PS3901L2 [RENESAS]

TRIAC OUTPUT OPTOCOUPLER;
PS3901L2
型号: PS3901L2
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

TRIAC OUTPUT OPTOCOUPLER

三端双向交流开关 输出元件 光电
文件: 总14页 (文件大小:204K)
中文:  中文翻译
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Old Company Name in Catalogs and Other Documents  
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April 1st, 2010  
Renesas Electronics Corporation  
Issued by: Renesas Electronics Corporation (http://www.renesas.com)  
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DATA SHEET  
PHOTO TRIAC COUPLERS  
PS3901,PS3901L  
HIGH OUTPUT CURRENT PHOTO TRIAC OUTPUT TYPE  
10-PIN PHOTOCOUPLER  
DESCRIPTION  
The PS3901 and PS3901L are optically coupled isolators containing a GaAs light emitting diode and poto trcs.  
The PS3901 is in a plastic DIP (Dual In-line Package) and the PS3901L is lead bending type (ull-wing) for  
surface mounting.  
FEATURES  
High RMS on-state current (IT (RMS) = 1.2 A)  
High critical rate of rise of off-state voltage (dV/dt = 500 V/ s TYP.)  
Low input trigger current (IFT = 5 mA MAX.)  
High repetitive peak off-state voltage (VDRM = 600 V)  
High Isolation voltage (BV = 5 000 Vr.m.s.)  
Lead bended for long distance type (PS3901L1, L2)  
UL approved (File No. E72422 (S) )  
APPLICATIONS  
Vending machine  
Electric home appliances  
Fan heaters, Air conditioner  
The information in this document is subject to change without notice.  
Document No. P10421EJ4V0DS00 (4th edition)  
Date Published October 1997 NS  
Printed in Japan  
The mark shows major revised points.  
1995  
©
PS3901,PS3901L  
PACKAGE DIMENSIONS (in millimeters)  
PS3901  
DIP type  
TOP VIEW  
15  
13  
11  
9
20.3 MAX.  
5.08  
2
3
4
5
6
7
2. Anode  
3. Cathode  
4. NC  
5. NC  
6. NC  
7. NC  
9. Triac T  
13. Triac T  
11. Triac T  
15. Gate*1  
2
2
1
2.54  
*1 RG, CG needles  
7.62  
6.5  
oduct  
0 to 15˚  
0.50±0.10 0.25  
M
1.34±0.1  
PS3901L  
Lead bending type  
TOP VIEW  
15  
13  
11  
9
ued Pr  
20.3 MAX.  
5.08  
2
3
4
5
6
7
2. Anode  
7. NC  
3. Cathode  
4. NC  
5. NC  
9. Triac T  
13. Triac T  
11. Triac T  
15. Gate*1  
2
2
1
6. NC  
*1 RG, CG needles  
2.54  
7.62  
6.5  
Discontin  
0.9±0.25  
9.60±0.4  
1.34±0.1 0.25  
M
2
PS3901,PS3901L  
PS3901L1  
DIP type  
(for Long Distance)  
TOP VIEW  
15  
13  
11  
9
20.3 MAX.  
5.08  
2
3
4
5
6
7
2. Anode  
3. Cathode  
4. NC  
5. NC  
6. NC  
7. NC  
9. Triac T  
13. Triac T  
11. Triac T  
15. Gate*1  
2
2
1
*1 RG, CG needles  
10.16  
2.54  
7.62  
6.5  
0 to 15˚  
0.50±0.1 0.25  
M
1.34±0.1  
PS3901L2  
Lead bendpe  
(for Long Danc)  
TOP VIEW  
15  
13  
11  
9
20.3 MAX.  
5.
2
3
4
5
6
7
2. Anode  
3. Cathode  
4. NC  
5. NC  
6. NC  
7. NC  
9. Triac T  
13. Triac T  
11. Triac T  
15. Gate*1  
2
2
1
*1 RG, CG needles  
10.16  
7.62  
6.5  
2.54  
0.9±0.25  
11.8±0.4  
1.34±0.1 0.25  
M
3
PS3901,PS3901L  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise specified)  
Parameter  
Symbol  
IF  
Ratings  
80  
Unit  
mA  
V
Diode  
Forward Current  
Reverse Voltage  
VR  
6.0  
Power Dissipation Derating  
Power Dissipation  
PD/°C  
PD  
1.5  
mW/°C  
mW  
A
150  
Peak Forward Current*1  
Repetitive Peak Off-state Voltage  
RMS On-state Current*2  
Peak 1 Cycle Surge On Current*3  
Power Dissipation Derating  
Power Dissipation  
IFP  
1
Triac  
VDRM  
IT (RMS)  
ITSM  
PC/°C  
PC  
600  
V
1.2  
A
10  
A
15  
mW/°C  
W
1.5  
Isolation Voltage*4  
BV  
5 000  
25 to +85  
40 to +125  
Vr.m.s.  
°C  
Operating Ambient Temperature  
Storage Temperature  
TA  
Tstg  
°C  
*1 PW = 100 s, Duty Cycle = 1 %  
*2 Current for operation of this device differs depending on condions such as load, operating temperature, and  
supply voltage.  
*3 Sine Wave f = 50 Hz  
*4 AC voltage for 1 minute at TA = 25 °C, RH = 60 % betn input and output.  
RECOMMENDED OPERATING CONDITIONS  
Parameter  
Supply Voltage  
Symbl  
IF  
IN.  
TYP.  
15  
MAX.  
240  
20  
Unit  
VAC  
mA  
°C  
Forward Current  
10  
20  
Operating Ambient Temperature  
TA  
+80  
4
PS3901,PS3901L  
ELECTRICAL CHARACTERISTICS (TA = 25 °C)  
Parameter  
Symbol  
VF  
Conditions  
MIN.  
TYP.  
1.1  
MAX.  
1.4  
Unit  
V
Diode  
Triac  
Forward Voltage  
IF = 10 mA  
VR = 5 V  
Reverse Current  
IR  
10  
A
Terminal Capacitance  
Peak Off-state Current  
Peak On-state Voltage  
Holding Current  
Ct  
V = 0 V, f = 1 MHz  
VDRM = Rated  
ITM = Rated  
30  
pF  
A
IDRM  
VTM  
IH  
100  
3
V
25  
mA  
V/ s  
mA  
Rate Off-state Voltage*1  
LED Trigger Current  
Isolation Resistance  
Isolation Capacitance  
dV/dt  
IFT  
VIN = 1/ 2 Rated  
VT = 6 V  
500  
1.5  
Coupled  
5
RI-O  
CI-O  
VI-O = 1 kVDC  
1011  
V = 0 V, f = 1 MHz  
pF  
*1 Test circuit for critical rate of rise of off-state voltage  
oduct  
VIN  
RL = 1 k  
ued Pr  
USAGE CAUTIONS  
1. All pins should be soldered for heat sink.  
2. Be sure to connect a circuit for surge absorbent.  
3. Trigger input current is changed by pulse, temperature and load voltage, therefore it must be careful examined.  
4. An appropriate circuit must be chosen according to the load (for CR, chose its constant). This must be carefully  
done especially for an inductive load.  
5. On the phase control, load current at initial input signal input should be applied to 50 mA (MIN).  
Discontin  
5
PS3901,PS3901L  
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified)  
MAXIMUM FORWARD CURRENT vs.  
AMBIENT TEMPERATURE  
RMS ON-STATE CURRENT vs.  
AMBIENT TEMPERATURE  
120  
100  
80  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
60  
40  
20  
0
25  
50  
75  
100  
0
25  
50  
75  
100  
Ambient Temperature T  
A
(˚C)  
Ambient Temperature T  
A
(˚C)  
FORWARD CURRENT vs.  
FORWARD VOLTAGE  
TRIGGER INPUT CURRENT vs.  
oduct  
AMBIENT TEMPERATURE  
100  
10  
8
6
4
2
VT = 6 V  
T
A
= +100 ˚C  
+75 ˚C  
+50 ˚C  
+25 ˚C  
0 ˚C  
–25 ˚C  
–50 ˚C  
1
0.1  
0.01  
ued Pr  
0
0.6  
0.8  
1.0  
1.2  
1.4  
(V)  
1.6  
–50  
–25  
0
25  
50  
75  
(˚C)  
100  
Forward Voltage V  
F
Ambient Temperature T  
A
HOLDING CURRENT vs.  
AMBIENT TEMPERATURE  
20  
18  
16  
14  
12  
10  
8
Discontin  
6
4
2
0
–50  
–25  
0
25  
50  
75  
100  
Ambient Temperature T  
A
(˚C)  
6
PS3901,PS3901L  
ON-STATE CURRENT vs.  
ON-STATE VOLTAGE  
ON-STATE VOLTAGE vs.  
AMBIENT TEMPERATURE  
2.0  
1.6  
1.2  
0.8  
0.4  
2.0  
1.6  
1.2  
0.8  
0.4  
0
IT (RMS) = 1.2 A  
0.0  
0.4  
0.8  
1.2  
1.6  
–50  
–25  
0
25  
50  
5  
100  
On-state Voltage VT (V)  
Ambient Tempere TA (˚C)  
PEAK OFF-STATE CURRENT vs.  
AMBIENT TEMPERATURE  
10  
1
VDRM, VRRM = Rated  
µ
IRRM  
IDRM  
0.1  
0.01  
–25  
0
25  
50  
5  
100  
Ambient Temperature TA ˚)  
7
PS3901,PS3901L  
RECOMMENDED SOLDERING CONDITIONS  
(1) Infrared reflow soldering  
• Peak reflow temperature  
• Time of temperature higher than 210 °C  
• Number of reflows  
235 °C (package surface temperature)  
30 seconds or less  
Three  
• Flux  
Rosin flux containing small amount of chlorine (The flux with a  
maximum chlorine content of 0.2 Wt % is recommended.)  
Recommended Temperature Profile of Infrared Reflow  
(heating)  
to 10 s  
235 ˚C (perature)  
210 ˚C  
to 30 s  
120 to 160 ˚C  
60 to 90 s  
(preheating)  
Time s)  
Caution Please avoid to removed the sidul flux by water after the first reflow processes.  
Peak temperature 235 ˚C or below  
(2) Dip soldring  
atur
260 °C or below (molten solder temperature)  
10 seconds or less  
• Nuer of times  
• Flux  
One  
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of  
0.2 Wt % is recommended.)  
8
PS3901,PS3901L  
[MEMO]  
9
PS3901,PS3901L  
[MEMO]  
10  
PS3901,PS3901L  
[MEMO]  
11  
PS3901,PS3901L  
CAUTION  
Within this device there exists GaAs (Gallium Arsenide) material which is a  
harmful substance if ingested. Please do not under any circumstances break the  
hermetic seal.  
No part of this document may be copied or reproduced in any form oy mns without the prior written  
consent of NEC Corporation. NEC Corporation assumes no responsibiliany errors which may appear in this  
document.  
NEC Corporation does not assume any liability for infringemet of patents, copyrights or other intellectual  
property rights of third parties by or arising from use of a devscribed herein or any other liability arising  
from use of such device. No license, either express, implitherwise, is granted under any patents,  
copyrights or other intellectual property rights of NEC Cration or others.  
While NEC Corporation has been making continuous effoo ehance the reliability of its semiconductor devices,  
the possibility of defects cannot be eliminated entiry. Tminimize risks of damage or injury to persons or  
property arising from a defect in an NEC semicoductdevice, customers must incorporate sufficient safety  
measures in its design, such as redundancy, fire-cntinment, and anti-failure features.  
NEC devices are classified into the following thre quality grades:  
"Standard", "Special", and "Specific". The Secific quality grade applies only to devices developed based on  
a customer designated "quality asurancprogram" for a specific application. The recommended applications  
of a device depend on its quality grae, as indicated below. Customers must check the quality grade of each  
device before using it in a partiur apcation.  
Standard: Computers, offiequment, communications equipment, test and measurement equipment,  
audio and vual euipment, home electronic appliances, machine tools, personal electronic  
equipmendustrial robots  
Special: Transportaquipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systms, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for lisuport)  
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
suport systems or medical equipment for life support, etc.  
The qualy grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.  
merintend to use NEC devices for applications other than those specified for Standard quality grade,  
uld contact an NEC sales representative in advance.  
Adioactive design is not implemented in this product.  
M4 96. 5  

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