PS9309L2-V-E3 [RENESAS]
LOW IF TOTEM POLE OUTPUT TYPE HIGH CMR, IPM DRIVER, 6-PIN SDIP PHOTOCOUPLER; 低中频图腾柱输出型高CMR ， IPM驱动器， 6 -PIN SDIP PHOTOCOUPLER
| 型号： | PS9309L2-V-E3 |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | LOW IF TOTEM POLE OUTPUT TYPE HIGH CMR, IPM DRIVER, 6-PIN SDIP PHOTOCOUPLER |
| 文件： | 总14页 (文件大小：266K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Preliminary Data Sheet
Specifications in this document are tentative and subject to change.
R08DS0047EJ0001
PS9309L, PS9309L2
Rev.0.01
Feb 20, 2012
LOW IF TOTEM POLE OUTPUT TYPE HIGH CMR, IPM DRIVER, 6-PIN SDIP PHOTOCOUPLER
DESCRIPTION
The PS9309L and PS9309L2 are optical coupled high-speed, totem pole output (active high output type) isolators
containing a GaAlAs LED on the input side and a photodiode and a signal processing circuit on the output side on one
chip.
The PS9309L and PS9309L2 are specified high CMR and pulse width distortion with operating temperature. It is
suitable for IPM drive.
The PS9309L is lead bending type (Gull-wing) for surface mounting. The PS9309L2 is lead bending type for long
creepage distance (Gull-wing) for surface mount.
FEATURES
PIN CONNECTION
•
•
•
•
•
•
•
•
High common mode transient immunity (CMH, CML = 15 kV/μs MIN.)
Half size of 8-pin DIP
(Top View)
Pulse width distortion (|tPLH − tPHL| = 80 ns MAX.)
High isolation voltage (BV = 5 000 Vr.m.s.)
Totem pole output (Active High Output Type)
Embossed tape product : PS9309L-E3, PS9309L2-E3: 2 000 pcs/reel
Pb-Free product
Safety standards
• UL approved: No. E72422
6
5
4
1. Anode
2. NC
3. Cathode
4. GND
5. V
6. VCC
O
• CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950)
• SEMKO approved: No. 1115598
1
2
3
• DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40024069 (Option)
APPLICATIONS
•
•
IPM Driver
General purpose inverter
R08DS0047EJ0001 Rev.0.01
Feb 20, 2012
Page 1 of 12
Preliminary document
Specifications in this document are tentative and subject to change.
PS9309L, PS9309L2
Chapter Title
PACKAGE DIMENSIONS (UNIT: mm)
Lead Bending Type (Gull-wing) For Surface Mount
PS9309L
4.58 0.3
(0.82)
9.7 0.3
7.62
021.5
1.27
0.25 M
0.8 0.25
0.4 0.1
Lead Bending Type (Gull-wing) For Long Creepage Distance (Surface Mount)
PS9309L2
4.58 0.3
(0.82)
11.5 0.3
7.62
021.5
1.27
0.25 M
0.75 0.25
0.4 0.1
R08DS0047EJ0001 Rev.0.01
Feb 20, 2012
Page 2 of 12
Preliminary document
Specifications in this document are tentative and subject to change.
PS9309L, PS9309L2
Chapter Title
PHOTOCOUPLER CONSTRUCTION
Parameter
Air Distance (MIN.)
PS9309L
PS9309L2
8 mm
7 mm
7 mm
Outer Creepage Distance (MIN.)
Isolation Distance (MIN.)
8 mm
0.4 mm
0.4 mm
BLOCK DIAGRAM
1
6
5
3
4
Shield
LED
Output
ON
H
L
OFF
MARKING EXAMPLE
Company initial
Type Number
R
9309
N131
Assembly Lot
No. 1 pin Mark
N
1
31
Week Assembled
Year Assembled
(Last 1 Digit)
Rank Code
R08DS0047EJ0001 Rev.0.01
Feb 20, 2012
Page 3 of 12
Preliminary document
Specifications in this document are tentative and subject to change.
PS9309L, PS9309L2
Chapter Title
ORDERING INFORMATION
Part Number
Order Number
Solder
Plating
Specification
Packing Style
Safety Standard Application
Approval
Part
Number*1
PS9309L
PS9309L-AX
Pb-Free
20 pcs (Tape 20 pcs cut) Standard products PS9309L
PS9309L-E3
PS9309L-E3-AX
(Ni/Pd/Au)
Embossed Tape 2 000
pcs/reel
(UL, CSA, SEMKO
approved)
PS9309L2
PS9309L2-AX
20 pcs (Tape 20 pcs cut)
Embossed Tape 2 000
pcs/reel
PS9309L2
PS9309L2-E3
PS9309L2-E3-AX
PS9309L-V
PS9309L-V-AX
20 pcs (Tape 20 pcs cut) DIN EN60747-5-2 PS9309L
PS9309L-V-E3
PS9309L-V-E3-AX
Embossed Tape 2 000
pcs/reel
(VDE0884 Part2)
approved (Option)
PS9309L2-V
PS9309L2-V-AX
20 pcs (Tape 20 pcs cut)
Embossed Tape 2 000
pcs/reel
PS9309L2
PS9309L2-V-E3 PS9309L2-V-E3-AX
Note: *1. For the application of the Safety Standard, following part number should be used.
R08DS0047EJ0001 Rev.0.01
Feb 20, 2012
Page 4 of 12
Preliminary document
Specifications in this document are tentative and subject to change.
PS9309L, PS9309L2
Chapter Title
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
IF
Ratings
20
Unit
mA
V
Diode
Forward Current*1
Reverse Voltage
Supply Voltage
Output Voltage
Output Current
Power Dissipation*2
VR
5
Detector
VCC
VO
−0.5 to +25
−0.5 to +25
25
V
V
IO
mA
mW
Vr.m.s.
°C
PC
210
Isolation Voltage *3
BV
TA
5 000
Operating Ambient Temperature
Storage Temperature
−40 to +110
−55 to +125
Tstg
°C
Notes: *1. Reduced to 0.32 mA/°C at TA = 70°C or more.
*2. Reduced to 3.75 mW/°C at TA = 70°C or more
*3. AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-3 shorted together, 4-6 shorted together.
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Symbol
VCC
MIN.
4.5
0
TYP.
MAX.
20
Unit
V
15
Output Voltage
VO
20
V
Forward Current (ON)
Forward Voltage (OFF)
IF (ON)
VF (OFF)
4
10
mA
V
0
0.8
R08DS0047EJ0001 Rev.0.01
Feb 20, 2012
Page 5 of 12
Preliminary document
Specifications in this document are tentative and subject to change.
PS9309L, PS9309L2
Chapter Title
ELECTRICAL CHARACTERISTICS
(TA = −40 to +110°C, VCC = 4.5 to 20 V, unless otherwise specified)
Parameter
Symbol
Conditions
IF = 10 mA, TA = 25°C
VR = 3 V, TA = 25°C
VF = 0 V, f = 1 MHZ,
TA = 25°C
MIN.
TYP.*1 MAX.
Unit
V
Diode
Forward Voltage
Reverse Current
Input Capacitance
VF
IR
1.3
1.55
1.8
10
μA
pF
Ct
30
3.2
Detector High Level Output Voltage
VOH
VCC = 4.5 V, IO = −2.6 mA,
2.7
V
IF = 4 mA
VCC = 20 V, IO = −2.6 mA,
17.4
18.6
IF = 4 mA
Low Level Output Voltage *2
High Level Supply Current
VOL
IO = 3.5 mA, IF = 0 mA
VCC = 4.5 V, IF = 4 mA
VCC = 20 V, IF = 4 mA
VCC = 4.5 V, IF = 0 mA
VCC = 20 V, IF = 0 mA
0.25
0.98
1.32
1.23
1.53
−45
0.6
3
V
ICCH
mA
3
Low Level Supply Current
ICCL
IOSH
3
mA
3
High Level Output Short *3
Circuit Current
VCC = 4.5 V, VO = GND,
IF = 4 mA
mA
−7
Low Level Output Short *3
IOSL
IFLH
RI-O
CI-O
tPHL
tPLH
VCC = VO = 4.5 V, VF = 0 V
7
34
mA
mA
Ω
Circuit Current
Coupled Threshold Input Current
VCC = 4.5 V, VO > 2.7 V,
IO = −2.6 mA
VI-O = 500 VDC, RH = 60%,
TA = 25°C
V = 0 V, f = 1 MHz,
TA = 25°C
CL = 15 pF,
IF = 4 → 0 mA, VTHHL = 1.3 V
CL = 15 pF,
IF = 0 → 4 mA, VTHLH = 1.3 V
CL = 15 pF,
IF = 4 ↔ 0 mA
1.57
3
Isolation Resistance
Isolation Capacitance
1012
0.6
124
113
11
pF
ns
ns
ns
Propagation Delay Time
200
200
80
(H → L)*4
Propagation Delay Time
(L → H)*4
Pulse Width Distortion
(PWD)
⏐tPLH-tPHL
⏐
Maximum Propagation
Delays (PDD)
80
Rise Time (10-90%)*4
tr
tf
CL = 15 pF,
IF = 0 → 4 mA
CL = 15 pF,
24
ns
ns
Fall Time (90-10%)*4
3.2
IF = 4 → 0 mA
Common Mode
Transient Immunity at High
Level Output*5
CMH
VCC = 5 V, TA = 25°C,
IF = 4 mA, ⏐VCM⏐ = 1.0 kV
15
15
kV/μs
Common Mode
CML
VCC = 5 V, TA = 25°C,
kV/μs
Transient Immunity at Low
Level Output*5
IF = 0 mA, ⏐VCM⏐ = 1.0 kV
Notes: *1. Typical values at TA = 25°C
*2. Because VO of 2.4 V may be output when the LED current is not input and when output supply of VCC = 4.5 V or
less, it is important to confirm the characteristics (operation with the power supply on and off) during design,
before using this device.
*3. Duration of output short circuit time should not exceed 10 ms.
R08DS0047EJ0001 Rev.0.01
Feb 20, 2012
Page 6 of 12
Preliminary document
Specifications in this document are tentative and subject to change.
PS9309L, PS9309L2
Chapter Title
*4. Test circuit for propagation delay time
Pulse input (I
F)
IF (ON)
(PW = 4 s,
Duty cycle = 1/10)
μ
Input
50%
V
CC = 4.5 V
1
2
3
6
5
4
0.1
μF
I
F
V
O
(monitor)
t
PLH
t
PHL
Input
(monitor)
V
OH
Output
90%
10%
C
L
= 15 pF
47 Ω
1.3 V
V
O
V
OL
t
r
t
f
Remark C includes probe and stray wiring capacitance.
L
*5. Test circuit for common mode transient immunity
I
F
1 kV
V
CM
V
CC = 5 V
90%
10%
1
2
3
6
5
4
SW
0.1μF
V
O
(monitor)
t
r
t
f
V
O
V
2.4 V
OH
(I
F
= 10 mA)
= 0 mA)
+
−
0.6 V
V
CM = 1 kV
V
O
V
OL
(I
F
Remark C includes probe and stray wiring capacitance.
L
R08DS0047EJ0001 Rev.0.01
Feb 20, 2012
Page 7 of 12
Preliminary document
Specifications in this document are tentative and subject to change.
PS9309L, PS9309L2
Chapter Title
TAPING SPECIFICATIONS (UNIT: mm)
Outline and Dimensions (Tape)
2.0 0.1
+0.1
4.0 0.1
1.5
–0
4.5 MAX.
+0.1
1.5
–0
0.35
8.0 0.1
5.08 0.1
Tape Direction
PS9309L-E3
Outline and Dimensions (Reel)
2.0 0.5
2.0 0.5
13.0 0.2
R 1.0
21.0 0.8
17.5 1.0
21.5 1.0
15.9 to 19.4
Outer edge of
flange
Packing: 2 000 pcs/reel
R08DS0047EJ0001 Rev.0.01
Feb 20, 2012
Page 8 of 12
Preliminary document
Specifications in this document are tentative and subject to change.
PS9309L, PS9309L2
Chapter Title
Outline and Dimensions (Tape)
2.0 0.1
+0.1
4.0 0.1
1.5
–0
4.5 MAX.
+0.1
2.0
–0
8.0 0.1
0.35
5.08 0.1
Tape Direction
PS9309L2-E3
Outline and Dimensions (Reel)
2.0 0.5
2.0 0.5
13.0 0.2
R 1.0
21.0 0.8
25.5 1.0
29.5 1.0
23.9 to 27.4
Outer edge of
flange
Packing: 2 000 pcs/reel
R08DS0047EJ0001 Rev.0.01
Feb 20, 2012
Page 9 of 12
Preliminary document
Specifications in this document are tentative and subject to change.
PS9309L, PS9309L2
Chapter Title
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
D
A
Part Number
PS9309L
A
B
C
Lead Bending
D
lead bending type (Gull-wing)
for surface mount
2.2
9.2
1.27
0.8
lead bending type (Gull-wing)
for long creepage distance (surface mount)
PS9309L2
0.8
2.2
1.27
10.2
R08DS0047EJ0001 Rev.0.01
Feb 20, 2012
Page 10 of 12
Preliminary document
Specifications in this document are tentative and subject to change.
PS9309L, PS9309L2
Chapter Title
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. By-pass capacitor of more than 0.1 μF is used between VCC and GND near device. Also, ensure that the distance
between the leads of the photocoupler and capacitor is no more than 10 mm.
3. Pin 2 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open.
Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may
degrade the internal noise environment of the device.
Note: *1. NC: Non-Connection (No Connection).
4. Avoid storage at a high temperature and high humidity.
R08DS0047EJ0001 Rev.0.01
Feb 20, 2012
Page 11 of 12
Preliminary document
Specifications in this document are tentative and subject to change.
PS9309L, PS9309L2
Chapter Title
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
Caution GaAs Products
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
R08DS0047EJ0001 Rev.0.01
Feb 20, 2012
Page 12 of 12
Revision History
PS9309L, PS9309L2 Preliminary Data Sheet
Description
Summary
Rev.
0.01
Date
Page
Feb 20, 2012
−
First edition issued
All trademarks and registered trademarks are the property of their respective owners.
C - 1
Notice
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Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to
be disclosed by Renesas Electronics such as that disclosed through our website.
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Colophon 1.1
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