ISL83220EIA [RENESAS]
LINE TRANSCEIVER, PDSO16, PLASTIC, MO-150-AC, SSOP-16;
| 型号： | ISL83220EIA |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | LINE TRANSCEIVER, PDSO16, PLASTIC, MO-150-AC, SSOP-16 驱动 光电二极管 接口集成电路 驱动器 |
| 文件： | 总10页 (文件大小：188K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ISL83220E
®
Data Sheet
April 27, 2006
FN6011.5
±15kV ESD Protected, +3V to +5.5V,
1Microamp, 250kbps, RS-232
Transmitters/Receivers
Features
• Pb-Free Plus Anneal Available (RoHS Compliant)
• ESD Protection for RS-232 I/O Pins to ±15kV (IEC61000)
• Drop in Replacement for SP3220E
The Intersil ISL83220E is a 3.0V to 5.5V powered RS-232
transmitter/receiver which meets ElA/TIA-232 and V.28/V.24
specifications, even at V
= 3.0V. Additionally, it provides
• Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V
• RS-232 Compatible Outputs at 2.7V
CC
±15kV ESD protection (IEC61000-4-2 Air Gap and Human
Body Model) on transmitter outputs and receiver inputs
(RS-232 pins). Targeted applications are PDAs, Palmtops,
and notebook and laptop computers where the low
operational, and even lower standby, power consumption is
critical. Efficient on-chip charge pumps, coupled with a
manual powerdown function, reduce the standby supply
current to a 1μA trickle. Small footprint packaging, and the
use of small, low value capacitors ensure board space
savings as well. Data rates greater than 250kbps are
guaranteed at worst case load conditions. This family is fully
compatible with 3.3V only systems, mixed 3.3V and 5.0V
systems, and 5.0V only systems.
• Latch-Up Free
• On-Chip Voltage Converters Require Only Four External
0.1μF Capacitors
• Manual Powerdown Feature with Receivers Active
• Separate Receiver Enable Pin
• R and T Hysteresis For Improved Noise Immunity
X
X
• Guaranteed Minimum Data Rate . . . . . . . . . . . . . 250kbps
• Guaranteed Minimum Slew Rate . . . . . . . . . . . . . . . 6V/μs
• Wide Power Supply Range . . . . . . . Single +3V to +5.5V
• Low Supply Current in Powerdown State. . . . . . . . . . .1μA
Table 1 summarizes the features of the ISL83320E, while
Application Note AN9863 summarizes the features of each
device comprising the ICL32XXE 3V family.
Applications
• Any System Requiring RS-232 Communication Ports
- Battery Powered, Hand-Held, and Portable Equipment
- Laptop Computers, Notebooks, Palmtops
- Modems, Printers and other Peripherals
- Digital Cameras
- Cellular/Mobile Phones
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
TABLE 1. SUMMARY OF FEATURES
DATA
RATE
NO. OF
MONITOR Rx.
MANUAL
POWER-
DOWN?
AUTOMATIC
POWERDOWN
FUNCTION?
NO. OF NO.OF
Rx. ENABLE
FUNCTION?
READY
OUTPUT?
PART NUMBER
Tx.
Rx.
(R
)
(kbps)
OUTB
ISL83220E
1
1
0
250
Yes
No
Yes
No
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2004, 2006. All Rights Reserved
1
All other trademarks mentioned are the property of their respective owners.
ISL83220E
Ordering Information
Pinout
ISL83220E (TSSOP)
TEMP.
RANGE
(°C)
TOP VIEW
PART
PKG.
DWG. #
PART NUMBER MARKING
PACKAGE
EN
C1+
V+
1
2
3
4
5
6
7
8
16 SHDN
15 V
ISL83220ECV
83220ECV
0 to 70 16 Ld TSSOP M16.173
CC
ISL83220ECV-T 83220ECV
0 to 70 16 Ld TSSOP M16.173
Tape and Reel
14 GND
13 T1
C1-
C2+
C2-
V-
OUT
ISL83220ECVZ
(See Note)
83220ECVZ 0 to 70 16 Ld TSSOP M16.173
(Pb-Free)
12 N.C.
11 T1
IN
10 N.C.
R1
ISL83220ECVZ-T 83220ECVZ 0 to 70 16 Ld TSSOP M16.173
(See Note)
(Pb-Free)
Tape and Reel
R1
9
IN
OUT
ISL83220EIV
83220EIV
83220EIV
-40 to 85 16 Ld TSSOP M16.173
ISL83220EIV-T
-40 to 85 16 Ld TSSOP M16.173
Tape and Reel
ISL83220EIVZ
(See Note)
83220EIVZ -40 to 85 16 Ld TSSOP M16.173
(Pb-Free)
ISL83220EIVZ-T 83220EIVZ -40 to 85 16 Ld TSSOP M16.173
(See Note)
(Pb-Free)
Tape and Reel
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
Pin Descriptions
PIN
FUNCTION
V
System power supply input (3.0V to 5.5V).
Internally generated positive transmitter supply (+5.5V).
Internally generated negative transmitter supply (-5.5V).
Ground connection.
CC
V+
V-
GND
C1+
C1-
External capacitor (voltage doubler) is connected to this lead.
External capacitor (voltage doubler) is connected to this lead.
External capacitor (voltage inverter) is connected to this lead.
External capacitor (voltage inverter) is connected to this lead.
TTL/CMOS compatible transmitter Inputs.
C2+
C2-
T
IN
T
±15kV ESD Protected, RS-232 level (nominally ±5.5V) transmitter outputs.
±15kV ESD Protected, RS-232 compatible receiver inputs.
TTL/CMOS level receiver outputs.
OUT
R
IN
R
OUT
EN
SHDN
N.C.
Active low receiver enable control; doesn’t disable R
outputs.
OUTB
Active low input shuts down transmitters and on-board power supply, to place device in low power mode.
No internal connection.
2
ISL83220E
Typical Operating Circuit
ISL83220E
+3.3V
+
0.1μF
15
2
+
4
C
0.1μF
3
C1+
1
V
CC
C
0.1μF
3
+
V+
V-
C1-
5
C
0.1μF
2
C2+
+
7
C
4
0.1μF
6
C2-
+
T
1
11
13
T1
OUT
T1
IN
TTL/CMOS
RS-232
LOGIC LEVELS
9
1
8
LEVELS
R1
R1
IN
OUT
5kΩ
R
1
EN
16
V
CC
SHDN
GND
14
3
ISL83220E
Absolute Maximum Ratings
Thermal Information
V
to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
Thermal Resistance (Typical, Note 1)
θJA (°C/W)
CC
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V
Input Voltages
16 Ld TSSOP Package . . . . . . . . . . . . . . . . . . . . . .
145
Maximum Junction Temperature (Plastic Package) . . . . . . . 150°C
Maximum Storage Temperature Range. . . . . . . . . . .-65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C
(Lead Tips Only)
T
, EN, SHDN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
IN
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25V
IN
Output Voltages
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±13.2V
Operating Conditions
T
OUT
Temperature Range
ISL83220ECV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to V +0.3V
OUT
Short Circuit Duration
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
CC
T
OUT
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θ is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JA
Electrical Specifications Test Conditions: V = 3V to 5.5V, C - C = 0.1μF; Unless Otherwise Specified.
CC
1
4
Typicals are at T = 25°C
A
TEMP
(°C)
PARAMETER
DC CHARACTERISTICS
Supply Current
TEST CONDITIONS
MIN
TYP
MAX
UNITS
All Outputs Unloaded,
SHDN = V
V
= 3.15V
25
25
-
-
0.3
1.0
1.0
10
mA
CC
CC
SHDN = GND
Supply Current, Powerdown
μA
LOGIC AND TRANSMITTER INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold Low
Input Logic Threshold High
T
T
, EN, SHDN
, EN, SHDN
Full
Full
Full
25
-
-
0.8
V
V
IN
IN
V
V
= 3.3V
= 5.0V
2.0
-
-
-
-
CC
CC
2.4
V
Transmitter Input Hysteresis
Input Leakage Current
Output Leakage Current
Output Voltage Low
-
-
-
-
0.3
±0.01
±0.05
-
V
T
, EN, SHDN
Full
Full
Full
Full
±1.0
±10
0.4
-
μA
μA
V
IN
EN = V
CC
I
I
= 1.6mA
= -1.0mA
OUT
OUT
Output Voltage High
V
-0.6 V
-0.1
CC
V
CC
TRANSMITTER OUTPUTS
Output Voltage Swing
Output Resistance
All Transmitter Outputs Loaded with 3kΩ to Ground
Full
Full
Full
Full
±5.0
±5.4
-
V
Ω
V
V
V
= V+ = V- = 0V, Transmitter Output = ±2V
300
10M
±35
-
-
CC
Output Short-Circuit Current
Output Leakage Current
RECEIVER INPUTS
= 0V
-
-
±60
±25
mA
μA
OUT
OUT
= ±12V, V
= 0V or 3V to 5.5V, SHDN = GND
CC
Input Voltage Range
Full
Full
Full
Full
Full
25
-25
0.6
0.8
-
-
25
-
V
V
Input Threshold Low
V
V
V
V
= 3.3V
= 5.0V
= 3.3V
= 5.0V
1.2
1.5
1.5
1.8
0.3
5
CC
CC
CC
CC
-
V
Input Threshold High
2.4
2.4
-
V
-
V
Input Hysteresis
Input Resistance
-
V
Full
3
7
kΩ
4
ISL83220E
Electrical Specifications Test Conditions: V = 3V to 5.5V, C - C = 0.1μF; Unless Otherwise Specified.
CC
1
4
Typicals are at T = 25°C (Continued)
A
TEMP
(°C)
PARAMETER
TIMING CHARACTERISTICS
Maximum Data Rate
TEST CONDITIONS
MIN
TYP
MAX
UNITS
R = 3kΩ, C = 1000pF, One Transmitter Switching
Full
25
250
500
1.0
1.0
-
-
-
kbps
μs
L
L
Transmitter Propagation Delay
Transmitter Input to
Transmitter Output,
R = 3kΩ, C = 1000pF
t
t
-
-
PHL
PLH
25
μs
L
L
Receiver Propagation Delay
Receiver Input to Receiver
Output, C = 150pF
L
t
t
25
25
25
25
25
Full
25
25
-
-
0.20
0.30
200
200
100
100
-
-
-
μs
μs
PHL
PLH
Receiver Output Enable Time
Receiver Output Disable Time
Transmitter Skew
Normal Operation
Normal Operation
-
-
ns
-
-
ns
t
t
- t
PHL PLH
(Note 2)
-
500
1000
30
30
ns
Receiver Skew
- t
PHL PLH
-
ns
Transition Region Slew Rate
V
= 3.3V,
C = 150pF to 2500pF
4
6
V/μs
V/μs
CC
L
R = 3kΩ to 7kΩ,
L
C = 150pF to 1000pF
-
L
Measured From 3V to -3V or
-3V to 3V
ESD PERFORMANCE
RS-232 Pins (T
, R
)
Human Body Model
25
25
25
25
-
-
-
-
±15
±8
-
-
-
-
kV
kV
kV
kV
OUT IN
IEC61000-4-2 Contact Discharge
IEC61000-4-2 Air Gap Discharge
Human Body Model
±15
±3
All Other Pins
NOTE:
2. Transmitter skew is measured at the transmitter zero crossing points.
these transmitters deliver true RS-232 levels over a wide
range of single supply system voltages.
Detailed Description
The ISL83220E operates from a single +3V to +5.5V supply,
guarantees a 250kbps minimum data rate, requires only four
small external 0.1μF capacitors, features low power
consumption, and meets all ElA RS-232C and V.28
specifications. The circuit is divided into three sections: The
charge pump, the transmitter, and the receiver.
The transmitter output disables and assumes a high
impedance state when the device enters the powerdown
mode (see Table 2). This output may be driven to ±12V when
disabled.
All devices guarantee a 250kbps data rate for full load
Charge-Pump
conditions (3kΩ and 1000pF), V
≥ 3.0V. Under more
≥ 3.3V, R = 3kΩ, and C = 250pF,
CC
typical conditions of V
Intersil’s new 3.3V family utilizes regulated on-chip dual
charge pumps as voltage doublers, and voltage inverters to
CC
L
L
the ISL83220E easily operates at 900kbps.
generate ±5.5V transmitter supplies from a V
supply as
CC
Transmitter inputs float if left unconnected, and may cause
increases.
low as 3.0V. This allows these devices to maintain RS-232
compliant output levels over the ±10% tolerance range of
3.3V powered systems. The efficient on-chip power supplies
require only four small, external 0.1μF capacitors for the
I
CC
Receivers
The ISL83220E device contains a standard inverting
receiver that three-states via the EN control line. Receivers
convert RS-232 signals to CMOS output levels and accept
inputs up to ±25V while presenting the required 3kΩ to 7kΩ
input impedance (see Figure 1) even if the power is off
voltage doubler and inverter functions, even at V
= 3.3V.
CC
The charge pumps operate discontinuously (i.e., they turn off
as soon as the V+ and V- supplies are pumped up to the
nominal values), resulting in significant power savings.
(V
= 0V). The receiver’s Schmitt trigger input stage uses
CC
Transmitters
hysteresis to increase noise immunity and decrease errors
due to slow input signal transitions.
The transmitters are proprietary, low dropout, inverting
drivers that translate TTL/CMOS inputs to EIA/TIA-232
output levels. Coupled with the on-chip ±5.5V supplies,
5
ISL83220E
The ISL83220E receiver disables only when EN is driven
high. (see Table 2). This allows the receiver to monitor
external devices, like a modem, even when the ISL83220E
TABLE 2. POWERDOWN AND ENABLE LOGIC TRUTH TABLE
SHDN
EN TRANSMITTER RECEIVER
MODE OF
INPUT INPUT
OUTPUT
OUTPUT
OPERATION
is in its 1μA powerdown state.
L
L
L
High-Z
Active
Manual Powerdown
Standard receivers driving powered down peripherals must
be disabled to prevent current flow through the peripheral’s
protection diodes (see Figure 2). This renders them useless
for wake up functions.
H
High-Z
High-Z
Manual Powerdown
w/Rcvr. Disabled
H
H
L
Active
Active
Active
Normal Operation
H
High-Z
Normal Operation
w/Rcvr. Disabled
V
CC
R
R
1IN
1OUT
V
CC
V
CC
GND ≤ V
≤ V
-25V ≤ V
≤ +25V
5kΩ
ROUT
CC
RIN
GND
CURRENT
FLOW
V
CC
FIGURE 1. INVERTING RECEIVER CONNECTIONS
V
= V
CC
OUT
Rx
Operation Down to 2.7V
ISL83220E transmitter outputs meet RS-562 levels (±3.7V),
POWERED
DOWN
UART
at the full data rate, with V
as low as 2.7V. RS-562 levels
CC
Tx
typically ensure interoperability with RS-232 devices.
OLD
RS-232 CHIP
SHDN = GND
GND
Powerdown Functionality
This 3V family of RS-232 interface devices requires a
nominal supply current of 0.3mA during normal operation
(not in powerdown mode), which is considerably less than
the 5mA to 11mA current required of 5V RS-232 devices.
The already low current requirement drops significantly
when the device enters powerdown mode. In powerdown,
supply current drops to 1μA, because the on-chip charge
FIGURE 2. POWER DRAIN THROUGH POWERED DOWN
PERIPHERAL
Receiver ENABLE Control
The ISL83220E also features an EN input to control the
receiver output. Driving EN high disables the receiver output
placing it in a high impedance state. This is useful to
eliminate supply current, due to a receiver output forward
biasing the protection diode, when driving the input of a
pump turns off (V+ collapses to V , V- collapses to GND),
CC
and the transmitter outputs three-state. This micro-power
mode makes these devices ideal for battery powered and
portable applications.
powered down (V
CC
= GND) peripheral (see Figure 2).
Software Controlled (Manual) Powerdown
Capacitor Selection
On the ISL83220E, the powerdown control is via a simple
shutdown (SHDN) pin. Driving this pin high enables normal
operation, while driving it low forces the IC into it’s
The charge pumps require 0.1μF capacitors for 3.3V
operation. Do not use values smaller than 0.1μF. Increasing
the capacitor values (by a factor of 2) reduces ripple on the
transmitter outputs and slightly reduces power consumption.
When using minimum required capacitor values, make sure
that capacitor values do not degrade excessively with
temperature. If in doubt, use capacitors with a larger nominal
value. The capacitor’s equivalent series resistance (ESR)
usually rises at low temperatures and it influences the
amount of ripple on V+ and V-.
powerdown state. Connect SHDN to V
if the powerdown
CC
function isn’t needed. Note that the receiver output remains
enabled during shutdown (see Table 2). For the lowest
power consumption during powerdown, the receiver should
also be disabled by driving the EN input high (see next
section). The time to recover from manual powerdown mode
is typically 100μs.
Power Supply Decoupling
In most circumstances a 0.1μF bypass capacitor is
adequate. In applications that are particularly sensitive to
power supply noise, decouple V
to ground with a
CC
capacitor of the same value as the charge-pump capacitor C .
1
Connect the bypass capacitor as close as possible to the IC.
6
ISL83220E
Transmitter Output when Exiting
Powerdown
5V/DIV
T1
IN
Figure 3 shows the response of the transmitter output when
exiting powerdown mode. As it activates, the transmitter
output properly goes to RS-232 levels, with no glitching,
ringing, nor undesirable transients. The transmitter is loaded
with 3kΩ in parallel with 2500pF. Note that the transmitter
enables only when the magnitude of the supplies exceed
approximately 3V.
T1
OUT
R1
OUT
V
= +3.3V
5V/DIV
SHDN
CC
C1 - C4 = 0.1µF
T
= LOW
IN
5µs/DIV
FIGURE 5. LOOPBACK TEST AT 120kbps
2V/DIV
5V/DIV
T1
T
= HIGH
IN
IN
V
= +3.3V
CC
C1 - C4 = 0.1µF
TIME (20µs/DIV)
FIGURE 3. TRANSMITTER OUTPUT WHEN EXITING
POWERDOWN
T1
OUT
High Data Rates
The ISL83220E maintains the RS-232 ±5V minimum
transmitter output voltages even at high data rates. Figure 4
details a transmitter loopback test circuit, and Figure 5
illustrates the loopback test result at 120kbps. For this test,
the transmitter is driving an RS-232 load in parallel with
1000pF, at 120kbps. Figure 6 shows the loopback results for
the transmitter driving 1000pF and an RS-232 load at
250kbps.
R1
OUT
V
= +3.3V
CC
C1 - C4 = 0.1µF
2µs/DIV
FIGURE 6. LOOPBACK TEST AT 250kbps
Interconnection with 3V and 5V Logic
V
CC
The ISL83220E directly interfaces with 5V CMOS and TTL
logic families. Nevertheless, with the device at 3.3V, and the
logic supply at 5V, AC, HC, and CD4000 outputs can drive
ISL83220E inputs, but ISL83220E outputs do not reach the
+
0.1μF
V
CC
V+
V-
+
C1+
C1-
C2+
C2-
+
C
minimum V for these logic families. See Table 4 for more
1
2
IH
C
3
4
information.
ISL83220E
+
C
C
+
T
T
IN
OUT
1000pF
R
IN
R
OUT
EN
5K
V
SHDN
CC
FIGURE 4. TRANSMITTER LOOPBACK TEST CIRCUIT
7
ISL83220E
determines an IC’s ability to withstand the ESD transients
TABLE 3. LOGIC FAMILY COMPATIBILITY WITH VARIOUS
SUPPLY VOLTAGES
typically present during handling and manufacturing. Due to
the random nature of these events, each pin is tested with
respect to all other pins. The RS-232 pins on “E” family
devices can withstand HBM ESD events to ±15kV.
SYSTEM
V
CC
POWER-SUPPLY SUPPLY
VOLTAGE
(V)
VOLTAGE
(V)
COMPATIBILITY
IEC61000-4-2 Testing
3.3
3.3
Compatible with all CMOS
families.
The IEC61000 test method applies to finished equipment,
rather than to an individual IC. Therefore, the pins most likely
to suffer an ESD event are those that are exposed to the
outside world (the RS-232 pins in this case), and the IC is
tested in its typical application configuration (power applied)
rather than testing each pin-to-pin combination. The lower
current limiting resistor coupled with the larger charge
storage capacitor yields a test that is much more severe than
the HBM test. The extra ESD protection built into this
device’s RS-232 pins allows the design of equipment
meeting level 4 criteria without the need for additional board
level protection on the RS-232 port.
5
5
Compatible with all TTL and
CMOS logic families.
5
3.3
Compatible with ACT and HCT
CMOS, and with TTL.
ISL83220E outputs are
incompatible with AC, HC, and
CD4000 CMOS inputs.
±15kV ESD Protection
All pins on ISL8XXX devices include ESD protection
structures, but the ISL8XXXE family incorporates advanced
structures which allow the RS-232 pins (transmitter outputs
and receiver inputs) to survive ESD events up to ±15kV. The
RS-232 pins are particularly vulnerable to ESD damage
because they typically connect to an exposed port on the
exterior of the finished product. Simply touching the port
pins, or connecting a cable, can cause an ESD event that
might destroy unprotected ICs. These new ESD structures
protect the device whether or not it is powered up, protect
without allowing any latchup mechanism to activate, and
don’t interfere with RS-232 signals as large as ±25V.
AIR-GAP DISCHARGE TEST METHOD
For this test method, a charged probe tip moves toward the
IC pin until the voltage arcs to it. The current waveform
delivered to the IC pin depends on approach speed,
humidity, temperature, etc., so it is difficult to obtain
repeatable results. The “E” device RS-232 pins withstand
±15kV air-gap discharges.
CONTACT DISCHARGE TEST METHOD
During the contact discharge test, the probe contacts the
tested pin before the probe tip is energized, thereby
eliminating the variables associated with the air-gap
discharge. The result is a more repeatable and predictable
test, but equipment limits prevent testing devices at voltages
higher than ±8kV. All “E” family devices survive ±8kV contact
discharges on the RS-232 pins.
Human Body Model (HBM) Testing
As the name implies, this test method emulates the ESD
event delivered to an IC during human handling. The tester
delivers the charge through a 1.5kΩ current limiting resistor,
making the test less severe than the IEC61000 test which
utilizes a 330Ω limiting resistor. The HBM method
Typical Performance Curves V = 3.3V, T = 25°C
CC
A
6
25
20
V
+
OUT
4
2
TRANSMITTER AT 250kbps
0
15
-SLEW
-2
-4
+SLEW
10
V
-
OUT
-6
5
0
1000
2000
3000
4000
5000
0
1000
2000
3000
4000
5000
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
FIGURE 7. TRANSMITTER OUTPUT VOLTAGE vs LOAD
CAPACITANCE
FIGURE 8. SLEW RATE vs LOAD CAPACITANCE
8
ISL83220E
Typical Performance Curves V = 3.3V, T = 25°C (Continued)
CC
A
45
40
35
30
25
20
15
10
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
NO LOAD
ALL OUTPUTS STATIC
250kbps
120kbps
20kbps
5
0
0
1000
2000
3000
4000
5000
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
LOAD CAPACITANCE (pF)
SUPPLY VOLTAGE (V)
FIGURE 9. SUPPLY CURRENT vs LOAD CAPACITANCE
WHEN TRANSMITTING DATA
FIGURE 10. SUPPLY CURRENT vs SUPPLY VOLTAGE
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
TRANSISTOR COUNT:
286
PROCESS:
Si Gate CMOS
9
ISL83220E
Thin Shrink Small Outline Plastic Packages (TSSOP)
M16.173
N
16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
MIN
INDEX
AREA
0.25(0.010)
M
B M
E
E1
-B-
GAUGE
PLANE
SYMBOL
MAX
0.043
0.006
0.037
0.012
0.008
0.201
0.177
MIN
-
MAX
1.10
0.15
0.95
0.30
0.20
5.10
4.50
NOTES
A
A1
A2
b
-
-
0.002
0.033
0.0075
0.0035
0.193
0.169
0.05
0.85
0.19
0.09
4.90
4.30
-
1
2
3
-
L
0.25
0.010
0.05(0.002)
SEATING PLANE
A
9
-A-
c
-
D
D
3
-C-
E1
e
4
α
0.026 BSC
0.65 BSC
-
A2
e
A1
c
E
0.246
0.020
0.256
0.028
6.25
0.50
6.50
0.70
-
b
0.10(0.004)
L
6
0.10(0.004) M
C
A M B S
N
16
16
7
o
o
o
o
0
8
0
8
-
α
NOTES:
Rev. 1 2/02
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AB, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.15mm (0.006
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact. (Angles in degrees)
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
10
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