TGC2510-SMEVBUL [QORVO]
Ku - Band Upconverter;型号: | TGC2510-SMEVBUL |
厂家: | Qorvo |
描述: | Ku - Band Upconverter |
文件: | 总23页 (文件大小:1014K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TGC2510-SM
®
Ku - Band Upconverter
Product Description
The QORVO TGC2510-SM is a Ku-Band image reject
upconverter with integrated LO buffer amplifier and output
variable gain amplifier. The TGC2510-SM operates from an
RF of 10 to 16 GHz and LO from 6.5 to 19 GHz with IF
inputs from DC to 3.5GHz and is designed using QORVO’s
3MI DR 0.15 um pHEMT production process.
The TGC2510-SM typically provides 33 dBm of output TOI
at –10 dBm input power per tone and has a conversion gain
of 17 dB.
The TGC2510-SM is available in a low-cost, surface mount
28 lead 5x5mm QFN package and is ideally suited for Point-
to-Point Radio, and Ku-Band VSAT Ground Terminal.
28-pin 5x5 mm QFN package
Lead-free and RoHS compliant.
Product Features
Function Block Diagram
•
•
•
•
•
•
•
•
RF Frequency Range: 10 - 16 GHz
IF Frequency: DC – 3.5 GHz
LO Frequency: 6.5 – 19 GHz
LO Input Power: 0 to 6 dBm
Conversion Gain: 17 dB
OTOI: 33 dBm at max gain
Attenuation Range: 15 dB typical
Package Dimensions: 5.0 x 5.0 x 1.3 mm
Performance is typical across frequency. Please
reference electrical specification table and data plots
for more details.
Ordering Information
Part No.
Description
TGC2510-SM
Ku-Band Upconverter
TGC2510-SM EVB
LSB, Low IF Band, 1.3 to 2.45 GHz
TGC2510-SM EVB
LSB, High IF Band, 2.5 to 4.0 GH
TGC2510-SM EVB
USB, Low IF Band, 1.3 to 2.45 GHz
TGC2510-SM EVB
USB, High IF Band, 2.5 to 4.0 GHz
TGC2510-SMEVBLL
TGC2510-SMEVBLH
TGC2510-SMEVBUL
TGC2510-SMEVBUH
Applications
• VSAT
• Point-to-Point Radio
• Test Equipment & Sensors
Data Sheet Rev J, June 2020 | Subject to change without notice
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TGC2510-SM
®
Ku - Band Upconverter
Recommended Operating Conditions
Absolute Maximum Ratings
Parameter
VDRF
Rating
6 V
Parameter
Operating Temp. Range
VDRF
Min Typ. Max Units
-40
+25
+85
C
V
VDLO
6 V
5
IDRF
350 mA
100 mA
3 V
IDRF
240
-0.70
5
mA
V
IDLO
VGRF
VREF
VDLO
V
VGRF, VGLO, VGX
VCTRL
-2 to +1.5 V
3 V
IDLO
60
mA
V
VGLO
-0.63
2
IF1, IF2
-2 to +2 V
10 dBm
200 C
-65 to 125C
VREF
V
IF Input Power, 50Ω, T = 25C
Channel Temperature, Tch
Storage Temperature
VGX
-1.2
0
V
VCTRL
V
LO Input Power
0
6
dBm
These are stress ratings only, functional operation of the device at
these conditions is not implied. Extended application of Absolute
Maximum Rating conditions may reduce device reliability.
Operation of this device outside the parameter ranges given
above may cause permanent damage.
Electrical specifications are measured at specified test conditions.
Specifications are not guaranteed over all recommended operating
conditions.
Electrical Specifications
Test conditions unless otherwise noted: IF Input Power = -10 dBm, VGX = -1.2 V, VREF = 2 V, VDLO = 5 V, IDLO = 60 mA,
VDRF = 5 V, IDRF = 240 mA. VCTRL = 0 V for maximum gain.
Parameter
Conditions
Min
10
Typ
Max
16
Units
GHz
GHz
GHz
dBm
dBm
RF Frequency Range
LO Frequency Range
IF Frequency Range
LO Input Power
6.5
DC
0
19
3.5
6
Conversion Gain
Third Order Output Intercept Point,
OIP3
Third Order Output Intercept Point,
OIP3
IF=2GHz
15
17
33
RF = 10 to 11.7GHz, IF=2GHz
RF = 12.7 to 15.4GHz, IF=2GHz
24
26
dBm
dBm
33
Image Rejection
25
22
dB
P1dB Output Power
dBm
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TGC2510-SM
®
Ku - Band Upconverter
Thermal and Reliability Information
Parameter
Conditions
Rating
Thermal Resistance, θJC, measured to back of package
Tbase = 85 °C
θJC = 26.1 °C/W
Tbase = 85 °C,
VDRF = 5 V, IDRF = 240 mA
VDLO = 5 V, IDLO = 60 mA
Pdiss = 1.5 W
Tch = 124 °C
Tm = 2.3 E+7 Hours
Channel Temperature (Tch), and Median Lifetime (Tm)
Tbase = 85 °C
VDRF = 5 V, IDRF = 240 mA
VDLO = 5 V, IDLO = 85 mA
Pin = -10 dBm
Channel Temperature (Tch), and Median Lifetime (Tm)
Under RF Drive
Tch = 128 °C
Tm = 1.4 E+7 Hours
Pdiss = 1.63 W
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TGC2510-SM
®
Ku - Band Upconverter
Performance Plots
IF Input Power = -10 dBm, VDLO = 5 V, IDLO = 60 mA, VDRF = 5 V, IDRF = 240 mA. VGX = -1.2 V, VREF = 2 V.
Data taken with external IF hybrid and LO nulling applied.
Conversion Gain vs. RF vs. IF
Conversion Gain vs. RF vs. IF
Vcontrol = 0 V, LO = 0 dBm, LSB, 25 °C
Vcontrol = 0 V, LO = 0 dBm, USB, 25 °C
25
20
15
10
5
25
20
15
10
5
1.0 GHz
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
2.0 GHz
3.0 GHz
3.5 GHz
0
0
10
11
12
13
14
15
16
10
11
12
13
14
15
16
RF Frequency (GHz)
RF Frequency (GHz)
Conversion Gain vs. RF vs. IF
Conversion Gain vs. RF vs. IF
Vcontrol = 0 V, LO = 6 dBm, LSB, 25 °C
Vcontrol = 0 V, LO = 6 dBm, USB, 25 °C
25
20
15
10
5
25
20
15
10
5
1.0 GHz
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
2.0 GHz
3.0 GHz
3.5 GHz
0
0
10
11
12
13
14
15
16
10
11
12
13
14
15
16
RF Frequency (GHz)
RF Frequency (GHz)
Conversion Gain vs. RF vs. IF
Conversion Gain vs. RF vs. IF
Vcontrol = 2 V, LO = 0 dBm, USB, 25 °C
Vcontrol = 2 V, LO = 0 dBm, LSB, 25 °C
5
5
0
0
-5
-5
1.0 GHz
1.0 GHz
-10
-15
-20
-10
-15
-20
2.0 GHz
3.0 GHz
3.5 GHz
2.0 GHz
3.0 GHz
3.5 GHz
10
11
12
13
14
15
16
10
11
12
13
14
15
16
RF Frequency (GHz)
RF Frequency (GHz)
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TGC2510-SM
®
Ku - Band Upconverter
Performance Plots
IF Input Power = -10 dBm, VDLO = 5 V, IDLO = 60 mA, VDRF = 5 V, IDRF = 240 mA, VGX = -1.2 V, VREF = 2 V.
Data taken with external IF hybrid and LO nulling applied.
Conversion Gain vs. RF vs. IF
Conversion Gain vs. RF vs. IF
Vcontrol = 2 V, LO = 6 dBm, USB, 25 °C
Vcontrol = 2 V, LO = 6 dBm, LSB, 25 °C
5
0
5
0
-5
-5
1.0 GHz
1.0 GHz
-10
-15
-20
-10
-15
-20
2.0 GHz
3.0 GHz
3.5 GHz
2.0 GHz
3.0 GHz
3.5 GHz
10
10
10
11
12
13
14
15
16
16
16
10
11
12
13
14
15
16
RF Frequency (GHz)
RF Frequency (GHz)
IMR vs. RF Output and IF Input
IMR vs. RF Output and IF Input
Vcontrol = 0 V, LO = 0 dBm, USB, 25 °C
Vcontrol = 0 V, LO = 0 dBm, LSB, 25 °C
50
40
30
20
10
0
50
40
30
20
10
0
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
10
11
12
13
14
15
16
11
12
13
14
15
RF Frequency (GHz)
RF Frequency (GHz)
IMR vs. RF Output and IF Input
IMR vs. RF Output and IF Input
Vcontrol = 0 V, LO = 6 dBm, LSB, 25 °C
Vcontrol = 0 V, LO = 6 dBm, USB, 25 °C
50
40
30
20
10
0
50
40
30
20
10
0
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
11
12
13
14
15
10
11
12
13
14
15
16
RF Frequency (GHz)
RF Frequency (GHz)
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TGC2510-SM
®
Ku - Band Upconverter
Performance Plots
IF Input Power = -10 dBm, VDLO = 5 V, IDLO = 60 mA, VDRF = 5 V, IDRF = 240 mA, VGX = -1.2 V, VREF = 2 V.
Data taken with external IF hybrid and LO nulling applied.
IMR vs. RF Output and IF Input
IMR vs. RF Output and IF Input
Vcontrol = 2 V, LO = 0 dBm, LSB, 25 °C
Vcontrol = 2 V, LO = 0 dBm, USB, 25 °C
50
40
30
20
10
0
50
40
30
20
10
0
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
10
11
12
13
14
15
16
10
11
12
13
14
15
16
RF Frequency (GHz)
RF Frequency (GHz)
IMR vs. RF Output and IF Input
IMR vs. RF Output and IF Input
Vcontrol = 2 V, LO = 6 dBm, LSB, 25 °C
Vcontrol = 2 V, LO = 6 dBm, USB, 25 °C
50
40
30
20
10
0
50
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
40
30
20
10
0
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
10
11
12
13
14
15
16
10
11
12
13
14
15
16
RF Frequency (GHz)
RF Frequency (GHz)
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TGC2510-SM
®
Ku - Band Upconverter
Performance Plots
IF Input Power = -10 dBm, VDLO = 5 V, IDLO = 60 mA, VDRF = 5 V, IDRF = 240 mA, VGX = -1.2 V, VREF = 2 V.
Data taken with external IF hybrid and LO nulling applied.
OIP3 vs. RF Output and IF Input
OIP3 vs. RF Output and IF Input
Vcontrol = 0 V, LO = 0 dBm, LSB, 25 °C
Vcontrol = 0 V, LO = 0 dBm, USB, 25 °C
40
35
30
25
20
15
10
5
40
35
30
25
20
15
10
5
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
0
0
10
11
12
13
14
15
16
10
11
12
13
14
15
16
RF Frequency (GHz)
RF Frequency (GHz)
OIP3 vs. RF Output and IF Input
OIP3 vs. RF Output and IF Input
Vcontrol = 0 V, LO = 6 dBm, LSB, 25 °C
Vcontrol = 0 V, LO = 6 dBm, USB, 25 °C
40
35
30
25
20
15
10
5
40
35
30
25
20
15
10
5
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
0
0
10
11
12
13
14
15
16
10
11
12
13
14
15
16
RF Frequency (GHz)
RF Frequency (GHz)
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TGC2510-SM
®
Ku - Band Upconverter
Performance Plots
IF Input Power = -10 dBm, VDLO = 5 V, IDLO = 60 mA, VDRF = 5 V, IDRF = 240 mA, VGX = -1.2 V, VREF = 2 V.
Data taken with external IF hybrid and LO nulling applied.
OIP3 vs. RF Output and IF Input
OIP3 vs. RF Output and IF Input
Vcontrol = 2 V, LO = 0 dBm, USB, 25 °C
Vcontrol = 2 V, LO = 0 dBm, LSB, 25 °C
40
35
30
25
20
15
10
5
40
35
30
25
20
15
10
5
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
0
0
10
11
12
13
14
15
16
10
11
12
13
14
15
16
RF Frequency (GHz)
RF Frequency (GHz)
OIP3 vs. RF Output and IF Input
OIP3 vs. RF Output and IF Input
Vcontrol = 2 V, LO = 6 dBm, USB, 25 °C
Vcontrol = 2 V, LO = 6 dBm, LSB, 25 °C
40
35
30
25
20
15
10
5
40
35
30
25
20
15
10
5
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
0
0
10
11
12
13
14
15
16
10
11
12
13
14
15
16
RF Frequency (GHz)
RF Frequency (GHz)
L-I Isolation vs. LO Frequency
L-I Isolation vs. LO Frequency
Vcontrol = 0 V, USB, 25 °C
Vcontrol = 0 V, LSB, 25 °C
50
40
30
20
10
0
50
40
30
20
10
0
LO = 0 dBm
LO = 6 dBm
LO = 0 dBm
LO = 6 dBm
10
11
12
13
14
15
16
10
11
12
13
14
15
16
LO Frequency (GHz)
LO Frequency (GHz)
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TGC2510-SM
®
Ku - Band Upconverter
Performance Plots
IF Input Power = -10 dBm, VDLO = 5 V, IDLO = 60 mA, VDRF = 5 V, IDRF = 240 mA, VGX = -1.2 V, VREF = 2 V.
Data taken with external IF hybrid and LO nulling applied.
L-I Isolation vs. LO Frequency
L-I Isolation vs. LO Frequency
Vcontrol = 2 V, LSB, 25 °C
Vcontrol = 2 V, USB, 25 °C
50
40
30
20
10
0
50
40
30
20
10
0
LO = 0 dBm
LO = 6 dBm
LO = 0 dBm
LO = 6 dBm
10
11
12
13
14
15
16
10
11
12
13
14
15
16
LO Frequency (GHz)
LO Frequency (GHz)
L-R Isolation vs. LO Frequency
L-R Isolation vs. LO Frequency
Vcontrol = 0 V, LSB, 25 °C
Vcontrol = 0 V, USB, 25 °C
50
50
40
30
20
10
0
40
30
20
10
0
LO = 0 dBm
LO = 6 dBm
LO = 0 dBm
LO = 6 dBm
10
11
12
13
14
15
16
10
11
12
13
14
15
16
LO Frequency (GHz)
LO Frequency (GHz)
L-R Isolation vs. LO Frequency
L-R Isolation vs. LO Frequency
Vcontrol = 2 V, LSB, 25 °C
Vcontrol = 2 V, USB, 25 °C
50
50
40
30
20
10
0
40
30
20
10
0
LO = 0 dBm
LO = 6 dBm
LO = 0 dBm
LO = 6 dBm
10
11
12
13
14
15
16
10
11
12
13
14
15
16
LO Frequency (GHz)
LO Frequency (GHz)
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TGC2510-SM
®
Ku - Band Upconverter
Performance Plots
IF Input Power = -10 dBm, VDLO = 5 V, IDLO = 60 mA, VDRF = 5 V, IDRF = 240 mA, VGX = -1.2 V, VREF = 2 V.
Data taken with external IF hybrid and LO nulling applied.
I to R Isolation vs. LO vs. IF
I to R Isolation vs. LO vs. IF
Vcontrol = 0 V, LO = 0 dBm, LSB, 25 °C
Vcontrol = 0 V, LO = 0 dBm, USB, 25 °C
80
70
60
50
40
30
20
10
0
80
70
60
50
40
30
20
10
0
1.0 GHz
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
2.0 GHz
3.0 GHz
3.5 GHz
10
11
12
13
14
15
16
16
16
10
11
12
13
14
15
16
LO Frequency (GHz)
LO Frequency (GHz)
I to R Isolation vs. LO vs. IF
I to R Isolation vs. LO vs. IF
Vcontrol = 0 V, LO = 6 dBm, LSB, 25 °C
Vcontrol = 0 V, LO = 6 dBm, USB, 25 °C
80
70
60
50
40
30
20
10
0
80
70
60
50
40
30
20
10
0
1.0 GHz
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
2.0 GHz
3.0 GHz
3.5 GHz
10
11
12
13
14
15
10
11
12
13
14
15
16
LO Frequency (GHz)
LO Frequency (GHz)
I to R Isolation vs. LO vs. IF
Vcontrol = 2 V, LO = 0 dBm, LSB, 25 °C
80
70
60
50
40
30
20
10
0
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
10
11
12
13
14
15
LO Frequency (GHz)
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TGC2510-SM
®
Ku - Band Upconverter
Performance Plots
IF Input Power = -10 dBm, VDLO = 5 V, IDLO = 60 mA, VDRF = 5 V, IDRF = 240 mA, VGX = -1.2 V, VREF = 2 V.
Data taken with external IF hybrid and LO nulling applied.
I to R Isolation vs. LO vs. IF
I to R Isolation vs. LO vs. IF
Vcontrol = 2 V, LO = 6 dBm, LSB, 25 °C
Vcontrol = 2 V, LO = 6 dBm, USB, 25 °C
80
70
60
50
40
30
20
10
0
80
70
60
50
40
30
20
10
0
1.0 GHz
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
2.0 GHz
3.0 GHz
3.5 GHz
10
11
12
13
14
15
16
10
11
12
13
14
15
16
LO Frequency (GHz)
LO Frequency (GHz)
Input 1dB Compression vs. RF Output
Input 1dB Compression vs. RF Output
Vcontrol = 0 V, LO = 0 dBm, LSB, 25 °C
Vcontrol = 0 V, LO = 0 dBm, USB, 25 °C
15
10
5
15
10
5
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
0
0
-5
-5
10
11
12
13
14
15
16
10
11
12
13
14
15
16
RF Frequency (GHz)
RF Frequency (GHz)
Input 1dB Compression vs. RF Output
Input 1dB Compression vs. RF Output
Vcontrol = 0 V, LO = 6 dBm, LSB, 25 °C
Vcontrol = 0 V, LO = 6 dBm, USB, 25 °C
15
15
10
5
10
5
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
0
0
-5
-5
10
11
12
13
14
15
16
10
11
12
13
14
15
16
RF Frequency (GHz)
RF Frequency (GHz)
Data Sheet Rev J, June 2020 | Subject to change without notice
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TGC2510-SM
®
Ku - Band Upconverter
Performance Plots
IF Input Power = -10 dBm, VDLO = 5 V, IDLO = 60 mA, VDRF = 5 V, IDRF = 240 mA, VGX = -1.2 V, VREF = 2 V.
Data taken with external IF hybrid and LO nulling applied.
Input 1dB Compression vs. RF Output
Input 1dB Compression vs. RF Output
Vcontrol = 2 V, LO = 0 dBm, LSB, 25 °C
Vcontrol = 2 V, LO = 0 dBm, USB, 25 °C
15
10
5
15
10
5
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
0
0
-5
-5
10
11
12
13
14
15
16
16
16
10
11
12
13
14
15
16
RF Frequency (GHz)
RF Frequency (GHz)
Input 1dB Compression vs. RF Output
Input 1dB Compression vs. RF Output
Vcontrol = 2 V, LO = 6 dBm, LSB, 25 °C
Vcontrol = 2 V, LO = 6 dBm, USB, 25 °C
15
10
5
15
10
5
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
1.0 GHz
2.0 GHz
3.0 GHz
3.5 GHz
0
0
-5
-5
10
11
12
13
14
15
10
11
12
13
14
15
16
RF Frequency (GHz)
RF Frequency (GHz)
Nulling Voltages vs. LO Frequency
Nulling Voltages vs. LO Frequency
LO at 3 dBm, IF = 2.5 GHz, USB, 25 °C
LO at 3 dBm, IF = 3.5 GHz, USB, 25 °C
1
1
VDI_Min Gain
VDI_Max Gain
VDQ_Min Gain
VDQ_Max gain
VDI_Min Gain
VDI_Max Gain
VDQ_Min Gain
VDQ_Max gain
0.8
0.6
0.4
0.2
0
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1
-0.2
-0.4
-0.6
-0.8
-1
10
11
12
13
14
15
10
11
12
13
14
15
16
LO Frequency (GHz)
LO Frequency (GHz)
Data Sheet Rev J, June 2020 | Subject to change without notice
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TGC2510-SM
®
Ku - Band Upconverter
Performance Plots
IF Input Power = -10 dBm, VDLO = 5 V, IDLO = 60 mA, VDRF = 5 V, IDRF = 240 mA, VGX = -1.2 V, VREF = 2 V.
Data taken with external IF hybrid and LO nulling applied.
Conversion Gain vs. RF vs. Temperature
Conversion Gain vs. RF vs. Temperature
Vcontrol = 0 V, LO = 0 dBm, LSB
Vcontrol = 0 V, LO = 0 dBm, USB
25
25
IF = 2.0 GHz
IF @ 2.0 GHz
20
15
10
5
20
15
10
5
85 °C
25 °C
-40 °C
85 °C
25 °C
-40 °C
0
0
10
11
12
13
14
15
16
10
11
12
13
14
15
16
RF Frequency (GHz)
RF Frequency (GHz)
Conversion Gain vs. RF vs. Temperature
Conversion Gain vs. RF vs. Temperature
Vcontrol = 0 V, LO = 0 dBm, USB
Vcontrol = 0 V, LO = 0 dBm, LSB
25
25
IF @ 3.5 GHz
IF = 3.5 GHz
20
15
10
5
20
15
10
5
85 °C
25 °C
-40 °C
85 °C
25 °C
-40 °C
0
0
10
11
12
13
14
15
16
10
11
12
13
14
15
16
RF Frequency (GHz)
RF Frequency (GHz)
OIP3 vs. RF Output vs. Temperature
OIP3 vs. RF Output vs. Temperature
Vcontrol = 0 V, LO = 6 dBm, USB
Vcontrol = 0 V, LO = 6 dBm, LSB
50
50
40
30
20
10
0
IF @ 2.0 GHz
IF = 2.0 GHz
40
30
20
10
0
85 °C
25 °C
-40 °C
85 °C
25 °C
-40 °C
10
11
12
13
14
15
16
10
11
12
13
14
15
16
RF Frequency (GHz)
RF Frequency (GHz)
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TGC2510-SM
®
Ku - Band Upconverter
Performance Plots
IF Input Power = -10 dBm, VDLO = 5 V, IDLO = 60 mA, VDRF = 5 V, IDRF = 240 mA, VGX = -1.2 V, VREF = 2 V.
Data taken with external IF hybrid and LO nulling applied.
OIP3 vs. RF Output vs. Temperature
OIP3 vs. RF Output vs. Temperature
Vcontrol = 0 V, LO = 6 dBm, USB
Vcontrol = 0 V, LO = 6 dBm, LSB
50
40
30
20
10
0
50
40
30
20
10
0
IF @ 3.5 GHz
IF = 3.5 GHz
85 °C
25 °C
-40 °C
85 °C
25 °C
-40 °C
10
11
12
13
14
15
16
10
11
12
13
14
15
16
RF Frequency (GHz)
RF Frequency (GHz)
IMR vs. RF Output vs. Temperature
IMR vs. RF Output vs. Temperature
Vcontrol = 0 V, LO = 0 dBm, LSB
Vcontrol = 0 V, LO = 0 dBm, USB
50
50
IF = 2.0 GHz
IF @ 2.0 GHz
40
30
20
10
0
40
30
20
10
0
85 °C
25 °C
-40 °C
85 °C
25 °C
-40 °C
10
11
12
13
14
15
16
10
11
12
13
14
15
16
RF Frequency (GHz)
RF Frequency (GHz)
IMR vs. RF Output vs. Temperature
IMR vs. RF Output vs. Temperature
Vcontrol = 0 V, LO = 0 dBm, LSB
Vcontrol = 0 V, LO = 0 dBm, USB
50
40
30
20
10
0
50
40
30
20
10
0
IF @ 3.5 GHz
IF = 3.5 GHz
85 °C
25 °C
-40 °C
85 °C
25 °C
-40 °C
10
11
12
13
14
15
16
10
11
12
13
14
15
16
RF Frequency (GHz)
RF Frequency (GHz)
Data Sheet Rev J, June 2020 | Subject to change without notice
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TGC2510-SM
®
Ku - Band Upconverter
Mixing Products
IF Input Power = -10 dBm, VDLO = 5 V, IDLO = 60 mA, VDRF = 5 V, IDRF = 240 mA. VGX = -1.2 V, VREF = 2 V.
Data taken with external IF hybrid and LO nulling applied.
M x N Spurious Outputs for LSB
LO = 0 – 6 dBm, 25 °C; All values are in dBc.
For LSB IF = 2.0 GHz: LO = 12.0 GHz to 18.0 GHz; IF = 3.5 GHz: LO = 13.5 GHz to 19.0 GHz.
Spurious Suppresion (dBc) for IF = 2.0 GHz
Spurious Suppresion (dBc) for IF = 3.5 GHz
RF/LO
0
1
2
3
RF/LO
0
1
2
3
-3
-2
-1
0
---
---
---
---
61
62
72
70
44
0
79
40
38
30
69
79
78
76
75
69
38
68
75
76
-3
-2
-1
0
---
---
---
---
51
49
85
84
50
0
75
45
59
28
64
74
70
73
71
63
34
69
74
---
24
24
44
78
21
27
64
77
1
1
2
2
3
3
M x N Spurious Outputs for USB
LO = 0 – 6 dBm, 25 °C; All values are in dBc.
For USB IF = 2.0 GHz: LO = 8.0 GHz to 14.0 GHz; IF = 3.5 GHz: LO = 6.5 GHz to 12.5 GHz.
Spurious Suppresion (dBc) for IF = 2.0 GHz
Spurious Suppresion (dBc) for IF = 3.5 GHz
RF/LO
0
1
2
3
RF/LO
0
1
2
66
33
8
3
-3
-2
-1
0
---
---
---
---
56
28
48
70
46
17
23
0
46
29
20
-17
8
44
54
15
25
26
62
71
-3
-2
-1
0
---
---
---
---
23
27
56
62
70
23
19
0
49
41
14
-17
11
41
72
-29
4
1
1
2
33
43
32
66
2
30
58
38
64
3
3
Data Sheet Rev J, June 2020 | Subject to change without notice
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TGC2510-SM
®
Ku - Band Upconverter
Pin Configuration and Description
Pin No.
Label
Description
1, 7, 8, 9, 13, 14, 15, 16,
21, 22, 26, 28
GND
Internal Grounding; must be grounded on PCB.
2
RF OUT
NC
RF Output matched to 50 ohms, AC Coupled.
3, 11, 18, 19, 20
No internal connection; must be grounded on PCB.
Control Voltage. Bias network is required; see Application Circuit on
page 17 as an example.
Reference Voltage. Bias network is required; see Application Circuit on
page 17 as an example.
RF Gate Voltage. Bias network is required; see Application Circuit on
page 17 as an example.
4
5
6
VCTRL
VREF
VGRF
10
12
17
IF1
IF Input matched to 50 ohms, DC coupled.
IF Input matched to 50 ohms, DC coupled.
LO Input, matched to 50 ohms, AC coupled.
IF2
LO IN
LO Gate Voltage. Bias network is required; see Application Circuit on
page 17 as an example.
LO Drain Voltage. Bias network is required; see Application Circuit on
page 17 as an example.
Mixer Voltage. Bias network is required; see Application Circuit on page
17 as an example.
RF Drain Voltage. Bias network is required; see Application Circuit on
page 17 as an example.
23
24
25
27
VGLO
VDLO
VGX
VDRF
Backside Paddle. Multiple vias should be employed to minimize
inductance and thermal resistance; see Mounting Configuration on page
20 for suggested footprint.
29
GND
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TGC2510-SM
®
Ku - Band Upconverter
Applications Circuit
Bias-up Procedure
Bias-down Procedure
Set VGX = -1.2 V, Set VREF = 2.0 V, Set VCTRL = 0 V
Set VGLO = -1.5 V, Set VDLO = 5.0 V
Turn off RF and LO signals
Set VGX, VREF, VCTRL, VGLO, VGRF, VDI, VDQ
current limits to 10 mA
Reduced VDLO = 0 V
Reduce VDRF = 0 V
Set IDLO limit to 100 mA, Set IDRF limit to 350 mA
Increase VGLO to get IDLO = 60 mA
Set VGRF = -1.5 V, Set VDRF = 5.0 V
Increase VGRF to get IDRF = 240 mA
Set VDI, VDQ to 0V; or no connection
Set VDI = 0 V, if used for LO nulling
Set VDQ = 0 V, if used for LO nulling
Reduced VGLO = 0V, VGRF = 0 V, VREF = 0 V
Reduce VCTRL = 0 V
Apply LO and RF signals
Reduced VGX = 0 V
Data Sheet Rev J, June 2020 | Subject to change without notice
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TGC2510-SM
®
Ku - Band Upconverter
Evaluation Board (EVB) Assembly Layout
Board material is RO4003 0.008” thickness with ½ oz copper cladding.
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TGC2510-SM
®
Ku - Band Upconverter
Application Circuit Component
Bill of Material
Ref Des
Value Description
Manufacturer
Part Number
C1 – C2
10 pF
100 pF
1 µF
Cap, 0402, 50V, 5%, NPO
Cap, 0402, 50V, 5%, NPO
Cap, 0805, 25V, 5%, X5R
various
various
various
C3 - C5, C7, C13 - C15
C10 – C12, C6, C8, C9
L1 – L4
27 nH
Ind, 0201, 100 mA, 5%, SMD various
Q1
Ku-Band Up-Converter
QORVO
TGC2510-SM
LSB Configuration
Ref Des
X1
Value Description
Manufacturer
Mini-Circuits
Mini-Circuits
various
Part Number
QCN-25+
IF Quad Coupler, 1.35 to 2.45 GHz
X1
IF Quad Coupler, 2.5 to 4.0 GHz
Res, 0402, 0.01W, SMD
Res, 0402, 0.05W, 0.1%, SMD
DNP
QCN-45+
R1
0 Ω
R4
50 Ω
various
R2, R3
USB Configuration
Ref Des
X1
Value Description
Manufacturer
Mini-Circuits
Mini-Circuits
various
Part Number
QCN-25+
IF Quad Coupler, 1.35 to 2.45 GHz
IF Quad Coupler, 2.5 to 4.0 GHz
Res, 0402, 0.01W, SMD
X1
QCN-45+
R3
0 Ω
R2
50 Ω Res, 0402, 0.05W, 0.1%, SMD
various
R1, R4
DNP
Note: Due to bandwidth limitations of IF quad coupler, two versions of coupler were used on EVBs,
users need to choose low or high band of IF to be used, in addition to LSB and USB selection.
Refer to ordering information section for details.
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TGC2510-SM
®
Ku - Band Upconverter
Package Marking and Dimensions
The TGC2510-SM will be marked with the “2510” designator. The “YY” represents the last two digits of the year the part
was manufactured, the “WW” is the work week, and the “XXXX” is batch ID.
This package is lead-free/RoHS-compliant with a copper alloy base (CDA194), and the plating material on the leads is
NiPdAu. It is compatible with a lead-free (maximum 260 °C reflow temperature) soldering process.
PCB Mounting Pattern
Notes:
1.The pad pattern shown has been developed and tested for
optimized assembly at TriQuint Semiconductor. The PCB land
pattern has been developed to accommodate lead and package
tolerances. Since surface mount processes vary from company to
company, careful process development is recommended.
2.Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm diameter drill and have a final
plated thru diameter of .25 mm.
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TGC2510-SM
®
Ku - Band Upconverter
Tape and Reel Information
Standard T/R size = 500 pieces on a 7” reel.
Distance Between
Centerline (mm)
Carrier
Tape (mm) Carrier (mm)
Cover
Material
Vendor P/N
Cavity (mm)
Length Width Depth Pitch
Length
direction
(P2)
Width
Direction
(F)
Width
(W)
Width
(W)
Vendor
(A0)
(B0)
(K0)
(P1)
QFN0500X0
500F-L500
Tek-Pak
5.3
5.3
1.65
8.0
2.00
5.50
12.0
9.20
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TGC2510-SM
®
Ku - Band Upconverter
Assembly Notes
Compatible with lead-free soldering processes with 260°C peak reflow temperature.
This package is air-cavity and non-hermetic, and therefore cannot be subjected to aqueous washing. The use of no-clean
solder to avoid washing after soldering is highly recommended.
Contact plating: Ni-Pd-Au.
Solder rework not recommended.
Recommended Soldering Temperature Profile
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TGC2510-SM
®
Ku - Band Upconverter
Handling Precautions
Parameter
Rating
Standard
Caution!
ESD-Sensitive Device
ESDꢀ–ꢀHuman Body Model (HBM)
Class 0
ESDAꢁ/ꢁJEDEC JS-001-2012
MSLꢀ–ꢀMoisture Sensitivity Level
Level 1
IPC/JEDEC J-STD-020
RoHS Compliance
This product is compliant with the 2011/65/EU RoHS directive (Restrictions on the Use of Certain Hazardous Substances
Electrical and Electronic Equipment), as amended by Directive 2015/863/EU. This product also has the following attributes:
•
•
•
•
•
•
Lead Free
Halogen Free (Chlorine, Bromine)
Antimony Free
TBBP-A (C15H12Br402) Free
PFOS Free
SVHC Free
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations:
Tel: 1-844-890-8163
Web: www.qorvo.com
Email: customer.support@qorvo.com
Important Notice
The information contained herein is believed to be reliable; however, Qorvo makes no warranties regarding the informatio
contained herein and assumes no responsibility or liability whatsoever for the use of the information contained herein. A
information contained herein is subject to change without notice. Customers should obtain and verify the latest releva
information before placing orders for Qorvo products. The information contained herein or any use of such information doe
not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether wi
regard to such information itself or anything described by such information. THIS INFORMATION DOES NOT CONSTITUT
A WARRANTY WITH RESPECT TO THE PRODUCTS DESCRIBED HEREIN, AND QORVO HEREBY DISCLAIMS AN
AND ALL WARRANTIES WITH RESPECT TO SUCH PRODUCTS WHETHER EXPRESS OR IMPLIED BY LAW, COURS
OF DEALING, COURSE OF PERFORMANCE, USAGE OF TRADE OR OTHERWISE, INCLUDING THE IMPLIE
WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE.
Without limiting the generality of the foregoing, Qorvo products are not warranted or authorized for use as critical componen
in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected
cause severe personal injury or death.
Copyright 2020 © Qorvo, Inc. | Qorvo is a registered trademark of Qorvo, Inc.
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