SA602AD,602 [NXP]
SA602A - Double-balanced mixer and oscillator SOIC 8-Pin;
| 型号： | SA602AD,602 |
| 厂家： | 
NXP |
| 描述： | SA602A - Double-balanced mixer and oscillator SOIC 8-Pin 电信 光电二极管 电信集成电路 |
| 文件： | 总19页 (文件大小：1473K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SA602A
Double-balanced mixer and oscillator
Rev. 3 — 27 May 2014
Product data sheet
1. General description
The SA602A is a low-power VHF monolithic double-balanced mixer with input amplifier,
on-board oscillator, and voltage regulator. It is intended for high-performance, low-power
communication systems. The guaranteed parameters of the SA602A make this device
well-suited for cellular radio applications. The mixer is a ‘Gilbert cell’ multiplier
configuration which typically provides 18 dB of gain at 45 MHz. The oscillator operates to
200 MHz. It can be configured as a crystal oscillator, a tuned tank oscillator, or a buffer for
an external LO. For higher frequencies, the LO input may be externally driven. The noise
figure at 45 MHz is typically less than 5 dB. The gain, intercept performance, low-power
and noise characteristics make the SA602A a superior choice for high-performance
battery operated equipment. It is available in an 8-lead SO (surface-mount miniature
package).
2. Features and benefits
Low current consumption: 2.4 mA typical
Excellent noise figure: <4.7 dB typical at 45 MHz
High operating frequency
Excellent gain, intercept and sensitivity
Low external parts count; suitable for crystal/ceramic filters
SA602A meets cellular radio specifications
3. Applications
Cellular radio mixer/oscillator
Portable radio
VHF transceivers
RF data links
HF/VHF frequency conversion
Instrumentation frequency conversion
Broadband LANs
SA602A
NXP Semiconductors
Double-balanced mixer and oscillator
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
SO8
Description
plastic small outline package; 8 leads; body width 3.9 mm
Version
SA602AD/01
SOT96-1
4.1 Ordering options
Table 2.
Ordering options
Type number
Orderable
Package
Packing method
Minimum Temperature
part number
order
quantity
SA602AD/01
SA602AD/01,112
SA602AD/01,118
SO8
SO8
Standard marking
* IC’s tube - DSC bulk pack
2000
2500
Tamb = 40 C to +85 C
amb = 40 C to +85 C
Reel 13” Q1/T1
T
Standard mark SMD
5. Block diagram
8
7
6
5
E
B
VOLTAGE
REGULATOR
OSCILLATOR
1
2
3
4
aaa-013202
Fig 1. Block diagram
SA602A
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 3 — 27 May 2014
2 of 19
SA602A
NXP Semiconductors
Double-balanced mixer and oscillator
6. Pinning information
6.1 Pinning
SA602AD/01
1
2
3
4
8
7
6
5
IN_A
IN_B
V
CC
OSC_E
OSC_B
OUT_B
GND
OUT_A
aaa-013201
Fig 2. Pin configuration for SO8
6.2 Pin description
Table 3.
Pin description
Symbol
IN_A
Pin
1
Description
RF input A
RF input B
ground
IN_B
2
GND
3
OUT_A
OUT_B
OSC_B
OSC_E
VCC
4
mixer output A
mixer output B
5
6
oscillator input (base)
oscillator output (emitter)
supply voltage
7
8
SA602A
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 3 — 27 May 2014
3 of 19
SA602A
NXP Semiconductors
Double-balanced mixer and oscillator
7. Functional description
The SA602A is a Gilbert cell, an oscillator/buffer, and a temperature-compensated bias
network as shown in Figure 3. The Gilbert cell is a differential amplifier (IN_A and IN_B
pins) that drives a balanced switching cell. The differential input stage provides gain and
determines the noise figure and signal handling performance of the system.
18 kΩ
1.5 kΩ
4
1.5 kΩ
5
buffer
6
7
25 kΩ
BIAS
BIAS
2
1
BIAS
1.5 kΩ
1.5 kΩ
3
GND
aaa-013205
Fig 3. Equivalent circuit
The SA602A is designed for optimum low-power performance. When used with the
SA604A as a 45 MHz cellular radio second IF and demodulator, the SA602A is capable of
receiving 119 dBm signals with a 12 dB S/N ratio. Third-order intercept is typically
13 dBm (that is approximately +5 dBm output intercept because of the RF gain). The
system designer must be cognizant of this large signal limitation. When designing LANs or
other closed systems where transmission levels are high, and small-signal or
signal-to-noise issues are not critical, the input to the SA602A should be appropriately
scaled.
Besides excellent low-power performance well into VHF, the SA602A is designed to be
flexible. The input, RF mixer output and oscillator ports support various configurations
provided the designer understands certain constraints, which are explained here.
The RF inputs (IN_A and IN_B pins) are biased internally. They are symmetrical. The
equivalent AC input impedance is approximately 1.5 k 3 pF through 50 MHz. IN_A and
IN_B pins can be used interchangeably, but they should not be DC biased externally.
Figure 4 shows three typical input configurations.
SA602A
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 3 — 27 May 2014
4 of 19
SA602A
NXP Semiconductors
Double-balanced mixer and oscillator
SA602A
SA602A
SA602A
input
aaa-013216
aaa-013217
aaa-013218
a. Single-ended
tuned input
b. Balanced input
c. Single-ended
untuned input
(for attenuation of
second-order
products)
Fig 4. Input configuration
The mixer outputs (OUT_A and OUT_B pins) are also internally biased. Each output is
connected to the internal positive supply by a 1.5 k resistor. This permits direct output
termination yet allows for balanced output as well. Figure 5 shows three single-ended
output configurations and a balanced output.
SA602A
SA602A
a. Single-ended ceramic filter
SA602A
aaa-013219
aaa-013220
b. Single-ended crystal filter
SA602A
aaa-013221
aaa-013222
c. Single-ended IFT
d. Balanced output
Fig 5. Output configuration
SA602A
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 3 — 27 May 2014
5 of 19
SA602A
NXP Semiconductors
Double-balanced mixer and oscillator
The oscillator can sustain oscillation beyond 200 MHz in crystal or tuned tank
configurations. The upper limit of operation is determined by tank ‘Q’ and required drive
levels. The higher the ‘Q’ of the tank or the smaller the required drive, the higher the
permissible oscillation frequency. If the required LO is beyond oscillation limits, or the
system calls for an external LO, the external signal can be injected at OSC_B (pin 6)
through a DC blocking capacitor. External LO should be at least 200 mV (peak-to-peak).
Figure 6 shows several proven oscillator circuits. Figure 6a is appropriate for cellular
radio. As shown, an overtone mode of operation is utilized. Capacitor C3 and inductor L1
suppress oscillation at the crystal fundamental frequency. In the fundamental mode, the
suppression network is omitted.
C2
L1
XTAL
C3
C1
SA602A
SA602A
SA602A
aaa-013237
aaa-013238
aaa-013239
a. Colpitts crystal
oscillator
b. Colpitts L/C tank
oscillator
c. Hartley L/C tank
oscillator
(overtone mode)
Fig 6. Oscillator circuits
Figure 7 shows a Colpitts varactor tuned tank oscillator suitable for synthesizer-controlled
applications. It is important to buffer the output of this circuit to assure that switching
spikes from the first counter or prescaler do not end up in the oscillator spectrum. The
dual-gate MOSFET provides optimum isolation with low current. The FET offers good
isolation, simplicity, and low current, while the bipolar transistors provide the simple
solution for non-critical applications. The resistive divider in the emitter-follower circuit
should be chosen to provide the minimum input signal that assures correct system
operation.
When operated above 100 MHz, the oscillator may not start if the Q of the tank is too low.
A 22 k resistor from OSC_E (pin 7) to ground increases the DC bias current of the
oscillator transistor. This improves the AC operating characteristic of the transistor and
should help the oscillator to start. A 22 k resistor does not upset the other DC biasing
internal to the device, but smaller resistance values should be avoided.
SA602A
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 3 — 27 May 2014
6 of 19
SA602A
NXP Semiconductors
Double-balanced mixer and oscillator
5.5 μH
+6 V
10 nF
10 μF
0.1 μF
1
2
3
4
8
7
6
5
to buffer
10 pF
7 pF
SA602A
1000 pF
DC control voltage
from synthesizer
1000 pF
MV2105
or equivalent
0.06 μH
0.01 μF
100 kΩ
2 kΩ
2N918
3SK126
2 pF
to synthesizer
0.01 μF
2N5484
to synthesizer
100 kΩ
330 Ω
1.0 nF
100 kΩ
aaa-013258
Fig 7. Colpitts oscillator suitable for synthesizer applications and typical buffers
8. Application design-in information
22 pF
1 nF
0.5 μH to
1.3 μH
44.545 MHz
third overtone crystal
10 pF
5.5 μH
V
CC
6.8 μF
100 nF
10 nF
SA602A
SFG455A3
or equivalent
output
47 pF
220 pF
0.209 μH
45 MHz
RF input
to
0.283 μH
100 nF
aaa-013257
Fig 8. Typical application for cellular radio
SA602A
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 3 — 27 May 2014
7 of 19
SA602A
NXP Semiconductors
Double-balanced mixer and oscillator
9. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCC
Parameter
Conditions
Min
-
Max
9
Unit
V
supply voltage
Tstg
storage temperature
ambient temperature
65
40
+150
+85
C
C
Tamb
operating
10. Thermal characteristics
Table 5.
Symbol
Zth(j-a)
Thermal characteristics
Parameter
Conditions
Min
Max
Unit
transient thermal impedance
from junction to ambient
-
90
C/W
11. Static characteristics
Table 6.
Static characteristics
VCC = +6 V; Tamb = 25 C; unless specified otherwise.
Symbol
VCC
Parameter
Conditions
Min
Typ
-
Max
Unit
V
supply voltage
supply current
4.5
-
8.0
2.8
ICC
2.4
mA
12. Dynamic characteristics
Table 7.
Dynamic characteristics
Tamb = 25 C; VCC = +6 V; unless specified otherwise.
Symbol
fi
Parameter
Conditions
Min
Typ
500
200
5.0
Max
-
Unit
MHz
MHz
dB
input frequency
oscillator frequency
noise figure
-
-
-
-
fosc
-
NF
at 45 MHz
5.5
15
IP3i
input third-order
intercept point
RF input = 45 dBm;
RF1 = 45.0 MHz;
RF2 = 45.06 MHz
13
dBm
Gconv
Ri(RF)
Ci(RF)
Ro(mix)
conversion gain
at 45 MHz
14
1.5
-
17
-
-
dB
k
pF
k
RF input resistance
RF input capacitance
-
3
3.5
-
mixer output resistance OUT_A, OUT_B pins
-
1.5
SA602A
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 3 — 27 May 2014
8 of 19
SA602A
NXP Semiconductors
Double-balanced mixer and oscillator
13. Performance curves
aaa-013241
aaa-013242
3.5
20.0
conv
I
CC
G
(mA)
3.0
V
CC
= 8.5 V
(dB)
V
CC
= 8.5 V
6.0 V
18.0
4.5 V
2.5
2.0
1.5
6.0 V
4.5 V
16.0
14.0
−40
−20
0
20
40
60
80 90
−40
−20
0
20
40
60
amb
80 90
(°C)
T
(°C)
T
amb
Fig 9. Supply current versus temperature
Fig 10. Conversion gain versus temperature
aaa-013243
aaa-013244
−10.0
IP3
6.0
NF
(dB)
i
(dBm)
5.5
−12.0
V
= 8.5 V
6.0 V
CC
4.5 V
5.0
4.5
4.0
−14.0
−16.0
−40
−20
0
20
40
60
80 90
(°C)
−40
−20
0
20
40
60
80 90
(°C)
T
T
amb
amb
Fig 11. Third-order intercept point versus temperature Fig 12. Noise Figure versus temperature
aaa-013246
aaa-013245
−10
40
IP3
i
third-order product
IF output power
(dBm)
(dBm)
−12
−14
−16
−18
0
fund. product
−40
−80
−80
4
6
8
10
−60
−40
−20
0
20
V
(V)
RF input level (dBm)
CC
RF1 = 45 MHz; IF = 455 kHz; RF2 = 45.06 MHz
Fig 13. Third-order intercept and compression
Fig 14. Input third-order intercept point versus
supply voltage
SA602A
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 3 — 27 May 2014
9 of 19
SA602A
NXP Semiconductors
Double-balanced mixer and oscillator
14. Test information
22 pF
1 nF
0.5 μH to
1.3 μH
44.545 MHz
third overtone crystal
10 pF
5.5 μH
V
CC
6.8 μF
100 nF
10 nF
330 pF
455 kHz
303 μH
IF output
to
SA602A
560 pF
100 nF
765 μH
47 pF
220 pF
0.209 μH
to
0.283 μH
45 MHz
RF input
100 nF
aaa-013203
Fig 15. Test configuration
SA602A
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 3 — 27 May 2014
10 of 19
SA602A
NXP Semiconductors
Double-balanced mixer and oscillator
15. Package outline
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Fig 16. Package outline SOT96-1 (SO8)
SA602A
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 3 — 27 May 2014
11 of 19
SA602A
NXP Semiconductors
Double-balanced mixer and oscillator
16. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
SA602A
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 3 — 27 May 2014
12 of 19
SA602A
NXP Semiconductors
Double-balanced mixer and oscillator
16.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 17) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 8 and 9
Table 8.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350
350
220
< 2.5
235
220
2.5
220
Table 9.
Lead-free process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 17.
SA602A
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 3 — 27 May 2014
13 of 19
SA602A
NXP Semiconductors
Double-balanced mixer and oscillator
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 17. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
17. Soldering: PCB footprints
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Fig 18. PCB footprint for SOT96-1 (SO8); reflow soldering
SA602A
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 3 — 27 May 2014
14 of 19
SA602A
NXP Semiconductors
Double-balanced mixer and oscillator
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Fig 19. PCB footprint for SOT96-1 (SO8); wave soldering
18. Abbreviations
Table 10. Abbreviations
Acronym
FET
Description
Field-Effect Transistor
High Frequency
HF
IF
Intermediate Frequency
Local Area Network
LAN
LO
Local Oscillator
MOSFET
RF
Metal-Oxide Semiconductor Field-Effect Transistor
Radio Frequency
VHF
Very High Frequency
SA602A
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© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 3 — 27 May 2014
15 of 19
SA602A
NXP Semiconductors
Double-balanced mixer and oscillator
19. Revision history
Table 11. Revision history
Document ID
SA602A v.3
Release date
Data sheet status
Change notice
Supersedes
20140527
Product data sheet
-
SA602A v.2
Modifications:
• The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP
Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Section 1 “General description”, last sentence: deleted “8-lead dual in-line plastic package”
• Table 1 “Ordering information”:
–
Type number SA602AN (DIP8 package, SOT97-1 package outline) is discontinued and removed
from this data sheet
–
Type number changed from “SA602AD” to “SA602AD/01”
• Added Section 4.1 “Ordering options”
• Added Section 6.2 “Pin description”
• Figure 7 “Colpitts oscillator suitable for synthesizer applications and typical buffers”:
capacitor value corrected from “0.10 pF” to “10 nF” (above pin 8)
• Figure 8 “Typical application for cellular radio”: component value corrected from “34.545 MHz third
overtone crystal” to “44.545 MHz third overtone crystal”
• Table 5 “Thermal characteristics”: deleted characteristic values for “N package” (SA602AN)
• Old table “AC/DC electrical characteristics” split into Table 6 “Static characteristics” and
Table 7 “Dynamic characteristics”
• Table 7 “Dynamic characteristics”, Conditions for IP3i, input third-order intercept point,
corrected from “f1” to “RF1” and from “f2” to “RF2”
• Figure 15 “Test configuration”: component values corrected throughout this drawing
• Package outline SOT97-1 (DIP8) is deleted
• Added soldering information
• Added Section 17 “Soldering: PCB footprints”
• Added Section 18 “Abbreviations”
SA602A v.2
19971107
Product specification
853-1424 18662
853-1424 99374
NE/SA602A v.1
-
NE/SA602A v.1 19900417
Product specification
SA602A
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 3 — 27 May 2014
16 of 19
SA602A
NXP Semiconductors
Double-balanced mixer and oscillator
20. Legal information
20.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
20.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
20.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
SA602A
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 3 — 27 May 2014
17 of 19
SA602A
NXP Semiconductors
Double-balanced mixer and oscillator
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
20.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
21. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
SA602A
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© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 3 — 27 May 2014
18 of 19
SA602A
NXP Semiconductors
Double-balanced mixer and oscillator
22. Contents
1
General description. . . . . . . . . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3
4
4.1
5
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 4
Application design-in information . . . . . . . . . . 7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
Thermal characteristics . . . . . . . . . . . . . . . . . . 8
Static characteristics. . . . . . . . . . . . . . . . . . . . . 8
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Performance curves . . . . . . . . . . . . . . . . . . . . . 9
Test information. . . . . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
8
9
10
11
12
13
14
15
16
Soldering of SMD packages . . . . . . . . . . . . . . 12
Introduction to soldering . . . . . . . . . . . . . . . . . 12
Wave and reflow soldering . . . . . . . . . . . . . . . 12
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 12
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 13
16.1
16.2
16.3
16.4
17
18
19
Soldering: PCB footprints. . . . . . . . . . . . . . . . 14
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 16
20
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
20.1
20.2
20.3
20.4
21
22
Contact information. . . . . . . . . . . . . . . . . . . . . 18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 27 May 2014
Document identifier: SA602A
相关型号：
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