LC0402FC24C [PROTEC]
200W LOW CAPACITANCE flip chip tvs array; 200瓦特低电容倒装芯片TVS阵列
| 型号： | LC0402FC24C |
| 厂家： | 
PROTEK DEVICES |
| 描述： | 200W LOW CAPACITANCE flip chip tvs array |
| 文件： | 总9页 (文件大小：623K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LC0402FC3.3C - LC0402FC36C
Only One Name Means ProTek’Tion™
200W LOW CAPACITANCE FLIP ChIP Tꢀꢁ ARRAy
DEꢁCRIPTION
The LC0402FCxxC Series Flip Chips employ advanced silicon P/N juncꢀon technology for unmatched board-level transient voltage protecꢀon against Electrostaꢀc Dis-
charge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protecꢀon, this series meets the IEC 61000-4-2 and 61000-4-4 require-
ments. These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This low capacitance series provides ESD protecꢀon greater than 25 kilovolts with a peak pulse power dissipaꢀon of 200 Waꢁs per line for an 8/20µs waveform. In ad-
diꢀon, the LC0402FCxxC series features superior clamping performance, low leakage current characterisꢀcs and a response ꢀme of less than a nanosecond. Their low
inductance virtually eliminates overshoot voltage due to package inductance.
APPLICATIONꢁ
FEATuREꢁ
• SMART Phones
• Portable Electronics
• SMART Cards
• Compaꢀble with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
• Compaꢀble with IEC 61000-4-4 (EFT): 40A, 5/50ns
• ESD Protecꢀon > 25 kilovolts
• Available in Voltages Ranging from 3.3V to 36V
• 200 Waꢁs Peak Pulse Power per Line (tp = 8/20µs)
• Bidirecꢀonal and Monolithic Structure
• Low Clamping Voltage
• Low Capacitance
• Low Leakage Current
• Protecꢀon for 1 Line
• RoHS Compliant
• REACH Compliant
MEChANICAL ChARACTERIꢁTICꢁ
• Standard EIA Chip Size: 0402
• Approximate Weight: 0.73 milligrams
• Lead-Free Plaꢀng
• Solder Reflow Temperature:
•
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
• Flammability Raꢀng UL 94V-0
• 8mm Tape per EIA Standard 481
• Top Contacts: Solder Bump 0.004” in Height (Nominal)
PIN CONFIGuRATION
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Page 1
LC0402FC3.3C - LC0402FC36C
Only One Name Means ProTek’Tion™
TyPICAL DEꢀICE ChARACTERIꢁTICꢁ
MAXIMuM RATINGꢁ @ 25°C unless Otꢂerwise ꢁpecified
PARAMETER
ꢁyMBOL
ꢀALuE
200
uNITꢁ
Waꢁs
°C
Peak Pulse Power (tp = 8/20µs) - See Figure 1
PPP
TA
Operaꢀng Temperature
Storage Temperature
-55 to 150
-55 to 150
TSTG
°C
ELECTRICAL ChARACTERIꢁTICꢁ PER LINE @ 25°C unless Otꢂerwise ꢁpecified
PART
NuMBER
(Note 1)
RATED
ꢁTANDꢃOFF
ꢀOLTAGE
MINIMuM
BREAKDOWN
ꢀOLTAGE
MAXIMuM
CLAMPING
ꢀOLTAGE
(Fig. 2)
ꢄ IP = 1A
ꢀC
MAXIMuM
CLAMPING
ꢀOLTAGE
(Fig. 2)
MAXIMuM
LEAKAGE
CuRRENT
(Note 2)
ꢄꢀWM
TyPICAL
CAPACITANCE
ꢄ0ꢀ, 1Mhz
ꢄ 1mA
ꢀꢅBRꢆ
ꢀOLTꢁ
C
pF
ꢀWM
ꢀOLTꢁ
ꢄ 8/20µꢁ
ꢀC ꢄ IPP
ID
µA
ꢀOLTꢁ
LC0402FC3.3C
LC0402FC05C
LC0402FC08C
LC0402FC12C
LC0402FC15C
LC0402FC24C
LC0402FC36C
NOTEꢁ
3.3
5.9
4.0
6.0
7.0
12.5V @ 16A
13.0V @ 15A
18.0V @ 11A
26.9V @ 7.4A
34.5V @ 5.8A
50.6V @ 4A
75*
70
35
32
30
25
20
18
11.0
13.2
19.8
25.4
37.2
70.0
10**
8.0
8.5
1
1
1
1
1
12.0
15.0
24.0
36.0
13.3
16.7
26.7
40.0
80.0V @ 2.5A
1. All devices are bidirecꢀonal. Electrical characterisꢀcs apply in both direcꢀons.
2. *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current < 500nA @ 3.3V.
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05139.R8 2/11
Page 2
LC0402FC3.3C - LC0402FC36C
Only One Name Means ProTek’Tion™
TyPICAL DEꢀICE ChARACTERIꢁTICꢁ
FIGuRE 1
PEAK PuLꢁE POWER ꢀꢁ PuLꢁE TIME
10,000
1,000
200W, 8/20µs Waveform
100
10
0.1
1
10
100
1,000
10,000
td - Pꢇlse Dꢇraꢈon - µs
FIGuRE 2
PuLꢁE WAꢀE FORM
FIGuRE 3
POWER DERATING CuRꢀE
120
100
TEST
Peak Pulse Power
8/20µs
tf
Peak Value IPP
WAVEFORM
PARAMETERS
tf = 8µs
100
80
80
60
td = 20µs
e-t
60
40
20
0
40
td = t/(IPP/2)
20
0
Average Power
0
5
10
15
20
25
30
0
25
50
75 100 125
150
t - Time - µs
TA - Ambient Temperatꢇre - °C
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05139.R8 2/11
Page 3
LC0402FC3.3C - LC0402FC36C
Only One Name Means ProTek’Tion™
TyPICAL DEꢀICE ChARACTERIꢁTICꢁ
FIGuRE 4
OꢀERꢁhOOT & CLAMPING ꢀOLTAGE FOR LC0402FC05C
35
25
15
5
-5
EꢁD Test Pꢇlse - 25 kilovolt, 1/30ns (Wavesꢂape)
FIGuRE 5
TyPICAL CLAMPING ꢀOLTAGE ꢀꢁ PEAK PuLꢁE CuRRENT LC0402FC05C
12
8
4
0
0
5
10
15
20
IPP - Peak Pꢇlse Cꢇrrent - Amps
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05139.R8 2/11
Page 4
LC0402FC3.3C - LC0402FC36C
Only One Name Means ProTek’Tion™
ꢁPICE MODEL
FIGuRE 1
ꢁPICE MODEL FOR
I/O
ABD
ABD
GND
ABD - Avalanche Breakdown Diode (TVS)
TABLE 1 ꢃ ꢁPICE PARAMETERꢁ
PARAMETER
uNIT
ABDꢅTꢀꢁꢆ
BV
IBV
Cjo
IS
V
µA
pF
A
See Table 2
1
See Table 2
See Table 2
0.6
Vj
V
M
N
-
0.33
-
1
RS
-
See Table 2
1E-8
TT
EG
s
eV
1.11
TABLE 2 ꢃ ABD ꢁPECIFIC ꢁPICE PARAMETERꢁ
PART NuMBER
LC0402FC3.3C
LC0402FC05C
LC0402FC08C
LC0402FC12C
LC0402FC15C
LC0402FC24C
LC0402FC36C
BꢀꢅꢀOLTꢁꢆ
4.0
Iꢁ ꢅAMPꢁꢆ
CjoꢅpFꢆ
70
RsꢅOhMꢁꢆ
0.20
1E-11
1E-11
1E-13
1E-13
1E-13
1E-13
1E-13
6.0
35
0.16
8.5
32
0.33
13.3
30
0.51
16.7
25
0.53
26.7
20
0.63
40.2
18
0.73
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Page 5
LC0402FC3.3C - LC0402FC36C
Only One Name Means ProTek’Tion™
ꢁOLDER REFLOW INFORMATION
PRINTED CIRCuIT BOARD RECOMMENDATIONꢁ
PARAMETER
ꢀALuE
0.275mm
Pad Size on PCB
Pad Shape
Round
Pad Definiꢀon
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)
Solder Paste Type
0.330mm Round
No Clean
Pad Protecꢀve Finish
OSP (Entek Cu Plus 106A)
±50µm
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
±20µm
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
60 seconds
270°C
REquIREMENTꢁ
RECOMMENDED NONꢃꢁOLDER MAꢁK
DEFINED PAD ILLuꢁTRATION
Non-ꢁolder Mask Defined Pad
0.275mm DIA.
Temperature:
TP for Lead-Free (Sn/Ag/Cu): 260-270°C
TP for Tin-Lead: 240-245°C
Preheat ꢀme and temperature depends on solder paste and flux acꢀva-
ꢀon temperature, component size, weight, surface area and plaꢀng.
ꢁolder Mask Opening
0.325mm DIA.
ꢁolder ꢁtencil Opening
0.330mm DIA.
Maximꢇm ꢁolder Reflow
(35-53°C Above Maximꢇm ꢁolder Melt Temp)
TP
ꢁolder Melt
(Maximꢇm Temp)
Ramp-up
Ramp-Down
Preꢂeat
(ꢁtaꢊ Below Flꢇx Acꢈvaꢈon Temp)
30-60 seconds
Ramp-up
15 seconds
(Minimize)
ꢁolder-Time
15-20 seconds
Ramp-Down
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Page 6
LC0402FC3.3C - LC0402FC36C
Only One Name Means ProTek’Tion™
0402 PACKAGE INFORMATION
OuTLINE DIMENꢁIONꢁ
MILLIMETERꢁ
MIN MAX
INChEꢁ
DIM
MIN
MAX
A
0.46
0.86
0.018
0.034
B
TOP
A
B
C
C
0.98
1.02
0.038
0.040
D
0.10
0.35
0.004
0.014
E
F
0.458
0.076
0.508
0.127
0.018
0.003
0.020
0.005
G
0.20
0.008
0.016
H
D
H
I
0.406
E
F
NOTEꢁ
1. Controlling dimensions in inches.
2. Decimal tolerance: .xxx ± 0.05mm (0.002”).
3. Maximum chip size: 1.02mm (0.040”) by 0.51mm (0.020”).
END
I
C
LAyOuT DIMENꢁIONꢁ
B
MILLIMETERꢁ
NOMINAL
0.23
INChEꢁ
D
A
DIM
NOMINAL
0.009
A
B
0.48
0.019
C
0.69
0.027
SOLDER
BUMP
D
0.46
0.018
F
E
0.99
0.039
F
0.20
0.008
DIE
H
E
G
0.20
0.008
I
H
0.66
0.026
I
0.13
0.005
NOTEꢁ
1. Controlling dimensions in inches.
2. Decimal tolerance: .xxx ± 0.05mm (0.002”).
SOLDER PRINT
DIAMETER 0.010” - 0.012”
G
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Page 7
LC0402FC3.3C - LC0402FC36C
Only One Name Means ProTek’Tion™
TAPE AND REEL INFORMATION
10 Pitches Cumulaꢀve
Tolerance on tape ± 0.2
E
P0
D
T
P2
Top Cover
Tape
F
A0
W
K0
B0
P
User Direcꢀon of Feed
ꢁPECIFICATIONꢁ
TAPE
WIDTh
REEL DIA.
A0
B0
K0
D
E
F
W
P0
P2
P
Tmax
178(7”)
8
0.70 ± 0.05 1.15 ± 0.10 0.56 ± 0.05 1.55 ± 0.05 1.75 ± 0.10 3.50 ± 0.05 8.00 ± 0.20 4.00 ± 0.05 2.00 ± 0.05 2.00 ± 0.05
0.25
NOTEꢁ
1. Dimensions in millimeters.
TAPE & REEL ORIENTATION
2. Top view of tape. Metal contacts are face down in tape package.
3. Orientaꢀon: preferred stencil - 0.1mm (0.004”).
4. Surface mount product is taped and reeled in accordance with EIA 481.
5. 8mm plasꢀc tape: 7” Reels - 5,000 (pocket under hole skipped) or 10,000 pieces per reel.
6. Marking on Reel - part number, date code and lot number.
Single Die - 0402
Package outline, pad layout and tape specificaꢀons per document number 06001.R5 8/10.
ORDERING INFORMATION
BAꢁE PART NuMBER
ꢅxx = ꢀoltageꢆ
LEADFREE ꢁuFFIX
TAPE ꢁuFFIX
qTy/REEL
REEL ꢁIZE
TuBE qTy
LC0402FCxxC
LC0402FCxxC
-LF
-LF
-T75-1
5,000
7”
7”
n/a
n/a
-T710-1
10,000
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Page 8
LC0402FC3.3C - LC0402FC36C
Only One Name Means ProTek’Tion™
COMPANy INFORMATION
COMPANy PROFILE
ProTek Devices, based in Tempe, Arizona USA, is a manufacturer of Transient Voltage Suppression (TVS) products designed specifically for
the protecꢀon of electronic systems from the effects of lightning, Electrostaꢀc Discharge (ESD), Nuclear Electromagneꢀc Pulse (NEMP), in-
ducꢀve switching and EMI/RFI. With over 25 years of engineering and manufacturing experience, ProTek designs TVS devices that provide
applicaꢀon specific protecꢀon soluꢀons for all electronic equipment/systems.
ProTek Devices Analog Products Division, also manufactures analog interface, control, RF and power management products.
CONTACT uꢁ
Corporate headꢋꢇarters
2929 South Fair Lane
Tempe, Arizona 85282
USA
Bꢊ Telepꢂone
General: 602-431-8101
Sales: 602-414-5109
Customer Service: 602-414-5114
Bꢊ Fax
General: 602-431-2288
Bꢊ E-mail:
Sales: sales@protekdevices.com
Customer Service: service@protekdevices.com
Technical Support: support@protekdevices.com
Web
www.protekdevices.com
www.protekanalog.com
COPYRIGHT © ProTek Devices 2000 - This literature is subject to all applicable copyright laws and is not for resale in any manner.
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characterisꢀcs described herein without noꢀce.
DESIGN CHANGES: ProTek reserves the right to disconꢀnue product lines without noꢀce and that the final judgement concerning selecꢀon and specificaꢀons is the buyer’s and that in furnishing engineering
and technical assistance. ProTek assumes no responsibility with respect to the selecꢀon or specificaꢀons of such products. ProTek makes no warranty, representaꢀon or guarantee regarding the suitability of
its products for any parꢀcular purpose, nor does ProTek assume any liability arising out of the applicaꢀon or use of any product or circuit and specifically disclaims any and all liability without limitaꢀon special,
consequenꢀal or incidental damages.
LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without wriꢁen consent from the factory.
PATENT INFORMATION: This device is patented under U.S. Patent No. Des. “D456,367S”.
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05139.R8 2/11
Page 9
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