320
300
280
260
240
65
60
55
50
45
40
35
400
375
350
325
300
275
250
OutputꢀPower
DrainꢀEfficiency
Pout
5
Eff
10
100
PulseꢀWidthꢀ(μsec)
1000
0
10
15
20
DutyꢀCycleꢀ(%)
PulseꢀPowerꢀDissipationꢀDeꢁratingꢀCurve
(BasedꢀonꢀMaximumꢀpackageꢀtemperatureꢀandꢀRth)
1200
1000
800
600
400
200
0
300ꢂSꢀPulseꢀWidth,ꢀ10%ꢀDutyꢀCycle
100ꢂSꢀPulseꢀWidth,ꢀ10%ꢀDutyꢀCycle
0
20
40
60
80
100
120
140
MaximumꢀCaseꢀTemperatureꢀ(°C)
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DS120503
RF3928B
Package Drawing
(All Dimensions in mm)
Pin
1
Function
Gate
Description
V
RF Input
G
V
RF Output
2
Drain
D
Ground Base
3
Source
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support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.
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RF3928B
Bias Instruction for RF3928B Evaluation Board
ESD Sensitive Material. Please use proper ESD precautions when handling devices of evaluation board. Evaluation board
requires additional external fan cooling. Connect all supplies before powering evaluation board.
1. Connect RF cables at RFIN and RFOUT.
2. Connect ground to the ground supply terminal, and ensure that both the VG and VD grounds are also connected to this
ground terminal.
3. Apply -6V to VG.
4. Apply 65V to VD.
5. Increase VG until drain current reaches 440mA or desired bias point.
6. Turn on the RF input.
IMPORTANT NOTE: Depletion mode device, when biasing the device VG must be applied BEFORE VD. When removing bias VD
must be removed BEFORE VG is removed. Failure to follow sequencing will cause the device to fail.
NOTE: For optimal RF performance, consistent and optimal heat removal from the base of the package is required. A thin layer
of thermal grease should be applied to the interface between the base of the package and the equipment chassis. It is recom-
mended a small amount of thermal grease is applied to the underside of the device package. Even application and removal of
excess thermal grease can be achieved by spreading the thermal grease using a razor blade. The package should then be
bolted to the chassis and input and output leads soldered to the circuit board.
Vd
Vg
RFIN
RFOUT
RF3928B
2.8GHz to 3.4GHz
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DS120503
RF3928B
Evaluation Board Schematic
VDRAIN
+
C19
C18
VGATE
L21
L20
C7
C8
+
L22
C14
L23
R3
R2
R1
C5
C17
C15
C16
C6
C4
C3
C2
C12
C13
L1
J2
RF OUT
50 strip
50 strip
C11
J1
RF IN
C10
RF3928B
C1
C9
Evaluation Board Bill of Materials
Component
Value
10
0
51
22pF
Manufacturer
Panasonic
Panasonic
Panasonic
ATC
Part Number
ERJ-8GEYJ100V
ERJ-3GEY0R00
ERJ-8GEYJ510
ATC100A220JT
ATC100A150JT
R1
R2
R3
C1,C11
C2, C14
C5, C16
C6, C15
C7
15pF
ATC
1000pF
10000pF
120
10F
Novacap
TDK
0805G102M101NT
C2012X7R2A103M
ERJ-6GEYJ120V
EEU-FC2A100
Panasonic
Panasonic
ATC
C8, C18
C9
0.7pF
ATC100A0R7BT
ATC100A0R2BT
ATC100B620JT
0807SQ-22N_LC
28F0181-1SR-10
35F0121-1SR-10
9337CKE100M
C10
0.2pF
ATC
C17
62pF
ATC
L1
22nH
Coilcraft
Steward
Steward
Illinois Capacitor
L20, L21
L22, L23
C19
115, 10A
75, 10A
330F
C3, C4, C7, C12, C13
NOT POPULATED
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support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.
DS120503
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RF3928B
Evaluation Board Layout
Device Impedances
Frequency (MHz)
Z Source ()
Z Load ()
42.1 – j30.5
2800
60.4 – j0.5
3000
3200
3400
51.9 – j13.5
44.1 – j16.5
38.3 – j16.7
33.8 – j25.7
29.5 – j8.9
17.0 – j9.0
NOTE: Device impedances reported are the measured evaluation board impedances chosen for a trade off of peak power, peak efficiency and
gain performance across the entire frequency bandwidth.
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DS120503
RF3928B
Device Handling/Environmental Conditions
GaN HEMT devices are ESD sensitive materials. Please use proper ESD precautions when handling devices or
evaluation boards.
GaN HEMT Capacitances
The physical structure of the GaN HEMT results in three terminal capacitors similar to other FET technologies.
These capacitances exist across all three terminals of the device. The physical manufactured characteristics of
the device determine the value of the CDS (drain to source), CGS (gate to source) and CGD (gate to drain). These
capacitances change value as the terminal voltages are varied. RFMD presents the three terminal capacitances
measured with the gate pinched off (VGS = -8V) and zero volts applied to the drain. During the measurement pro-
cess, the parasitic capacitances of the package that holds the amplifier is removed through a calibration step.
Any internal matching is included in the terminal capacitance measurements. The capacitance values presented
in the typical characteristics table of the device represent the measured input (CISS), output (COSS), and reverse
(CRSS) capacitance at the stated bias voltages. The relationship to three terminal capacitances is as follows:
CISS = CGD + CGS
COSS = CGD + CDS
CRSS = CGD
DC Bias
The GaN HEMT device is a depletion mode high electron mobility transistor (HEMT). At zero volts VGS the drain of
the device is saturated and uncontrolled drain current will destroy the transistor. The gate voltage must be taken
to a potential lower than the source voltage to pinch off the device prior to applying the drain voltage, taking care
not to exceed the gate voltage maximum limits. RFMD recommends applying VGS = -5V before applying any VDS
.
RF Power transistor performance capabilities are determined by the applied quiescent drain current. This drain
current can be adjusted to trade off power, linearity, and efficiency characteristics of the device. The recom-
mended quiescent drain current (IDQ) shown in the RF typical performance table is chosen to best represent the
operational characteristics for this device, considering manufacturing variations and expected performance.
The user may choose alternate conditions for biasing this device based on performance trade off.
Mounting and Thermal Considerations
The thermal resistance provided as RTH (junction to case) represents only the packaged device thermal charac-
teristics. This is measured using IR microscopy capturing the device under test temperature at the hottest spot of
the die. At the same time, the package temperature is measured using a thermocouple touching the backside of
the die embedded in the device heatsink but sized to prevent the measurement system from impacting the
results. Knowing the dissipated power at the time of the measurement, the thermal resistance is calculated.
In order to achieve the advertised MTTF, proper heat removal must be considered to maintain the junction at or
below the maximum of 200°C. Proper thermal design includes consideration of ambient temperature and the
thermal resistance from ambient to the back of the package including heatsinking systems and air flow mecha-
nisms. Incorporating the dissipated DC power, it is possible to calculate the junction temperature of the device.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.
DS120503
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