ISL97671AIRZ-T13 [RENESAS]
LED Driver;型号: | ISL97671AIRZ-T13 |
厂家: | RENESAS TECHNOLOGY CORP |
描述: | LED Driver 驱动 接口集成电路 |
文件: | 总28页 (文件大小:917K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
6-Channel SMBus/I2C or PWM Dimming LED Driver with
Phase Shift Control
ISL97671A
Features
The ISL97671A is a 6-Channel 45V dual dimming capable LED
driver that can be used with either SMBus/I2C or PWM signal
for dimming control. The ISL97671A can drive six channels of
LEDs from an input of 4.5V~26.5V to an output of up to 45V. It
can also operate from an input as low as 3V to an output of up
to 26.5V in bootstrap configuration (see Figure 38).
• 6 x 50mA channels
• 4.5V to 26.5V input with max 45V output
• 3V (see Figure 38) to 21V input with max 26.5V output
• PWM dimming with phase shift control
• SMBus/I2C controlled PWM or DC dimming
• Direct PWM dimming
The ISL97671A features optional channel phase shift control
to minimize the input: output ripple characteristics and load
transients to improve efficiency and eliminate audible noise.
• PWM dimming linearity
- PWM dimming with adjustable dimming frequency and
duty cycle linear from 0.4% to 100% <30kHz
The device can also be configured in Direct PWM Dimming
with minimum dimming duty cycle of 0.007% at 200Hz.
- Direct PWM dimming duty cycle linear from 0.007% to
100% at 200Hz
The ISL97671A headroom control circuit monitors the highest
LED forward voltage string for output regulation, to minimize
the voltage headroom and power loss in a typical multi-string
operation.
• Current matching ±0.7%
• 600kHz/1.2MHz selectable switching frequency
• Dynamic headroom control
• Fault protection
The ISL97671A is offered in compact and thermally efficient
20 Ld QFN 4mmx3mm package.
- String open/short circuit, OVP, OTP, and optional output
short circuit fault protection
• 20 Ld 4mmx3mm QFN package
Applications
• Tablet PC to notebook displays LED backlighting
• LCD monitor LED backlighting
• Field sequential RGB LED backlighting
Typical Application Circuits
45V*, 6 x 50mA
45V*, 6 x 50mA
45V*, 6 x 50mA
VIN = 4.5~26.5V
VIN = 4.5~26.5V
VIN = 4.5~26.5V
Q1 (OPTIONAL)
Q1 (OPTIONAL)
Q1 (OPTIONAL)
ISL97671A
1 FAULT
ISL97671A
FAULT
ISL97671A
1
2
4
FAULT
VIN
1
2
LX 20
LX 20
LX 20
2
VIN
VIN
OVP
OVP
16
OVP
16
16
4
8
4
VDC
VDC
VDC
FPWM
PGND 19
PGND 19
PGND 19
CH0 10
7
6
7
6
SMBCLK/SCL
SMBDAT/SDA
7
6
SMBCLK/SCL
SMBCLK/SCL
SMBDAT/SDA
CH0
10
11
12
13
14
15
CH0 10
SMBDAT/SDA
CH1
CH2
CH3
CH4
CH5
CH1
CH2
CH3
CH4
CH5
CH1
CH2
CH3
CH4
CH5
11
12
13
14
15
11
12
13
14
15
5
3
PWM
EN
5
3
PWM
EN
5
3
PWM
EN
17
RSET
17
8
17
8
RSET
RSET
FPWM
FPWM
*VIN > 12V
COMP
*VIN > 12V
9
18
AGND
COMP
*VIN > 12V
COMP
9
18
9
AGND
18
AGND
FIGURE 1A. SMBus/I2C CONTROLLED
DIMMING AND ADJUSTABLE
DIMMING FREQUENCY
FIGURE 1B. PWM DIMMING WITH PWM INPUT
AND ADJUSTABLE DIMMING
FREQUENCY
FIGURE 1C. DIRECT PWM DIMMING
FIGURE 1. ISL97671A TYPICAL APPLICATION DIAGRAMS
November 30, 2012
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2011, 2012. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
1
FN7709.3
ISL97671A
Block Diagram
V
= 4.5V TO 26.5V
IN
45V*, 6 x 50mA
V
LX
FAULT
IN
ISL97671A
EN
OVP
VDC
REG
OVP
FAULT/STATUS
REGISTER
OSC AND
RAMP
COMP
FET
DRIVER
Σ = 0
LOGIC
ILIMIT
IMAX
FPWM
COMP
PGND
LED PWM
CONTROL
CH0
CH5
GM
AMP
HIGHEST VF
STRING
DETECT
OC, SC
DETECT
REFERENCE
GENERATOR
+
-
OC, SC
DETECT
*V > 12V
IN
+
-
RSET
FAULT/STATUS
REGISTER
AGND
TEMP
SENSOR
+
-
REGISTERS
PWM BRIGHTNESS CONTROL
DEVICE CONTROL
2
FAULT/STATUS
REGISTER
SMBUS/I C
SMBCLK/SCL
SMBDAT/SDA
PWM
PWM/OC/SC
DC
INTERFACE
AND PWM
CONTROL
LOGIC
FAULT/STATUS
IDENTIFICATION
DC BRIGHTNESS CONTROL
CONFIGURATION
FIGURE 2. ISL97671A BLOCK DIAGRAM
FN7709.3
November 30, 2012
2
ISL97671A
Pin Configuration
Ordering Information
ISL97671A
(20 LD QFN)
TOP VIEW
PART NUMBER
PART
PACKAGE
(Pb-free)
PKG.
DWG. #
(Notes 1, 2, 3)
MARKING
ISL97671AIRZ
671A
20 Ld 3x4 QFN
L20.3x4
ISL97671AIRZ-EVALZ Evaluation Board
20
19
18
17
NOTES:
FAULT
VIN
1. Add “-T* suffix for tape and reel. Please refer to TB347 for details on
reel specifications.
1
2
3
4
5
6
OVP
CH5
CH4
CH3
CH2
CH1
16
15
14
13
12
11
2. These Intersil Pb-free plastic packaged products employ special
Pb-free material sets, molding compounds/die attach materials, and
100% matte tin plate plus anneal (e3 termination finish, which is
RoHS compliant and compatible with both SnPb and Pb-free
soldering operations). Intersil Pb-free products are MSL classified at
Pb-free peak reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020.
EN
VDC
PWM
SMBDAT/SDA
3. For Moisture Sensitivity Level (MSL), please see device information
page for ISL97671A. For more information on MSL please see
techbrief TB363.
7
8
9
10
Pin Descriptions (I = Input, O = Output, S = Supply, X = Don’t Care)
PIN NAME
FAULT
VIN
PIN #
TYPE
DESCRIPTION
1
2
3
O
S
I
Fault Disconnect Switch Gate Control.
Input voltage for the device and LED power.
EN
Enable input. The device needs 4ms for initial power-up enable. It will be disabled if it is not biased for longer than
30.5ms.
VDC
PWM
4
5
6
S
I
Internal LDO output. Connect a decoupling capacitor to ground.
PWM brightness control pin or DPST control input.
SMBDAT/SDA
I/O SMBus/I2C serial data input and output. When pins 6 and 7 are grounded or in logic 0’s for longer than 60ms, the
drivers will be controlled by external PWM signal.
SMBCLK/SCL
FPWM
7
8
I
SMBus/I2C serial clock input. When pins 6 and 7 are grounded or in logic 0’s for longer than 60ms, the drivers will
be controlled by external PWM signal.
I
Set PWM dimming frequency, by connecting a resistor between this pin and ground. When FPWM is tied to VDC and
SMBCLK/SMBDAT is tied to ground, the device will be in Direct PWM Dimming where the output follows the input
frequency and duty cycle without any digitization.
AGND
9
S
I
Analog Ground for precision circuits.
CH0, CH1
CH2, CH3
CH4, CH5
10, 11,
12, 13,
14, 15
Current source and channel monitoring input for channels 0-5.
OVP
RSET
COMP
PGND
LX
16
17
18
19
20
I
Overvoltage protection input.
I
Resistor connection for setting LED current, (see Equation 1 for calculating the ILED(peak)).
O
S
O
Boost compensation pin.
Power ground
Boost switch node.
EPAD
No electrical connection but should be used to connect PGND and AGND. For example use top plane as PGND and
bottom plane as AGND with vias on EPAD to allow heat dissipation and minimum noise coupling from PGND to
AGND operation.
FN7709.3
November 30, 2012
3
ISL97671A
Table of Contents
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Thermal Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Typical Performance Curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Theory of Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
PWM Boost Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Current Matching and Current Accuracy. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Dynamic Headroom Control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Maximum DC Current Setting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
PWM DIMMING Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
PWM Dimming Frequency Adjustment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Phase Shift Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Switching Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5V Low Dropout Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
IC Protection Features and Fault Management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
SMBus/I2C Communications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Write Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Read Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Slave Device Address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
SMBus/I2C Register Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
PWM Brightness Control Register (0x00) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Device Control Register (0x01) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Fault/Status Register (0x02) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Identification Register (0x03) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
DC Brightness Control Register (0x07) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Configuration Register (0x08) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Output Channel Mask/Fault Readout Register (0x09) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Phase Shift Control Register (0x0A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Components Selections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Input Capacitor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Inductor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Output Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Output Ripple . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Schottky Diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
High-Current Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Low Voltage Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
16-Bit Dimming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Field Sequential RGB LED Backlighting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
About Intersil . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Package Outline Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
FN7709.3
November 30, 2012
4
ISL97671A
Absolute Maximum Ratings (TA = +25°C)
Thermal Information
VIN, EN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 28V
FAULT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VIN - 8.5V to VIN + 0.3V
VDC, COMP, RSET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 5.5V
SMBCLK/SCL, SMBDAT/SDA, FPWM, PWM . . . . . . . . . . . . . . -0.3V to 5.5V
OVP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 5.5V
CH0 - CH5, LX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 45V
PGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +0.3V
Above voltage ratings are all with respect to AGND pin
Thermal Resistance (Typical)
20 Ld QFN Package (Notes 4, 5, 7) . . . . . .
Thermal Characterization (Typical)
θ
JA (°C/W)
40
θ
JC (°C/W)
2.5
PSIJT (°C/W)
1
20 Ld QFN Package (Note 6) . . . . . . . . . . . . . . . . . . . . .
Maximum Continuous Junction Temperature . . . . . . . . . . . . . . . . .+125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
ESD Rating
Human Body Model (Tested per JESD22-A114E). . . . . . . . . . . . . . . . 3kV
Machine Model (Tested per JESD22-A115-A). . . . . . . . . . . . . . . . . 300V
Charged Device Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1kV
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise
noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
5. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
6. PSIJT is the PSI junction-to-top thermal characterization parameter. If the package top temperature can be measured with this rating then the die
junction temperature can be estimated more accurately than the θJC and θJC thermal resistance ratings.
7. Refer to JESD51-7 high effective thermal conductivity board layout for proper via and plane designs.
Electrical Specifications V = 12V, EN = 5V, R = 20.1kΩ, unless otherwise noted. Boldface limits apply over the operating
IN
SET
temperature range, -40°C to +85°C.
MIN
MAX
PARAMETER
GENERAL
DESCRIPTION
CONDITION
(Note 8)
TYP
(Note 8)
UNIT
V
VIN (Note 9)
Backlight Supply Voltage
≤13 LEDs per channel
4.5
26.5
(3.2V/20mA type)
IVIN_STBY
IVIN
VIN Shutdown Current
VIN Active Current
Output Voltage
TA = +25°C
EN = 5V
5
µA
mA
V
5
VOUT
4.5V < VIN ≤ 26V,
45
45
F
SW = 600kHz
8.55V < VIN ≤ 26V,
V
F
SW = 1.2MHz
4.5V < VIN ≤ 8.55V, FSW = 1.2MHz
VIN/0.19
2.6
V
V
VUVLO
VUVLO_HYS
REGULATOR
VDC
Undervoltage Lockout Threshold
Undervoltage Lockout Hysteresis
2.1
200
4.8
20
mV
LDO Output Voltage
VIN ≥ 6V
4.55
5
5
V
µA
mV
V
IVDC_STBY
VLDO
Standby Current
EN = 0V
VDC LDO Droop Voltage
Guaranteed Range for EN Input Low Voltage
VIN > 5.5V, 20mA
200
0.5
ENLOW
ENHI
Guaranteed Range for EN Input High Voltage
EN Low Time Before Shut-down
1.8
V
tENLow
30.5
ms
FN7709.3
November 30, 2012
5
ISL97671A
Electrical Specifications V = 12V, EN = 5V, R = 20.1kΩ, unless otherwise noted. Boldface limits apply over the operating
IN
SET
temperature range, -40°C to +85°C. (Continued)
MIN
MAX
PARAMETER
BOOST
DESCRIPTION
CONDITION
(Note 8)
TYP
(Note 8)
UNIT
SWILimit
rDS(ON)
SS
Boost FET Current Limit
1.5
2.0
235
7
2.7
A
mΩ
ms
%
Internal Boost Switch ON-resistance
Soft-Start
TA = +25°C
100% LED Duty Cycle
IN = 12V, 72 LEDs, 20mA each,
300
Eff_peak
Peak Efficiency
V
92.9
L = 10µH with DCR 101mΩ,
TA = +25°C
V
IN = 12V, 60 LEDs, 20mA each,
90.8
0.1
%
L = 10µH with DCR 101mΩ,
TA = +25°C
ΔIOUT/ΔVIN
Line Regulation
%
%
DMAX
Boost Maximum Duty Cycle
FSW = 1, 600kHz
FSW = 0, 1.2MHz
FSW = 1, 600kHz
90
81
DMIN
Boost Minimum Duty Cycle
9.5
17
%
F
SW = 0, 1.2MHz
fOSC_hi
fOSC_lo
Lx Frequency High
Lx Frequency Low
FSW = 1, 600kHz
FSW = 0, 1.2MHz
LX = 45V, EN = 0V
475
600
640
1.31
10
kHz
MHz
µA
0.97
1.14
ILX_leakage
REFERENCE
FAULT DETECTION
VSC
LX Pin Leakage Current
Short Circuit Threshold Accuracy
7.5
8.2
150
23
V
Temp_shtdwn Temperature Shutdown Threshold
°C
°C
V
Temp_Hyst
VOVPlo
Temperature Shutdown Hysteresis
Overvoltage Limit on OVP Pin
1.199
1.24
CURRENT SOURCES
IMATCH
DC Channel-to-Channel Current Matching
RSET = 20.1kΩ, Reg0x00 = 0xFF,
(IOUT = 20mA)
±0.7
500
±1.0
+1.5
%
IACC
Current Accuracy
-1.5
1.2
%
VHEADROOM
Dominant Channel Current Source Headroom ILED = 20mA
at CH Pin
mV
TA = +25°C
VRSET
Voltage at RSET Pin
Maximum LED Current per Channel
RSET = 20.1kΩ
1.22
50
1.24
V
ILED(max)
VIN = 12V, VOUT = 45V, FSW = 1.2MHz,
TA = +25°C
mA
PWM GENERATOR
VIL
VIH
Guaranteed Range for PWM Input Low Voltage
Guaranteed Range for PWM Input High Voltage
PWM Input Frequency Range
0.8
VDD
V
V
1.5
FPWMI
PWMACC
200
30,000
Hz
bits
PWM Dimming Accuracy (Except Direct PWM
Dimming)
8
tDIRECTPWM
FPWM
Direct PWM Minimum On Time
PWM Dimming Frequency Range
Direct PWM Mode
250
350
ns
Hz
100
30,000
FN7709.3
November 30, 2012
6
ISL97671A
Electrical Specifications V = 12V, EN = 5V, R = 20.1kΩ, unless otherwise noted. Boldface limits apply over the operating
IN
SET
temperature range, -40°C to +85°C. (Continued)
MIN
MAX
PARAMETER
FAULT PIN
IFAULT
DESCRIPTION
CONDITION
(Note 8)
TYP
(Note 8)
UNIT
Fault Pull-down Current
VIN = 12V
12
6
21
7
30
8.3
1.2
5
µA
V
VFAULT
Fault Clamp Voltage with Respect to VIN
LX Start-up Threshold
VIN = 12, VIN - VFAULT
LXstart_thres
0.9
1
V
ILXStart-up
2
LX Start-up Current
3.5
mA
SMBus/I C INTERFACE
VIL
VIH
VOL
Guaranteed Range for Data, Clock Input Low
Voltage
0.8
V
V
Guaranteed Range for Data, Clock Input High
Voltage
1.5
-10
VDD
2
SMBus/I C Data line Logic Low Voltage
IPULLUP = 4mA
0.17
10
V
ILEAK
Input Leakage On SMBData/SMBClk
Measured at 4.8V
µA
2
SMBus/I C TIMING SPECIFICATIONS
tEN-SMB/I2C
Minimum Time Between EN high and
1µF capacitor on VDC
2
ms
µs
SMBus/I2C Enabled
PWS
Pulse Width Suppression on
SMBCLK/SMBDAT
0.15
0.45
400
fSMB
tBUF
SMBus/I2C Clock Frequency
kHz
µs
Bus Free Time Between Stop and Start
Condition
1.3
0.6
tHD:STA
Hold Time After (Repeated) START Condition.
After this Period, the First Clock is Generated
µs
tSU:STA
tSU:STO
tHD:DAT
tSU:DAT
tLOW
tHIGH
tF
Repeated Start Condition Setup Time
Stop Condition Setup Time
Data Hold Time
0.6
0.6
µs
µs
ns
ns
µs
µs
ns
ns
300
100
1.3
0.6
Data Setup Time
Clock Low Period
Clock High Period
Clock/data Fall Time
Clock/data Rise Time
300
300
tR
NOTES:
8. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
9. At maximum VIN of 26.5V, minimum VOUT is limited 28V.
FN7709.3
November 30, 2012
7
ISL97671A
Typical Performance Curves
100
90
80
70
60
50
40
30
20
10
0
100
6P10S LEDs
90
80
70
24V
IN
580kHz
1.2MHz
12V
IN
60
50
40
30
20
10
0
5V
IN
0
5
10
15
20
25
30
35
0
5
10
15
(V)
20
25
30
I
(mA)
V
LED
IN
FIGURE 3. EFFICIENCY vs UP TO 30mA LED CURRENT (100% LED
DUTY CYCLE) vs VIN
FIGURE 4. EFFICIENCY vs VIN vs SWITCHING FREQUENCY AT 20mA
(100% LED DUTY CYCLE)
100
90
100
80
80
+25°C
70
-40°C
1.2MHz
580k
60
60
50
40
30
20
10
0
0°C
+85°C
40
20
0
0
5
10
15
(V)
20
25
30
0
5
10
15
(V)
20
25
30
V
V
IN
IN
FIGURE 5. EFFICIENCY vs VIN vs SWITCHING FREQUENCY AT 30mA
(100% LED DUTY CYCLE)
FIGURE 6. EFFICIENCY vs VIN vs TEMPERATURE AT 20mA
(100% LED DUTY CYCLE)
0.40
0.30
0.20
0.10
0.00
1.2
1.0
0.8
4.5 V
IN
0.6
0.4
0.2
0
4.5V
IN
12 V
IN
12V
IN
-0.10
-0.20
-0.30
-0.40
21V
4
IN
0
1
2
3
5
6
7
0
1
2
3
4
5
6
CHANNEL
PWM DIMMING DUTY CYCLE(%)
FIGURE 7. CHANNEL-TO-CHANNEL CURRENT MATCHING
FIGURE 8. CURRENT LINEARITY vs LOW LEVEL PWM DIMMING
DUTY CYCLE vs VIN
FN7709.3
November 30, 2012
8
ISL97671A
Typical Performance Curves (Continued)
0.60
0.55
0.50
0.45
0.40
-40°C
+25°C
V
= 50mV/DIV
OUT
2.00µs/DIV
0°C
VLX = 20V/DIV
2.00µs/DIV
0
5
10
15
(V)
20
25
30
V
IN
FIGURE 10. VOUT RIPPLE VOLTAGE, VIN = 12V, 6P12S AT
20mA/CHANNEL
FIGURE 9. VHEADROOM vs VIN vs TEMPERATURE AT 20mA
V_OUT
V_OU
V_OUT
V_EN
V_EN
V_LX
V_LX
II_INDUCTOR
I_INDUCTOR
FIGURE 11. SOFT-START INDUCTOR CURRENT AT VIN = 6V FOR
6P12S AT 20mA/CHANNEL
FIGURE 12. SOFT-START INDUCTOR CURRENT AT VIN = 12V FOR
6P12S AT 20mA/CHANNEL
6P12S, 20mA/CH
6P12S, 20mA/CH
V
= 10V/DIV
V
= 10V/DIV
IN
IN
10ms/DIV
10.0ms/DIV
I_V = 1A/DIV
IN
I_V = 1A/DIV
IN
ILED = 20mA/DIV
ILED = 20mA/DIV
FIGURE 13. LINE REGULATION WITH VIN CHANGE FROM 6V TO 26V,
6P12S AT 20mA/CHANNEL
FIGURE 14. LINE REGULATION WITH VIN CHANGE FROM 26V TO 6V
FOR 6P12S AT 20mA/CHANNEL
FN7709.3
November 30, 2012
9
ISL97671A
Typical Performance Curves (Continued)
6P12S, 20mA/CH
6P12S, 20mA/CH
V
= 1V/DIV
V
= 1V/DIV
O
O
10.0ms/DIV
10.0ms/DIV
ILED = 20mA/DIV
ILED = 20mA/DIV
FIGURE 15. BOOST OUTPUT VOLTAGE WITH BRIGHTNESS CHANGE
FROM 0% TO 100%, VIN = 12V, 6P12S AT
20mA/CHANNEL
FIGURE 16. BOOST OUTPUT VOLTAGE WITH BRIGHTNESS CHANGE
FROM 100% TO 0%, VIN = 12V, 6P12S AT
20mA/CHANNEL
6P12S, 20mA/CH
0.0030
0.0025
0.0020
0.0015
V
O = 10V/DIV
20.0ms/DIV
I_V = 1A/DIV
IN
ILED = 20mA/DIV
F
= 200Hz
PWM
EN
NO CH CAPS
I
= 20mA @ 100% DUTY CYCLE
LED
0.0010
0.006 0.007 0.008 0.009 0.010 0.011 0.012 0.013 0.014
PWM DIMMING DUTY CYCLE (%)
FIGURE 17. ISL97671A SHUTS DOWN AND STOPS SWITCHING
~30ms AFTER EN GOES LOW
FIGURE 18. DIRECT PWM DIMMING LINEARITY AT VERY LOW DUTY
CYCLE
FN7709.3
November 30, 2012
10
ISL97671A
Dynamic Headroom Control
Theory of Operation
The ISL97671A features a proprietary Dynamic Headroom
Control circuit that detects the highest forward voltage string or
effectively the lowest voltage from any of the CH0-CH5 pins.
When this lowest channel voltage is lower than the short circuit
threshold, VSC, such voltage will be used as the feedback signal
for the boost regulator. The boost makes the output to the correct
level such that the lowest channel pin is at the target headroom
voltage. Since all LED stacks are connected to the same output
voltage, the other channel pins will have a higher voltage, but the
regulated current source circuit on each channel will ensure that
each channel has the same programmed current. The output
voltage will regulate cycle-by-cycle and is always referenced to
the highest forward voltage string in the architecture.
PWM Boost Converter
The current mode PWM boost converter produces the minimal
voltage needed to enable the LED stack with the highest forward
voltage drop to run at the programmed current. The ISL97671A
employs current mode control boost architecture that has a fast
current sense loop and a slow voltage feedback loop. Such
architecture achieves a fast transient response that is essential
for notebook backlight applications in which drained batteries
can be instantly changed to an AC/DC adapter without
noticeable visual disturbance. The number of LEDs that can be
driven by ISL97671A depends on the type of LED chosen in the
application. The ISL97671A is capable of boosting up to 45V and
typically driving 13 LEDs in series for each of the 6 channels,
enabling a total of 78 pieces of the 3.2V/20mA type of LEDs.
MAXIMUM DC CURRENT SETTING
The initial brightness should be set by choosing an appropriate
value for RSET. This should be chosen to fix the maximum
possible LED current:
Enable
The EN pin is used to enable or disable the ISL97671A operation. It
is a high voltage pin that can be tied directly to VIN up to 26.5V. If EN
is pulled low for longer than 30ms, the device will shut down.
410.5
--------------
I
=
LEDmax
(EQ. 1)
R
SET
Once RSET is fixed, the LED DC current can be adjusted through
Register 0x07 (BRTDC) as follows:
Current Matching and Current Accuracy
Each channel of the LED current is regulated by the current
source circuit, as shown in Figure 19.
I
= 1.61x(BRTDC ⁄ R
)
SET
(EQ. 2)
LED
The LED peak current is set by translating the RSET current to the
output with a scaling factor of 410.5/RSET. The source terminals
of the current source MOSFETs are designed to run at 500mV to
optimize power loss versus accuracy requirements. The sources
of errors of the channel-to-channel current matching come from
the op amps offset, internal layout, reference, and current source
resistors. These parameters are optimized for current matching
and absolute current accuracy. On the other hand, the absolute
accuracy is additionally determined by the external RSET, and
therefore, additional tolerance will be contributed by the current
setting resistor. A 1% tolerance resistor is therefore
BRTDC can be programmed from 0 to 255 in decimal and
defaults to 255 (0xFF). If left at the default value, LED current will
be fixed at ILEDmax. BRTDC can be adjusted dynamically on the fly
during operation. BRTDC = 0 disconnects all channels.
For example, if the maximum required LED current (ILED(max)) is
20mA, rearranging Equation 1 yields Equation 3:
R
= 410.5 ⁄ 0.02 = 20.52kΩ
(EQ. 3)
SET
If BRTDC is set to 200 then:
(EQ. 4)
I
= 1.61 • 200 ⁄ 20100 = 16.02mA
LED
recommended.
PWM DIMMING CONTROL
The ISL97671A provides multiple PWM dimming methods, as
described in the following. Table 1 summarizes the dimming
mode selection. Each of these methods results in PWM chopping
of the current in the LEDs for all 6 channels to provide a lower
average LED current. During the On periods, the LED current will
be defined by the value of RSET and BRTDC, as described in
Equations 1 and 2. The source of the PWM signal can be
described as follows:
+
-
+
-
REF
1. Internally generated 256 step duty cycle BRT register
programmed through the SMBus/I2C.
RSET
2. External signal from PWM.
+
-
3. DPST mode. Internally generated signal with duty cycle
defined by the product of the PWM input duty cycle and
SMBus/I2C programmed BRT register.
PWM DIMMING
DC DIMMING
4. Direct PWM mode. The output duty cycle and dimming
frequency follow the input PWM signal.
FIGURE 19. SIMPLIFIED CURRENT SOURCE CIRCUIT
The default PWM dimming mode is in DPST. In all of the
methods, the average LED channel current is controlled by ILED
FN7709.3
November 30, 2012
11
ISL97671A
and the PWM duty cycle in percent, as shown in Equation 5:
cycle is 60% dimming at 1kHz, the resultant PWM duty cycle is
48% dimming at 200Hz.
I
= I
× PWM
LED
(EQ. 5)
LED(ave)
In DPST mode, the ISL97671A features 8-bit dimming resolution;
it calculates the dimming level by taking the 8 most significant
bits of the product of the PWMI duty cycle (digitized with 8-bit
resolution) and of the BRT I2C register.
Method 1 (SMBus/I2C Controlled Dimming)
The average LED channel current is controlled by the internally
generated PWM signal, as shown in Equation 6:
Method 4 (Direct PWM Mode)
(EQ. 6)
I
= I
× (BRT ⁄ 255)
LED
LED(ave)
Direct PWM Dimming mode is selected when FPWM is tied to VDC
and SMBCLK/SMBDAT are grounded. The current of the 6
channels will follow the incoming PWM signal’s frequency and
duty cycle. The minimum duty cycle can be as low as 0.007% at
200Hz (or equivalent pulse width of 350ns). This ultra low duty
cycle dimming performance can be achieved if no channel
capacitor is present. Also in Direct PWM Dimming mode the
Phase Shift function will be disabled.
where BRT is the PWM brightness level programmed in the
Register 0x00. BRT ranges from 0 to 255 in decimal and defaults
to 255 (0xFF). BRT = 0 disconnects all channels.
To use only the SMBus/I2C controlled PWM brightness control,
users need to set Register 0x01 to 0x05. Alternatively, the same
operation can be obtained by leaving Register 0x01 at its default
value of 0x01 (DPST mode) and connecting the PWM input to
VDC, so that the dimming level depends only on the BRT register.
TABLE 1. DIMMING MODE SELECTION
SMBCLK/ SMBDAT/
The PWM dimming frequency is adjusted by a resistor at the
FPWM pin.
SCL PIN
SIGNAL
SDA PIN
SIGNAL
DIMMING METHOD
SELECTION
FPWM PIN
0x01 REGISTER
Method 2 (PWM Controlled Dimming with Settable Dimming
Frequency)
2
2
2
SMBUS /I C SMBUS/I C Resistor to
Set to 0x05, or set to
0x01 and connect PWM controlled dimming)
to VDC
Method 1 (SMBUS/I C
clock
data
ground
The average LED channel current can also be controlled by the duty
cycle of external PWM signal, as shown in Equation 7:
2
2
SMBUS /I C SMBUS/I C Resistor to
Set to 0x03, or set to
Method 2 (PWM controlled
0x01 and not program with settable dimming
clock
data
ground
I
= I
× PWMI
LED
(EQ. 7)
register 0x00
N/A
frequency)
LILED(ave)
Grounded
Grounded
Resistor to
ground
Method 2 (PWM controlled
with settable dimming
frequency)
The PWM dimming frequency is adjusted by a resistor at the
FPWM pin. The PWM input cannot be low for more than 30.5ms
or else the driver will enter shutdown.
2
2
SMBUS /I C SMBUS/I C Resistor to
Set to 0x01
N/A
Method 3 (DPST mode)
clock
data
ground
To use externally applied PWM signal only for brightness control,
users need to set Register 0x01 to 0x03. Alternatively, the same
operation can be obtained by leaving Register 0x01 at its default
value of 0x01 (DPST mode), and not program Register BRT, so
that it contains its default value of 0xFF. A third way to obtain this
mode of operation is to tie both SCL and SDA to ground.
Grounded
Grounded
Tie to VDC
Method 4 (Direct PWM
dimming)
PWM Dimming Frequency Adjustment
For dimming methods 1-3, the PWM dimming frequency is set by
an external resistor at the FPWM pin as:
Method 3 (DPST Mode)
7
The average LED channel current can also be controlled by the
product of the SMBus/I2C controlled PWM and the external PWM
signals as:
6.66×10
-----------------------
=
(EQ. 11)
F
PWM
RFPWM
where FPWM is the PWM dimming frequency and RFPWM is the
setting resistor.
I
= I
xPWM
DPST
(EQ. 8)
LED(ave)
LED
Where:
The maximum PWM dimming frequency is 30kHz when the duty
cycle is from 0.4% to 100%.
PPWM
= BRT ⁄ 255 × PWMI
(EQ. 9)
DPST
Phase Shift Control
Therefore:
For dimming methods 1-3, the ISL97671A is capable of delaying
the phase of each current source to minimize load transients. By
default, phase shifting is disabled as shown in Figure 20 where
the channels PWM currents are switching at the same time.
(EQ. 10)
I
= I
× BRT ⁄ 255 × PWMI
LED(ave)
LED
Where BRT is the value held in Register 0x00 (default setting
0xFF) controlled by SMBus/I2C and PWMI is the duty cycle of the
incoming PWM signal. In this way, the users can change the
PWM current in ratiometric manner to achieve DPST compliant
backlight dimming. To use the DPST mode, users need to set
Register 0x01 to 0x01. The PWM dimming frequency is adjusted
by a resistor at the FPWM pin.
For example, if the SMBus/I2C controlled PWM duty is 80%
dimming at 200Hz (see Equation 11) and the external PWM duty
FN7709.3
November 30, 2012
12
ISL97671A
tPWMin
tFPWM
60%
40%
PWMI
tON
tOFF
ILED0
tFPWM
(tPWMout
)
tON
60%
tOFF
40%
ILED1
ILED1
ILED2
ILED3
tD1
ILED2
ILED3
ILED4
tD1
tD1
ILED4
ILED5
tD2
FIGURE 20. NO DELAY (DEFAULT PHASE SHIFT DISABLED)
ILED1
tD1 = Fixed Delay with Integer only while the decimal value will be discarded (eg. 63.75=63)
When EqualPhase = 1(register 0x0A, bit 7), the phase shift evenly
spreads the channels switching across the PWM cycle, depending on
how many channels are enabled, as shown in Figures 21 and 22.
Equal phase means there are fixed delays between channels and
such delay can be calculated as Equation 12 in Figures 21 and 22.
FIGURE 22. 4 EQUAL PHASE CHANNELS PHASE SHIFT ILLUSTRATION
tFPWM
ILED0
tON
tOFF
t
255
N
FPWM
255
⎛
x
⎞
⎠
tPD
------------------ ---------
(EQ. 12)
t
=
D1
⎝
ILED1
ILED2
ILED3
tPD
Equation 13 shows the phase delay between the last channel of
the current duty cycle and the first channel of the next duty cycle
in Figures 21 and 22.
tPD
tPD
t
255
N
FPWM
255
⎛
⎛
⎝
⎞⎞
⎠⎠
(EQ. 13)
------------------
---------
t
=
x 255 – (N – 1)
ILED4
ILED5
D2
⎝
tPD
where (255/N) is rounded down to the nearest integer. For
example, if N = 6, (255/N) = 42, that leads to:
FIGURE 23. PHASE SHIFT WITH 7-BIT PROGRAMMABLE DELAY
tD1 = tFPWM x 42/255
tD2 = tFPWM x 45/255
The ISL97671A allows the user to program the amount of phase
shift degree with 7-bit resolution, as shown in Figure 23. To
enable programmable phase shifting, the user must write to the
Phase Shift Control register with EqualPhase = 0 and the
desirable phase shift value of PhaseShift[6:0]. The delay
between CH5 and the repeated CH0 is the rest of the PWM cycle.
where tFPWM is the sum of tON and tOFF. N is the number of LED
channels. The ISL97671A will detect the number of operating
channels automatically.
60%
40%
PWMI
ILED0
Switching Frequency
The default switching frequency is 600kHz but it can be selected
to 600kHz or 1.2MHz if the SMBus/I2C communications is used.
The switching frequency select bit is accessible in the SMBus/I2C
Configuration Register 0x08 bit 2.
60%
40%
tD1
ILED1
ILED2
ILED3
tD1
5V Low Dropout Regulator
tD1
There is an internal 5V low dropout (LDO) regulator to develop the
necessary low-voltage supply, which is used by the chip’s internal
control circuitry. VDC is the output of this LDO regulator which
requires a bypass capacitor of 1µF or more for the regulation.
The VDC pin can be used as a coarse reference as long as it is
sourcing only a few milliamps.
tD1
ILED4
ILED5
tD1
tD2
tFPWM
ILED0
tON
tOFF
IC Protection Features and Fault
Management
FIGURE 21. 6 EQUAL PHASE CHANNELS PHASE SHIFT ILLUSTRATION
ISL97671A has several protection and fault management
features that improve system reliability. The following sections
describe them in more detail.
FN7709.3
November 30, 2012
13
ISL97671A
All LED faults are reported via the SMBus/I2C interface to
In-Rush Control and Soft-Start
Register 0x02 (Fault/Status register). The controller is able to
determine which channels have failed via Register 0x09 (Output
Masking register). The controller can also choose to use Register
0x09 to disable faulty channels at start-up, resulting in only
further faulty channels being reported by Register 0x02.
The ISL97671A has separate, built-in, independent in-rush
control and soft-start functions. The in-rush control function is
built around an external short-circuit protection P-channel FET in
series with VIN. At start-up, the fault protection FET is turned on
slowly due to a 21µA pull-down current output from the FAULT
pin. This discharges the fault FET's gate-source capacitance,
turning on the FET in a controlled fashion. As this happens, the
output capacitor is charged slowly through the low-current FET
before it becomes fully enhanced. This results in a low in-rush
current. This current can be further reduced by adding a
capacitor (in the 1nF to 5nF range) across the gate source
terminals of the FET.
Short-Circuit Protection (SCP)
The short-circuit detection circuit monitors the voltage on each
channel and disables faulty channels that are above
approximately 7.5V (this action is described in “PROTECTIONS
TABLE” on page 16).
Open-Circuit Protection (OCP)
Once the chip detects that the fault protection FET is turned on
fully, it assumes that in-rush is complete. At this point, the boost
regulator begins to switch, and the current in the inductor ramps
up. The current in the boost power switch is monitored, and
switching is terminated in any cycle in which the current exceeds
the current limit. The ISL97671A includes a soft-start feature in
which this current limit starts at a low value (275mA). This value
is stepped up to the final 2.2A current limit in seven additional
steps of 275mA each. These steps happen over at least 8ms and
are extended at low LED PWM frequencies if the LED duty cycle is
low. This extension allows the output capacitor to charge to the
required value at a low current limit and prevents high input
current for systems that have only a low to medium output
current requirement.
When one of the LEDs becomes an open circuit, it can behave as
either an infinite resistance or as a gradually increasing finite
resistance. The ISL97671A monitors the current in each channel
such that any string that reaches the intended output current is
considered “good.” Should the current subsequently fall below the
target, the channel is considered an “open circuit.” Furthermore,
should the boost output of the ISL97671A reach the OVP limit, or
should the lower over-temperature threshold be reached, all
channels that are not good are immediately considered to be open
circuit. Detection of an open circuit channel results in a time-out
before the affected channel is disabled. This time-out is sped up
when the device is above the lower over-temperature threshold, in
an attempt to prevent the upper over-temperature trip point from
being reached.
For systems with no master fault protection FET, the in-rush
current flows towards COUT when VIN is applied. The in-rush
current is determined by the ramp rate of VIN and the values of
COUT and L.
Some users employ special types of LEDs that have a Zener
diode structure in parallel with the LED. This configuration
provides ESD enhancement and enables open-circuit operation.
When this type of LED is open circuited, the effect is as if the LED
forward voltage has increased but the lighting level has not
increased. Any affected string will not be disabled, unless the
failure results in the boost OVP limit being reached, which allows
all other LEDs in the string to remain functional. In this case, care
should be taken that the boost OVP limit and SCP limit are set
properly, to ensure that multiple failures on one string do not
cause all other good channels to fault out. This condition could
arise if the increased forward voltage of the faulty channel
makes all other channels look as if they have LED shorts. See
Table 2 for details of responses to fault conditions.
Fault Protection and Monitoring
The ISL97671A features extensive protection functions to cover
all perceivable failure conditions.
The failure mode of an LED can be either an open circuit or a
short. The behavior of an open-circuited LED can additionally
take the form of either infinite resistance or, for some LEDs, a
Zener diode, which is integrated into the device in parallel with
the now-opened LED.
For basic LEDs (which do not have built-in Zener diodes), an
open-circuit failure of an LED results only in the loss of one
channel of LEDs, without affecting other channels. Similarly, a
short-circuit condition on a channel that results in that channel
being turned off does not affect other channels unless a similar
fault is occurring.
OVP and V
OUT
The Overvoltage Protection (OVP) pin has a function of setting the
overvoltage trip level as well as limiting the VOUT regulation
range.
The ISL97671A OVP threshold is set by RUPPER and RLOWER such
that:
Due to the lag in boost response to any load change at its output,
certain transient events (such as LED current steps or significant
step changes in LED duty cycle) can transiently look like LED
fault modes. The ISL97671A uses feedback from the LEDs to
determine when it is in a stable operating region and prevents
apparent faults during these transient events from allowing any
of the LED stacks to fault out. See Table 2 for details.
(R
+ R
)
UPPER
LOWER
------------------------------------------------------------
(EQ. 14)
V
= 1.22Vx
OUT_OVP
R
LOWER
and the output voltage VOUT can regulate between 64% and
100% of the VOUT_OVP such that:
Allowable VOUT = 64% to 100% of VOUT_OVP
A fault condition that results in an input current that exceeds the
device’s electrical limits will result in a shutdown of all output
channels.
If R1 and R2 are chosen such that the OVP level is set at 40V,
then VOUT is allowed to operate between 25.6V and 40V. If the
VOUT requirement is changed to an application of six LEDs of 21V,
FN7709.3
November 30, 2012
14
ISL97671A
then the OVP level must be reduced. Users should follow the
start-up, the LX pins inject a fixed current into the output
capacitor. The device does not start unless the voltage at LX
exceeds 1.2V. The OVP pin is also monitored such that if it rises
above and subsequently falls below 20% of the target OVP level,
the input protection FET is also switched off.
VOUT = (64% ~100%) OVP level requirement; otherwise, the
headroom control will be disturbed such that the channel voltage
can be much higher than expected. This can sometimes prevent
the driver from operating properly.
The resistances should be large, to minimize power loss. For
example, a 1MΩ RUPPER and a 30kΩ RLOWER sets OVP to 41.9V.
Large OVP resistors also allow COUT to discharge slowly during the
PWM Off time. Parallel capacitors should also be placed across
Over-Temperature Protection (OTP)
The ISL97671A includes two over-temperature thresholds. The lower
threshold is set to +130°C. When this threshold is reached, any
channel that is outputting current at a level significantly below the
regulation target is treated as “open circuit” and is disabled after a
time-out period. This time-out period is 800µs when it is above the
lower threshold. The lower threshold isolates and disables bad
channels before they cause enough power dissipation (as a result of
other channels having large voltages across them) to hit the upper
temperature threshold.
the OVP resistors such that RUPPER/RLOWER = CLOWER/CUPPER
.
Using a CUPPER value of 30pF is recommended. These capacitors
reduce the AC impedance of the OVP node, which is important
when using high-value resistors. For example, if
RUPPER/RLOWER = 33/1, then CUPPER/CLOWER = 1/33 with
CUPPER = 100pF and CLOWER = 3.3nF
Undervoltage Lock-out
The upper threshold is set to +150°C. Each time this threshold is
reached, the boost stops switching, and the output current
sources switch off. Once the device has cooled to approximately
+100°C, the device restarts, with the DC LED current level
reduced to 75% of the initial setting. If dissipation persists,
subsequent hitting of the limit causes identical behavior, with the
current reduced in steps to 50% and finally 25%. Unless disabled
via the EN pin, the device stays in an active state throughout.
If the input voltage falls below the UVLO level, the device stops
switching and is reset. Operation restarts only when VIN returns
to the normal operating range.
Input Overcurrent Protection
During a normal switching operation, the current through the
internal boost power FET is monitored. If the current exceeds the
current limit, the internal switch is turned off. Monitoring occurs
on a cycle-by-cycle basis in a self-protecting way. Additionally, the
ISL97671A monitors the voltage at the LX and OVP pins. At
For complete details of fault protection conditions, see Figure 24
and Table 2.
LX
V
V
OUT
IN
FAULT
O/P
DRIVER
SHORT
OVP
IMAX
FET
LOGIC
ILIMIT
DRIVER
VSC
CH0
CH5
VSET/2
REG
THRM
SHDN
REF
T2
TEMP
SENSOR
OTP
T1
VSET
+
+
-
VSET
Q0
Q5
-
PWM/OC0/SC0
PWM/OC5/SC5
2
SMBUS/I C
FAULT/
STATUS
REGISTER
CONTROL
LOGIC
DC CURRENT
FIGURE 24. SIMPLIFIED FAULT PROTECTIONS
FN7709.3
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15
ISL97671A
TABLE 2. PROTECTIONS TABLE
FAILED CHANNEL ACTION
VOUT REGULATED
BY
CASE
1
FAILURE MODE
DETECTION MODE
GOOD CHANNELS ACTION
CHx Short Circuit
Upper Over-Temperature CHx ON and burns power.
Protection limit (OTP) not
Remaining channels normal
Highest VF of all
channels
triggered and CHx < 7.5V
2
CHx Short Circuit
CHx Short Circuit
Upper OTP triggered but
CHx < 7.5V
All channels go off until chip cooled Same as CHx
and then comes back on with
current reduced to 76%. Subsequent
OTP triggers will reduce IOUT further.
Highest VF of
remaining
channels
3
4
5
6
Upper OTP not triggered CHx disabled after 6 PWM cycle
but CHx > 7.5V time-outs.
Remaining channels normal
Highest VF of
remaining
channels
CHx Open Circuit with Upper OTP not triggered
infinite resistance and CHx < 7.5V
VOUT will ramp to OVP. CHx will time- Remaining channels normal
Highest VF of
remaining
channels
out after 6 PWM cycles and switch
off. VOUT will drop to normal level.
CHx LED Open Circuit Upper OTP not triggered CHx remains ON and has highest VF, Remaining channels ON,
but has paralleled
Zener
VF of CHX
and CHx < 7.5V
thus VOUT increases.
remaining channel FETs burn
power
CHx LED Open Circuit Upper OTP triggered but All channels go off until chip cooled Same as CHx
VF of CHx
but has paralleled
Zener
CHx < 7.5V
and then comes back on with
current reduced to 76%. Subsequent
OTP triggers will reduce IOUT further
7
8
CHx LED Open Circuit Upper OTP not triggered CHx remains ON and has highest VF, VOUT increases, then CH-X
VF of CHx
but has paralleled
Zener
but CHx > 7.5V
thus VOUT increases.
switches OFF after 6 PWM cycles.
This is an unwanted shut off and
can be prevented by setting OVP
at an appropriate level.
Channel-to-Channel
Lower OTP triggered but Any channel below the target current will fault out after 6 PWM cycles. Highest VF of
ΔVF too high
CHx < 7.5V
Remaining channels driven with normal current.
remaining
channels
9
Channel-to-Channel
Upper OTP triggered but All channels go off until chip cools and then come back on with current Boost switch OFF
ΔVF too high
CHx < 7.5V
reduced to 76%. Subsequent OTP triggers will reduce IOUT further
10
Output LED stack
voltage too high
VOUT > VOVP
Any channel that is below the target current will time-out after 6 PWM
cycles, and VOUT will return to the normal regulation voltage required for remaining
other channels. channels
Highest VF of
11
V
OUT/LX shorted to
GND at start-up or
OUT shorted in
operation
LX current and timing are The chip is permanently shutdown 31ms after power-up if VOUT/Lx is
monitored.
shorted to GND.
V
OVP pins monitored for
excursions below 20% of
OVP threshold.
FN7709.3
November 30, 2012
16
ISL97671A
t
t
F
R
SMBCLK
SMBDAT
t
LOW
V
IH
V
IL
t
HIGH
t
t
t
HD:DAT
SU:STA
HD:STA
t
t
SU:STO
SU:DAT
V
IH
V
IL
t
BUF
P
P
S
S
NOTES:
2
SMBus/I C Description
S = start condition
P = stop condition
A = acknowledge
A = not acknowledge
R/W = read enable at high; write enable at low
FIGURE 25. SMBUS/I2C INTERFACE
1
7
1
1
8
1
8
1
1
S
Slave Address
W
A
Command Code
A
Data byte
A
P
Master to Slave
Slave to Master
FIGURE 26. WRITE BYTE PROTOCOL
1
7
1
1
8
1
1
8
1
1
8
1
1
S
Slave Address
W
A
Command Code
A
S
Slave Address
R
A
Data Byte
A
P
Master to Slave
Slave to Master
FIGURE 27. READ BYTE PROTOCOL
FN7709.3
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17
ISL97671A
2
SMBus/I C Communications
Slave Device Address
The ISL97671A can be controlled by SMBus/I2C for PWM or DC
dimming. Except when both the SDA and SCL input pins are tied to
ground, the LEDs are off by default and the user must use the
SMBus/I2C interface to turn them on. When both SDA and SCL are
instead shorted to ground, the LEDs turn on by default when the IC is
turned on, and the customer can use the ISL97671A without having
to control the SMBus/I2C interface. The switching frequency is fixed
at 600kHz if SMBus/I2C is not used.
The slave address contains 7 MSB plus one LSB as R/W bit, but
these 8 bits are usually called Slave Address bytes. Figure 28 shows
that the high nibble of the Slave Address byte is 0x5 or 0101b to
denote the “backlight controller class.” Bit 3 in the lower nibble of
the Slave Address byte is 1. Bit 0 is always the R/W bit, as specified
by the SMBus/I2C protocol. Note: In this document, the device
address will always be expressed as a full 8-bit address instead of
the shorter 7-bit address typically used in other backlight controller
specifications to avoid confusion. Therefore, if the device is in the
write mode where bit 0 is 0, the slave address byte is 0x58 or
01011000b. If the device is in the read mode where bit 0 is 1, the
slave address byte is 0x59 or 01011001b.
Write Byte
The Write Byte protocol is only three bytes long. The first byte starts
with the slave address followed by the “command code,” which
translates to the “register index” being written. The third byte
contains the data byte that must be written into the register selected
by the “command code”. A shaded label is used on cycles during
which the slaved backlight controller “owns” or “drives” the Data
line. All other cycles are driven by the “host master.”
2
SMBus/I C Register Definitions
The backlight controller registers are Byte wide and accessible via the
SMBus/I2C Read/Write Byte protocols. Their bit assignments are
provided in the following sections with reserved bits containing a
default value of “0”.
Read Byte
MSB
LSB
Figure 27 shows that the four byte long Read Byte protocol starts
out with the slave address followed by the “command code” which
translates to the “register index.” Subsequently, the bus direction
turns around with the re-broadcast of the slave address with bit 0
indicating a read (“R”) cycle. The fourth byte contains the data
being returned by the backlight controller. That byte value in the
data byte reflects the value of the register being queried at the
“command code” index. Note the bus directions, which are
highlighted by the shaded label that is used on cycles during which
the slaved backlight controller “owns” or “drives” the Data line. All
other cycles are driven by the “host master.”
0
1
0
1
1
0
0
R/W
DEVICE
DEVICE
ADDRESS
IDENTIFIER
FIGURE 28. SLAVE ADDRESS BYTE DEFINITION
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18
ISL97671A
TABLE 3A. ISL97671A REGISTER LISTING
DEFAULT
VALUE
SMBUS/I2C
PROTOCOL
ADDRESS
0x00
REGISTER
BIT 7
BRT7
BIT 6
BRT6
BIT 5
BRT5
BIT 4
BRT4
BIT 3
BRT3
BIT 2
BRT2
BIT 1
BRT1
BIT 0
BRT0
PWM
0xFF
Read and Write
Brightness
Control Register
0x01
0x02
0x03
0x07
0x08
0x09
0x0A
Device Control Reserved Reserved
Register
Reserved Reserved Reserved PWM_MD
PWM_SEL
BL_CTL
FAULT
REV0
BRTDC0
VSC
0x00
0x00
0xC8
0xFF
0x1F
0x3F
0x00
Read and Write
Read Only
Fault/Status Reserved Reserved
Register
2_CH_SD 1_CH_SD BL_STAT OV_CURR THRM_SHDN
Identification
Register
LED
PANEL
MFG3
MFG2
MFG1
MFG0
REV2
REV1
BRTDC1
Reserved
CH1
Read Only
DC Brightness BRTDC7
Control Register
BRTDC6
BRTDC5
BRTDC4 BRTDC3 BRTDC2
Read and Write
Read and Write
Read and Write
Read and Write
Configuration Reserved Reserved Reserved BstSlew BstSlew
Register
FSW
CH2
Rate1
Rate0
OutputChannel Reserved Reserved
Register
CH5
CH4
CH3
CH0
Phase Shift Deg Equal
Phase
Phase
Shift6
Phase
Shift5
Phase
Shift4
Phase
Shift3
Phase
Shift2
Phase
Shift1
Phase
Shift0
TABLE 3B. DATA BIT DESCRIPTIONS
ADDRESS
0x00
REGISTER
DATA BIT DESCRIPTIONS
PWM Brightness Control
Register
BRT[7..0] = 256 steps of DPWM duty cycle brightness control
0x01
0x02
Device Control Register
PWM_MD, PWM_SEL: select the dimming method - see Table 4 for more details. Default = 00
BL_CTL = BL On/Off (1 = On, 0 = Off), default = 0
Fault/Status Register
2_CH_SD = Two LED output channels are shutdown (1 = shutdown, 0 = OK)
1_CH_SD = One LED output channel is shutdown (1 = shutdown, 0 = OK)
BL_STAT = BL status (1 = BL On, 0 = BL Off)
OV_CURR = Input overcurrent (1 = Overcurrent condition, 0 = Current OK)
THRM_SHDN = Thermal Shutdown (1 = Thermal fault, 0 = Thermal OK)
FAULT = Fault occurred (Logic “OR” of all of the fault conditions)
0x03
Identification Register
LED PANEL = 1
MFG[3..0] = Manufacturer ID (16 vendors available. Intersil is vendor ID 9)
REV[2..0] = Silicon rev (Rev 0 through Rev 7 allowed for silicon spins)
0x07
0x08
DC Brightness Control Register
Configuration Register
BRTDC[7..0] = 256 steps of DC brightness control
BstSlewRate[1..0] = Controls strength of FET driver. 00 - 25% drive strength, 01 - 50% drive strength,
10 - 75% drive strength, 11 - 100% drive strength.
F
SW = Switching frequencies selection, FSW = 0 = 1.2MHz. FSW = 1 = 600kMHz
VSC[0] = Short circuit thresholds selection, 0 = disabled, 1 = 7.2V minimum
0x09
0x0A
Output Channel Mask/Fault
Readout Register
CH[5..0] = Output Channel Read and Write. In Write, 1 = Channel Enabled, 0 = Channel Disabled. In
Read, 1 = Channel OK, 0 = Channel Not OK/Channel disabled
Phase Shift Degree
EqualPhase = Controls phase shift mode - When 1, phase shift is 360/N (where N is the number of
channels enabled). When 0, phase shift is defined by PhaseShift<6:0>.
PS[6..0] = 7-bit Phase shift setting - phase shift between each channel is
PhaseShift<6:0>/(255*PWMFreq). In direct PWM modes, phase shift between each channel is
PhaseShift<6:0>/12.8MHz.
FN7709.3
November 30, 2012
19
ISL97671A
PWM Brightness Control Register (0x00)
Device Control Register (0x01)
The Brightness control resolution has 256 steps of PWM duty cycle
adjustment. Figure 29 shows the bit assignment. All of the bits in
this Brightness Control Register can be read or written. Step 0
corresponds to the minimum step where the current is less than
10µA. Steps 1 to 255 represent the linear steps between 0.39% and
100% duty cycle with approximately 0.39% duty cycle adjustment
per step.
This register has two bits that control either SMBus/I2C
controlled or external PWM controlled PWM dimming and a
single bit that controls the backlight ON/OFF state. The
remaining bits are reserved. The bit assignment is shown in
Figure 30. All other bits in the Device Control Register will read as
low unless otherwise written.
• All reserved bits have no functional effect when written.
• An SMBus/I2C Write Byte cycle to Register 0x00 sets the PWM
brightness level only if the backlight controller is in SMBus/I2C
mode (see Table 4) Operating Modes selected by Device
Control Register Bits 1 and 2).
• All defined control bits return their current, latched value when
read.
A value of 1 written to BL_CTL turns on the backlight in 4ms or less
after the write cycle completes. The backlight is deemed to be on
when Bit 3 BL_STAT of Register 0x02 is 1 and Register 0x09 is not 0.
• An SMBus/I2C Read Byte cycle to Register 0x00 returns the
programmed PWM brightness level.
A value of 0 written to BL_CTL immediately turns off the BL. The
BL is deemed to be off when Bit 3 BL_STAT of Register 0x02 is 0
and Register 0x09 is 0.
• An SMBus/I2C setting of 0xFF for Register 0x00 sets the
backlight controller to the maximum brightness.
• An SMBus/I2C setting of 0x00 for Register 0x00 sets the
backlight controller to the minimum brightness output.
The default value for Register 0x01 is 0x00.
• Default value for Register 0x00 is 0xFF.
REGISTER 0x00
PWM BRIGHTNESS CONTROL REGISTER
BRT7
BRT6
Bit 6 (R/W)
BRT5
BRT4
BRT3
BRT2
BRT1
BRT0
Bit 7 (R/W)
Bit 5 (R/W)
Bit 4 (R/W)
Bit 3 (R/W)
Bit 2 (R/W)
Bit 1 (R/W)
Bit 0 (R/W)
BIT ASSIGNMENT
BIT FIELD DEFINITIONS
= 256 steps of PWM brightness levels
FIGURE 29. DESCRIPTIONS OF BRIGHTNESS CONTROL REGISTER
BRT[7..0]
REGISTER 0x01
DEVICE CONTROL REGISTER
RESERVED
Bit 7 (R/W)
RESERVED
RESERVED
Bit 5 (R/W)
RESERVED
Bit 4 (R/W)
RESERVED
Bit 3 (R/W)
PWM_MD
PWM_SEL
Bit 1 (R/W)
BL_CTL
Bit 6 (R/W)
Bit 2 (R/W)
Bit 0 (R/W)
PWM_MD
PWM_SEL
BL_CTL
MODE
X
0
X
0
0
1
Backlight Off
SMBus/I2C and PWM input controlled (DPST)
dimming (Method 3)
1
X
0
1
1
1
SMBus/I2C controlled PWM dimming (Method 1)
PWM input controlled PWM dimming (Method 2)
FIGURE 30. DESCRIPTIONS OF DEVICE CONTROL REGISTER
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ISL97671A
For example, the Cbt = 50% duty cycle programmed in the
TABLE 4. OPERATING MODES SELECTED BY DEVICE CONTROL
REGISTER BITS 1 AND 2
SMBus/I2C Register 0x00 and the PWM frequency is tuned to be
200Hz with an appropriate capacitor at the FPWM pin. On the other
hand, PWM is fed with a 1kHz 30% high PWM signal. When
PWM_SEL = 0 and PWM_MD = 0, the device is in DPST operation
where DPST brightness = 15% PWM dimming at 200Hz.
PWM_MD
0
PWM_SEL
0
MODE
SMBus/I2C and PWM input controlled
(DPST) dimming (Method 3)
1
X
0
1
SMBus/I2C controlled PWM dimming
(Method 1)
Fault/Status Register (0x02)
PWM input controlled PWM dimming
(Method 2)
This register has 6 status bits that allow monitoring of the backlight
controller’s operating state. Not all of the bits in this register are
fault related (Bit 3 is a simple BL status indicator). The remaining
bits are reserved and return a “0” when read and ignore the bit value
when written. All of the bits in this register are read-only, with the
exception of bit 0, which can be cleared by writing to it.
The PWM_SEL bit determines whether the SMBus/I2C or PWM
input should drive the output brightness in terms of PWM
dimming. When PWM_SEL bit is 1, the PWM input only drives the
output brightness regardless of what the PWM_MD is.
• BL_STAT indicates the current backlight on/off status in
BL_STAT (1 if the BL is on, 0 if the BL is off).
When the PWM_SEL bit is 0, the PWM_MD bit selects the
manner in which the PWM dimming is to be interpreted; when
this bit is 1, the PWM dimming is based on the SMBus/I2C
brightness setting only. When this bit is 0, the PWM dimming
reflects a percentage change in the current brightness
programmed in the SMBus/I2C Register 0x00, i.e., DPST (Display
Power Saving Technology) mode as:
• FAULT is the logical OR of THRM_SHDN, OV_CURR, 2_CH_SD,
and 1_CH_SD should these events occur.
• 1_CH_SD returns a 1 if one or more channels have faulted out.
• 2_CH_SD returns a 1 if two or more channels have faulted out.
• When FAULT is set to 1, it will remain at 1 even if the signal
which sets it goes away. FAULT will be cleared when the
BL_CTL bit of the Device Control Register is toggled or when a
0 is written into the FAULT bit. At that time, if the fault
condition is still present or reoccurs, FAULT will be set to 1
again. BL_STAT will not cause FAULT to be set.
(EQ. 15)
DSPT Brightness = Cbt × PWM
Where:
Cbt = Current brightness setting from SMBus/I2C Register 0x00
without influence from the PWM
• The default value for Register 0x02 is 0x00.
PWM = is the percent duty cycle of the PWM
REGISTER 0x02
FAULT/STATUS REGISTER
RESERVED
Bit 7 (R)
RESERVED
Bit 6 (R)
2_CH_SD
Bit 5 (R)
1_CH_SD
Bit 4 (R)
BL_STAT
Bit 3 (R)
OV_CURR
Bit 2 (R)
THRM_SHDN
Bit 1 (R)
FAULT
Bit 0 (R)
BIT
BIT ASSIGNMENT
BIT FIELD DEFINITIONS
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
2_CH_SD
1_CH_SD
BL_STAT
= Two LED output channels are shutdown (1 = shutdown, 0 = OK)
= One LED output channel is shutdown (1 = shutdown, 0 = OK)
= BL Status (1 = BL On, 0 = BL Off)
OV_CURR
THRM_SHDN
FAULT
= Input Overcurrent (1 = Overcurrent condition, 0 = Current OK)
= Thermal Shutdown (1 = Thermal Fault, 0 = Thermal OK)
= Fault occurred (Logic “OR” of all of the fault conditions)
FIGURE 31. DESCRIPTIONS OF FAULT/STATUS REGISTER
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ISL97671A
Identification Register (0x03)
DC Brightness Control Register (0x07)
The ID register contains 3 bit fields to denote the LED driver (always
set to 1), manufacturer and the silicon revision of the controller IC.
The bit field widths allow up to 16 vendors with up to 8 silicon
revisions each. All of the bits in this register are read-only.
The DC Brightness Control Register 0x07 sets the LED current
level between 0% and 100% of the level set using the RSET pin.
When PWM dimming, the level set is the current during the on
time. This register allows users to have additional dimming
flexibility by:
• Vendor ID 9 represents Intersil Corporation.
• The default value for Register 0x03 is 0xC8.
1. Effectively achieving 16-bits of dimming control when DC
dimming is combined with PWM dimming
The initial value of REV shall be 0. Subsequent values of REV will
increment by 1.
2. Achieving visual or audio noise free 8-bit DC dimming over
potentially noisy PWM dimming.
The bit assignment is shown in Figure 33. All of the bits in this
Register can be read or written. Steps 0 to 255 represent the
linear steps of current adjustment in DC on-the-fly.
• An SMBus/I2C Write Byte cycle to Register 0x07 sets the DC
LED current level.
• An SMBus/I2C Read Byte cycle to Register 0x07 returns the DC
LED current.
• Default value for Register 0x07 is 0xFF.
REGISTER 0x03
ID REGISTER
LED PANEL
Bit 7 = 1
MFG3
MFG2
Bit 5 (R)
MFG1
MFG0
REV2
REV1
REV0
Bit 6 (R)
Bit 4 (R)
Bit 3 (R)
Bit 2 (R)
Bit 1 (R)
Bit 0 (R)
BIT ASSIGNMENT
MFG[3..0]
BIT FIELD DEFINITIONS
= Manufacturer ID. See “Identification Register
(0x03)” on page 21.
data 0 to 8 in decimal correspond to other vendors
data 9 in decimal represents Intersil ID
data 10 to 14 in decimal are reserved
data 15 in decimal Manufacturer ID is not
implemented
REV[2..0]
= Silicon rev (Rev 0 through Rev 7 allowed for silicon
spins)
FIGURE 32. DESCRIPTIONS OF ID REGISTER
REGISTER 0x07
DC BRIGHTNESS CONTROL REGISTER
BRTDC7
BRTDC6
BRTDC5
BRTDC4
BRTDC3
BRTDC2
BRTDC1
Bit 1 (R/W)
BRTDC0
Bit 0 (R/W)
Bit 7 (R/W)
Bit 6 (R/W)
Bit 5 (R/W)
Bit 4 (R/W)
Bit 3 (R/W)
Bit 2 (R/W)
BIT ASSIGNMENT
BRTDC[7..0]
BIT FIELD DEFINITIONS
= 256 steps of DC brightness levels
FIGURE 33. DESCRIPTIONS OF DC BRIGHTNESS CONTROL REGISTER
FN7709.3
November 30, 2012
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ISL97671A
Configuration Register (0x08)
Output Channel Mask/Fault Readout
Register (0x09)
The Configuration Register provides many extra functions that
users can explore in order to optimize the driver performance at
a given application.
This register can be read or written. It allows enabling and
disabling each channel individually. The bit position corresponds
to the channel. For example, Bit 0 corresponds to Ch0 and bit 5
corresponds to Ch5 and so on. A 1 bit value enables the channel
of interest. When reading data from this register, any disabled
channel and any faulted out channel will read as 0. This allows
the user to determine which channel is faulty and optionally not
enabling it in order to allow the rest of the system to continue to
function. Additionally, a faulted out channel can be disabled and
re-enabled in order to allow a retry for any faulty channel without
having to power-down the other channels.
A BstSlewRate bit allows users to control the boost FET slew rate
(the rates of turn-on and turn-off). The slew rate can be selected
to four relative strengths when driving the internal boost FET. The
purpose of this function is to allow users to experiment with the
slew rate with respect to EMI effect in the system. In general, the
slower the slew rate is, the lower the EMI interference to the
surrounding circuits; however, the switching loss of the boost FET
is also increased.
The FSW bit allows users to set the boost converter switching
frequency between 1.2MHz and 600kHz. The VSC bit allows
users to set the LED string short circuit threshold VSC to 7.2V or
disable it.
The bit assignment is shown in Figure 35. The default for
Register 0x09 is 0x3F.
The bit assignment is shown in Figure 34. The default value for
Register 0x08 is 0x1F.
REGISTER 0x08
CONFIGURATION REGISTER
RESERVED
Bit 7 (R/W)
RESERVED
Bit 6 (R/W)
BIT5
BIT4
BIT3
FSW
RESERVED
Bit 1 (R/W)
VSC
Bit 5 (R/W)
Bit 4 (R/W)
Bit 3 (R/W)
Bit 2 (R/W)
Bit 0 (R/W)
BIT ASSIGNMENT
BIT FIELD DEFINITIONS
BstSlewRate[1:0]
Controls strength of FET driver. 00 - 25% drive strength, 01 to 50% drive strength,
10 -75% drive strength, 11 to 100% drive strength.
FSW
VSC
2 levels of Switching Frequencies (1 = 1,200kHz, 0 = 600kHz)
Enable / Disable Short Circuit Protection (0 = disabled, 1 = 7.5V minimum)
FIGURE 34. DESCRIPTIONS OF CONFIGURATION REGISTER
REGISTER 0x09
OUTPUT CHANNEL REGISTER
RESERVED
Bit 7 (R/W)
RESERVED
Bit 6 (R/W)
CH5
CH4
CH3
CH2
CH1
CH0
Bit 5 (R/W)
Bit 4 (R/W)
Bit 3 (R/W)
Bit 2 (R/W)
Bit 1 (R/W)
Bit 0 (R/W)
BIT ASSIGNMENT
CH[5..0]
BIT FIELD DEFINITIONS
CH5 = Channel 5, CH4 = Channel 4 and so on
FIGURE 35. OUTPUT CHANNEL REGISTER
FN7709.3
November 30, 2012
23
ISL97671A
REGISTER 0x0A
PHASE SHIFT CONTROL REGISTER
EQUALPHASE
Bit 7 (R/W)
PHASESHIFT6
Bit 6 (R/W)
PHASESHIFT5
Bit 5 (R/W)
PHASESHIFT4
Bit 4 (R/W)
PHASESHIFT3
Bit 3 (R/W)
PHASESHIFT2
Bit 2 (R/W)
PHASESHIFT1
Bit 1 (R/W)
PHASESHIFT0
Bit 0 (R/W)
BIT ASSIGNMENT
EqualPhase
BIT FIELD DEFINITIONS
Controls phase shift mode - When 0, phase shift is defined by PhaseShift<6:0>. When 1, phase shift
is 360/N (where N is the number of channels enabled).
PhaseShift[6..0]
7-bit Phase shift setting - phase shift between each channel is PhaseShift<6:0>/(255*PWMFreq)
FIGURE 36. DESCRIPTIONS OF PHASE SHIFT CONTROL REGISTER
Phase Shift Control Register (0x0A)
Input Capacitor
The Phase Shift Control register is used to set phase delay
between channels. When bit 7 is set high, the phase delay is set
by the number of channels enabled and the PWM frequency.
Referring to Figure 3, the delay time is defined by Equation 16:
Switching regulators require input capacitors to deliver peak
charging current and to reduce the impedance of the input
supply. The capacitors reduce interaction between the regulator
and input supply, thus improving system stability. The high
switching frequency of the loop causes almost all ripple current
to flow into the input capacitor, which must be rated accordingly.
(EQ. 16)
t
= (t
⁄ N)
FPWM
D1
where N is the number of channels enabled, and tFPWM is the
period of the PWM cycle. When bit 7 is set low, the phase delay is
set by bits 6 to 0 and the PWM frequency. Referencing Figure 23,
the programmable delay time is defined by Equation 17:
A capacitor with low internal series resistance should be chosen
to minimize heating effects and to improve system efficiency.
The X5R and X7R ceramic capacitors offer small size and a lower
value for temperature and voltage coefficient compared to other
ceramic capacitors.
(EQ. 17)
t
= (PS < 6, 0 > xt
⁄ (255))
FPWM
PD
An input capacitor of 10µF is recommended. Ensure that the
voltage rating of the input capacitor is able to handle the full
supply range.
where PS is an integer from 0 to 127, and tFPWM is the period of
the PWM cycle. By default, all the register bits are set low, which
sets zero delay between each channel. Note that the user should
not program the register to have more than one period of the
PWM cycle delay between the first and last enabled channels.
Inductor
Inductor selection should be based on its maximum current (ISAT
characteristics, power dissipation (DCR), EMI susceptibility
(shielded vs unshielded), and size. Inductor type and value
influence many key parameters, including ripple current, current
limit, efficiency, transient performance, and stability.
)
Components Selections
According to the inductor Voltage-Second Balance principle, the
change of inductor current during the switching regulator On
time is equal to the change of inductor current during the
switching regulator Off time. As shown in Equations 18 and 19,
since the voltage across an inductor is:
Inductor maximum current capability must be adequate to
handle the peak current in the worst-case condition. If an
inductor core with too low a current rating is chosen, saturation
in the core will cause the effective inductor value to fall, leading
to an increase in peak-to-average current level, poor efficiency,
and overheating in the core. The series resistance, DCR, within
the inductor causes conduction loss and heat dissipation. A
shielded inductor is usually more suitable for EMI-susceptible
applications such as LED backlighting.
V
L
------
ΔI
=
xΔt
(EQ. 18)
L
L
and ΔIL @ On = ΔIL @ Off, therefore:
(EQ. 19)
(V – 0) ⁄ L × D × t = (V – V – V ) ⁄ L × (1 – D) × t
S
I
S
O
D
I
where D is the switching duty cycle defined by the turn-on time
over the switching period. VD is a Schottky diode forward voltage
that can be neglected for approximation.
The peak current can be derived from the voltage across the
inductor during the Off period, as shown in Equation 22:
IL
= (V × I ) ⁄ (85% × V ) + 1 ⁄ 2[V × (V – V ) ⁄ (L × V × f )]
peak
O O I I O I O S
Rearranging the terms without accounting for VD gives the boost
ratio and duty cycle, respectively, as shown in Equations 20 and 21:
(EQ. 22)
The value of 85% is an average term for the efficiency
(EQ. 20)
V
⁄ V = 1 ⁄ (1 – D)
I
O
approximation. The first term is average current that is inversely
proportional to the input voltage. The second term is inductor
current change that is inversely proportional to L and fS. As a
result, for a given switching frequency and minimum input
voltage at which the system operates, the inductor ISAT must be
chosen carefully.
(EQ. 21)
D = (V – V ) ⁄ V
O
O
I
FN7709.3
November 30, 2012
24
ISL97671A
Output Capacitors
Applications
High-Current Applications
Each channel of the ISL97671A can support up to 30mA
(50mA @ VIN = 12V). For applications that need higher current,
multiple channels can be grouped to achieve the desired current
(Figure 37). For example, the cathode of the last LED can be
connected to CH0 through CH2; this configuration can be treated
as a single string with 90mA current driving capability.
The output capacitor smooths the output voltage and supplies
load current directly during the conduction phase of the power
switch. Output ripple voltage consists of discharge and charge of
the output capacitor during FET On and OFF time and the voltage
drop due to flow through the ESR of the output capacitor. The
ripple voltage can be shown as Equation 23:
(EQ. 23)
ΔV
= (I ⁄ C × D ⁄ f ) + ((I × ESR)
O O S O
CO
The conservation of charge principle shown in Equation 21 also
indicates that, during the boost switch Off period, the output
capacitor is charged with the inductor ripple current, minus a
relatively small output current in boost topology. As a result, the
user must select an output capacitor with low ESR and adequate
input ripple current capability.
V
OUT
Note: Capacitors have a voltage coefficient that makes their
effective capacitance drop as the voltage across them increases.
COUT in Equation 23 assumes the effective value of the capacitor
at a particular voltage and not the manufacturer’s stated value,
measured at 0V.
CH0
CH1
CH2
The value of ΔVCo can be reduced by increasing CO or fS, or by
using small ESR capacitors. In general, ceramic capacitors are
the best choice for output capacitors in small- to medium-sized
LCD backlight applications, due to their cost, form factor, and low
ESR.
FIGURE 37. GANGING MULTIPLE CHANNELS FOR HIGH CURRENT
APPLICATIONS
Low Voltage Operations
A larger output capacitor also eases driver response during the
PWM dimming Off period, due to the longer sample and hold
effect of the output drooping. The driver does not need to boost
harder in the next On period that minimizes transient current.
The ISL97671A VIN pin can be separately biased from the LED
power input to allow low-voltage operation. For systems that have
only a single supply, VOUT can be tied to the driver VIN pin to allow
initial start-up (Figure 38). The circuit works as follows: when the
input voltage is available and the device is not enabled, VOUT
follows VIN with a Schottky diode voltage drop. The VOUT
boot-strapped to the VIN pin allows initial start-up, once the part
is enabled. Once the driver starts up with VOUT regulating to the
target, the VIN pin voltage also increases. As long as VOUT does
not exceed 26.5V and the extra power loss on VIN is acceptable,
this configuration can be used for input voltage as low as 3.0V.
The Fault Protection FET feature cannot be used in this
configuration.
The output capacitor is also needed for compensation, and in
general, 2x4.7µF/50V ceramic capacitors are suitable for
notebook display backlight applications.
Output Ripple
ΔVCo, can be reduced by increasing Co or fSW, or using small ESR
capacitors. In general, ceramic capacitors are the best choice for
output capacitors in small to medium sized LCD backlight
applications due to their cost, form factor, and low ESR.
For systems that have dual supplies, the VIN pin can be biased
from 5V to 12V, while input voltage can be as low as 2.7V
(Figure 39). In this configuration, VBIAS must be greater than or
equal to VIN to use the fault FET.
A larger output capacitor will also ease the driver response
during PWM dimming Off period due to the longer sample and
hold effect of the output drooping. The driver does not need to
boost harder in the next On period that minimizes transient
current. The output capacitor is also needed for compensation,
and, in general 2x4.7µF/50V ceramic capacitors are suitable for
notebook display backlight applications.
Schottky Diode
A high-speed rectifier diode is necessary to prevent excessive
voltage overshoot. Schottky diodes are recommended because
of their fast recovery time, low forward voltage and reverse
leakage current, which minimize losses. The reverse voltage
rating of the selected Schottky diode must be higher than the
maximum output voltage. Also the average/peak current rating
of the Schottky diode must meet the output current and peak
inductor current requirements.
FN7709.3
November 30, 2012
25
ISL97671A
Compensation
VIN = 3V~21V
26.5V, 6 x 50mA*
The ISL97671A incorporates a transconductance amplifier in its
feedback path to allow the user to optimize boost stability and
transient response. The ISL97671A uses current mode control
architecture, which has a fast current sense loop and a slow
voltage feedback loop. The fast current feedback loop does not
require any compensation, but for stable operation, the slow
voltage loop must be compensated. The compensation is a
series of Rc, Cc1 network from COMP pin to ground, with an
optional Cc2 capacitor connected between the COMP pin and
ground. The Rc sets the high-frequency integrator gain for fast
transient response, and the Cc1 sets the integrator zero to
ensure loop stability. For most applications, the component
values in Figure 40 can be used: Rc is 10kΩ and Cc1 is 3.3nF.
Depending upon the PCB layout, for stability, a Cc2 of 390pF may
be needed to create a pole to cancel the output capacitor ESR’s
zero effect.
ISL97671A
FAULT
1
2
4
LX 20
VIN
OVP
16
VDC
PGND 19
CH0 10
7
6
SMBCLK/SCL
SMBDAT/SDA
CH1
CH2
CH3
CH4
CH5
11
12
13
14
15
5
3
PWM
EN
17
8
RSET
FPWM
AGND
COMP
9
18
*VIN>12V
FIGURE 38. SINGLE SUPPLY 3V OPERATION
Rc 10k
COMP
45V, 6 x 50mA*
VIN = 2.7~26.5V
Cc2
Cc1
390pF
3.3nF
Q1 (OPTIONAL)
ISL97671A
1
FAULT
LX 20
VBIAS = 5V~12V
2
4
VIN
FIGURE 40. COMPENSATION CIRCUIT
OVP
16
VDC
PGND 19
CH0 10
7
6
SMBCLK/SCL
SMBDAT/SDA
CH1
CH2
CH3
CH4
CH5
11
12
13
14
15
5
3
PWM
EN
17
8
RSET
FPWM
AGND
COMP
*VIN > 12V
9
18
FIGURE 39. DUAL SUPPLIES 2.7V OPERATION
16-Bit Dimming
The SMBus/I2C controlled PWM and DC dimmings can be
combined to effectively provide 16 bits of dimming capability,
which can be valuable for automotive and avionics display
applications.
Field Sequential RGB LED Backlighting
The ISL97671A allows to turn each channel ON and OFF
independently. In field sequential RGB LED application, it is
possible to have different DC current and PWM duty cycle for
different channels as long as only one channel is active at a time.
This is achieved by continuously setting a new DC current and/or
PWM duty cycle each time a channel is turned ON. ISL97671A
does not allow to have different DC currents or PWM duty cycles
for channels that are ON at the same time.
FN7709.3
November 30, 2012
26
ISL97671A
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you
have the latest Rev.
DATE
REVISION
FN7709.3
CHANGE
October 3, 2012
Minor changes to improve the wording of various sections.
page 5 - Thermal Information, removed Pb-Free Reflow Profile link.
page 6 - VOVPlo in the spec table, changed to Min 1.199 and Max 1.24 from Min 1.19 and Max 1.24
page 8 - Figure 3 “EFFICIENCY vs up to 20mA LED CURRENT (100% LED DUTY CYCLE) vs VIN” removed.
page 9 - Figures 11, 12 replaced to clear waveforms
page 12 & page 16 respectively, Tables 1, 2 improved.
page 18 - I2C section, specified that the backlight can turns on when SDA/SCL are connected to ground.
page 20 - Improved description of PWM_MD and PWM_SEL I2C register bits. Corrected Figure 30.
Removed Direct PWM and PWM-to-DC register bits from the description
July 11, 2012
FN7709.2
FN7709.1
PWM-to-DC bit and BstSlewRate bit in the register 0x08 updated on page 19, page 22 and page 23.
In “Current Matching and Current Accuracy” on page 11, changed 401.8 to 410.5.
On page 11 Equation 1, changed 401.8 to 410.5.
March 24, 2011
Initial Release to web.
About Intersil
Intersil Corporation is a leader in the design and manufacture of high-performance analog, mixed-signal and power management
semiconductors. The company's products address some of the fastest growing markets within the industrial and infrastructure,
personal computing and high-end consumer markets. For more information about Intersil or to find out how to become a member of
our winning team, visit our website and career page at www.intersil.com.
For a complete listing of Applications, Related Documentation and Related Parts, please see the respective product information page.
Also, please check the product information page to ensure that you have the most updated datasheet: ISL97671A
To report errors or suggestions for this datasheet, please go to: www.intersil.com/askourstaff
Reliability reports are available from our website at: http://rel.intersil.com/reports/search.php
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN7709.3
November 30, 2012
27
ISL97671A
Package Outline Drawing
L20.3x4
20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 1, 3/10
0.10 M
C
C
A
B
3.00
A
M
0.05
0.50
16X
20X 0.25 +0.05
6
B
4
-0.07
PIN 1 INDEX AREA
(C 0.40)
17
20
A
16
1
6
PIN 1
INDEX AREA
4.00
+0.10
2.65
-0.15
11
6
0.15 (4X)
A
10
7
VIEW "A-A"
1.65 +0.10
-0.15
TOP VIEW
20x 0.40±0.10
BOTTOM VIEW
SEE DETAIL "X"
C
C
0.10
0.9± 0.10
SEATING PLANE
0.08
C
SIDE VIEW
(16 x 0.50)
(2.65)
(3.80)
(20 x 0.25)
5
0.2 REF
C
(20 x 0.60)
0.00 MIN.
0.05 MAX.
(1.65)
(2.80)
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
Tiebar shown (if present) is a non-functional feature.
5.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
FN7709.3
November 30, 2012
28
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