ASM3P2579AF-08TT [PULSECORE]

Low Power Peak EMI Reducing Solution; 低功耗峰值EMI降低解决方案
ASM3P2579AF-08TT
型号: ASM3P2579AF-08TT
厂家: PulseCore Semiconductor    PulseCore Semiconductor
描述:

Low Power Peak EMI Reducing Solution
低功耗峰值EMI降低解决方案

晶体 时钟发生器 微控制器和处理器 外围集成电路 光电二极管
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January 2007  
rev 1.1  
ASM3P2579A  
Low Power Peak EMI Reducing Solution  
Features  
The ASM3P2579A uses the most efficient and optimized  
modulation profile approved by the FCC and is  
implemented by using a proprietary all digital method.  
Generates an EMI optimized clock signal at the  
output.  
Integrated loop filter components.  
Operates with a 3.3 / 2.5V Supply.  
Operating current less than 4mA.  
Low power CMOS design.  
Input frequency range: 12MHz to 30MHz for 2.5V  
: 12MHz to 30MHz for 3.3V  
Generates a 1X low EMI spread spectrum clock of  
the input frequency.  
Spread Spectrum Enable Control.  
Frequency deviation: ±1% @ 24MHz  
Available in 6 pin TSOT-23, 8 pin SOIC and 8 pin  
TSSOP Packages.  
The ASM3P2579A modulates the output of a single PLL  
in order to “spread” the bandwidth of a synthesized clock,  
and more importantly, decreases the peak amplitudes of  
its harmonics. This results in significantly lower system  
EMI compared to the typical narrow band signal produced  
by oscillators and most frequency generators. Lowering  
EMI by increasing a signal’s bandwidth is called ‘spread  
spectrum clock generation’.  
Applications  
The ASM3P2579A is targeted towards all portable  
devices with very low power requirements like MP3  
players and digital still cameras.  
Product Description  
The ASM3P2579A is  
a versatile spread spectrum  
Key Specifications  
frequency modulator designed specifically for a wide  
range of clock frequencies. The ASM3P2579A reduces  
electromagnetic interference (EMI) at the clock source,  
allowing system wide reduction of EMI of all clock  
dependent signals. The ASM3P2579A allows significant  
system cost savings by reducing the number of circuit  
board layers ferrite beads, shielding that are traditionally  
required to pass EMI regulations.  
Description  
Supply voltages  
Cycle-to-Cycle Jitter  
Output Duty Cycle  
Modulation Rate Equation  
Frequency Deviation  
Specification  
VDD = 3.3V/2.5V  
200pS (Max)  
45/55% (worst case)  
FIN/640  
±1% @ 24MHz  
Block Diagram  
VDD  
SSON  
PLL  
Modulation  
XIN  
Crystal  
Frequency  
Divider  
Oscillator  
Output  
Divider  
Phase  
Loop  
XOUT  
VCO  
Detector  
Filter  
Feedback  
Divider  
ModOUT  
VSS  
PulseCore Semiconductor Corporation  
1715 S. Bascom Ave Suite 200, Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018  
www.pulsecoresemi.com  
Notice: The information in this document is subject to change without notice.  
January 2007  
rev 1.1  
ASM3P2579A  
Pin Configuration (6-pin TSOT-23 Package)  
SSON  
XOUT  
1
2
3
6
5
4
VSS  
ASM3P2579A  
ModOUT  
VDD  
XIN/CLKIN  
Pin Description  
Pin# Pin Name Type  
Description  
When SSON is HIGH, the spread spectrum is enabled and when LOW, it turns off the  
spread spectrum. Connect the pin to ground When Spread Spectrum feature is not  
required.  
1
SSON  
I
2
3
XOUT  
O
I
Crystal connection. If using an external reference, this pin must be left unconnected.  
Crystal connection or external reference frequency input. This pin has dual functions. It  
can be connected either to an external crystal or an external reference clock.  
XIN/CLKIN  
4
5
6
VDD  
ModOUT  
VSS  
P
O
P
Power supply for the entire chip  
Spread spectrum clock output.  
Ground connection.  
Low Power Peak EMI Reducing Solution  
2 of 12  
Notice: The information in this document is subject to change without notice.  
January 2007  
rev 1.1  
ASM3P2579A  
Pin Configuration (8-pin SOIC and TSSOP Packages)  
XIN/CLKIN  
XOUT  
SSON  
NC  
VDD  
1
2
3
8
7
6
5
NC  
ASM3P2579A  
ModOUT  
VSS  
4
Pin Description  
Pin# Pin Name Type  
Description  
Crystal connection or external reference frequency input. This pin has dual functions. It  
1
2
XIN/CLKIN  
XOUT  
I
can be connected either to an external crystal or an external reference clock.  
Crystal connection. If using an external reference, this pin must be left unconnected.  
O
When SSON is HIGH, the spread spectrum is enabled and when LOW, it turns off the  
spread spectrum. Connect the pin to ground When Spread Spectrum feature is not  
required.  
SSON  
3
I
4
5
6
7
8
NC  
VSS  
-
P
O
-
No connect.  
Ground connection.  
Spread spectrum clock output.  
No connect.  
ModOUT  
NC  
VDD  
P
Power supply for the entire chip  
Modulation Profile  
Specifications  
Description  
Frequency Range  
Specification  
12MHz < CLKIN < 30MHz  
FIN/640  
Modulation Equation  
Frequency Deviation  
±1% @ 24MHz  
Low Power Peak EMI Reducing Solution  
3 of 12  
Notice: The information in this document is subject to change without notice.  
January 2007  
ASM3P2579A  
rev 1.1  
Absolute Maximum Ratings  
Symbol  
VDD, VIN  
TSTG  
TA  
Ts  
Parameter  
Voltage on any pin with respect to Ground  
Rating  
-0.5 to +4.6  
-65 to +125  
-40 to +85  
260  
Unit  
V
°C  
°C  
°C  
°C  
Storage temperature  
Operating temperature  
Max. Soldering Temperature (10 sec)  
Junction Temperature  
TJ  
150  
Static Discharge Voltage  
TDV  
2
KV  
(As per JEDEC STD22- A114-B)  
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect  
device reliability.  
DC Electrical Characteristics for 2.5V Supply  
(Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated)  
Symbol  
VIL  
Parameter  
Min  
VSS - 0.3  
Typ  
-
-
-
-
3
3
-
Max  
0.8  
VDD + 0.3  
Unit  
V
V
µA  
µA  
mA  
mA  
V
Input low voltage  
Input high voltage  
Input low current  
Input high current  
VIH  
IIL  
IIH  
2.0  
-
-
-
-
-
1.8  
-
-
2.375  
-
-
-35  
35  
-
-
0.6  
-
-
-
IXOL  
IXOH  
VOL  
VOH  
IDD  
ICC  
VDD  
tON  
XOUT output low current (@0.5V, VDD=2.5V)  
XOUT output high current (@1.8V, VDD=2.5V)  
Output low voltage (VDD = 2.5V, IOL = 8mA)  
Output high voltage (VDD = 2.5V, IOH = 8mA)  
Static supply current *  
Dynamic supply current (2.5V, 24MHz and no load)  
Operating Voltage  
Power-up time (first locked cycle after power-up)  
Output impedance  
-
V
1.1  
3.5  
2.5  
-
mA  
mA  
V
mS  
2.625  
5
-
ZOUT  
50  
* XIN/CLKIN is made low.  
AC Electrical Characteristics for 2.5V Supply  
Symbol  
CLKIN  
Parameter  
Min  
Typ  
-
Max  
30  
30  
-
Unit  
MHz  
MHz  
Input frequency  
12  
12  
-
ModOUT  
Output frequency  
-
Input Frequency = 12MHz  
Input Frequency = 30MHz  
±1.65  
±0.80  
1.5  
1.0  
-
fd  
Frequency Deviation  
%
-
-
tLH*  
tHL*  
tJC  
Output rise time (measured from 0.7V to 1.7V)  
Output fall time (measured from 1.7V to 0.7V)  
Jitter (cycle to cycle)  
0.7  
0.4  
-
1.9  
1.1  
200  
55  
nS  
nS  
pS  
%
tD  
Output duty cycle  
45  
50  
* tLH and tHL are measured into a capacitive load of 15pF  
Low Power Peak EMI Reducing Solution  
4 of 12  
Notice: The information in this document is subject to change without notice.  
January 2007  
rev 1.1  
ASM3P2579A  
DC Electrical Characteristics for 3.3V Supply  
(Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated)  
Symbol  
VIL  
Parameter  
Min  
VSS - 0.3  
Typ  
-
-
-
-
3
3
-
Max  
0.8  
VDD + 0.3  
Unit  
V
V
µA  
µA  
mA  
mA  
V
Input low voltage  
Input high voltage  
Input low current  
Input high current  
VIH  
IIL  
IIH  
2.0  
-
-
-
-
-
2.5  
-
-
2.7  
-
-
-35  
35  
-
-
0.4  
-
-
-
IXOL  
IXOH  
VOL  
VOH  
IDD  
ICC  
VDD  
tON  
XOUT output low current (@0.4V, VDD=3.3V)  
XOUT output high current (@2.5V, VDD=3.3V)  
Output low voltage (VDD = 3.3V, IOL = 8mA)  
Output high voltage (VDD = 3.3V, IOH = 8mA)  
Static supply current*  
Dynamic supply current (3.3V, 24MHz and no load)  
Operating Voltage  
Power-up time (first locked cycle after power-up)  
Output impedance  
-
V
1.2  
4.0  
3.3  
-
mA  
mA  
V
mS  
3.6  
5
-
ZOUT  
45  
* XIN/CLKIN is made low.  
AC Electrical Characteristics for 3.3V Supply  
Symbol  
CLKIN  
Parameter  
Min  
Typ  
-
Max  
30  
30  
-
Unit  
MHz  
MHz  
Input frequency  
12  
12  
-
ModOUT  
Output frequency  
-
Input Frequency = 12MHz  
Input Frequency = 30MHz  
±1.65  
±0.80  
1.4  
1.0  
-
fd  
Frequency Deviation  
%
-
-
tLH*  
tHL*  
tJC  
Output rise time (measured from 0.8 to 2.0V)  
Output fall time (measured at 2.0V to 0.8V)  
Jitter (cycle to cycle)  
0.5  
0.4  
-
1.7  
1.2  
200  
55  
nS  
nS  
pS  
%
tD  
Output duty cycle  
45  
50  
*tLH and tHL are measured into a capacitive load of 15pF  
Low Power Peak EMI Reducing Solution  
5 of 12  
Notice: The information in this document is subject to change without notice.  
January 2007  
rev 1.1  
ASM3P2579A  
Typical Crystal Oscillator Circuit  
R1 = 510  
Crystal  
C1 = 27 pF  
C2 = 27 pF  
Typical Crystal Specifications  
Fundamental AT cut parallel resonant crystal  
Nominal frequency  
14.31818MHz  
Frequency tolerance  
Operating temperature range  
Storage temperature  
± 50 ppm or better at 25°C  
-25°C to +85°C  
-40°C to +85°C  
18pF  
Load capacitance  
Shunt capacitance  
ESR  
7pF maximum  
25  
Low Power Peak EMI Reducing Solution  
6 of 12  
Notice: The information in this document is subject to change without notice.  
January 2007  
rev 1.1  
ASM3P2579A  
Package Information  
6-pin TSOT-23 Package  
Dimensions  
Millimeters  
Symbol  
Inches  
Min  
Max  
Min  
Max  
A
A1  
A2  
b
0.04  
1.00  
0.10  
0.90  
0.50  
0.00  
0.033  
0.012  
0.004  
0.036  
0.02  
0.00  
0.84  
0.30  
H
D
B
0.005 BSC  
0.114 BSC  
0.06 BSC  
0.127 BSC  
2.90 BSC  
1.60 BSC  
0.950 BSC  
2.80 BSC  
e
0.0374 BSC  
0.11 BSC  
C
L
0.0118  
0°  
0.02  
4°  
0.30  
0°  
0.50  
4°  
θ
Low Power Peak EMI Reducing Solution  
7 of 12  
Notice: The information in this document is subject to change without notice.  
January 2007  
rev 1.1  
ASM3P2579A  
8-Pin SOIC Package  
H
E
D
A2  
A
C
θ
e
A1  
L
B
Dimensions  
Symbol  
Inches  
Millimeters  
Min  
Max  
0.010  
0.069  
0.059  
0.020  
0.010  
Min  
0.10  
1.35  
1.25  
0.31  
0.18  
Max  
0.25  
1.75  
1.50  
0.51  
0.25  
A1  
A
0.004  
0.053  
0.049  
0.012  
0.007  
A2  
B
C
D
E
0.193 BSC  
0.154 BSC  
0.050 BSC  
0.236 BSC  
4.90 BSC  
3.91 BSC  
1.27 BSC  
6.00 BSC  
e
H
L
0.016  
0°  
0.050  
8°  
0.41  
0°  
1.27  
8°  
θ
Low Power Peak EMI Reducing Solution  
8 of 12  
Notice: The information in this document is subject to change without notice.  
January 2007  
rev 1.1  
ASM3P2579A  
8-Pin TSSOP Package  
H
E
D
A2  
A
C
θ
e
A1  
L
B
Dimensions  
Inches  
Symbol  
Millimeters  
Min  
Max  
Min  
Max  
A
A1  
A2  
B
0.043  
1.10  
0.15  
0.95  
0.30  
0.20  
3.10  
4.50  
0.002  
0.033  
0.008  
0.004  
0.114  
0.169  
0.006  
0.037  
0.012  
0.008  
0.122  
0.177  
0.05  
0.85  
0.19  
0.09  
2.90  
4.30  
c
D
E
e
0.026 BSC  
0.252 BSC  
0.65 BSC  
6.40 BSC  
H
L
0.020  
0°  
0.028  
8°  
0.50  
0°  
0.70  
8°  
θ
Low Power Peak EMI Reducing Solution  
9 of 12  
Notice: The information in this document is subject to change without notice.  
January 2007  
rev 1.1  
ASM3P2579A  
Ordering Information  
Part Number  
ASM3P2579AF-06OR  
ASM3P2579AF-08TT  
ASM3P2579AF-08TR  
ASM3P2579AF-08ST  
ASM3P2579AF-08SR  
ASM3P2579AG-06OR  
ASM3P2579AG-08TT  
ASM3P2579AG-08TR  
ASM3P2579AG-08ST  
ASM3P2579AG-08SR  
ASM3I2579AF-06OR  
ASM3I2579AF-08TT  
ASM3I2579AF-08TR  
ASM3I2579AF-08ST  
ASM3I2579AF-08SR  
ASM3I2579AG-06OR  
ASM3I2579AG-08TT  
ASM3I2579AG-08TR  
ASM3I2579AG-08ST  
ASM3I2579AG-08SR  
Marking  
S4LL  
Package Type  
6-Pin TSOT-23, TAPE & REEL, Pb Free  
Temperature  
Commercial  
Commercial  
Commercial  
Commercial  
Commercial  
Commercial  
Commercial  
Commercial  
Commercial  
Commercial  
Industrial  
3P2579AF  
3P2579AF  
3P2579AF  
3P2579AF  
S3LL  
8-Pin TSSOP, TUBE, Pb Free  
8-Pin TSSOP, TAPE & REEL, Pb Free  
8-Pin SOIC, TUBE, Pb Free  
8-Pin SOIC, TAPE & REEL, Pb Free  
6-Pin TSOT-23, TAPE & REEL, Green  
8-Pin TSSOP, TUBE, Green  
3P2579AG  
3P2579AG  
3P2579AG  
3P2579AG  
S5LL  
8-Pin TSSOP, TAPE & REEL, Green  
8-Pin SOIC, TUBE, Green  
8-Pin SOIC, TAPE & REEL, Green  
6-Pin TSOT-23, TAPE & REEL, Pb Free  
8-Pin TSSOP, TUBE, Pb Free  
3I2579AF  
3I2579AF  
3I2579AF  
3I2579AF  
S6LL  
Industrial  
8-Pin TSSOP, TAPE & REEL, Pb Free  
8-Pin SOIC, TUBE, Pb Free  
Industrial  
Industrial  
8-Pin SOIC, TAPE & REEL, Pb Free  
6-Pin TSOT-23, TAPE & REEL, Green  
8-Pin TSSOP, TUBE, Green  
Industrial  
Industrial  
3I2579AG  
3I2579AG  
3I2579AG  
3I2579AG  
Industrial  
8-Pin TSSOP, TAPE & REEL, Green  
8-Pin SOIC, TUBE, Green  
Industrial  
Industrial  
8-Pin SOIC, TAPE & REEL, Green  
Industrial  
Low Power Peak EMI Reducing Solution  
10 of 12  
Notice: The information in this document is subject to change without notice.  
January 2007  
rev 1.1  
ASM3P2579A  
Device Ordering Information  
A S M 3 P 2 5 7 9 A F - 0 8 T R  
R = Tape & Reel, T = Tube or Tray  
O = TSOT23  
S = SOIC  
U = MSOP  
E = TQFP  
L = LQFP  
U = MSOP  
P = PDIP  
J=TSOT26  
T = TSSOP  
A = SSOP  
V = TVSOP  
B = BGA  
D = QSOP  
X = SC-70  
Q = QFN  
DEVICE PIN COUNT  
F = LEAD FREE AND RoHS COMPLIANT PART  
G = GREEN PACKAGE, LEAD FREE, and RoHS  
PART NUMBER  
X= Automotive  
I= Industrial  
P or n/c = Commercial  
(0C to +70C)  
(-40C to +125C) (-40C to +85C)  
1 = Reserved  
6 = Power Management  
7 = Power Management  
8 = Power Management  
9 = Hi Performance  
0 = Reserved  
2 = Non PLL based  
3 = EMI Reduction  
4 = DDR support products  
5 = STD Zero Delay Buffer  
PulseCore Semiconductor Mixed Signal Product  
Licensed under U.S Patent Nos 5,488,627 and 5,631,921  
Low Power Peak EMI Reducing Solution  
11 of 12  
Notice: The information in this document is subject to change without notice.  
January 2007  
rev 1.1  
ASM3P2579A  
PulseCore Semiconductor Corporation  
1715 S. Bascom Ave Suite 200  
Campbell, CA 95008  
Copyright © PulseCore Semiconductor  
All Rights Reserved  
Part Number: ASM3P2579A  
Document Version: 1.1  
Tel: 408-879-9077  
Fax: 408-879-9018  
www.pulsecoresemi.com  
Campbell, CA 95008  
Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003  
© Copyright 2007 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or  
registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their  
respective companies. PulseCore reserves the right to make changes to this document and its products at any time without  
notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein  
represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct  
this data at any time, without notice. If the product described herein is under development, significant changes to these  
specifications are possible. The information in this product data sheet is intended to be general descriptive information for  
potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or  
customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product  
described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products  
including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual  
property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from  
PulseCore). All sales of PulseCore products are made exclusively according to PulseCore’s Terms and Conditions of Sale.  
The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights,  
trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products  
for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result  
in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the  
manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use.  
Low Power Peak EMI Reducing Solution  
12 of 12  
Notice: The information in this document is subject to change without notice.  

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