PS9307AL [RENESAS]
0.6 A Output Current, High CMR, IGBT Gate Drive, 6-PIN SDIP Photocoupler;
| 型号： | PS9307AL |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | 0.6 A Output Current, High CMR, IGBT Gate Drive, 6-PIN SDIP Photocoupler 栅 双极性晶体管 |
| 文件： | 总20页 (文件大小：372K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Preliminary Data Sheet
PS9307AL, PS9307AL2
R08DS0122EJ0100
Rev.1.00
0.6 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 6-PIN SDIP PHOTOCOUPLER
May 16, 2014
DESCRIPTION
The PS9307AL and PS9307AL2 are optical coupled isolators containing a GaAlAs LED on the input side and a photo
diode, a signal processing circuit and power MOSFETs on the output side on one chip.
The PS9307AL and PS9307AL2 are in 6-pin plastic SDIP (Shrink Dual In-line Package). The PS9307AL2 has 8 mm
creepage distance. The mount area of 6-pin plastic SDIP is half size of 8-pin DIP.
The PS9307AL and PS9307AL2 are designed specifically for high common mode transient immunity (CMR) and high
switching speed. It is suitable for driving IGBTs and MOS FETs.
The PS9307AL is lead bending type (Gull-wing) for surface mounting.
The PS9307AL2 is lead bending type for long creepage distance (Gull-wing) for surface mount.
FEATURES
•
•
•
•
•
•
•
•
•
Long creepage distance (8 mm MIN.: PS9307AL2)
Half size of 8-pin DIP
PIN CONNECTION
(Top View)
Peak output current (0.6 A MAX., 0.4 A MIN.)
High speed switching (tPLH, tPHL = 150 ns MAX.)
High common mode transient immunity (CMH, CML = 50 kV/μs MIN.)
Operating Ambient Temperature (125 °C)
Embossed tape product: PS9307AL-E3, PS9307AL2-E3: 2 000 pcs/reel
Pb-Free product
6
5
4
1. Anode
2. NC
3. Cathode
4. VEE
5. V
O
6. VCC
Safety standards
• UL approved: No. E72422
• CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950)
• SEMKO approved (EN 60065, EN 60950)
• DIN EN 60747-5-5 (VDE 0884-5) approved (Option)
1
2
3
APPLICATIONS
•
•
•
IGBT, Power MOS FET Gate Driver
Industrial inverter
AC Servo
R08DS0122EJ0100 Rev.1.00
May 16, 2014
Page 1 of 18
PS9307AL, PS9307AL2
PACKAGE DIMENSIONS (UNIT: mm)
Lead Bending Type (Gull-wing) For Surface Mount
PS9307AL
4.58±0.3
(0.82)
9.7±0.3
7.62
5
1
.0
±2
.
0
1.27
0.25 M
0.8±0.25
0.4±0.1
Lead Bending Type (Gull-wing) For Long Creepage Distance (Surface Mount)
PS9307AL2
4.58±0.3
(0.82)
11.5±0.3
7.62
51
.0
.02±
1.27
0.25 M
0.75±0.25
0.4±0.1
R08DS0122EJ0100 Rev.1.00
May 16, 2014
Page 2 of 18
PS9307AL, PS9307AL2
PHOTOCOUPLER CONSTRUCTION
Parameter
PS9307AL
PS9307AL2
8 mm
Air Distance (MIN.)
7 mm
7 mm
Outer Creepage Distance (MIN.)
Isolation Distance (MIN.)
8 mm
0.4 mm
0.4 mm
MARKING EXAMPLE
Company Initial
Type Number
Assembly Lot
R
307A
N320
No. 1 pin Mark
N
3
20
Week Assembled
Year Assembled
(Last 1 Digit)
Rank Code
ORDERING INFORMATION
Part Number
Order Number
Solder Plating
Specification
Packing Style
Safety
Standard
Approval
Application
Part
Number*1
PS9307AL
PS9307AL-AX
Pb-Free
20 pcs (Tape 20 pcs cut) Standard
PS9307AL
PS9307AL2
PS9307AL
PS9307AL-E3
PS9307AL-E3-AX
(Ni/Pd/Au)
Embossed Tape 2 000
pcs/reel
products
(UL, CSA,
PS9307AL2
PS9307AL2-AX
20 pcs (Tape 20 pcs cut) SEMKO
PS9307AL2-E3
PS9307AL2-E3-AX
Embossed Tape 2 000
pcs/reel
approved)
PS9307AL-V
PS9307AL-V-AX
20 pcs (Tape 20 pcs cut) UL, CSA,
PS9307AL-V-E3
PS9307AL-V-E3-AX
Embossed Tape 2 000
pcs/reel
SEMKO, DIN
EN 60747-5-5
PS9307AL2-V
PS9307AL2-V-AX
20 pcs (Tape 20 pcs cut) (VDE 0884-5) PS9307AL2
PS9307AL2-V-E3 PS9307AL2-V-E3-AX
Embossed Tape 2 000
pcs/reel
approved
Note: *1. For the application of the Safety Standard, following part number should be used.
R08DS0122EJ0100 Rev.1.00
May 16, 2014
Page 3 of 18
PS9307AL, PS9307AL2
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
IF
Ratings
25
Unit
mA
A
Diode
Forward Current
Peak Transient Forward Current
IF (TRAN)
1.0
(Pulse Width < 1 μs)
Reverse Voltage
VR
5
45
V
mW
A
Power Dissipation *1
PD
IOH (PEAK)
IOL (PEAK)
(VCC − VEE
VO
Detector High Level Peak Output Current *2
Low Level Peak Output Current *2
Supply Voltage
0.6
0.6
A
)
0 to 35
0 to VCC
250
V
Output Voltage
Power Dissipation *3
Isolation Voltage *4
V
PC
mW
Vr.m.s.
kHz
°C
BV
5 000
250
Operating Frequency
f
Operating Ambient Temperature
Storage Temperature
TA
−40 to +125
−55 to +150
Tstg
°C
Notes: *1. Reduced to 1.2 mW/°C at TA = 110°C or more.
*2. Maximum pulse width = 10 μs, Maximum duty cycle = 0.5%
*3. Reduced to 3.9 mW/°C at TA = 85°C or more.
*4. AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-3 shorted together, 4-6 shorted together.
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Symbol
(VCC − VEE
IF (ON)
MIN.
10
TYP. MAX.
Unit
V
)
30
Forward Current (ON)
8
10
12
0.8
125
mA
V
Forward Voltage (OFF)
VF (OFF)
TA
−2
−40
Operating Ambient Temperature
°C
R08DS0122EJ0100 Rev.1.00
May 16, 2014
Page 4 of 18
PS9307AL, PS9307AL2
ELECTRICAL CHARACTERISTICS (at RECOMMENDED OPERATING CONDITIONS,
VEE = GND, unless otherwise specified)
Parameter
Symbol
VF
Conditions
IF = 10 mA, TA = 25°C
VR = 3 V, TA = 25°C
f = 1 MHz, VF = 0 V
VO = (VCC − 4 V) *2
VO = (VCC − 10 V) *3
VO = (VEE + 2.5 V) *2
VO = (VEE + 10 V) *3
IO = −100 mA *4
MIN.
TYP.*1
MAX.
1.8
Unit
V
Diode
Forward Voltage
Reverse Current
Input Capacitance
1.2
1.56
IR
10
μA
pF
A
CIN
30
Detector High Level Output Current
IOH
0.2
0.4
0.2
0.4
Low Level Output Current
IOL
A
High Level Output Voltage
Low Level Output Voltage
High Level Supply Current
Low Level Supply Current
UVLO Threshold
VOH
VOL
ICCH
ICCL
VCC − 3.0 VCC − 1.5
V
V
IO = 100 mA
0.25
1.4
1.3
8.6
1.0
2.0
2.0
9.8
VO = Open
mA
mA
V
VO = Open
VUVLO
+
VO > 5 V, IF = 10 mA
VUVLO
−
6.8
0.8
8.2
0.4
UVLO Hysteresis
UVLOHYS VO > 5 V, IF = 10 mA
V
Coupled Threshold Input Current
IFLH
IO = 0 mA, VO > 5 V
2.5
5.0
mA
(L → H)
Threshold Input Voltage
VFHL
IO = 0 mA, VO < 5 V
V
(H → L)
Notes: *1. Typical values at TA = 25°C, VCC − VEE = 30 V.
*2. Maximum pulse width = 50 μs, Maximum duty cycle = 0.2%.
*3. Maximum pulse width = 10 μs, Maximum duty cycle = 0.5%.
*4. VOH is measured with the DC load current in this testing (Maximum pulse width = 2 ms, Maximum duty cycle
= 20%).
SWITCHING CHARACTERISTICS (at RECOMMENDED OPERATING CONDITIONS,
VEE = GND, unless otherwise specified)
Parameter
Symbol
tPLH
Conditions
Rg = 47 Ω, Cg = 3 nF,
f = 50 kHz,
MIN.
50
TYP.*1
100
90
MAX.
150
150
50
Unit
ns
Propagation Delay Time (L → H)
Propagation Delay Time (H → L)
Pulse Width Distortion (PWD)
tPHL
50
ns
|tPHL−tPLH
|
Duty Cycle = 50%,
5
ns
Propagation Delay Time
(Difference Between Any Two
Products)
tPHL−tPLH IF = 10 mA, VCC = 30 V
−80
80
ns
Rise Time
Fall Time
tr
tf
6
7
ns
ns
Common Mode Transient
Immunity at High Level Output
|CMH|
TA = 25°C, IF = 10 mA,
VCC = 30 V, VCM = 1.5 kV
50
50
kV/μs
Common Mode Transient
|CML|
TA = 25°C, IF = 0 mA,
kV/μs
Immunity at Low Level Output
VCC = 30 V, VCM = 1.5 kV
Notes: *1. Typical values at TA = 25°C, VCC−VEE = 30 V.
R08DS0122EJ0100 Rev.1.00
May 16, 2014
Page 5 of 18
PS9307AL, PS9307AL2
TEST CIRCUIT
Fig. 1 IOH Test Circuit
Fig. 2 IOL Test Circuit
V
CC
V
CC
1
2
3
6
5
4
1
2
3
6
5
4
1.0μF
1.0μF
I
OL
IOH
IF
SHIELD
SHIELD
Fig. 3 VOH Test Circuit
Fig. 4 VOL Test Circuit
V
CC
V
CC
1
2
3
6
5
4
1
2
3
6
5
4
1.0μF
μ
1.0 F
V
OH
V
OL
100 mA
100 mA
IF
SHIELD
SHIELD
Fig. 5 ICCH/ICCL Test Circuit
Fig. 6 UVLO Test Circuit
V
CC
1
2
3
6
5
4
6
1
2
3
IF
= 10 mA
1.0
μF
1.0
μF
5
4
VCC
VO
> 5 V
SHIELD
SHIELD
R08DS0122EJ0100 Rev.1.00
May 16, 2014
Page 6 of 18
PS9307AL, PS9307AL2
Fig. 7 IFLH Test Circuit
V
CC
1
2
3
6
5
4
1.0μF
IF
VO > 5 V
SHIELD
Fig. 8 tPLH, tPHL, t
r, t
f
Test Circuit and Wave Forms
V
CC
I = 10 mA
F
1
2
3
6
5
4
IF
1.0μF
tr
tf
VO
90%
50%
10%
47 Ω
3 nF
10 kHz
50% DUTY
CYCLE
V
OUT
SHIELD
tPLH
tPHL
Fig. 9 CMR Test Circuit and Wave Forms
IF
A
B
V
CC = 30 V
1
2
3
6
5
4
90%
1 500 V
V
CM
1.0μF
10%
0 V
VO
t
r
tr
V
OH
V
O
26 V
SHIELD
(Switch A: I
F
= 10 mA)
= 0 mA)
1 V
V
V
O
OL
+
-
(Switch B: I
F
V
CM = 1.5 kV
R08DS0122EJ0100 Rev.1.00
May 16, 2014
Page 7 of 18
PS9307AL, PS9307AL2
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
DETECTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
DIODE POWER DISSIPATION
vs. AMBIENT TEMPERATURE
50
40
30
20
10
300
250
200
150
ꢀ
ꢀ
100ꢀ
ꢀ
50
0
125
(°C)
0
25
50
75
100
125
(°C)
150
25
50
75
100
150
2.4
3
Ambient Temperature T
A
Ambient Temperature T
A
FORWARD CURRENT vs.
FORWARD VOLTAGE
THRESHOLD INPUT CURRENT vs.
AMBIENT TEMPERATURE
100
10
3
2
1
0
I
FLH
T
A
= 125°C
100°C
85°C
50°C
25°C
−20°C
−40°C
1
0.1
IFHL
V
V
V
CC = 30 V,
EE = GND,
th = 5 V
0.01
1.0
1.2
1.4
1.6
1.8
2.0
(V)
2.2
−50 −25
0
25
50
75 100 125 150
(°C)
Ambient Temperature T
A
Forward Voltage V
F
HIGH LEVEL OUTPUT CURRENT vs. HIGH LEVEL
OUTPUT VOLTAGE – SUPPLY VOLTAGE
OUTPUT VOLTAGE vs.
FORWARD CURRENT
35
2.0
V
V
CC = 30 V,
EE = GND,
= 10 mA
V
V
CC = 30 V,
EE = GND
30
25
20
15
10
5
I
F
1.5
1.0
0.5
0.0
0
0
1
2
0
−2
−4
−6
−8
−10
High Level Output Voltage – Supply
Voltage VOH – VCC (V)
Forward Current I
F
(mA)
Remark The graphs indicate nominal characteristics.
R08DS0122EJ0100 Rev.1.00
May 16, 2014
Page 8 of 18
PS9307AL, PS9307AL2
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. FORWARD CURRENT
LOW LEVEL OUTPUT CURRENT vs.
LOW LEVEL OUTPUT VOLTAGE
2.0
1.5
1.0
0.5
0.0
150
120
90
60
30
0
V
R
CC = 30 V, VEE = GND,
V
V
CC = 30 V,
EE = GND,
= 0 mA
g
= 47 Ω, C
g
= 3 nF,
f = 50 kHz, Duty cycle = 50%
IF
t
PHL
t
PLH
PWD
0
0
0
2
4
6
8
10
6
5
10
15
20
25
Low Level Output Voltage VOL (V)
Forward Current I
F
(mA)
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. SUPPLY VOLTAGE
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. LOAD CAPACITANCE
150
120
90
60
30
0
150
120
90
60
30
0
V
C
CC = 30 V, VEE = GND, R
= 3 nF, I = 10 mA, f = 50 kHz,
Duty cycle = 50%
g
= 47 Ω,
V
CC = 30 V, VEE = GND, R
g
= 47 Ω,
g
F
I
F
= 10 mA, f = 50 kHz, Duty cycle = 50%
t
PHL
PLH
t
t
PLH
PHL
t
PWD
50
PWD
20
Supply Voltage VCC (V)
5
10
15
25
30
35
100
0
Load Capacitance C (nF)
g
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. LOAD RESISTANCE
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. AMBIENT TEMPERATURE
150
120
90
60
30
0
150
120
90
60
30
0
V
CC = 30 V, VEE = GND, C
g
= 3 nF,
V
C
CC = 30 V, VEE = GND, R
= 3 nF, I = 10 mA, f = 50 kHz,
Duty cycle = 50%
g
= 47 Ω,
I
F
= 10 mA, f = 50 kHz, Duty cycle = 50%
g
F
t
PHL
PLH
t
PHL
PLH
t
t
PWD
50
PWD
75 100 125 150
Ambient Temperature T (°C)
100
50
−50 −25
0
25
A
Load Resistance R (Ω)
g
Remark The graphs indicate nominal characteristics.
R08DS0122EJ0100 Rev.1.00
May 16, 2014
Page 9 of 18
PS9307AL, PS9307AL2
SUPPLY CURRENT vs.
AMBIENT TEMPERATURE
SUPPLY CURRENT vs.
SUPPLY VOLTAGE
2.5
2.0
1.5
1.0
0.5
0.0
2.5
2.0
1.5
1.0
0.5
0.0
V
V
EE = GND,
= OPEN
O
I
CCH
I
CCH
CCL
I
CCL
I
V
V
V
CC = 30 V,
EE = GND,
= OPEN
O
−50 −25
0
25
50
75 100 125 150
(°C)
0
5
10
15
20
25
30
35
Ambient Temperature T
A
Supply Voltage VCC (V)
HIGH LEVEL OUTPUT VOLTAGE – SUPPLY
VOLTAGE vs. AMBIENT TEMPERATURE
LOW LEVEL OUTPUT VOLTAGE vs.
AMBIENT TEMPERATURE
2.0
1.5
1.0
0.5
2.0
1.5
1.0
0.5
0.0
V
CC = 30 V, VEE = GND,
= 0 mA
IF
V
CC = 30 V, VEE = GND,
= 10 mA
IF
0.0
−50 −25
0
25
50
75 100 125 150
(°C)
−50 −25
0
25
50
75 100 125 150
(°C)
Ambient Temperature T
A
Ambient Temperature T
A
LOW LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
HIGH LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
2.0
1.5
1.0
0.5
0.0
2.0
1.5
1.0
0.5
0.0
V −VCC = −10 V
O
V = 10 V
O
V = 2.5 V
O
V
O
−VCC = −4 V
V
CC = 30 V, VEE = GND,
= 10 mA
V
CC = 30 V, VEE = GND,
= 0 mA
I
F
IF
−50 −25
0
25
50
75 100 125 150
(°C)
−50 −25
0
25
50
75 100 125 150
Ambient Temperature T
A
Ambient Temperature T
A
(°C)
Remark The graphs indicate nominal characteristics.
R08DS0122EJ0100 Rev.1.00
May 16, 2014
Page 10 of 18
PS9307AL, PS9307AL2
OUTPUT VOLTAGE vs. SUPPLY VOLTAGE
14
12
10
8
UVLOHYS
6
V
UVLO-
4
2
0
VUVLO+
0
5
10
15
20
Supply Voltage VCC (V)
Remark The graphs indicate nominal characteristics.
R08DS0122EJ0100 Rev.1.00
May 16, 2014
Page 11 of 18
PS9307AL, PS9307AL2
TAPING SPECIFICATIONS (UNIT: mm)
Outline and Dimensions (Tape)
2.0±0.1
+0.1
4.0±0.1
1.5
–0
4.5 MAX.
+0.1
1.5
–0
0.35
8.0±0.1
5.08±0.1
Tape Direction
PS9307AL-E3
Outline and Dimensions (Reel)
2.0±0.5
2.0±0.5
13.0±0.2
R 1.0
21.0±0.8
17.5±1.0
21.5±1.0
Packing: 2 000 pcs/reel
R08DS0122EJ0100 Rev.1.00
May 16, 2014
Page 12 of 18
PS9307AL, PS9307AL2
Outline and Dimensions (Tape)
2.0±0.1
+0.1
4.0±0.1
1.5
–0
4.5 MAX.
+0.1
2.0
–0
8.0±0.1
0.35
5.08±0.1
Tape Direction
PS9307AL2-E3
Outline and Dimensions (Reel)
2.0±0.5
2.0±0.5
13.0±0.2
R 1.0
21.0±0.8
25.5±1.0
29.5±1.0
Packing: 2 000 pcs/reel
R08DS0122EJ0100 Rev.1.00
May 16, 2014
Page 13 of 18
PS9307AL, PS9307AL2
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
D
A
Part Number
PS9307AL
Lead Bending
A
B
C
D
lead bending type (Gull-wing)
for surface mount
9.2
1.27
0.8
2.2
lead bending type (Gull-wing)
for long creepage distance (surface mount)
10.2
1.27
0.8
2.2
PS9307AL2
R08DS0122EJ0100 Rev.1.00
May 16, 2014
Page 14 of 18
PS9307AL, PS9307AL2
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
•
•
•
•
•
•
Peak reflow temperature
260°C or below (package surface temperature)
10 seconds or less
60 seconds or less
120 30 s
Time of peak reflow temperature
Time of temperature higher than 220°C
Time to preheat temperature from 120 to 180°C
Number of reflows
Three
Flux
Rosin flux containing small amount of chlorine (The flux
with a maximum chlorine content of 0.2 Wt% is
recommended.)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260°C MAX.
220°C
to 60 s
180°C
120°C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
•
•
•
•
•
Temperature
Time
260°C or below (molten solder temperature)
10 seconds or less
Preheating conditions 120°C or below (package surface temperature)
Number of times
Flux
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
•
•
•
Peak Temperature (lead part temperature) 350°C or below
Time (each pins)
3 seconds or less
Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
(4) Cautions
Fluxes
•
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output at startup, the output
transistor may enter the on state, even if the voltage is within the absolute maximum ratings.
R08DS0122EJ0100 Rev.1.00
May 16, 2014
Page 15 of 18
PS9307AL, PS9307AL2
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. Board designing
(1) By-pass capacitor of more than 1.0 μF is used between VCC and GND near device. Also, ensure that the distance
between the leads of the photocoupler and capacitor is no more than 10 mm.
(2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too close
to the input block pattern of the photocoupler.
If the pattern is too close to the input block and coupling occurs, a sudden fluctuation in the voltage on the IGBT
output side might affect the photocoupler’s LED input, leading to malfunction or degradation of characteristics.
(If the pattern needs to be close to the input block, to prevent the LED from lighting during the off state due to
the abovementioned coupling, design the input-side circuit so that the bias of the LED is reversed, within the
range of the recommended operating conditions, and be sure to thoroughly evaluate operation.)
(3) Pin 2 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open.
Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may
degrade the internal noise environment of the device.
Note: *1. NC: Non-Connection (No Connection).
3. Make sure the rise/fall time of the forward current is 0.5 μs or less.
4. In order to avoid malfunctions, make sure the rise/fall slope of the supply voltage is 3 V/μs or less.
5. Avoid storage at a high temperature and high humidity.
R08DS0122EJ0100 Rev.1.00
May 16, 2014
Page 16 of 18
PS9307AL, PS9307AL2
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter
Symbol
Spec.
Unit
Climatic test class (IEC 60068-1/DIN EN 60068-1)
40/125/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.6 × UIORM., Pd < 5 pC
UIORM
Upr
Vpeak
Vpeak
1 130
1 808
Test voltage (partial discharge test, procedure b for all devices)
Upr = 1.875 × UIORM., Pd < 5 pC
Highest permissible overvoltage
Upr
2 119
Vpeak
Vpeak
UTR
8 000
2
Degree of pollution (DIN EN 60664-1 VDE0110 Part 1)
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11))
Material group (DIN EN 60664-1 VDE0110 Part 1)
Storage temperature range
CTI
175
III a
Tstg
TA
–55 to +150
–40 to +125
°C
°C
Operating temperature range
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25°C
Ris MIN.
Ris MIN.
1012
1011
Ω
Ω
VIO = 500 V dc at TA MAX. at least 100°C
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Tsi
Isi
Psi
175
400
700
°C
mA
mW
Current (input current IF, Psi = 0)
Power (output or total power dissipation)
Isolation resistance
V
IO = 500 V dc at TA = Tsi
Ris MIN.
109
Ω
R08DS0122EJ0100 Rev.1.00
May 16, 2014
Page 17 of 18
PS9307AL, PS9307AL2
This product uses gallium arsenide (GaAs).
Caution GaAs Products
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
R08DS0122EJ0100 Rev.1.00
May 16, 2014
Page 18 of 18
Revision History
PS9307AL, PS9307AL2 Data Sheet
Description
Summary
Rev.
1.00
Date
Page
May 16, 2014
−
First edition issued
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C - 1
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