2SK3081 [RENESAS]

Silicon N Channel MOS FET High Speed Power Switching; 硅N沟道MOS FET高速电源开关
2SK3081
型号: 2SK3081
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

Silicon N Channel MOS FET High Speed Power Switching
硅N沟道MOS FET高速电源开关

晶体 开关 晶体管 功率场效应晶体管 电源开关 局域网
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中文:  中文翻译
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2SK3081  
Silicon N Channel MOS FET  
High Speed Power Switching  
REJ03G1064-0400  
(Previous: ADE-208-636A)  
Rev.4.00  
Sep 07,2005  
Features  
Low on-resistance  
DS(on) = 10 mtyp.  
R
4 V gate drive devices.  
High speed switching  
Outline  
RENESAS Package code: PRSS0004AC-A  
(Package name: TO-220AB)  
1. Gate  
2. Drain  
(Flange)  
3. Source  
1
2
3
S
Rev.4.00 Sep 07, 2005 page 1 of 6  
2SK3081  
Absolute Maximum Ratings  
(Ta = 25°C)  
Item  
Drain to source voltage  
Gate to source voltage  
Drain current  
Symbol  
VDSS  
VGSS  
ID  
Ratings  
Unit  
30  
V
V
±20  
45  
180  
A
Note1  
Drain peak current  
ID(pulse)  
A
Body-drain diode reverse drain current  
Channel dissipation  
IDR  
45  
A
Pch Note2  
Tch  
75  
W
°C  
°C  
Channel temperature  
150  
Storage temperature  
Tstg  
–55 to +150  
Notes: 1. PW 10µs, duty cycle 1 %  
2. Value at Tc = 25°C  
Electrical Characteristics  
(Ta = 25°C)  
Item  
Symbol  
Min  
30  
±20  
Typ  
Max  
Unit  
Test Conditions  
mA, VGS = 0  
Drain to source breakdown voltage  
Gate to source breakdown voltage  
Zero gate voltage drain current  
Gate to source leak current  
Gate to source cutoff voltage  
V(BR)DSS  
V(BR)GSS  
IDSS  
±100 µA, VDS = 0  
DS = 30 V, VGS = 0  
10  
IGSS  
VGS = ±16 V, VDS = 0  
ID = 1 mA, VDS = 10 V  
ID = 20 A, VGS = 10 V Note3  
ID = 20 A, VGS = 4 V Note3  
ID = 20 A, VDS = 10 V Note3  
VGS(off)  
RDS(on)  
RDS(on)  
|yfs|  
1.0  
Static drain to source on state  
resistance  
10  
mΩ  
mΩ  
S
Forward transfer admittance  
Input capacitance  
20  
Ciss  
Coss  
Crss  
td(o
10  
32  
pF  
pF  
pF  
ns  
ns  
ns  
ns  
V
VDS = 10 V, VGS = 0,  
f = 1 MHz  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
VGS = 10 V, ID = 20 A,  
RL = 0.5 Ω  
300  
180  
200  
1.0  
75  
Turn-off delay time  
Fall time  
Body–drain diode forward volta
IF = 45 A, VGS = 0  
Body–drain diode reverse  
recovery time  
rr  
ns  
IF = 45 A, VGS = 0  
diF/ dt = 50 A/ µs  
Note: 3. Pulse test  
Rev.4.00 Sep 07, 2005 page 2 of 6  
2SK3081  
Main Characteristics  
Power vs. Temperature Derating  
Maximum Safe Operation Area  
100  
75  
1000  
300  
100  
10 µs  
30  
10  
3
50  
Operation in  
this area is  
limited by R  
DS(on)  
1
25  
0.3  
0.1  
Ta = 25°C  
1 shot pulse  
0
3
30  
50  
100  
150  
200  
0.1 0.3  
1
10  
100  
Case Temperature TC (°C)  
Drain to Source Voltage VDS (V)  
Typical Output Characteristics  
er Characteristics  
10 V  
8 V  
100  
80  
60  
40  
20  
1
60  
40  
20  
6 V  
5 V  
Pulse Test  
25°C  
= –25°C  
4.5 V  
4 V  
75°C  
3.5 V  
3
VDS = 10 V  
Pulse Test  
VGS
0
0
2
4
6
8
10  
2
4
0  
Drain to Sourc(V)  
Gate to Source Voltage VGS (V)  
Drain to tion Voltage  
vs. Gate to Source Voltage  
Static Drain to Source on State  
Resistance vs. Drain Current  
100  
50  
1.0  
0.8  
0.6  
0.4  
0.2  
Pulse Test  
Pulse Test  
ID = 50 A  
20  
10  
5
VGS = 4 V  
10 V  
20 A  
10 A  
12  
0
4
8
16  
20  
1
2
5
10 20  
50 100  
Gate to Source Voltage VGS (V)  
Drain Current ID (A)  
Rev.4.00 Sep 07, 2005 page 3 of 6  
2SK3081  
Static Drain to Source on State  
Resistance vs. Temperature  
Forward Transfer Admittance  
vs. Drain Current  
50  
40  
30  
20  
50  
Pulse Test  
20  
10  
5
Tc = –25°C  
25°C  
10 A  
ID = 20 A  
75°C  
VGS = 4 V  
2
50 A  
10, 20 A  
10  
0
1
VDS = 10 V  
Pulse Test  
10 V  
0.5  
0.1  
–40  
0
40  
80  
120  
160  
0.3  
1
3
10  
30  
100  
Case Temperature TC (°C)  
Drain Current ID (A)  
Body to Drain Diode Reverse  
Recovery Time  
TCapacitance  
vource Voltage  
1000  
500  
10000  
5
Ciss  
200  
100  
50  
Coss  
500  
Crss  
200  
100  
5
20  
10  
di / dt = 50 A / µs  
VGS = 0, Ta =
VGS = 0  
f = 1 MHz  
0.1 0.3  
1
3
1
0
10  
20  
30  
40  
50  
Reverse Drain C
Drain to Source Voltage VDS (V)  
Dynamcteristics  
ID = 45 A  
Switching Characteristics  
50  
40  
30  
20  
10  
20  
1000  
500  
16  
12  
8
t
d(off)  
200  
100  
50  
VGS  
VDD = 5 V  
10 V  
VDS  
t
f
15 V  
t
r
t
d(on)  
4
0
VDD = 15 V  
10 V  
VGS = 10 V, VDD = 10 V  
PW = 5 µs, duty < 1 %  
20  
10  
5 V  
0
20  
40  
60  
80  
100  
0.1 0.3  
1
3
10  
30  
100  
Drain Current ID (A)  
Gate Charge Qg (nc)  
Rev.4.00 Sep 07, 2005 page 4 of 6  
2SK3081  
Reverse Drain Current vs.  
Source to Drain Voltage  
100  
80  
60  
40  
20  
10 V  
5 V  
VGS = 0, –5 V  
Pulse Test  
0
0.4  
0.8  
1.2  
1.6  
2.0  
Source to Drain Voltage VSD (V)  
Normalized Transient Thermal Impedance vs. Pulse Wi
3
1
= 25°C  
D = 1  
0.5  
0.3  
0.1  
θ
γ
θ
ch – c(t) = s (t) ch – c  
ch – c = 1.67°C/W, Tc = 25°C  
PW  
T
P
DM  
D =  
0.03  
0.01  
PW  
T
10 µ  
m  
10 m  
100 m  
1
10  
Pulse Width PW (S)  
Switching uit  
Vin Monitor  
Waveform  
Vout  
Monitor  
90%  
D.U.T.  
RL  
10%  
10%  
Vin  
Vout  
10%  
VDD  
= 30 V  
Vin  
10 V  
50 Ω  
90%  
90%  
t
t
d(on)  
t
f
t
d(off)  
r
Rev.4.00 Sep 07, 2005 page 5 of 6  
2SK3081  
Package Dimensions  
JEITA Package Code  
SC-46  
RENESAS Code  
PRSS0004AC-A  
Package Name  
MASS[Typ.]  
1.8g  
Unit: mm  
TO-220AB / TO-220ABV  
Ordering Information  
Part Name  
Quanti
Shipping Container  
2SK3081-E  
500 pcs  
Box (Sack)  
Note: For some grades, production med. Please contact the Renesas sales office to check the state of  
production before ordering t
Rev.4.00 Sep 07, 2005 page 6 of 6  
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
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