ISL84522IBZ [RENESAS]

Low-Voltage, Single and Dual Supply, Quad SPST, Analog Switches; SOIC16, TSSOP16; Temp Range: -40° to 85°C;
ISL84522IBZ
型号: ISL84522IBZ
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

Low-Voltage, Single and Dual Supply, Quad SPST, Analog Switches; SOIC16, TSSOP16; Temp Range: -40° to 85°C

光电二极管
文件: 总13页 (文件大小:776K)
中文:  中文翻译
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DATASHEET  
ISL84521, ISL84522, ISL84523  
Low-Voltage, Single and Dual Supply, Quad SPST, Analog Switches  
FN6031  
Rev 4.00  
August 10, 2015  
The Intersil ISL84521, ISL84523, ISL84523 devices are  
CMOS, precision, quad analog switches designed to operate  
Features  
• Drop-in Replacements for MAX4521 - MAX4523  
• Four Separately Controlled SPST Switches  
• Pin Compatible with DG411, DG412, DG413  
• ON Resistance (R Max.) . . . . . . . . . . . . . . . . . . . 100  
from a single +2V to +12V supply or from a 2V to 6V supply.  
Targeted applications include battery powered equipment that  
benefit from the devices’ low power consumption (<1W), low  
leakage currents (1nA max), and fast switching speeds  
(t  
= 45ns, t  
= 15ns). A12maximum R flatness  
ON  
Matching Between Channels. . . . . . . . . . . . . . . . . .<1  
ON  
OFF  
ON  
ensures signal fidelity, while channel-to-channel mismatch is  
guaranteed to be less than 4.  
• R  
ON  
• Low Power Consumption (P ). . . . . . . . . . . . . . . . . . . .<1W  
D
The ISL84521, ISL84522, ISL84523 are quad  
single-pole/ single-throw (SPST) devices. The ISL84521 has  
four normally closed (NC) switches; the ISL84522 has four  
normally open (NO) switches; the ISL84523 has two NO and  
two NC switches and can be used as a dual SPDT, or a dual  
2:1 multiplexer.  
• Low Leakage Current (Max at 85oC) . . . . . . . . . . . . 10nA  
• Fast Switching Action  
- t  
- t  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45ns  
ON  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15ns  
OFF  
• Break before Make Timing  
Table 1 summarizes the performance of this family. For higher  
performance, pin compatible versions and 3mm x 3mm Quad  
No-Lead Flatpack (QFN) package see the ISL43140,  
ISL43142 data sheet.  
• Minimum 2000V ESD Protection per Method 3015.7  
• TTL, CMOS Compatible  
Pb-free available  
TABLE 1. FEATURES AT A GLANCE  
Applications  
ISL84521  
4
ISL84522  
4
ISL84523  
4
• Battery Powered, Handheld, and Portable Equipment  
- Cellular/Mobile Phones  
Number of Switches  
Configuration  
All NC  
65  
All NO  
65  
2 NC/2 NO  
65  
- Pagers  
5V R  
ON  
- Laptops, Notebooks, Palmtops  
5V t /t  
45ns/15ns  
125  
45ns/15ns  
125  
45ns/15ns  
125  
ON OFF  
5V R  
• Communications Systems  
- Military Radios  
ON  
- RF “Tee” Switches  
5V t /t  
60ns/20ns  
260  
60ns/20ns  
260  
60ns/20ns  
260  
ON OFF  
• Test Equipment  
- Ultrasound  
3V R  
ON  
3V t /t  
120ns/40ns 120ns/40ns 120ns/40ns  
16 Ld SOIC (N), 16 Ld TSSOP  
ON OFF  
- Electrocardiograph  
Packages  
• Heads-Up Displays  
• Audio and Video Switching  
• General Purpose Circuits  
- +3V/+5V DACs and ADCs  
- Digital Filters  
- Operational Amplifier Gain Switching Networks  
- High Frequency Analog Switching  
- High Speed Multiplexing  
Related Literature  
• Technical Brief TB363 “Guidelines for Handling and  
Processing Moisture Sensitive Surface Mount Devices  
(SMDs)”  
• Application Note AN557 “Recommended Test Procedures  
for Analog Switches”  
FN6031 Rev 4.00  
August 10, 2015  
Page 1 of 13  
ISL84521, ISL84522, ISL84523  
Pinouts (Note 1)  
ISL84521 (SOIC, TSSOP)  
ISL84522 (SOIC, TSSOP)  
TOP VIEW  
TOP VIEW  
IN1  
COM1  
NC1  
V-  
1
2
3
4
5
6
7
8
16 IN2  
IN1  
COM1  
NO1  
V-  
1
2
3
4
5
6
7
8
16 IN2  
15 COM2  
14 NC2  
13 V+  
15 COM2  
14 NO2  
13 V+  
GND  
NC4  
COM4  
IN4  
12 N.C.  
11 NC3  
10 COM3  
GND  
NO4  
COM4  
IN4  
12 N.C.  
11 NO3  
10 COM3  
9
IN3  
9 IN3  
ISL84523 (SOIC, TSSOP)  
TOP VIEW  
IN1  
COM1  
NO1  
V-  
1
2
3
4
5
6
7
8
16 IN2  
15 COM2  
14 NC2  
13 V+  
GND  
NO4  
COM4  
IN4  
12 N.C.  
11 NC3  
10 COM3  
9
IN3  
NOTE:  
1. Switches Shown for Logic “0” Input.  
Truth Table  
Ordering Information  
TEMP.  
ISL84521  
SW 1, 2, 3, 4  
On  
ISL84522  
ISL84523  
PART NO.  
(Note 2)  
RANGE  
PACKAGE  
(RoHS Compliant)  
PKG.  
DWG. #  
o
LOGIC  
SW 1, 2, 3, 4  
SW 1, 4 SW 2, 3  
( C)  
0
1
Off  
On  
Off  
On  
On  
Off  
ISL84521IBZ*  
ISL84521IVZ*  
ISL84522IBZ*  
ISL84522IVZ*  
-40 to 85 16 Ld SOIC (N)  
-40 to 85 16 Ld TSSOP  
-40 to 85 16 Ld SOIC (N)  
-40 to 85 16 Ld TSSOP  
-40 to 85 16 Ld SOIC (N)  
M16.15  
M16.173  
M16.15  
M16.173  
M16.15  
Off  
NOTE: Logic “0” 0.8V. Logic “1” 2.4V.  
ISL84523IBZ*  
Pin Descriptions  
No longer available,  
recommended  
replacement:  
PIN  
V+  
V-  
FUNCTION  
Positive Power Supply Input  
ISL84524IUZ-T)  
Negative Power Supply Input. Connect to GND for  
Single Supply Configurations.  
ISL84523IVZ*  
-40 to 85 16 Ld TSSOP  
M16.173  
No longer available,  
recommended  
replacement:  
GND  
IN  
Ground Connection  
Digital Control Input  
ISL84524IUZ-T)  
*Add “-T” suffix to part number for tape and reel packaging.  
COM  
NO  
Analog Switch Common Pin  
Analog Switch Normally Open Pin  
Analog Switch Normally Closed Pin  
No Internal Connection  
NOTE:  
2. Intersil Pb-free products employ special Pb-free material sets; molding compounds/die  
attach materials and 100% matte tin plate termination finish, which is compatible with  
both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL  
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free  
requirements of IPC/JEDEC J Std-020B.  
NC  
N.C.  
FN6031 Rev 4.00  
August 10, 2015  
Page 2 of 13  
ISL84521, ISL84522, ISL84523  
Absolute Maximum Ratings  
Thermal Information  
o
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to15V  
V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to15V  
V- to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -15 to 0.3V  
All Other Pins (Note 3). . . . . . . . . . . . . ((V-) - 0.3V) to ((V+) + 0.3V)  
Continuous Current (Any Terminal) . . . . . . . . . . . . . . . . . . . . . 10mA  
Peak Current, IN, NO, NC, or COM  
Thermal Resistance (Typical, Note 4)  
( C/W)  
JA  
16 Ld SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . .  
16 Ld TSSOP Package . . . . . . . . . . . . . . . . . . . . . .  
115  
150  
o
Maximum Junction Temperature (Plastic Package) . . . . . . . 150 C  
Moisture Sensitivity (See Technical Brief TB363)  
All Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1  
Maximum Storage Temperature Range. . . . . . . . . . . . -65 C to 150 C  
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300 C  
o
o
o
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . . . 20mA  
ESD Rating (Per MIL-STD-883 Method 3015). . . . . . . . . . . . . > 2kV  
(Lead Tips Only)  
Operating Conditions  
Temperature Range  
ISL8452XIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 C to 85 C  
o
o
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTES:  
3. Signals on NC, NO, COM, or IN exceeding V+ or V- are clamped by internal diodes. Limit forward diode current to maximum current ratings.  
4. is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.  
JA  
Electrical Specifications +5V Supply  
Test Conditions: V  
Unless Otherwise Specified  
= 4.5V to 5.5V, GND = 0V, V  
= 2.4V, V  
= 0.8V (Note 5),  
INL  
SUPPLY  
INH  
TEMP (NOTE 6)  
(NOTE 6)  
MAX  
o
PARAMETER  
TEST CONDITIONS  
( C)  
MIN  
TYP  
UNITS  
ANALOG SWITCH CHARACTERISTICS  
Analog Signal Range, V  
Full  
25  
V-  
-
-
V+  
100  
125  
4
V
ANALOG  
ON Resistance, R  
V
V
V
V
= 5V, I = 1.0mA, V  
COM NO  
or V  
NC  
= 3V (Figure 5)  
65  
ON  
S
S
S
S
Full  
25  
-
-
R
Matching Between Channels,  
= 5V, I  
= 5V, I  
= 1.0mA, V  
= 1.0mA, V  
or V  
or V  
= 3V  
-
1
ON  
R  
COM  
COM  
NO  
NO  
NC  
NC  
ON  
Full  
25  
-
-
6
R
Flatness, R  
= 3V (Note 8)  
-
7
12  
15  
1
ON  
FLAT(ON)  
Full  
25  
-
-
NO or NC OFF Leakage Current,  
or I  
= 5.5V, V  
= 4.5V, V  
= 4.5V, V  
or V  
= +4.5V  
= +4.5V  
-1  
-10  
-1  
-10  
-2  
-20  
0.01  
nA  
nA  
nA  
nA  
nA  
nA  
COM  
COM  
COM  
NO  
NC  
NC  
I
(Note 7)  
NO(OFF)  
NC(OFF)  
Full  
25  
-
0.01  
-
10  
1
COM OFF Leakage Current,  
V
= 5.5V, V  
or V  
S
NO  
I
(Note 7)  
COM(OFF)  
Full  
25  
10  
2
COM ON Leakage Current,  
V
= 5.5V, V  
= V  
or V = 4.5V (Note 7)  
NC  
0.01  
-
S
NO  
I
COM(ON)  
Full  
20  
DIGITAL INPUT CHARACTERISTICS  
Input Voltage High, V  
Full  
Full  
Full  
-
1.6  
1.6  
2.4  
-
V
V
INH  
Input Voltage Low, V  
Input Current, I , I  
0.8  
-1  
INL  
V
= 5.5V, V = 0V or V+  
IN  
0.03  
1
A  
INH INL  
DYNAMIC CHARACTERISTICS  
Turn-ON Time, t  
S
V
V
= 4.5V, V  
or V  
= 3V, R = 300, C = 35pF,  
25  
Full  
25  
-
-
45  
-
80  
100  
30  
40  
-
ns  
ns  
ns  
ns  
ns  
ON  
S
NO  
NC  
L
L
= 0 to 3V (Figure 1)  
IN  
Turn-OFF Time, t  
V
V
= 4.5V, V  
or V  
= 3V, R = 300, C = 35pF,  
-
15  
-
OFF  
S
NO  
NC  
L
L
= 0 to 3V (Figure 1)  
IN  
Full  
25  
-
Break-Before-Make Time Delay  
(ISL84523), t  
V
V
= 5.5V, V  
or V  
= 3V, R = 300, C = 35pF,  
5
20  
S
NO  
NC  
L
L
= 0 to 3V (Figure 3)  
D
IN  
Charge Injection, Q  
C
= 1.0nF, V = 0V, R = 0(Figure 2)  
25  
25  
25  
-
-
-
1
2
2
5
-
pC  
pF  
pF  
L
G
G
NO or NC OFF Capacitance, C  
f = 1MHz, V  
f = 1MHz, V  
or V  
or V  
= V  
= 0V (Figure 7)  
= 0V (Figure 7)  
OFF  
NO  
NC  
COM  
COM  
COM OFF Capacitance,  
= V  
-
NO  
NC  
C
COM(OFF)  
COM ON Capacitance, C  
f = 1MHz, V  
or V  
= V  
= 0V (Figure 7)  
25  
-
5
-
pF  
COM(ON)  
NO  
NC  
COM  
FN6031 Rev 4.00  
August 10, 2015  
Page 3 of 13  
ISL84521, ISL84522, ISL84523  
Electrical Specifications +5V Supply  
Test Conditions: V  
Unless Otherwise Specified (Continued)  
= 4.5V to 5.5V, GND = 0V, V  
= 2.4V, V  
= 0.8V (Note 5),  
INL  
SUPPLY  
INH  
TEMP (NOTE 6)  
(NOTE 6)  
MAX  
o
PARAMETER  
TEST CONDITIONS  
( C)  
MIN  
TYP  
>90  
UNITS  
dB  
OFF Isolation  
R
= 50, C = 15pF, f = 100kHz,  
25  
25  
-
-
-
-
L
L
V
or V  
= 1V  
, (See Figures 4 and 6)  
NO  
NC  
RMS  
Crosstalk, (Note 9)  
<-90  
dB  
POWER SUPPLY CHARACTERISTICS  
Power Supply Range  
Full  
25  
2  
-1  
-1  
-1  
-1  
-
0.05  
-
6  
1
V
Positive Supply Current, I+  
Negative Supply Current, I-  
NOTES:  
V
= 5.5V, V = 0V or V+, Switch On or Off  
IN  
A  
A  
A  
A  
S
Full  
25  
1
0.05  
-
1
Full  
1
5. V = Input voltage to perform proper function.  
IN  
6. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet.  
o
7. Leakage parameter is 100% tested at high temp, and guaranteed by correlation at 25 C.  
8. Flatness is defined as the delta between the maximum and minimum R  
9. Between any two switches.  
values over the specified voltage range.  
ON  
Electrical Specifications 5V Supply  
Test Conditions: V+ = +4.5V to +5.5V, V- = GND = 0V, V  
Unless Otherwise Specified  
= 2.4V, V  
= 0.8V (Note 5),  
INL  
INH  
TEMP  
( C)  
MIN  
(NOTE 6)  
MAX  
(NOTE 6) UNITS  
o
PARAMETER  
TEST CONDITIONS  
TYP  
ANALOG SWITCH CHARACTERISTICS  
Analog Signal Range, V  
Full  
25  
0
-
-
V+  
200  
250  
8
V
ANALOG  
ON Resistance, R  
V+ = 4.5V, I  
(Figure 5)  
= 1.0mA, V or V  
NO NC  
= 3.5V  
125  
ON  
COM  
Full  
25  
-
-
R
Matching Between Channels, V+ = 5V, I  
COM  
= 1.0mA, V  
NO  
or V  
NC  
= 3.5V  
-
2
ON  
R  
ON  
Full  
25  
-
-
10  
1
NO or NC OFF Leakage Current,  
V+ = 5.5V, V  
(Note 7)  
= 1V, 4.5V, V  
= 1V, 4.5V, V  
or V  
or V  
= 4.5V, 1V  
-1  
-10  
-1  
-10  
-2  
-20  
0.01  
nA  
nA  
nA  
nA  
nA  
nA  
COM  
COM  
COM  
NO  
NO  
NC  
I
or I  
NO(OFF)  
NC(OFF)  
Full  
25  
-
10  
1
COM OFF Leakage Current,  
V+ = 5.5V, V  
(Note 7)  
= 4.5V, 1V  
0.01  
NC  
I
COM(OFF)  
Full  
25  
-
-
-
10  
2
COM ON Leakage Current,  
V+ = 5.5V, V  
= 1V, 4.5V (Note 7)  
I
COM(ON)  
Full  
20  
DIGITAL INPUT CHARACTERISTICS  
Input Voltage High, V  
Full  
Full  
Full  
-
1.6  
1.6  
2.4  
-
V
V
INH  
Input Voltage Low, V  
Input Current, I , I  
0.8  
-1  
INL  
V+ = 5.5V, V = 0V or V+  
IN  
0.03  
1
A  
INH INL  
DYNAMIC CHARACTERISTICS  
Turn-ON Time, t  
V+ = 4.5V, V  
or V  
= 3V, R = 300, C = 35pF,  
25  
Full  
25  
-
-
60  
-
100  
150  
50  
75  
-
ns  
ns  
ns  
ns  
ns  
ON  
NO  
NC  
L
L
V
= 0 to 3V (Figure 1)  
IN  
Turn-OFF Time, t  
V+ = 4.5V, V  
or V  
= 3V, R = 300, C = 35pF,  
-
20  
-
OFF  
NO  
NC  
L
L
V
= 0 to 3V (Figure 1)  
IN  
Full  
25  
-
Break-Before-Make Time Delay  
(ISL84523), t  
V+ = 5.5V, V  
or V  
= 3V, R = 300, C = 35pF,  
10  
30  
NO  
= 0 to 3V (Figure 3)  
IN  
NC  
L
L
V
C
D
Charge Injection, Q  
= 1.0nF, V = 0V, R = 0Figure 2)  
25  
-
1
5
pC  
L
G
G
FN6031 Rev 4.00  
August 10, 2015  
Page 4 of 13  
ISL84521, ISL84522, ISL84523  
Electrical Specifications 5V Supply  
Test Conditions: V+ = +4.5V to +5.5V, V- = GND = 0V, V  
Unless Otherwise Specified (Continued)  
= 2.4V, V  
= 0.8V (Note 5),  
INL  
INH  
TEMP  
( C)  
MIN  
(NOTE 6)  
MAX  
(NOTE 6) UNITS  
o
PARAMETER  
TEST CONDITIONS  
TYP  
POWER SUPPLY CHARACTERISTICS  
Positive Supply Current, I+  
V+ = 5.5V, V = 0V or V+, Switch On or Off  
IN  
25  
Full  
25  
-1  
-1  
-1  
-1  
0.05  
1
1
1
1
A  
A  
A  
A  
-
0.05  
-
Negative Supply Current, I-  
Full  
Electrical Specifications 3V Supply  
Test Conditions: V+ = +2.7V to +3.6V, V- = GND = 0V, V  
Unless Otherwise Specified  
= 2.4V, V  
= 0.8V (Note 5),  
INH  
INL  
TEMP  
( C)  
MIN  
(NOTE 6)  
MAX  
(NOTE 6) UNITS  
o
PARAMETER  
TEST CONDITIONS  
TYP  
ANALOG SWITCH CHARACTERISTICS  
Analog Signal Range, V  
Full  
25  
0
-
-
260  
-
V+  
500  
600  
V
ANALOG  
ON Resistance, R  
V+ = 2.7V, I  
= 0.1mA, V  
NO  
or V = 1V  
NC  
ON  
COM  
Full  
-
DIGITAL INPUT CHARACTERISTICS  
Input Voltage High, V  
Full  
Full  
Full  
-
1.6  
1.6  
2.4  
-
V
V
INH  
Input Voltage Low, V  
Input Current, I , I  
0.8  
-1  
INL  
V+ = 3.6V, V = 0V or V+  
IN  
0.03  
1
A  
INH INL  
DYNAMIC CHARACTERISTICS  
Turn-ON Time, t  
V+ = 2.7V, V  
or V  
= 1.5V, R = 300, C = 35pF,  
25  
Full  
25  
-
-
120  
-
250  
300  
80  
ns  
ns  
ns  
ns  
ns  
ON  
NO  
NC  
L
L
V
= 0 to V+ (Figure 1)  
IN  
Turn-OFF Time, t  
V+ = 2.7V, V  
or V  
= 1.5V, R = 300, C = 35pF,  
-
40  
-
OFF  
NO  
NC  
L
L
V
= 0 to V+ (Figure 1)  
IN  
Full  
25  
-
100  
-
Break-Before-Make Time Delay  
(ISL84523), t  
V+ = 3.6V, V  
or V  
= 1.5V, R = 300, C = 35pF,  
15  
50  
NO  
= 0 to 3V (Figure 3)  
IN  
NC  
L
L
V
C
D
Charge Injection, Q  
= 1.0nF, V = 0V, R = 0Figure 2)  
25  
-
0.5  
5
pC  
L
G
G
POWER SUPPLY CHARACTERISTICS  
Positive Supply Current, I+  
V+ = 3.6V, V = 0V or V+, Switch On or Off  
IN  
25  
Full  
25  
-1  
-1  
-1  
-1  
0.05  
1
1
1
1
A  
A  
A  
A  
-
0.05  
-
Negative Supply Current, I-  
Full  
Test Circuits and Waveforms  
V+  
3V  
t < 20ns  
r
t < 20ns  
f
C
LOGIC  
INPUT  
50%  
SWITCH  
INPUT  
0V  
NX  
C
t
V
OFF  
OUT  
NO OR NC  
SWITCH  
INPUT  
V
NX  
V
COM  
V
OUT  
IN  
90%  
90%  
C
35pF  
R
300  
L
L
GND  
SWITCH  
OUTPUT  
0V  
LOGIC  
INPUT  
t
ON  
C
V-  
Repeat test for all switches. C includes fixture and stray  
L
Logic input waveform is inverted for switches that have the opposite  
logic sense.  
capacitance.  
R
L
V
= V  
------------------------------  
OUT  
(NO or NC)  
R
+ R  
L
ON  
FIGURE 1B. TEST CIRCUIT  
FIGURE 1A. MEASUREMENT POINTS  
FIGURE 1. SWITCHING TIMES  
FN6031 Rev 4.00  
August 10, 2015  
Page 5 of 13  
ISL84521, ISL84522, ISL84523  
Test Circuits and Waveforms (Continued)  
V+  
C
SWITCH  
OUTPUT  
V  
OUT  
V
OUT  
R
G
NO OR NC  
COM  
V
OUT  
3V  
0V  
ON  
ON  
LOGIC  
INPUT  
V
OFF  
GND  
G
IN  
C
L
LOGIC  
INPUT  
C
Q = V  
x C  
L
OUT  
V-  
Repeat test for all switches. C includes fixture and stray  
L
capacitance.  
Logic input waveform is inverted for switches that have the opposite  
logic sense.  
FIGURE 2B. TEST CIRCUIT  
FIGURE 2A. MEASUREMENT POINTS  
FIGURE 2. CHARGE INJECTION  
V+  
C
C
3V  
V
OUT1  
NO1  
NC2  
IN1  
LOGIC  
INPUT  
V
NX  
COM1  
COM2  
C
V
R
L1  
L1  
35pF  
OUT2  
0V  
300  
R
90%  
C
35pF  
90%  
L2  
300  
SWITCH  
L2  
OUTPUT  
IN2  
V
0V  
0V  
OUT1  
LOGIC  
INPUT  
GND  
90%  
90%  
SWITCH  
OUTPUT  
C
V
OUT2  
V-  
t
t
D
D
C
includes fixture and stray capacitance.  
L
Reconfigure accordingly to test SW3 and SW4.  
FIGURE 3B. TEST CIRCUIT  
FIGURE 3A. MEASUREMENT POINTS  
FIGURE 3. BREAK-BEFORE-MAKE TIME (ISL84523 ONLY)  
V+  
V+  
C
C
R
= V /1mA  
1
ON  
SIGNAL  
GENERATOR  
NO OR NC  
NO OR NC  
V
NX  
1mA  
0V OR 2.4V  
0.8V OR 2.4V  
IN  
IN  
V
1
COM  
COM  
ANALYZER  
GND  
GND  
R
L
C
C
V-  
V-  
Repeat test for all switches.  
FIGURE 5. R  
Repeat test for all switches.  
FIGURE 4. OFF ISOLATION TEST CIRCUIT  
TEST CIRCUIT  
ON  
FN6031 Rev 4.00  
August 10, 2015  
Page 6 of 13  
ISL84521, ISL84522, ISL84523  
Test Circuits and Waveforms (Continued)  
V+  
C
V+  
SIGNAL  
GENERATOR  
50  
NO1 OR NC1  
IN2  
COM1  
NO OR NC  
0V OR 2.4V  
IN  
0V or 2.4V  
0V OR 2.4V  
IMPEDANCE  
ANALYZER  
IN2  
NO  
COM  
NO2 OR NC2  
CONNECTION  
COM2  
ANALYZER  
GND  
GND  
R
L
C
V-  
V-  
FIGURE 7. CAPACITANCE TEST CIRCUIT  
FIGURE 6. CROSSTALK TEST CIRCUIT  
unaffected by this approach, but the switch resistance may  
increase, especially at low supply voltages.  
Detailed Description  
The ISL84521, ISL84522, ISL84523 quad analog switches  
offer precise switching capability from a bipolar 2V to 6V  
or a single 2V to 12V supply with low on-resistance (65)  
OPTIONAL PROTECTION  
DIODE  
and high speed switching (t  
= 45ns, t = 15ns). The  
ON  
OFF  
V+  
devices are especially well suited to portable battery  
powered equipment thanks to the low operating supply  
voltage (2V), low power consumption (1W) and low leakage  
currents (1nA max). High frequency applications also benefit  
from the wide bandwidth, and the very high OFF isolation and  
crosstalk rejection.  
OPTIONAL  
PROTECTION  
RESISTOR  
IN  
V
X
V
NO OR NC  
COM  
Supply Sequencing And Overvoltage Protection  
V-  
As with any CMOS device, proper power supply sequencing  
is required to protect the device from excessive input  
currents which might permanently damage the IC. All I/O  
pins contain ESD protection diodes from the pin to V+ and to  
V- (Figure 8). To prevent forward biasing these diodes, V+  
and V- must be applied before any input signals, and input  
signal voltages must remain between V+ and V-. If these  
conditions cannot be guaranteed, then one of the following  
two protection methods should be employed.  
OPTIONAL PROTECTION  
DIODE  
FIGURE 8. OVERVOLTAGE PROTECTION  
Power-Supply Considerations  
The ISL8452X construction is typical of most CMOS analog  
switches, in that they have three supply pins: V+, V-, and  
GND. V+ and V- drive the internal CMOS switches and set  
their analog voltage limits, so there are no connections  
between the analog signal path and GND. Unlike switches  
with a 13V maximum supply voltage, the ISL8452X 15V  
maximum supply voltage provides plenty of room for the  
10% tolerance of 12V supplies (6V or 12V single supply),  
as well as room for overshoot and noise spikes.  
Logic inputs can easily be protected by adding a 1k  
resistor in series with the input (Figure 8). The resistor limits  
the input current below the threshold that produces  
permanent damage, and the sub-microamp input current  
produces an insignificant voltage drop during normal  
operation.  
This family of switches performs equally well when operated  
with bipolar or single voltage supplies, and bipolar supplies  
need not be symmetrical. The minimum recommended  
supply voltage is 2V or 2V. It is important to note that the  
input signal range, switching times, and ON-resistance  
degrade at lower supply voltages. Refer to the electrical  
specification tables and Typical Performance Curves for  
details.  
Adding a series resistor to the switch input defeats the  
purpose of using a low R  
switch, so two small signal  
ON  
diodes can be added in series with the supply pins to provide  
overvoltage protection for all pins (Figure 8). These  
additional diodes limit the analog signal from 1V below V+ to  
1V above V-. The low leakage current performance is  
FN6031 Rev 4.00  
August 10, 2015  
Page 7 of 13  
ISL84521, ISL84522, ISL84523  
V+ and GND power the internal logic (thus setting the digital  
switching point) and level shifters. The level shifters convert  
the logic levels to switched V+ and V- signals to drive the  
analog switch gate terminals, so switch parameters -  
another. Figure 16 details the high OFF Isolation and  
Crosstalk rejection provided by this family. At 10MHz, OFF  
isolation is about 50dB in 50systems, decreasing  
approximately 20dB per decade as frequency increases.  
Higher load impedances decrease OFF Isolation and  
Crosstalk rejection due to the voltage divider action of the  
switch OFF impedance and the load impedance.  
especially R  
- are strong functions of both supplies.  
ON  
Logic-Level Thresholds  
V+ and GND power the internal logic stages, so V- has no  
affect on logic thresholds. This switch family is TTL  
Leakage Considerations  
compatible (0.8V and 2.4V) over a V+ supply range of 2.5V  
Reverse ESD protection diodes are internally connected  
between each analog-signal pin and both V+ and V-. One  
of these diodes conducts if any analog signal exceeds V+  
or V-.  
to 10V. At 12V the V level is about 2.7V, so for best results  
IH  
use a logic family the provides a V  
OH  
greater than 3V.  
The digital input stages draw supply current whenever the  
digital input voltage is not at one of the supply rails. Driving  
the digital input signals from GND to V+ with a fast transition  
time minimizes power dissipation.  
Virtually all the analog leakage current comes from the ESD  
diodes to V+ or V-. Although the ESD diodes on a given  
signal pin are identical and therefore fairly well balanced,  
they are reverse biased differently. Each is biased by either  
V+ or V- and the analog signal. This means their leakages  
will vary as the signal varies. The difference in the two diode  
leakages to the V+ and V- pins constitutes the analog-signal-  
path leakage current. All analog leakage current flows  
between each pin and one of the supply terminals, not to the  
other switch terminal. This is why both sides of a given  
switch can show leakage currents of the same or opposite  
polarity. There is no connection between the analog signal  
paths and GND.  
High-Frequency Performance  
In 50systems, signal response is reasonably flat even past  
300MHz (Figure 15), with a small signal -3dB bandwidth in  
excess of 400MHz, and a large signal bandwidth exceeding  
300MHz.  
An off switch acts like a capacitor and passes higher  
frequencies with less attenuation, resulting in signal  
feedthrough from a switch’s input to its output. OFF Isolation  
is the resistance to this feedthrough, while Crosstalk  
indicates the amount of feedthrough from one switch to  
o
Typical Performance Curves T = 25 C, Unless Otherwise Specified  
A
90  
80  
70  
60  
50  
300  
250  
200  
150  
100  
I
= 1mA  
V
I
= (V+) - 1V  
V- = -5V  
COM  
COM  
= 1mA  
o
COM  
85 C  
o
85 C  
o
25 C  
o
25 C  
o
-40 C  
V+ = 2.7V  
V- = 0V  
o
-40 C  
40  
50  
225  
250  
V- = 0V  
o
85 C  
200  
150  
100  
50  
175  
125  
o
o
85 C  
25 C  
V+ = 3.3V  
V- = 0V  
o
-40 C  
o
25 C  
75  
140  
o
V+ = 5V  
V- = 0V  
85 C  
o
-40 C  
110  
80  
o
25 C  
o
-40 C  
0
50  
3
4
5
6
7
8
9
10  
11  
12  
0
1
2
V
3
4
5
V+ (V)  
(V)  
COM  
FIGURE 10. ON RESISTANCE vs SWITCH VOLTAGE  
FIGURE 9. ON RESISTANCE vs SUPPLY VOLTAGE  
FN6031 Rev 4.00  
August 10, 2015  
Page 8 of 13  
ISL84521, ISL84522, ISL84523  
Typical Performance Curves T = 25 C, Unless Otherwise Specified (Continued)  
o
A
180  
140  
100  
5
V
=2V  
I
= 1mA  
S
COM  
o
85 C  
o
25 C  
2.5  
o
-40 C  
60  
120  
V+ = 3.3V  
V+ = 5V  
0
V
=3V  
S
100  
80  
o
85 C  
o
25 C  
2.5  
o
60  
-40 C  
40  
90  
V
=5V  
S
-5  
o
V
=5V  
85 C  
S
70  
50  
30  
o
25 C  
-7.5  
o
-40 C  
4
-5  
-2.5  
0
2.5  
5
-5  
-4  
-3  
-2  
-1  
0
1
2
3
5
V
(V)  
COM  
V
(V)  
COM  
FIGURE 12. CHARGE INJECTION vs SWITCH VOLTAGE  
FIGURE 11. ON RESISTANCE vs SWITCH VOLTAGE  
250  
o
125  
o
V
= (V+) - 1V  
COM  
V
= (V+) - 1V  
25 C  
o
V- = -5V  
V- = -5V  
25 C  
COM  
200  
150  
100  
50  
100  
-40 C  
o
-40 C  
75  
o
o
25 C  
50  
25 C  
o
o
85 C  
85 C  
25  
o
o
-40 C  
-40 C  
0
0
50  
300  
V- = 0V  
V- = 0V  
250  
200  
150  
100  
50  
40  
30  
20  
10  
o
85 C  
o
85 C  
o
25 C  
o
25 C  
o
o
-40 C  
-40 C  
0
2
3
4
5
6
7
8
9
10  
11  
12  
2
3
4
5
6
7
8
9
10  
11  
12  
V+ (V)  
V+ (V)  
FIGURE 14. TURN - OFF TIME vs SUPPLY VOLTAGE  
FIGURE 13. TURN - ON TIME vs SUPPLY VOLTAGE  
FN6031 Rev 4.00  
August 10, 2015  
Page 9 of 13  
ISL84521, ISL84522, ISL84523  
o
Typical Performance Curves T = 25 C, Unless Otherwise Specified (Continued)  
A
-10  
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
V+ = 3V to 12V or  
V
= 5V  
S
V
= 2V to 5V  
R = 50  
L
-20  
-30  
-40  
-50  
-60  
-70  
-80  
-90  
S
3
0
V
= 0.2V  
GAIN  
IN  
P-P  
V
= 5V  
-3  
IN P-P  
0
ISOLATION  
PHASE  
45  
V
= 0.2V  
IN  
P-P  
= 5V  
90  
CROSSTALK  
V
IN  
P-P  
135  
180  
-100  
-110  
R
= 50  
L
110  
1k  
10k  
100k  
1M  
10M  
100M 500M  
1
10  
100  
FREQUENCY (MHz)  
600  
FREQUENCY (Hz)  
FIGURE 16. CROSSTALK AND OFF ISOLATION  
FIGURE 15. FREQUENCY RESPONSE  
Die Characteristics  
SUBSTRATE POTENTIAL (POWERED UP):  
V-  
TRANSISTOR COUNT:  
ISL84521: 188  
ISL84522: 188  
ISL84523: 188  
PROCESS:  
Si Gate CMOS  
FN6031 Rev 4.00  
August 10, 2015  
Page 10 of 13  
ISL84521, ISL84522, ISL84523  
Revision History  
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make  
sure that you have the latest revision.  
DATE  
REVISION  
CHANGE  
August 10, 2015  
FN6031.4  
Updated Ordering Information table on page 2.  
Added Revision History and About Intersil sections.  
Updated Package Outline Drawing (POD) M16.173 with the latest version. Changes from Rev. 1 to Rev 2  
are as follows:  
-Convert to new POD format by moving dimensions from table onto drawing and adding land pattern. No  
dimension changes.  
About Intersil  
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products  
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.  
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product  
information page found at www.intersil.com.  
You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask.  
Reliability reports are also available from our website at www.intersil.com/support  
© Copyright Intersil Americas LLC 2003-2015. All Rights Reserved.  
All trademarks and registered trademarks are the property of their respective owners.  
For additional products, see www.intersil.com/en/products.html  
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted  
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html  
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such  
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are  
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its  
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or  
otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
FN6031 Rev 4.00  
August 10, 2015  
Page 11 of 13  
ISL84521, ISL84522, ISL84523  
Small Outline Plastic Packages (SOIC)  
M16.15 (JEDEC MS-012-AC ISSUE C)  
N
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE  
INDEX  
AREA  
0.25(0.010)  
M
B M  
H
INCHES  
MILLIMETERS  
E
SYMBOL  
MIN  
MAX  
0.0688  
0.0098  
0.020  
MIN  
1.35  
0.10  
0.33  
0.19  
9.80  
3.80  
MAX  
1.75  
NOTES  
-B-  
A
A1  
B
C
D
E
e
0.0532  
0.0040  
0.013  
-
1
2
3
0.25  
-
L
0.51  
9
SEATING PLANE  
A
0.0075  
0.3859  
0.1497  
0.0098  
0.3937  
0.1574  
0.25  
-
-A-  
10.00  
4.00  
3
h x 45°  
D
4
-C-  
0.050 BSC  
1.27 BSC  
-
H
h
0.2284  
0.0099  
0.016  
0.2440  
0.0196  
0.050  
5.80  
0.25  
0.40  
6.20  
0.50  
1.27  
-
e
A1  
C
5
B
0.10(0.004)  
L
6
0.25(0.010) M  
C
A M B S  
N
16  
16  
7
0°  
8°  
0°  
8°  
-
NOTES:  
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of  
Publication Number 95.  
Rev. 1 6/05  
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
3. Dimension “D” does not include mold flash, protrusions or gate burrs.  
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006  
inch) per side.  
4. Dimension “E” does not include interlead flash or protrusions. Interlead  
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.  
5. The chamfer on the body is optional. If it is not present, a visual index  
feature must be located within the crosshatched area.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above  
the seating plane, shall not exceed a maximum value of 0.61mm  
(0.024 inch).  
10. Controlling dimension: MILLIMETER. Converted inch dimensions are  
not necessarily exact.  
FN6031 Rev 4.00  
August 10, 2015  
Page 12 of 13  
ISL84521, ISL84522, ISL84523  
Package Outline Drawing  
M16.173  
16 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)  
Rev 2, 5/10  
A
1
3
5.00 ±0.10  
SEE DETAIL "X"  
9
16  
6.40  
PIN #1  
I.D. MARK  
4.40 ±0.10  
2
3
0.20 C B A  
1
8
B
0.09-0.20  
0.65  
TOP VIEW  
END VIEW  
1.00 REF  
-
0.05  
H
C
0.90 +0.15/-0.10  
1.20 MAX  
SEATING  
PLANE  
GAUGE  
PLANE  
0.25 +0.05/-0.06  
0.25  
5
0.10  
C B A  
M
0.10 C  
0°-8°  
0.60 ±0.15  
0.05 MIN  
0.15 MAX  
SIDE VIEW  
DETAIL "X"  
(1.45)  
NOTES:  
1. Dimension does not include mold flash, protrusions or gate burrs.  
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.  
2. Dimension does not include interlead flash or protrusion. Interlead  
flash or protrusion shall not exceed 0.25 per side.  
3. Dimensions are measured at datum plane H.  
(5.65)  
4. Dimensioning and tolerancing per ASME Y14.5M-1994.  
5. Dimension does not include dambar protrusion. Allowable protrusion  
shall be 0.08mm total in excess of dimension at maximum material  
condition. Minimum space between protrusion and adjacent lead  
is 0.07mm.  
(0.65 TYP)  
(0.35 TYP)  
6. Dimension in ( ) are for reference only.  
TYPICAL RECOMMENDED LAND PATTERN  
7. Conforms to JEDEC MO-153.  
FN6031 Rev 4.00  
August 10, 2015  
Page 13 of 13  

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