3SK295 [RENESAS]

Silicon N-Channel Dual Gate MOS FET; 硅N沟道双栅MOS FET
3SK295
型号: 3SK295
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

Silicon N-Channel Dual Gate MOS FET
硅N沟道双栅MOS FET

晶体 小信号场效应晶体管 射频小信号场效应晶体管 光电二极管 栅 放大器
文件: 总7页 (文件大小:89K)
中文:  中文翻译
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3SK295  
Silicon N-Channel Dual Gate MOS FET  
REJ03G0814-0300  
(Previous ADE-208-387A)  
Rev.3.00  
Aug. 10, 2005  
Application  
UHF RF amplifier  
Features  
Low noise figure.  
NF = 2.0 dB typ. at f = 900 MHz  
Capable of low voltage operation  
Outline  
RENESAS Package code: PLSP0004ZA-A  
(Package name: MPAK-4)  
2
1. Source  
2. Gate1  
3. Gate2  
4. Drain  
3
1
4
Note: Marking is “ZQ–”  
Attention:  
This device is very sensitive to electro static discharge.  
It is recommended to adopt appropriate cautions when handling this transistor.  
Rev.3.00, Aug 10.2005, page 1 of 6  
3SK295  
Absolute Maximum Ratings  
(Ta = 25°C)  
Item  
Drain to source voltage  
Gate 1 to source voltage  
Gate 2 to source voltage  
Drain current  
Symbol  
VDS  
Ratings  
Unit  
V
12  
VG1S  
VG2S  
ID  
±8  
±8  
V
V
25  
mA  
mW  
°C  
°C  
Channel power dissipation  
Channel temperature  
Storage temperature  
Pch  
150  
Tch  
150  
Tstg  
–55 to +150  
Electrical Characteristics  
(Ta = 25°C)  
Item  
Symbol  
Min  
Typ  
Max  
Unit  
Test conditions  
Drain to source breakdown voltage  
V(BR)DSX  
12  
V
ID = 200 µA , VG1S = –3 V,  
VG2S = –3 V  
Gate 1 to source breakdown voltage V(BR)G1SS  
Gate 2 to source breakdown voltage V(BR) G2SS  
±8  
±8  
V
V
IG1 = ±10 µA, VG2S = VDS = 0  
IG2 = ±10 µA, VG1S = VDS = 0  
VG1S = ±6 V, VG2S = VDS = 0  
VG2S = ±6 V, VG1S = VDS = 0  
Gate 1 cutoff current  
Gate 2 cutoff current  
Drain current  
IG1SS  
IG2SS  
IDS(on)  
±100  
±100  
10  
nA  
nA  
mA  
0.5  
VDS = 6 V, VG1S = 0.5 V,  
VG2S = 3 V  
Gate 1 to source cutoff voltage  
Gate 2 to source cutoff voltage  
Forward transfer admittance  
VG1S(off)  
VG2S(off)  
|yfs|  
–0.5  
0
+0.5  
+1.0  
V
V
VDS = 10 V, VG2S = 3 V,  
ID = 100 µA  
VDS = 10 V, VG1S = 3 V,  
ID = 100 µA  
16  
20.8  
mS  
VDS = 6 V, VG2S = 3 V,  
ID = 10 mA, f = 1 kHz  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Power gain  
Ciss  
Coss  
Crss  
PG  
1.2  
0.6  
1.5  
0.9  
2.2  
1.2  
0.03  
pF  
pF  
pF  
dB  
dB  
VDS = 6 V, VG2S = 3 V,  
ID = 10 mA, f = 1 MHz  
0.01  
19.5  
2.0  
16  
VDS = 4 V, VG2S = 3 V,  
ID = 10 mA, f = 900 MHz  
Noise figure  
NF  
3
Rev.3.00, Aug 10.2005, page 2 of 6  
3SK295  
Main Characteristics  
Maximum Channel Power  
Dissipation Curve  
Typical Output Characteristics  
20  
16  
12  
8
200  
150  
100  
50  
Pulse test  
VG2S = 3 V  
1.2 V  
1.0 V  
0.8 V  
0.6 V  
4
VG1S = 0.4 V  
0
2
4
6
8
10  
0
50  
100  
150  
200  
Drain to Source Voltage VDS (V)  
Ambient Temperature Ta (°C)  
Drain Current vs. Gate1 to Source Voltage  
20  
Drain Current vs. Gate2 to Source Voltage  
20  
2.0 V  
VDS = 6 V  
3.0 V  
VDS = 6 V  
2.0 V  
1.5 V  
Pulse test  
Pulse test  
2.5 V  
16  
12  
8
16  
12  
8
1.5 V  
1.0 V  
1.0 V  
VG1S = 0.5 V  
4
4
VG2S = 0.5 V  
0
0
1
2
3
4
5
1
2
3
4
5
Gate1 to Source Voltage VG1S (V)  
Gate2 to Source Voltage VG2S (V)  
Forward Transfer Admittance vs.  
Gate1 to Source Voltage  
Power Gain vs. Drain Current  
25  
20  
15  
10  
30  
24  
18  
12  
6
VDS = 6 V  
f = 1 kHz  
VG2S = 3.0 V  
2.5 V  
2.0 V  
1.5 V  
VDS = 4 V  
5
0
1.0 V  
0.5 V  
VG2S = 3 V  
f = 900 MHz  
0
2.0  
20  
0.4  
0.8  
1.2  
1.6  
1
2
5
10  
Gate1 to Source Voltage VG1S (V)  
Drain Current ID (mA)  
Rev.3.00, Aug 10.2005, page 3 of 6  
3SK295  
Noise Figure vs. Drain Current  
VDS = 4 V  
Power Gain vs. Drain to Source Voltage  
25  
5
4
3
2
V
G2S = 3 V  
20  
15  
10  
5
f = 900 MHz  
VG2S = 3 V  
D = 10 mA  
1
0
I
f = 900 MHz  
0
20  
10  
1
2
5
10  
2
4
6 8  
Drain Current ID (mA)  
Drain to Source Voltage VDS (V)  
Noise Figure vs. Drain to Source Voltage  
5
4
3
2
VG2S = 3 V  
D = 10 mA  
1
I
f = 900 MHz  
0
10  
2
4
6 8  
Drain to Source Voltage VDS (V)  
Rev.3.00, Aug 10.2005, page 4 of 6  
3SK295  
S11 Parameter vs. Frequency  
S21 Parameter vs. Frequency  
Scale: 0.5 / div.  
1
.8  
90°  
1.5  
.6  
60°  
120°  
2
.4  
3
4
30°  
150°  
.2  
5
10  
.2  
.4 .6 .8 1.0 1.5 2 3 4 5 10  
0
180°  
0°  
–10  
–5  
–4  
–.2  
–30°  
–150°  
–3  
–.4  
–2  
–60°  
–.6  
–120°  
–1.5  
–.8  
–1  
–90°  
Condition:  
V
I
= 4 V, V  
= 10 mA, Zo = 50  
= 3 V  
G2S  
Condition:  
V
I
= 4 V, V = 3 V  
= 10 mA, Zo = 50 Ω  
DS  
DS  
G2S  
D
D
100 to 1000 MHz (50 MHz step)  
100 to 1000 MHz (50 MHz step)  
S12 Parameter vs. Frequency  
S22 Parameter vs. Frequency  
Scale: 0.002/ div.  
90°  
1
.8  
1.5  
60°  
120°  
.6  
2
.4  
3
30°  
150°  
4
5
.2  
0
10  
.2  
.4 .6 .8 1.0 1.5 2 3 4 5 10  
180°  
0°  
–10  
–5  
–4  
–.2  
–30°  
–150°  
–3  
–.4  
–2  
–60°  
–120°  
–.6  
–1.5  
–.8  
–90°  
–1  
Condition:  
V
I
= 4 V, V = 3 V  
= 10 mA, Zo = 50 Ω  
Condition:  
V
I
= 4 V, V  
= 10 mA, Zo = 50 Ω  
= 3 V  
G2S  
DS  
G2S  
DS  
D
D
100 to 1000 MHz (50 MHz step)  
100 to 1000 MHz (50 MHz step)  
Rev.3.00, Aug 10.2005, page 5 of 6  
3SK295  
Package Dimensions  
JEITA Package Code  
SC-61AA  
RENESAS Code  
Package Name  
MASS[Typ.]  
0.013g  
PLSP0004ZA-A  
MPAK-4 / MPAK-4V  
D
A
e
2
e
b
1
Q
c
B
B
E
HE  
Dimension in Millimeters  
Reference  
Symbol  
Min  
1.0  
0
Nom  
Max  
1.3  
0.1  
1.2  
A
A
A
A
1
2
3
L
L
P
L
1
1.0  
1.1  
0.25  
0.42  
0.62  
0.4  
A
A
A
3
b
0.35  
0.55  
0.5  
0.7  
b
b
1
2
3
x
S
A
M
e
2
e
b
b
0.6  
c
0.1  
0.13  
0.11  
0.15  
c
1
I1  
A
A
2
1
D
E
e
2.7  
3.1  
A
1.35  
1.5  
0.95  
0.85  
2.8  
1.65  
b
5
e
2
H
E
2.2  
3.0  
e
1
y
S
L
0.35  
0.15  
0.25  
0.75  
0.55  
0.65  
0.05  
0.05  
0.55  
0.75  
S
L
1
b
b1  
b3  
L
P
b
2
x
c1  
c
1
I1  
y
b
4
5
1
c
c
b
e
b
4
1.95  
0.3  
I1  
1.05  
A-A Section  
B-B Section  
Pattern of terminal position areas  
Q
Ordering Information  
Part Name  
Quantity  
Shipping Container  
φ178 mm Reel, 8 mm Emboss Taping  
3SK295ZQ-TL-E  
3000  
Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of  
production before ordering the product.  
Rev.3.00, Aug 10.2005, page 6 of 6  
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
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Colophon .3.0  

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