HFM106F [RECTRON]

SURFACE MOUNT GLASS PASSIVATED HIGH EFFICIENCY SILICON RECTIFIER;


型号：	HFM106F
厂家：	RECTRON SEMICONDUCTOR
描述：	SURFACE MOUNT GLASS PASSIVATED HIGH EFFICIENCY SILICON RECTIFIER 功效
文件：	总8页 (文件大小：247K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

HFM101F

THRU

HFM108F

SURFACE MOUNT GLASS PASSIVATED

HIGH EFFICIENCY SILICON RECTIFIER

VOLTAGE RANGE 50 to 1000 Volts CURRENT 1.0 Ampere

FEATURES

* Glass passivated device

* Ideal for surface mounted applications

* Low leakage current

* Metallurgically bonded construction

* Mounting position: Any

SMAF

(

2.8 0.110

)

2.4 0.094

(

MAX 1.05

(

)

0.15 0.006

(

)

0.11 0.004

MECHANICAL DATA

* Epoxy: Device has UL flammability classification 94V-O

(

)

13 0.051

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25 ^oC ambient temperature unless otherwise specified.

resistive or inductive load.

(

)

0.028.

0.7

Dimensions in millimeters and (inches)

MAXIMUM RATINGS (@ T

=25 C unless otherwise noted)

SYMBOL HFM101F HFM102F HFM103F HFM104F HFM105F HFM106F HFM107F HFM108F UNITS

RATINGS

V_RRM

V_RMS

V_DC

100

200

140

200

300

210

300

400

280

400

600

420

600

800

490

800

1000

700

Volts

Maximum Recurrent Peak Reverse Voltage

Maximum RMS Voltage

100

Maximum DC Blocking Voltage

1000

Maximum Average Forward Rectified Current

I_O

1.0

Amps

at T = 50 C

Peak Forward Surge Current 8.3 ms single half sine-wave

superimposed on rated load (JEDEC method)

I_FSM

Current Squared Time

⁰C/W

⁰C

Typical Thermal Resistance (Note 1)

Typical Junction Capacitance (Note 2)

Operating Temperature Range

J L

J A

C_J

T_J

T_STG

150

Storage Temperature Range

-55 to + 150

ELECTRICAL CHARACTERISTICS(@T

=25 C unless otherwise noted)

HFM101F HFM102F HFM103F HFM104F HFM105F HFM106F HFM107F HFM108F

CHARACTERISTICS

Maximum Instantaneous Forward Voltage at 1.0A DC

SYMBOL

V_F

UNITS

Volts

1.0

1.3

1.7

Maximum Full Load Reverse Current, Full

cycle Average T =55 C

I_R

@T_A= 25^oC

@T_A= 150^oC

Maximum Average Reverse Current

at Rated DC Blocking Voltage

5.0

1.0

Maximum Reverse Recovery Time (Note 4)

nSec

trr

NOTES : 1. Thermal Resistance : Mounted on PCB.

2019-07

REV:B

2. Measured at 1 MHz and applied reverse voltage of 4.0 volts.

3. “ ROHS compliant”

4. Test Conditions: I = 0.5A, I = -1.0A, I = -0.25A.

RATING AND CHARACTERISTICS CURVES ( HFM101F THRU HFM108F )

trr

+0.5A

50 Ω

NONINDUCTIVE

10Ω

NONINDUCTIVE

( - )

D.U.T

( + )

PULSE

25 Vdc

(approx)

( - )

GENERATOR

(NOTE 2)

-0.25A

( + )

OSCILLOSCOPE

(NOTE 1)

NON-

INDUCTIVE

NOTES: 1 Rise Time = 7ns max. Input Impedance =

1 megohm. 22pF.

-1.0A

2. Rise Time = 10ns max. Source Impedance =

1cm

50 ohms.

SET TIME BASE FOR 20/1 ns/cm

FIG.1 TEST CIRCUIT DIAGRAM AND REVERSE RECOVERY TIME CHARACTERISTIC

1.0

10000

0.8

0.6

= 150 ^OC

1000

= 2 5 ^O

0.4

0.2

1.0

0.1

Single Phase

Half Wave 60Hz

Resistive or

Inductive Load

100

125

150

175

100

120

140

AMBIENT TEMPERATURE, ( C)

PERCENT OF RATED PEAK REVERSE VOLTAGE, (%)

FIG.2 TYPICAL FORWARD CURRENT

DERATING CURVE

FIG.3 MAXIMUM REVERSE

CHARACTERISTICS

RATING AND CHARACTERISTICS CURVES ( HFM101F THRU HFM108F )

200

8.3ms Single Half Sine-Wave

(JEDED Method)

150

125

100

= 25 ^OC

3.0

1.0

HFM106F~HFM108F

0.3

0.1

HFM104F~HFM105F

HFM101F~HFM103F

0.03

0.01

Pulse Width=300uS

1% Duty Cycle

0.5

1.0

1.5

2.0

2.5

3.0

3.5

100

INSTANTANEOUS FORWARD VOLTAGE, (V)

NUMBER OF CYCLES AT 60Hz

FIG.4 MAXIMUM INSTANTANEOUS FORWARD

CHARACTERISTICS

FIG.5 MAXIMUM NON-REPETITIVE FORWARD

SURGE CURRENT

200

100

= 25 ^OC

HFM101F~HFM105F

HFM106F~HFM108F

2.0 4.0

100

0.2

0.4

REVERSE VOLTAGE, (V)

FIG.6 TYPICAL JUNCTION CAPACITANCE

Marking Description

Part No.

H X

Voltage-code

1-------50V

5-------400V

6-------600V

7-------800V

8-------1000V

V Y W W

2-------100V

3-------200V

4-------300V

Cathode Band

Year – code

Week – code

(WW:01~52)

(Y: Last digit of year&

A: 2010 , B: 2011......)

Mounting Pad Layout

0.224

(5.7)

0.098

(2.5)

0.063

(1.6)

Dimensions in inches and (millimeters)

" " " " " " "

REEL TAPING SPECIFICATIONS FOR

SURFACE MOUNT DEVICES-FLAT MELF

( SMAF )

Fig.: Configuration of FLAT MELF TAPING

(SMAF)

ITEM

SYMBOL

SMAF mm(inch)

Carrier width

Carrier length

Carrier depth

2.9 0.10 (0.114 0.004)

5.35 0.10 (0.211 0.004)

1.15 0.10 (0.045 0.004)

Sprocket hole

1.55 0.05 (0.061 0.002)

178 2.0 (7.0 0.079)

50 Min.

13 0.5 (0.512 0.020)

1.75 0.1 (0.069 0.004)

5.50 0.05 (0.217 0.002)

4.0 0.1 (0.157 0.004)

Reel outside diameter

Reel inner diameter

Feed hole diameter

Strocket hole position

Punch hole position

Punch hole pitch

Sprocket hole pitch

Embossment center

Totall tape thickness

Tape width

2.0 0.05 (0.079 0.002)

0.23 0.02 (0.009 0.001)

0.3

0.1

0.012

0.004

12.0

(0.472

)

Reel width

16.8 2.0 (0.661 0.079)

Note: 1.Devices are packed in accordance with EIA standard RS-481-D and specification given above.

2.Available on 7 inch ( 1500 ct. ) or 13 inch ( 5000 ct. ) diameter reels.

PACKAGING OF DIODE AND BRIDGE RECTIFIERS

REEL PACK

COMPONENT

SPACE

EA PER

INNER

BOX

PACKING

CODE

EA PER

REEL

REEL DIA CARTON SIZE EA PER

GROSS

TAPE SPACE

(mm)

PACKAGE

SMAF

(mm)

CARTON WEIGHT(Kg)

(mm)

-T

3,000

12,000

---

178

390*205*310 96,000 ---

---

DISCLAIMER NOTICE

Rectron Inc reserves the right to make changes without notice to any product

specification herein, to make corrections, modifications, enhancements or other

changes. Rectron Inc or anyone on its behalf assumes no responsibility or liabi-

lity for any errors or inaccuracies. Data sheet specifications and its information

contained are intended to provide a product description only. "Typical" paramet-

ers which may be included on RECTRON data sheets and/ or specifications ca-

n and do vary in different applications and actual performance may vary over ti-

me. Rectron Inc does not assume any liability arising out of the application or

use of any product or circuit.

Rectron products are not designed, intended or authorized for use in medical,

life-saving implant or other applications intended for life-sustaining or other rela-

ted applications where a failure or malfunction of component or circuitry may di-

rectly or indirectly cause injury or threaten a life without expressed written appr-

oval of Rectron Inc. Customers using or selling Rectron components for use in

such applications do so at their own risk and shall agree to fully indemnify Rect-

ron Inc and its subsidiaries harmless against all claims, damages and expendit-

ures.

HFM106F [RECTRON]

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