ISL58115 [RENESAS]

Laser Diode Driver with APC Amplifier for Printers;
ISL58115
型号: ISL58115
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

Laser Diode Driver with APC Amplifier for Printers

PC
文件: 总9页 (文件大小:500K)
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DATASHEET  
ISL58115  
FN6671  
Rev 1.00  
July 29, 2013  
Laser Diode Driver with APC Amplifier for Printers  
The ISL58115 is a high-performance laser driver that provides  
controlled current to grounded laser diodes. A bias current is  
summed with the switched current at the IOUT output, allowing  
the user to optimize laser diode performance.  
Features  
• Voltage-controlled Output Current Source  
• Very Few External Components Needed  
• Internal LVDS Termination Resistors  
• 300MHz Switching  
Output switched current flows when the LVDS signal DATA is  
high. The output current returns to the fixed-threshold value  
when DATA is low. Complete I  
shut-off is achieved by  
OUT  
• Up to 110mA Output Current  
• Rise Time < 500ps  
holding the CHPEN low, which will override all other control  
pins.  
• Fall Time < 500ps  
A fast settling APC amplifier connects directly to the monitor  
diode. The ISL58115 does not exhibit any time-dependent  
droop since the calibration gain is stored as a digital number.  
• APC Loop for Write Power Control  
• Fast Settling APC Amplifier  
• Single +5V Supply (±10%)  
Ordering Information  
• Disable Feature for Power-Up Protection and Conserving  
Power  
PACKAGE  
PART NUMBER  
(Notes 1, 2)  
PART  
MARKING  
Tape & Reel  
(Pb-free)  
PKG.  
DWG. #  
• Zero Droop  
• Pb-Free (RoHS compliant)  
ISL58115CRZ-T13  
58115 CRZ  
24 Ld QFN  
L24.4x5B  
NOTES:  
Load Configuration  
1. Please refer to TB347 for details on reel specifications.  
• Common-cathode LD, Common-anode PD  
2. These Intersil Pb-free plastic packaged products employ special Pb-  
free material sets, molding compounds/die attach materials, and  
100% matte tin plate plus anneal (e3 termination finish, which is  
RoHS compliant and compatible with both SnPb and Pb-free  
soldering operations). Intersil Pb-free products are MSL classified at  
Pb-free peak reflow temperatures that meet or exceed the Pb-free  
requirements of IPC/JEDEC J STD-020.  
IOUT PDIN  
GND  
Applications  
• Laser Printer Applications  
• Laser Diode Current Switching  
FN6671 Rev 1.00  
July 29, 2013  
Page 1 of 9  
ISL58115  
Pin Configuration  
ISL58115  
(24 LD QFN)  
TOP VIEW  
NC  
DATA  
DATAB  
GND  
DIS  
1
2
3
4
5
6
7
19 NC  
18 GND  
17 VCC  
16 IOUT  
15 VCC  
14 VCC  
13 PDIN  
THERMAL  
PAD  
NC  
NC  
Pin Descriptions  
PIN  
PIN  
NAME  
NUMBER  
I/O  
TYPE  
LVDS  
DESCRIPTION  
DATA  
DATAB  
GND  
DIS  
2
I
I
Input data to control Laser Switching Control  
Input data to control Laser Switching Control  
Ground  
3
4, 18, 24  
5
LVDS  
Ground  
Digital  
I
I
Disable output current  
NC  
1, 6, 7, 19,  
23  
No connect  
No connect  
CHPEN  
RPS  
8
I
I
Digital  
Analog  
Analog  
Analog  
Analog  
Chip Enable; Pull High to Enable  
9
External resistor sets the Hsync detection power  
Resistors set bias threshold current. See “Applications Information” on page 7 for more details  
Bandgap derived internal reference  
RBIAS  
RSET  
IVOUT  
10  
11  
12  
O
O
Calibrate channel with an external trimpot to GND  
Adjust the IV amplifier gain  
PDIN  
VCC  
13  
14, 15, 17  
16  
I
Analog  
Power  
Analog  
TLL  
Photo Diode input to the IV amplifier  
Supply Voltage  
IOUT  
HPSB  
O
I
Laser Current Output  
20  
Hsync Power Select Enable; Active Low. During HPSB is low AND Hsync signal from photo  
detector is low, the output current is set by RPS  
CALB  
VC  
21  
22  
-
I
I
TTL  
Samples the laser power for APC; Active Low  
Analog  
Voltage Controlling Laser Switching Current; 0V to 2V input for 0% to 100% output  
Exposed Thermal Pad should be soldered to GND  
Thermal  
Pad  
NOTE: Pins with the same name are not necessary internally connected together. LDD pins must not be used for connecting together external components  
or features.  
FN6671 Rev 1.00  
July 29, 2013  
Page 2 of 9  
ISL58115  
Absolute Maximum Ratings (T = +25°C)  
Recommended Operating Conditions  
A
Voltages Applied to:  
Thermal Resistance (Typical, Notes 3, 4)  
JA (°C/W)  
42  
V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 6.0V  
CC  
All Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to V + 0.5V  
24 Ld QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
CC  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to V  
Operating Ambient Temperature Range . . . . . . . . . . . . . . . . 0°C to +85°C  
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . .+150°C  
Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C  
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below  
http://www.intersil.com/pbfree/Pb-FreeReflow.asp  
I
OUT  
CC  
LVDS Max Current Inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mA  
ESD Rating  
Human Body Model (Tested per JESD22-A114F) . . . . . . . . . . . . . . . . 3kV  
Charged Device Model (Tested per JESD22-C110D) . . . . . . . . . . . .1.5kV  
Machine Model (Tested per JESD22-A115B) . . . . . . . . . . . . . . . . . . 200V  
Latch Up (Tested per JESD78B) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100mA  
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product  
reliability and result in failures not covered by warranty.  
NOTES:  
3. is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech  
JA  
Brief TB379.  
4. For , the “case temp” location is the center of the exposed metal pad on the package underside.  
JC  
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise  
noted, all tests are at the specified temperature and are pulsed tests, therefore: T = T = T  
J
C
A
Electrical Specifications  
V
= 5.0V, DIS = Lo, T = +25°C, R  
= 3.0kΩ, unless otherwise indicated.  
CC  
A
SET  
MIN  
MAX  
PARAMETER  
DESCRIPTION  
Supply Voltage  
CONDITIONS  
(Note 5)  
TYP  
5.0  
0.3  
22  
(Note 5)  
UNIT  
V
V
4.5  
5.5  
1.0  
31  
CC  
ISdis  
IS2  
Supply Current (Disabled)  
Supply Current (Standby)  
Low Voltage Threshold  
High Voltage Threshold  
Input Low Current  
DIS = SLPEN = HPSB = Hi  
DIS = Hi  
mA  
mA  
V
V
V
All TTL inputs  
All TTL inputs  
All TTL inputs  
All TTL inputs  
1.2  
LO  
HI  
2.8  
-20  
V
I
I
-10  
µA  
µA  
V
LO  
HI  
Input High Current  
1
V
V
V
V
VCC Shut Down Voltage  
LVDS Input Level  
2.5  
0.2  
2.9  
SHUT  
LVDS  
CMR  
C
Differential, with Vcm = 1.25V  
V
LVDS Common Mode Voltage Range  
Control Voltage  
300mV  
0.2  
0.3  
2.2  
2.6  
V
P-P  
V
R
Internal LVDS Termination Resistor  
180  
TYP  
Termination  
Laser Amplifier Output  
V
= 5.0V, DIS = Lo, T = +25°C, R = 3.0kΩ, unless otherwise indicated.  
SET  
CC  
A
MIN  
(Note 5)  
MAX  
(Note 5)  
PARAMETER  
OUT  
DESCRIPTION  
CONDITIONS  
UNIT  
I
IOUT  
IOUT  
Switched Output Current  
Bias Output Current  
Output Off Current  
VC = 2.6V  
= 1k  
75  
20  
81  
35  
0
mA  
mA  
µA  
SW-max  
R
BIAS-max  
BIAS  
I
DIS pin set to HIGH  
-75  
200  
+75  
OFF  
FREQ  
Operating Frequency  
I
I
= maximum switch current  
MHz  
%/V  
ns  
OP  
OUT  
OUT  
IOUT  
I
I
I
I
Supply Sensitivity  
Rise Time  
= 20mA, V = 5V ±10%  
CC  
13  
0.5  
0.7  
5
PSRR  
OUT  
OUT  
OUT  
OUT  
t
t
10% to 90%; typical LD for printer  
90% to 10%; typical LD for printer  
R-IOUT  
F-IOUT  
Fall Time  
ns  
OUTENx_t  
on  
on Propagation Delay  
DATAx crossing to I  
OUT  
at 50% of final value  
7
ns  
FN6671 Rev 1.00  
July 29, 2013  
Page 3 of 9  
ISL58115  
Laser Amplifier Output  
V
= 5.0V, DIS = Lo, T = +25°C, R = 3.0kΩ, unless otherwise indicated.  
SET  
CC  
A
MIN  
MAX  
PARAMETER  
BW  
DESCRIPTION  
Bandwidth of VC  
CONDITIONS  
(Note 5)  
TYP  
14  
(Note 5)  
UNIT  
MHz  
VC  
APC Electrical Specifications  
V
= 5.0V, DIS = Lo, T = +25°C, R  
A
= 3.0kΩ, unless otherwise indicated.  
SET  
CC  
MIN  
MAX  
PARAMETER  
APC-50  
DESCRIPTION  
CONDITIONS  
0V to 2V step of VC  
External resistor RIV = 500  
(Note 5)  
TYP  
7.5  
(Note 5)  
UNIT  
µs  
t
APC Response Time  
IV Amplifier Gain  
IVgain  
3.1  
k  
NOTE:  
5. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization  
and are not production tested.  
Timing Diagram  
CHPEN  
DIS  
VC  
CALB  
DATA(LVDS)  
HPSB  
SET BY  
RPS  
FIXED BIAS  
LEVEL  
I
RISES TO  
OUT  
SET BY R  
BIAS  
ITS VC DEFINED  
VALUE USING  
THE LAST  
OFF  
OFF  
I
CALIBRATION  
GAIN SETTING IN  
<1µs  
OUT  
FN6671 Rev 1.00  
July 29, 2013  
Page 4 of 9  
ISL58115  
I
Control  
OUT  
CHPEN  
DIS  
DATA  
x
CALB  
x
HPSB  
I
COMMENTS  
OUT  
POWER-DOWN (SLEEP MODE)  
0
x
x
x
OFF  
OFF  
CHPEN is slow to enable  
STANDBY (FULL STANDBY CURRENT, NO I  
)
OUTS  
1
1
x
x
Full standby current, no I  
OUT  
NORMAL DRIVE  
1
0
0
0
x
x
1
0
1
1
1
1
ON, BIAS ONLY  
ON, CAL to level set by VC  
ON  
1
1
1
Hsync POWER  
1
0
x
x
1
1
0
x
Hsync power  
INVALID  
Output current defined by RPS  
INVALID LOGIC COMBINATION  
1
0
NOTE: DATA1 and DATA2: 1 implies DATA>DATAB, 0 implies DATA<DATAB  
FN6671 Rev 1.00  
July 29, 2013  
Page 5 of 9  
ISL58115  
Typical Application  
+5V  
DATA  
GND  
+
DATAB  
-
LOGIC CNTRL  
4.7µF  
VCC  
+
-
0.1µF  
SWITCHING  
DRIVER  
GAIN  
CONTROL  
68  
IOUT  
VC  
RPS  
GND  
+
LASER  
VCC  
-
VCC  
RSET  
3kΩ  
0.1µF  
RBIAS  
BANDGAP  
REF.  
3kΩ  
NC  
NC  
NC  
NC  
CALB  
HPSP  
PDIN  
-
CAL.  
POT  
+
IV AMPLIFIER  
5kΩ  
IVOUT  
NC  
DIS  
CHPEN  
GND  
LOGIC BLOCK  
FN6671 Rev 1.00  
July 29, 2013  
Page 6 of 9  
ISL58115  
During calibration mode, the internal servo control will bring the  
laser diode output power level to match the voltage control level  
set by VC voltage.  
Applications Information  
APC System Overview  
As the laser heats up (or ages) its output power declines relative  
to the applied current, so some form of power control is required.  
The laser is optically coupled to a photo-diode, so that the laser’s  
optical output can be measured. Laser optical output power is  
controlled by comparing the externally applied control voltage  
with the voltage produced by the IV-amplifier which converts the  
photo-diode’s output current into a voltage. Since the calibrated  
gain is stored as a digital number in a register, the ISL58115  
exhibits none of the time-dependent droop that is seen in most  
printers' laser diode drivers. This is of particular importance  
during high dot/inch graphics modes where the line may be  
slowed down very significantly to allow 2400 dots per inch or  
even more.  
Horizontal edge detection  
When HPSB is low, the output current is set by RPS. Asserting  
HPSB low overrides both channel data inputs. HPSB should not  
be asserted low during a calibration cycle. When HPSB is low, the  
desired output current I  
equation:  
is governed by the following  
RPS  
RPS  
CalDAC RSET  
1.05V  
(EQ. 3)  
----------------------- ---------------  
IRPS = 40   
where the CalDAC setting (from the last write power calibration)  
ensures laser temperature and aging compensation. The  
CalDAC’s units are ohms. Full scale is about 380Ω and CalDAC is  
defined as CalDAC = 255/code*380Ω.  
Fixed-Threshold Laser Bias Control  
The horizontal sync pulse is meant to be a power level that  
overrides VC calibration and sets the output current to a fixed  
level.  
When a laser is driven from below threshold to well above  
threshold, it exhibits a few cycles of a damped oscillation. The  
amplitude of this oscillation is minimized when the laser is kept  
above threshold. The “fixed” bias mode is set by asserting a logic  
Low on the SLPEN pin. To set the laser bias threshold currents,  
Typical Application  
Upon the printer being powered up, the lasers should be  
calibrated. This would establish nominal light power outputs,  
typically a few milliwatts at the laser regardless of the ambient  
temperature and also any laser aging.  
I
, connect external resistors from RBIAS pins to GND. Figure  
BIAS  
1 shows value of R  
corresponding to desired bias current.  
BIAS  
100  
Once everything is ready for printing, the paper is in position and  
the mirror-motor is phase-locked then the print line(s) can be  
written. Before, or after, the beam is over the photo-sensitive  
drum, each laser can be re-calibrated. This continual re-  
calibration will compensate for any temperature drift of the laser,  
especially at the initial warming up period.  
10  
Since the calibrated gain is stored as a digital number in a  
register, the ISL58115 exhibits no time-dependent droop. With  
no droop to degrade performance the only limitation now is the  
lasers' own temperature change along the line. This in turn can  
be compensated for to some extent by adding a data-dependent  
compensation signal to the analog VCx input pin. It may be found  
that in fast draft modes for example, that the laser temperature  
change is sufficiently small that many lines can be written before  
the laser(s) need to be re-calibrated. If the printed page has a low  
enough duty cycle, no re-calibration may be needed at all.  
1
0.1  
1
10  
R
(k)  
BIAS  
FIGURE 1. R  
vs BIAS CURRENT  
BIAS  
Scaling External Resistors  
is used to scale the switching output current. Switching  
output current, I , is the function of VC and R  
R
SET  
.
SW SET  
VC  
2
--------------- --------------  
I
= I  
Gain   
SW  
(EQ. 1)  
The ISL58115 has analog voltage inputs to allow the laser power  
level to be adjusted during the line. Typically this would be driven  
with a PWM, low bandwidth signal to compensate for the  
differing beam path length as the beam is swept from one side  
of the page to the other.  
SW  
R
R
SET  
DAC  
Where I Gain = ~17, R  
SW  
= 400.  
DAC  
R
sets bias threshold current. Figure 1 exhibits the  
BIAS  
relationship between I  
Equation 2:  
and R . The bias current is set as  
BIAS  
BIAS  
Undervoltage, overcurrent and over-temperature error conditions  
are ORed together and made available on the ERRB pin.  
InternalVref  
(EQ. 2)  
-----------------------------------  
I
= BiasChannelGain   
BIAS  
R
BIAS  
Note on Illegal Logic Combination  
In normal use, CALB going low (active) without DIS being low  
(active) would be meaningless. Likewise with HPSB going low  
(active). Therefore, a combination of these should be avoided at  
all times. If this combination is applied, the chip will not work  
properly. To exit this mode, either set CALB to Low or/and DIS to  
Hi.  
Where BiasChannelGain = ~40, InternalVref = 1.0V.  
Controlling the Sampling  
The switching levels are sampled independently. This can be  
done during the “off-paper” period.  
FN6671 Rev 1.00  
July 29, 2013  
Page 7 of 9  
ISL58115  
Power Supply Decoupling  
DIS  
Due to the high values of current being switched rapidly on and  
off, it is important to ensure that the power supply is well  
decoupled to ground. During switching, the V undergoes severe  
current transients, thus every effort should be made to decouple  
CC  
CALB  
HPSB  
the V as close to the package as possible. Symptoms that  
CC  
could arise include poor rise/fall times, current overshoot, and  
poor settling response. It is recommended that VCC inputs  
should be bypassed with 4.7µF // 100nF // 470pF to GND  
FIGURE 2. ILLEGAL COMBINATION  
Revision History  
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you  
have the latest Rev.  
DATE  
REVISION  
FN7659.1  
FN7659.0  
CHANGE  
July 29, 2013  
June 15, 2010  
Conversion to New Intersil Template.  
Initial release.  
About Intersil  
Intersil Corporation is a leader in the design and manufacture of high-performance analog, mixed-signal and power management  
semiconductors. The company's products address some of the largest markets within the industrial and infrastructure, personal  
computing and high-end consumer markets. For more information about Intersil, visit our website at www.intersil.com.  
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product  
information page found at www.intersil.com. You may report errors or suggestions for improving this datasheet by visiting  
www.intersil.com/en/support/ask-an-expert.html. Reliability reports are also available from our website at  
http://www.intersil.com/en/support/qualandreliability.html#reliability  
© Copyright Intersil Americas LLC 2010-2013. All Rights Reserved.  
All trademarks and registered trademarks are the property of their respective owners.  
For additional products, see www.intersil.com/en/products.html  
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted  
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html  
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such  
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are  
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its  
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or  
otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
FN6671 Rev 1.00  
July 29, 2013  
Page 8 of 9  
ISL58115  
Package Outline Drawing  
L24.4x5B  
24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE  
Rev 0, 10/06  
4.00  
2.50  
A
PIN 1  
PIN #1 INDEX AREA  
24X0.40  
INDEX AREA  
CHAMFER 0.40×0 X 45°  
B
20  
24  
6
6
1
19  
3.50  
0.5x6=3.00 REF  
7
13  
12  
8
0.10  
0.25±0.05  
0.10  
4X  
0.50  
M
C A B  
TOP VIEW  
0.5x4=2.00 REF  
BOTTOM VIEW  
SEE DETAIL X''  
0.10  
C
C
SEATING PLANE  
0.08  
0.90±0.10  
C
(24x0.25)  
(20x0.50)  
SIDE VIEW  
(3.50)  
(4.80 TYP)  
5
0 . 20 REF  
C
(24x0.60)  
(2.50)  
(3.80 TYP)  
0 . 00 MIN.  
0 . 05 MAX.  
TYPICAL RECOMMENDED LAND PATTERN  
DETAIL "X"  
NOTES:  
1. Dimensions are in millimeters.  
Dimensions in ( ) for Reference Only.  
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.  
3. Unless otherwise specified, tolerance : Decimal ± 0.05  
4. Dimension b applies to the metallized terminal and is measured  
between 0.20mm and 0.30mm from the terminal tip.  
5. Tiebar shown (if present) is a non-functional feature.  
6. The configuration of the pin #1 identifier is optional, but must be  
located within the zone indicated. The pin #1 indentifier may be  
either a mold or mark feature.  
FN6671 Rev 1.00  
July 29, 2013  
Page 9 of 9  

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