F6121 [RENESAS]

Dual-beam Rx Active Beamforming IC 10.7 – 12.75 GHz;
F6121
型号: F6121
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

Dual-beam Rx Active Beamforming IC 10.7 – 12.75 GHz

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中文:  中文翻译
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Dual-beam Rx Active Beamforming IC  
F6121  
10.7 12.75 GHz  
Short-Form Datasheet  
Description  
Features  
The F6121 is a 16-channel dual-beam receive active beamforming  
RFIC designed for application in Ku-Band SATCOM planar phased  
array antennas. The IC has eight RF input ports, two RF output  
ports, and 16 (8 per beam) phase/amplitude control channels. The  
eight input ports of the IC can be driven by eight single-polarized  
elements or four dual-polarized elements of an electronically  
scanned array (ESA). Each channel has 6 bits of digital phase and  
gain control resolution spanning 360° and 26dB of dynamic range,  
enabling precise beam pattern and polarization control.  
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10.7 12.75GHz operation  
Supports 4 dual-pol or 8 single-pol elements  
Two simultaneous and independent beam outputs  
360° phase control with 6-bit resolution  
26dB gain control with 0.45dB step size  
2.3V nominal single supply input  
Standard 1.8V digital logic  
IDAC for external LNA biasing  
The IC operates from a single supply of 2.1 - 2.5V. When paired  
with the Renesas F6921 LNA, it achieves a typical cascaded gain  
of 30dB, while minimizing the front end feed loss due to the  
flexibility of LNA physical placement near the antenna feeds. The  
chip includes power management features such as a low-power  
standby mode, independent enable controls on every channel, and  
a single-beam mode activated via a dedicated control pin. The  
device SPI bus and control pins operate from standard 1.8V logic  
at speeds up to 50MHz. Advanced digital modes and large on-chip  
memory allow for < 100ns beam position switching times at the  
array level, greatly reducing dead time and latency.  
Temperature compensation  
Temperature sensor w/ digital readout  
Advanced digital modes with fast beam steering  
On-chip beam-state memory  
3.8 4.6 0.9 mm, 63-pin FCBGA  
Typical Applications  
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Phased array antennas  
Finally, the compact and CTE-matched FC-BGA organic package  
with all single-ended 50ohm matched RF ports and 0.5mm pitch  
greatly simplifies the physical integration of these devices onto  
large antenna panels.  
Ku-Band SATCOM terminals  
Aerospace, maritime, and SOTM  
Block Diagram  
© 2020 Renesas Electronics Corporation  
1
June 4, 2020  
F6121 Short-Form Datasheet  
Ordering Information  
Orderable Part Number  
Package  
MSL Rating  
Carrier Type  
Tray  
Temperature  
-40°C to +85°C  
-40°C to +85°C  
F6121AVGI  
F6121AVGI8  
F6121EVS  
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3.8 4.6 0.9 mm 63-BGA  
3.8 4.6 0.9 mm 63-BGA  
Reel  
F6121 Evaluation System. Includes Digital Interface Board, RF Evaluation Board, USB Cable, Power Supply  
Cable, Digital Interconnect Cable, Evaluation Software, Device Drivers and RF De-embed Files.  
© 2020 Renesas Electronics Corporation  
2
June 4, 2020  
IMPORTANT NOTICE AND DISCLAIMER  
RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL  
SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING  
REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND  
OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED,  
INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A  
PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.  
These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible  
for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3)  
ensuring your application meets applicable standards, and any other safety, security, or other requirements. These  
resources are subject to change without notice. Renesas grants you permission to use these resources only for  
development of an application that uses Renesas products. Other reproduction or use of these resources is strictly  
prohibited. No license is granted to any other Renesas intellectual property or to any third party intellectual property.  
Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims,  
damages, costs, losses, or liabilities arising out of your use of these resources. Renesas' products are provided only subject  
to Renesas' Terms and Conditions of Sale or other applicable terms agreed to in writing. No use of any Renesas resources  
expands or otherwise alters any applicable warranties or warranty disclaimers for these products.  
(Rev.1.0 Mar 2020)  
Corporate Headquarters  
Contact Information  
TOYOSU FORESIA, 3-2-24 Toyosu,  
Koto-ku, Tokyo 135-0061, Japan  
www.renesas.com  
For further information on a product, technology, the most  
up-to-date version of a document, or your nearest sales  
office, please visit:  
www.renesas.com/contact/  
Trademarks  
Renesas and the Renesas logo are trademarks of Renesas  
Electronics Corporation. All trademarks and registered  
trademarks are the property of their respective owners.  
© 2020 Renesas Electronics Corporation. All rights reserved.  

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