P87CL881H/000
更新时间:2024-09-18 01:52:20
品牌:NXP
描述:Low-voltage microcontroller with 63-kbyte OTP program memory and 2-kbyte RAM
P87CL881H/000 概述
Low-voltage microcontroller with 63-kbyte OTP program memory and 2-kbyte RAM 低电压微控制器,带有63 KB的OTP程序存储器和2 KB的RAM 微控制器
P87CL881H/000 规格参数
生命周期: | Obsolete | 零件包装代码: | QFP |
包装说明: | LQFP, QFP44,.47SQ,32 | 针数: | 44 |
Reach Compliance Code: | compliant | HTS代码: | 8542.31.00.01 |
风险等级: | 5.77 | 具有ADC: | NO |
地址总线宽度: | 16 | 位大小: | 8 |
CPU系列: | 8051 | 最大时钟频率: | 10 MHz |
DAC 通道: | NO | DMA 通道: | NO |
外部数据总线宽度: | 8 | JESD-30 代码: | S-PQFP-G44 |
JESD-609代码: | e3 | 长度: | 10 mm |
I/O 线路数量: | 32 | 端子数量: | 44 |
最高工作温度: | 70 °C | 最低工作温度: | -25 °C |
PWM 通道: | YES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LQFP | 封装等效代码: | QFP44,.47SQ,32 |
封装形状: | SQUARE | 封装形式: | FLATPACK, LOW PROFILE |
电源: | 3/3.3 V | 认证状态: | Not Qualified |
RAM(字节): | 2048 | ROM(单词): | 64512 |
ROM可编程性: | OTPROM | 座面最大高度: | 1.6 mm |
速度: | 10 MHz | 子类别: | Microcontrollers |
最大压摆率: | 4.8 mA | 最大供电电压: | 3.6 V |
最小供电电压: | 2.7 V | 标称供电电压: | 3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子面层: | TIN |
端子形式: | GULL WING | 端子节距: | 0.8 mm |
端子位置: | QUAD | 宽度: | 10 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER | Base Number Matches: | 1 |
P87CL881H/000 数据手册
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DATA SHEET
P87CL881H
Low-voltage microcontroller with
63-kbyte OTP program memory
and 2-kbyte RAM
1999 Apr 16
Product specification
File under Integrated Circuits, IC17
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
CONTENTS
1
2
3
4
5
FEATURES
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING INFORMATION
5.1
5.2
Pinning
Pin description
6
FUNCTIONAL DESCRIPTION
6.1
6.2
6.3
6.4
6.5
6.6
Special Function Registers
I/O facilities
Internal data memory
OTP programming
Oscillator circuitry
Non-conformance
7
LIMITING VALUES
DC CHARACTERISTICS
AC CHARACTERISTICS
AC testing
8
9
9.1
10
11
11.1
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
11.2
11.3
11.4
11.5
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
12
13
14
DEFINITIONS
LIFE SUPPORT APPLICATIONS
PURCHASE OF PHILIPS I2C COMPONENTS
1999 Apr 16
2
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
1
FEATURES
• Full static 80C51 CPU; enhanced 8-bit architecture with:
– Minimum 6 cycles per instruction (twice as fast as a
standard 80C51 core)
– Non-page oriented instructions
– Direct addressing
• Wake-up from Power-down mode via LVD or external
interrupts at Port 1
– Four 8-byte RAM register banks
• Two 16-bit timer/event counters
– Stack depth limited only by available internal RAM
(maximum 256 bytes)
• Additional 16-bit timer/event counters, with capture,
compare and PWM function
– Multiply, divide, subtract and compare instructions.
• Very low current consumption
• Watchdog Timer
• Full duplex enhanced UART with double buffering
• I2C-bus interface for serial transfer on two lines,
• Single supply voltage of 2.7 to 3.6 V
• Frequency: 1 to 10 MHz
maximum operating frequency 400 kHz.
• Operating temperature: −25 to +70 °C
• 44-pin LQFP package
2
GENERAL DESCRIPTION
• Four 8-bit ports (32 I/O lines)
The P87CL881 is an 8-bit microcontroller especially suited
for pager applications.
• 63-kbyte One-Time Programmable (OTP) program
memory; programmable in parallel mode or in-system
via I2C-bus interface.
The P87CL881 is manufactured in an advanced CMOS
technology and is based on single chip technology.
• 256-byte internal RAM
• 1792-byte internal AUX-RAM
The device is optimized for low power consumption and
has two software selectable features for power reduction:
Idle and Power-down modes. In addition, all derivative
blocks switch off their clock if they are inactive.
• External address range: 64 kbytes of ROM and
64 kbytes of RAM
• Amplitude Controlled Oscillator (ACO) suitable for use
with a quartz crystal or ceramic resonator
The instruction set of the P87CL881 is based on that of
the 80C51. The P87CL881 also functions as an arithmetic
processor having facilities for both binary and BCD
arithmetic plus bit-handling capabilities. The instruction set
consists of over 100 instructions: 49 one-byte,
46 two-byte, and 16 three-byte.
• Improved Power-on/Power-off reset circuitry (POR)
• Low Voltage Detection (LVD) with 11 software
programmable levels
• 8 interrupts on Port 1, edge or level sensitive triggering
selectable via software power-saving use for keyboard
control
This data sheet details the specific properties of the
P87CL881; for details of the P87CL881 core and the
derivative functions see the “TELX family” data sheet and
“8051-Based 8-bit Microcontrollers; Data Handbook IC20”.
• Twenty source, twenty vector interrupt structure with two
priority levels
3
ORDERING INFORMATION
TYPE
PACKAGE
PRODUCT TYPE
NUMBER(1)
NAME
DESCRIPTION
VERSION
P87CL881H/000 Blank OTP
LQFP44
plastic low profile quad flat package; SOT389-1
44 leads; body 10 × 10 × 1.4 mm
P87CL881H/xxx
Factory-programmed OTP
Note
1. Please refer to the Order Entry Form (OEF) for this device for the full type number to use when ordering. This type
number will also specify the required program and options.
1999 Apr 16
3
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(4)
INT1
(5)
(2)
(4)
(4)
(4)
V
V
V
V
V
INT2 to INT8
7
T0
T1
INT0
DD DDP
SS SSP PP
TWO 16-BIT
TIMER/
EVENT
COUNTERS
(T0, T1)
PROGRAM
MEMORY
ROM
DATA
MEMORY
RAM
DATA
MEMORY
AUX-RAM
EA
CPU
P87CL881H
80C51
core
excluding
ROM/RAM
XTAL1
XTAL2
ACO
(2)
8-bit
CLK
internal bus
PSEN
ALE
(4)
WR
(4)
RD
LVD
16-BIT
TIMER/EVENT
COUNTER WITH
CAPTURE/
COMPARE/
(T2)
(1)
AD0 to AD7
WATCHDOG
SERIAL
UART
PORT
2
PARALLEL
I/O PORTS
I C-BUS
INTERFACE
EEPROM
TIMER
(T3)
(3)
POR
A8 to A15
MGL617
(4)
(2)
(2)
(2)
RXD
(4)
T2EX
SDA
SCL
RST EW
PORENABLE
(2)
(2)
P0 P1 P2 P3 TXD
T2
T2COMP
(1) Alternative function of Port 0.
(2) Alternative function of Port 1.
(3) Alternative function of Port 2.
(4) Alternative function of Port 3.
(5) Alternative function of pin 6.
ahdnbok,uflapegwidt
Fig.1 Block diagram.
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
5
PINNING INFORMATION
Pinning
5.1
P1.5/INT7
P1.6/INT8/SCL
P1.7/INT9/SDA
RST
1
2
3
4
5
6
7
8
9
33 P0.4/AD4
32 P0.5/AD5
31 P0.6/AD6
30 P0.7/AD7
29 EA
P3.0/RXD/data
P87CL881H
PORENABLE/V
PP
28 EW
P3.1/TXD/clock
P3.2/INT0
27 ALE
26 PSEN
P3.3/INT1
25 P2.7/A15
24 P2.6/A14
23 P2.5/A13
P3.4/T0 10
P3.5/T1 11
MGL616
Fig.2 Pin configuration.
5
1999 Apr 16
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
5.2
Table 1 LQFP package
SYMBOL PIN
Pin description
DESCRIPTION
VDD
39
38
17
16
4
Power supply for core.
Power supply for I/O ring.
Ground for core.
VDDP
VSS
VSSP
RST
Ground for I/O ring.
RESET. A LOW level on this pin for two machine cycles while the oscillator is running,
resets the device. The RST pin is also an output which can be used to reset other ICs.
PORENABLE/VPP
6
PORENABLE. If set to a logic 1, the internal Power-on reset circuit is enabled. If external
reset circuitry is used, it is recommended to keep PORENABLE LOW in order to achieve
the lowest power consumption. This pin is also used for the OTP programming voltage
VPP
.
EW
28
14
Enable Watchdog Timer.
XTAL2
Crystal output. Output of the amplitude controlled oscillator. If an external oscillator
clock is used this pin not used.
XTAL1
PSEN
15
26
Crystal input. Input to the amplitude controlled oscillator. Also the input for an externally
generated clock source.
Program Store Enable. Read strobe to external program memory. When executing
code out of external program memory, PSEN is activated twice each machine cycle.
However, during each access to external data memory two PSEN activations are
skipped. During Power-down mode the PSEN pin stays HIGH.
ALE
27
Address Latch Enable. Latches the low byte of the address during accesses to external
memory. It is activated every six oscillator periods and may be used for external timing or
clocking purposes. For improved EMC behaviour, the toggle of the ALE pin can be
disabled by setting the RFI bit in the PCON register by software. This bit is cleared on
reset and can be set and cleared by software. When set, the ALE pin will be pulled-down
internally, switching an external address latch to a quiet state. The MOVX instruction will
still toggle ALE if external memory is accessed. ALE will retain its normal HIGH state
during Idle mode and a LOW state during the Power-down mode while in the EMC mode.
Additionally, during internal access (EA = 1) ALE will toggle normally when the address
exceeds the internal program memory size. During external access (EA = 0) ALE will
always toggle normally, whether the RFI bit is set or not.
EA
29
External Access. When EA is held HIGH, the CPU executes out of the internal program
memory (unless the program counter exceeds the highest address for internal program
memory). When EA is held LOW, the CPU executes out of external program memory
regardless of the value of the program counter. The state of the EA pin is internally
latched at reset.
1999 Apr 16
6
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
SYMBOL
P0.0/AD0
PIN
DESCRIPTION
37
36
35
34
33
32
31
30
40
41
42
Port 0. 8-bit bidirectional I/O port with alternative functions. Every port pin can be used
as open-drain, standard port, high-impedance input or push-pull output, according to
Section 6.2. AD7 to AD0 provide the multiplexed low-order address and data bus during
accesses to external memory.
P0.1/AD1
P0.2/AD2
P0.3/AD3
P0.4/AD4
P0.5/AD5
P0.6/AD6
P0.7/AD7
P1.0/INT2/T2
P1.1/INT3/T2EX
Port 1. 8-bit bidirectional I/O port with alternative functions. Every port pin except P1.6
and P1.7 (I2C-bus pins) can be used as open-drain, standard port, high-impedance input
or push-pull output, according to Section 6.2. Port 1 also serves the alternative functions
INT2 to INT9 interrupts, Timer 2 external input and Timer 2 compare output, external
clock output CLK and I2C-bus clock and I2C-bus data in/outputs.
P1.2/INT4/
T2COMP
P1.3/INT5
P1.4/INT6/CLK
P1.5/INT7
P1.6/INT8/SCL
P1.7/INT9/SDA
P2.0/A8
43
44
1
2
3
18
19
20
21
22
23
24
25
5
Port 2. 8-bit bidirectional I/O port with alternative functions. Every port pin can be used
as open-drain, standard port, high-impedance input or push-pull output, according to
Section 6.2. Port 2 emits the high order address byte during accesses to external
memory that use 16-bit addresses (MOVX @ DPTR). In this application it uses the
strong internal pull-ups when emitting logic 1's. During accesses to external memory that
use 8-bit addresses (MOVX @ Ri), Port 2 emits the contents of the P2 Special Function
Register.
P2.1/A9
P2.2/A10
P2.3/A11
P2.4/A12
P2.5/A13
P2.6/A14
P2.7/A15
P3.0/RXD/data
P3.1/TXD/clock
P3.2/INT0
P3.3/INT1
P3.4/T0
Port 3. 8-bit bidirectional I/O port with alternative functions. Every port pin can be used
as open-drain, standard port, high-impedance input or push-pull output, according to
Section 6.2. RXD/data is the serial port receiver data input (asynchronous) or data I/O
(synchronous). TXD/clock is the serial port transmitter data output (asynchronous) or
clock output (synchronous). INT0 and INT1 are external interrupt lines. T0 and T1 are
external inputs for Timers 0 and 1 respectively. WR is the external memory write strobe
and RD is the external memory read strobe.
7
8
9
10
11
12
13
P3.5/T1
P3.6/WR
P3.7/RD
1999 Apr 16
7
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
6
FUNCTIONAL DESCRIPTION
For the functional and block descriptions of the P87CL881, refer to the “TELX family” data sheet.
6.1
Special Function Registers
Table 2 Special Function Registers memory map and reset values; note 1
REGISTER NAME
REGISTER MNEMONIC
SFR ADDRESS
RESET VALUE(2)
80C51 core
Accumulator
B Register
ACC
B
E0H
F0H
0000 0000
0000 0000
0000 0000
0000 0000
0000 0000
0000 0000
0000 0000
0000 0000
0000 0000
0000 0111
XXXX X000
Data Pointer Low byte
Data Pointer High byte
Program Counter High byte
Program Counter Low byte
Power Control Register
Prescaler Register
DPL
82H
DPH
PCH
PCL
83H
no SFR
no SFR
87H
PCON
PRESC
PSW
SP
F3H
Program Status Word
Stack Pointer
D0H
81H
XRAM Page Register
XRAMP
FAH
Timers 0 and 1
Timer/Counter Control Register
Timer/Counter 0 High byte
Timer/Counter 1 High byte
Timer/Counter 0 Low byte
TCON
TH0
88H
8CH
8DH
8AH
8BH
89H
0000 0000
0000 0000
0000 0000
0000 0000
0000 0000
0000 0000
TH1
TL0
Timer/Counter 1 Low byte
TL1
Timer/Counter Mode Control Register
TMOD
Ports
Alternative Port Function Control Register
Port P0 output data Register
ALTP
A3H
80H
8EH
8FH
90H
9EH
9FH
A0H
AEH
AFH
B0H
BEH
BFH
0000 0000
1111 1111
1111 1111
0000 0000
0111 1111
0000 1000
0111 1111
1111 1111
1111 1111
0000 0000
1111 1111
1111 1110
1111 1111
P0
Port P0 Configuration A Register
Port P0 Configuration B Register
Port P1 output data Register
P0CFGA
P0CFGB
P1
Port P1 Configuration A Register
Port P1 Configuration B Register
Port P2 output data Register
P1CFGA
P1CFGB
P2
Port P2 Configuration A Register
Port P2 Configuration B Register
Port P3 output data Register
P2CFGA
P2CFGB
P3
Port P3 Configuration A Register
Port P3 Configuration B Register
P3CFGA
P3CFGB
1999 Apr 16
8
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
REGISTER NAME
REGISTER MNEMONIC
SFR ADDRESS
RESET VALUE(2)
Timer 2
Timer 2 Compare High byte
Timer 2 Compare Low byte
Timer 2 Reload/Capture High byte
Timer 2 Reload/Capture Low byte
Timer/Counter 2 Control Register
Timer/Counter 2 High byte
COMP2H
COMP2L
RCAP2H
RCAP2L
T2CON
TH2
ABH
AAH
CBH
CAH
C8H
CDH
CCH
0000 0000
0000 0000
0000 0000
0000 0000
0000 0000
0000 0000
0000 0000
Timer/Counter 2 Low byte
TL2
Interrupt logic
Interrupt Enable Register 0
Interrupt Enable Register 1
Interrupt Enable Register 2
Interrupt Priority Register 0
Interrupt Priority Register 1
Interrupt Priority Register 2
Interrupt Sensitivity Register 1
Interrupt Polarity Register
Interrupt Request Flag Register 1
IEN0
IEN1
IEN2
IP0
A8H
E8H
F1H
B8H
F8H
F9H
E1H
E9H
C0H
0000 0000
0000 0000
0000 0000
0000 0000
0000 0000
0000 0000
0000 0000
0000 0000
0000 0000
IP1
IP2
ISE1
IX1
IRQ1
Low Voltage Detection
LVD Control Register
PORACO
LVDCON
RSTAT
F2H
E6H
0000 0000
Reset Status Register
UART
XXX1 1000
Serial Port Buffer
S0BUF
S0CON
99H
98H
0000 0000
0000 0000
Serial Port Control Register
I2C-bus interface
Address Register
S1ADR
S1CON
S1DAT
S1STA
DBH
D8H
DAH
D9H
0000 0000
0000 0000
0000 0000
1111 1000
Serial Control Register
Data Shift Register
Serial Status Register
Watchdog timer
Watchdog Timer Control Register
Watchdog Timer Interval Register
WDCON
WDTIM
A5H
FFH
1010 0101
0000 0000
1999 Apr 16
9
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
REGISTER NAME
OTP interface
REGISTER MNEMONIC
SFR ADDRESS
RESET VALUE(2)
OTP Address High Register
OTP Address Low Register
OTP Data Register
OAH
D5
D4
D6
DC
D7
X00X XXXX
XXXX XXXX
XXXX XXXX
000X 0000
0000 0000
OAL
ODATA
OISYS
OTEST
OTP In-System Programming Register
OTP Test Register
Notes
1. E7H and FDH are reserved locations and must not be written to.
2. Where: X = undefined state.
To enable a port pin alternative function, the port bit latch
in its SFR must contain a logic 1.
6.2
I/O facilities
6.2.1
PORTS
Each port consists of a latch (Special Function Registers
P0 to P3), an output driver and input buffer. All ports have
internal pull-ups. Figure 3(a) shows that the strong
transistor P1 is turned on for only 1 oscillator period after a
LOW-to-HIGH transition in the port latch. When on, it turns
on P3 (a weak pull-up) through the inverter IN1. This
inverter and transistor P3 form a latch which holds the
logic 1.
The P87CL881 has 32 I/O lines treated as 32 individually
addressable bits or as four parallel 8-bit addressable ports.
Ports 0, 1, 2 and 3 perform the following alternative
functions:
Port 0 Provides the multiplexed low-order address and
data bus for expanding the device with standard
memories and peripherals.
Port 1 Used for a number of special functions:
6.2.2
PORT I/O CONFIGURATION
• P1.0 to P1.7 provides the inputs for the external
interrupts INT2 to INT9
I/O port output configurations are determined by the
settings in the port configuration SFRs. Each port has two
associated SFRs: PnCFGA and PnCFGB, where ‘n’
indicates the specific port number (0 to 3). One bit in each
of the 2 SFRs relates to the output setting for the
corresponding port pin, allowing any combination of the
2 output types to be mixed on those port pins.
• P1.0/T2 and P1.1/T2EX for external inputs of Timer 2
• P1.2/T2COMP for external activation and compare
output of Timer 2
• P1.4/CLK for the clock output
• P1.6/SCL and P1.7/SDA for the I2C-bus interface are
real open-drain outputs or high-impedance; no other
port configurations are available.
For example, the output type of P1.3 is controlled by
setting bit 3 in the SFRs P1CFGA and P1CFGB.
The port pins may be individually configured via the SFRs
with one of the following modes (P1.6 and P1.7 can be
open-drain or high-impedance but never have any diodes
against VDD).
Port 2 Provides the high-order address bus when
expanding the device with external program
memory and/or external data memory.
Port 3 Pins can be configured individually to provide:
Mode 0 Open-drain; quasi-bidirectional I/O with
n-channel open-drain output. Use as an output
(e.g. Port 0 for external memory accesses
(EA = 0) or access above the built-in memory
boundary) requires the connection of an external
pull-up resistor. The ESD protection diodes
against VDD and VSS are still present. Except for
the I2C-bus pins P1.6 and P1.7, ports which are
configured as open-drain still have a protection
diode to VDD. See Fig.3a.
• P3.0/RXD/data and P3.1/TXD/clock which are serial
port receiver input and transmitter output (UART)
• P3.2/INT0 and P3.3/INT1 are external interrupt request
inputs
• P3.4/T0 and P3.5/T1 as counter inputs
• P3.6/WR and P3.7/RD are control signals to write and
read to external memories.
1999 Apr 16
10
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
Mode 1 Standard port; quasi-bidirectional I/O with
pull-up. The strong pull-up p1 is turned on for
only one oscillator periods after a LOW-to-HIGH
transition in the port latch. After these two
oscillator periods the port is only weakly driven
through p2 and ‘very weakly’ driven through p3.
See Fig.3b.
Tables 2 and 3 show the configuration register settings for
the four output configurations. The electrical
characteristics of each output configuration are specified
in Chapter 8. The default port configuration after reset is
given in Table 2.
In case of external memory access, the appropriate
options for ports P0, P2 and P3.6/P3.7 (WR/RD, only in
case of external data memory access) must be set by
software.
Mode 2 High-impedance; this mode turns all port output
drivers off. Thus, the pin will not source or sink
current and may be used as an input-only pin with
no internal drivers for an external device to
overcome. See Fig.3c.
For Special Function Registers for port configurations/data
please refer to Table 2, note 1.
Mode 3 Push-pull; output with drive capability in both
polarities. In this mode, pins can only be used as
outputs. See Fig.3d.
Table 3 Port configuration register settings
PORT OUTPUT CONFIGURATION
MODE(1)
PnCFGA
PnCFGB
NORMAL PORTS
I2C-BUS PORTS (P1.6 AND P1.7)
0
1
2
3
0
1
0
1
0
0
1
1
open-drain
open-drain
quasi-bidirectional
high-impedance
push-pull
open-drain
high-impedance
open-drain
Note
1. Mode changes may cause glitches to occur during transitions. When modifying both registers, write instructions
should be carried out consecutively.
1999 Apr 16
11
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
V
external
V
DD
DD
this diode is not
implemented
on the I C-bus pins
external
pull-up
2
I/O pin
Q
from port latch
n
V
V
SS
SS
MBK004
input data
a. Open-drain.
V
strong pull-up
DD
1 oscillator
period
p2
p3
p1
n
I/O pin
Q
from port latch
IN1
V
V
SS
SS
MBK001
input data
b. Standard/quasi-bidirectional.
V
DD
this diode is not
implemented
2
on the I C-bus pins
input data
I/O pin
MBK002
V
SS
c. High-impedance.
strong pull-up
V
DD
V
DD
p
I/O pin
Q
from port latch
n
V
V
SS
SS
MBK003
input data
d. Push-pull.
Fig.3 Port configuration options.
1999 Apr 16
12
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
instructions in the same way as in the 80C51 structure, so
with P0 and P2 as data/address bus and P3.6 and P3.7 as
write and read timing signals. Note that the external data
memory cannot be accessed with R0 and R1 as address
pointer if the AUX-RAM is enabled (ARD = 0, default after
reset).
6.3
Internal data memory
The internal data memory is divided into three physically
separated parts:
256 bytes of RAM, 128 bytes of Special Function
Registers and 1792 bytes of AUX-RAM. These can be
addressed each in a different way (see also Table 4).
The Special Function Registers (SFR) can only be
1. RAM 0 to 127 can be addressed directly and indirectly
as in the 80C51; address pointers are R0 and R1 of
the selected register-bank
addressed directly in the address range from 128 to 255.
Four register banks, each 8 registers wide, occupy
locations 0 through 31 in the lower RAM area. Only one of
these banks may be enabled at a time. The next 16 bytes,
locations 32 through 47, contain 128 directly addressable
bit locations. The stack can be located anywhere in the
internal 256 bytes RAM. The stack depth is only limited by
the available internal RAM space of 256 bytes (see Fig.4).
2. RAM 128 to 255 can only be addressed indirectly;
address pointers are R0 and R1 of the selected
register bank
3. AUX-RAM 0 to 1791 is indirectly addressable via the
AUX-RAM Page Register (XRAMP) and MOVX-Ri
instructions, unless it is disabled by setting ARD = 1.
AUX-RAM 0 to 1791 is also indirectly addressable as
external data memory via MOVX-datapointer
Table 4 Internal data memory map
LOCATION ADDRESS
ADDRESSING
instruction, unless it is disable by setting ARD = 1.
When executing from internal program memory, an
access to AUX-RAM 0 to 1791 when ARD = 0 will not
affect the ports P0, P2, P3.6 and P3.7.
RAM
0 to 127
direct and indirect
indirect only with MOVX
indirect only
AUX-RAM
RAM
0 to 1791
128 to 255
128 to 255
An access to external data memory locations higher
than 1791 will be performed with the MOVX @ DPTR
SFR
direct only
FFFFH
FFFFH
FBFFH
(ARD = 0/1)
0700H
06FFH
PAGE 6
PAGE 5
PAGE 4
PAGE 3
PAGE 2
PAGE 1
PAGE 0
FFH
INDIRECT
ADDRESSING
(ARD = 1)
DIRECT
7FH
INDIRECT AND
DIRECT
ADDRESSING
INTERNAL
(EA = 1)
EXTERNAL
(EA = 0)
00H
0000H
INTERNAL RAM
INTERNAL
AUX-RAM
(ARD = 0)
EXTERNAL DATA
MEMORY
0
0
MGL618
PROGRAM MEMORY
DATA MEMORY
Fig.4 Memory map.
13
1999 Apr 16
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
6.3.1
AUX-RAM PAGE REGISTER (XRAMP)
The AUX-RAM Page Register is used to select one of the seven 256 bytes pages of the internal 1792-byte AUX-RAM
for MOVX-accesses via R0 or R1. Its reset value is ‘XXXX X000’ (AUX-RAM page 0).
Table 5 AUX-RAM Page Register (SFR address FAH)
7
6
5
4
3
2
1
0
−
−
−
−
−
XRAMP2
XRAMP1
XRAMP0
Table 6 Description of XRAMP bits
BIT
SYMBOL
−
FUNCTION
7 to 3
reserved, undefined during read, a write operation must write logic 0 to these locations
AUX-RAM page select bit 2
2
1
0
XRAMP2
XRAMP1
XRAMP0
AUX-RAM page select bit 1
AUX-RAM page select bit 0
Table 7 Memory locations for all possible MOVX accesses
ARD(1) XRAMP2 XRAMP1 XRAMP0
ACCESS
INSTRUCTION TYPE
0
0
0
0
0
0
0
0
1
0
0
0
0
0
1
1
1
1
X
X
0
0
1
1
0
0
1
1
X
X
0
1
0
1
0
1
0
1
X
X
AUX-RAM page 0 (address 0 to 255)
AUX-RAM page 1 (address 256 to 511)
AUX-RAM page 2 (address 512 to 767)
AUX-RAM page 3 (address 768 to 1023)
AUX-RAM page 4 (address 1024 to 1279)
AUX-RAM page 5 (address 1280 to 1535)
AUX-RAM page 6 (address 1536 to 1791)
no valid memory access
MOVX @ Ri, A and
MOVX @ A, Ri
external RAM locations 0 to 255
AUX-RAM locations 0 to 1791 external
RAM locations 1792 to 65535
MOVX @ DPTR, A and
MOVX A, DPTR
1
X
X
X
external RAM locations 0 to 65535
Note
1. ARD (AUX-RAM Disable) corresponds to bit 6 in the Special Function Register PCON (address 87H).
1999 Apr 16
14
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
6.4
OTP programming
6.4.2
IN-SYSTEM PROGRAMMING MODE
In the In-System Programming mode the OTP can be
programmed under control of the CPU. A program to
control programming has to be available in the OTP. This
mode can be used to program several bytes in the OTP if
the chip is already in a system e.g. to store tuning
parameters.
6.4.1
OTP PROGRAMMING
The 63-kbyte One-Time Programmable (OTP) memory
can be programmed by using an OM4260 programmer
together with a programmer adapter OM5510. Since the
memory is programmable only once, programming an
already programmed address results in a logical AND of
the old and new code. The OTP code can be read out by
the programmer for verification.
In the In-System Programming mode the complete
address space OTP can be programmed.
The user should take care not to overwrite the existing
code.
6.4.1.1
Signature bytes
For In-System Programming four SFRs are used to control
the OTP.
The OTP memory contains three signature bytes which
can be read by the programmer to identify the device.
A special address space has been used for these bytes
which does not influence the user address space.
The values of the signature bytes are:
Table 8 SFRs for In-System Programming
SFR NAME
DESCRIPTION
(030H) = 15H, indicates manufactured by Philips
Semiconductors
OAH
OTP Address High Register
OTP Address Low Register
OTP Data Register
OAL
(031H) = D6H, indicates P87CL881H
(060H) = 00H, currently not used.
ODATA
OISYS
OTP In-System Register
6.4.2.1
OTP In-System Programming Register (OISYS)
The OISYS SFR controls the In-System Programming mode. The data that has to be programmed is stored in the SFR
ODATA and the address for this data in the SFRs OAH and OAL.
Table 9 OTP In-System Programming Register (SFR address DCH)
7
6
5
4
3
2
1
0
−
−
−
VPon
0
SIG
WE
InSysMode
Table 10 Description of OISYS bits
BIT
SYMBOL
DESCRIPTION
7 to 5
−
VPon
0
These bits are reserved.
VPP status (read only).
4
3
2
1
0
This bit is reserved and must be kept to logic 0.
Signature bytes enable.
SIG
WE
Write Enable, enables programming.
InSysMode In-System Programming status bit.
1999 Apr 16
15
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
The signature bytes (and other test addresses) are always
readable independent of the security.
6.4.2.2
Mode entry
The In-System Programming mode is entered by setting
the InSysMode bit of the OISYS SFR. The I2C-bus is used
for data transfer in this mode. If the I2C-bus interface is
addressed by an external master, the interface generates
an interrupt request. The interrupt handler can now read
the OISYS SFR and determine the status of the external
high voltage (VPon). If high voltage is not present the
interrupt is a standard I2C-bus interrupt.
6.4.2.6
How to connect the PORENABLE/VPP pin in
the In-System Programming mode
If the VPP pin is dual-mode (e.g. PORENABLE/VPP), ICs
connected to the signal PORENABLE must be able to
withstand up to 13 V, i.e. cannot have clamping diodes or
low break-down voltages. If the pin is connected to a fixed
voltage (VDD or VSS) there must be a way of switching-off
this connection on the PCB. A possible implementation is
presented in Fig.5.
If high voltage is present the In-System program interrupt
routine has to start that writes the InSysMode bit
(OISYS.0) and controls the address and data transfer.
In the example (see Fig.5) the POR is enabled in normal
mode of operation (pin PORENABLE/VPP = 1 by the
pull-up), but the VPP source must supply enough current
in Rp in order to guarantee a minimum 12.5 V on the
PORENABLE/VPP pin.
The program voltage has to be available and stable for at
least 10 µs before the mode is entered and has to be
stable until the circuit has left the In-System Programming
mode. The high voltage can be applied for maximum
60 seconds during the complete lifetime of the circuit.
Note that if in the application the Power-on reset is
disabled (pin PORENABLE/VPP = 0), applying a high
voltage to the PORENABLE/VPP pin will also enable the
POR circuit. This will cause a reset independent of the
actual VDD value.
6.4.2.3
Program cycle
The data and address must be supplied to the
microcontroller and the control program has to write the
SFRs: ODATA, OAH and OAL. A timer has to be initialized
for a 100 µs cycle and the WE bit of the OISYS SFR must
be set. Now the core has to be set into Idle mode. As long
as the circuit is in Idle mode a programming pulse is
applied. After the interrupt request of the timer the OTP is
available for normal code fetching.
V
handbook, halfpage
DD
R
p
The address applied to the OAH and OAL SFRs must be
in the 63 kbytes address space.
V
pad on PCB
PP
6.4.2.4
Verify for In-System Programming
44
34
Verify is done in similar way as programming. The circuit
is put into Idle mode and at the start of this mode the sense
amplifiers are switched to verify mode and a read cycle is
started. The timer has to be initialized for a cycle of at least
1 µs. The address is supplied by the SFRs OAH and OAL.
The WE bit of the OISYS SFR has to be reset. The OTP
output data is latched in the ODATA SFR. After Idle mode
is finished this SFR can be read in a normal way. To be
sure that the verified data is written into the SFR it is
advised to write FFH into the ODATA SFR before a verify
is started.
1
6
33
P87CL881H
11
23
12
22
6.4.2.5
Signature bytes
MBL001
The signature bytes can be read by setting the SIG bit of
the OISYS SFR and applying the address of the signature
byte. Applying a write pulse while the SIG bit of the OISYS
SFR is HIGH is forbidden although the contents of the
signature bytes will never be destroyed.
Fig.5 Example of PORENABLE/VPP connection
on a PCB.
1999 Apr 16
16
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
6.5
Oscillator circuitry
6.6
Non-conformance
General information on the oscillator circuitry can be found
in the “TELX family” data sheet.
6.6.1
PROGRAMMING INTERFACE/TRANSPARENT MODE
The transparent mode is a special operating mode of the
microcontroller used for parallel and In-System OTP
programming.
6.5.1
RESONATOR REQUIREMENTS
For correct function of the oscillator, the values
For certain combinations of data written to Port 2 (used for
control signal during parallel programming mode) the
Transparent mode may be incorrectly active during normal
operation of the microcontroller. In this case, a transition
on any of the Port 0 pins can influence the read out of the
on-chip program memory resulting in incorrect code
execution.
of R1 and C0 of the chosen resonator (quartz or PXE) must
be below the line shown in Fig.6a. The value of the parallel
resistor R0 must be less than 47 kΩ. The wiring between
chip and resonator should be kept as short as possible.
To avoid this problem, the InSysMode bit in the OTP
In-System Programming Register (SFR address DCH)
must be set in the start-up sequence of the program code.
MDA088
500
handbook, halfpage
R1
(Ω)
400
300
Apart from preventing incorrect operation as described
above, the setting of this bit does not affect the normal
operation.
(1)
(2) (3)
6.6.2
MOVC INSTRUCTION LIMITATION
200
The ‘MOVC’ access to a data or program byte stored in
internal ROM/OTP-memory is inhibited while fetching
code from external program memory in roll-over mode.
100
0
Roll-over mode means that the CPU executes code out of
the external program memory because the program
counter exceeds the highest address for internal program
memory. The affected address range is FC00H to FFFFH.
0
20
40
60
80
C
(pF)
o
6.6.3
LOW VOLTAGE DETECTION
C1e and C2e are the external load capacitances; normally not needed
due to integrated load capacitances of typically 10 pF.
The LVDI bit (LVDCON.6) may be incorrectly set due to a
glitch on the LVD output when the LVD is enabled by
changing the bits LVDCON<3:0> from ‘0000’ to any value
within the range ‘0001’ to ‘0101’. If bit EA in register IEN0
is enabled, an unwanted interrupt may occur.
(1) C1e = C2e = 22 pF.
(2)
C1e = C2e = 0 pF.
(3) C1e = C2e = 12 pF.
a. Resonator curves for 3.58 MHz.
A software workaround for this problem exist. During the
initialisation sequence:
C
• Enable LVD by writing to register LVDCON
L
R
1
handbook, halfpage
1
1
• Enable LVD interrupt by writing to register IEN2
• Clear the LVDI bit by writing to LVDCON a second time
R
0
MGL137
• Set bit EA in register IEN0 (ensures LVDI to be cleared
C
0
after initialisation).
b. Resonator equivalent circuit.
Fig.6 Resonator requirements for the ACO.
1999 Apr 16
17
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
7
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
MIN.
−0.5
MAX.
+4.0
UNIT
VDD
VI
supply voltage
V
V
input voltage on any pin with respect to ground (VSS
total power dissipation
)
−0.5
−
VDD + 0.5
800
Ptot
Tstg
mW
storage temperature
−65
+150
°C
8
DC CHARACTERISTICS
VDD = 2.7 to 3.6 V; VSS = 0 V; fxtal = 1 to 10 MHz; Tamb = −25 to +70 °C; all voltages with respect to VSS; unless
otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VDD
supply voltage
operating
2.7
−
−
3.6
V
RAM data retention in
Power-down mode
1.0
3.6
V
VPP
IDD
OTP programming voltage
supply current operating
12.5
−
−
13.0
4.8
−
V
VDD = 3 V; fxtal = 7 MHz; note 1
−
−
−
−
mA
mA
mA
mA
T
amb = 25 °C
VDD = 3 V; fxtal = 7 MHz; note 2
amb = 25 °C
3.7
−
IDD(id)
supply current Idle mode
0.7
−
T
0.58
IDD(pd)
supply current Power-down VDD = 3 V; Tamb = 25 °C; note 3
mode
POR and LVD enabled
−
−
2
5
µA
POR and LVD disabled
50
−
nA
IDD(block)
supply current per block:
Watchdog
VDD = 3 V; fxtal = 7 MHz; Tamb = 25 °C;
notes 4 and 5
−
−
−
−
−
220
180
180
180
10
−
−
−
−
−
µA
µA
µA
µA
µA
I2C-bus
UART
Timer T2
Timer T0 or T1
1999 Apr 16
18
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Inputs (ports, RST and PORENABLE)
VIL
VIH
IIL
LOW-level input voltage
HIGH-level input voltage
notes 6 and 7
0
−
−
0.2VDD
VDD
V
note 6
0.8VDD
V
LOW-level input current
(ports in Mode 1)
VIN = 0.4 V; note 8 and Fig.8
−
10
50
µA
IIL(T)
LOW-level input current;
HIGH-to-LOW transition
(ports in Mode 1)
VIN = 0.2VDD; note 8 and Fig.8
−
−
200
1000
1
µA
µA
IILEAK
input leakage current (ports
in Mode 0 or 2)
VSS ≤ VI ≤ VDD
−
Outputs (ports and RST)
IOL
LOW-level output current;
except SDA and SCL
VOL = 0.4 V
2
3
2
−
−
−
−
−
−
mA
mA
mA
IOL2
IOH
LOW-level output current;
SDA and SCL
VOL = 0.4 V; note 9
HIGH-level output current
except (push-pull options
only)
VOH = VDD − 0.4 V
IRST
RST pull-up current source VDD = 3 V; VOH = VDD − 0.4 V
DD = 3 V; VOH = VSS
POR (Power-on reset) for the LVD (Low Voltage Detection), see note 10
0.05
0.2
0.6
−
µA
µA
V
−
2.5
VPORH
trip level HIGH
(option 5 in “TELX family
specification”)
2.13
2.37
1.30
2.61
V
V
VPORL
trip level LOW
(option B in “TELX family
specification”)
−
−
ACO (Amplitude Controlled Oscillator)
VXTAL1
external clock signal
500
−
VDD
mV
amplitude peak-to-peak
zi(XTAL1)
C1i; C2i
input impedance on XTAL1
300
1000
10
−
−
kΩ
input capacitance on
XTAL1 and XTAL2
notes 5 and 11
−
pF
In-System Programming for the OTP
tprog program cycle time
tprog(security) program cycle time security note 12
90
180
1
100
200
−
110
220
−
µs
µs
µs
µs
s
tver
verify cycle time
tVPP(setup)
tVPP(max)
program voltage setup time
10
−
−
−
maximum program voltage cumulative for the product lifetime
time
−
60
IVPP
program voltage current
In-System Programming
−
−
40
mA
1999 Apr 16
19
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
Notes
1. The operating supply current is measured with all output pins disconnected; VIL = VSS; VIH = VDD; RST = VDD; XTAL1
driven with square wave; XTAL2 not connected; fetch of NOP instructions; all derivative blocks disabled.
2. The Idle mode supply current is measured with all output pins and RST disconnected; VIL = VSS; VIH = VDD; XTAL1
driven with square wave; XTAL2 not connected; all derivative blocks disabled.
3. The power-down current is measured with all output pins and RST disconnected; VIL = VSS; VIH = VDD; XTAL1 and
XTAL2 not connected.
4. The typical currents are only for the specific block. To calculate the typical power consumption of the microcontroller,
the current consumption of the CPU must be added. Example: the typical current consumption of the microcontroller
in operating mode with CPU, Watchdog and UART active can be calculated as (3.7 + 0.220 + 0.18) mA = 4.1 mA at
VDD = 3 V and fXTAL = 7 MHz.
5. Verified on sampling basis.
6. The input threshold voltage of P1.6/SCL and P1.7/SDA meet the I2C-bus specification. Therefore, an input voltage
below 0.3VDD will be recognized as a logic 0 and an input voltage above 0.7VDD will be recognized as a logic 1.
7. For pin PORENABLE the VIL max is 0.1VDD
.
8. Not valid for pins SDA, SCL, RST and PORENABLE.
9. The maximum allowed load capacitance CL is in this case limited to around 200 pF.
10. The LVD is tested according to the “TELX family specification, Chapter - Low voltage detection”.
11. C1i/C2i are the total internal capacitances (including gate capacitance and leadframe capacitance).
12. Can also be done by two 100 µs pulses.
MGL506
500 µA
I
IL(T)
I
I
I
IL
10 µA
0
0.3V
0.5V
V
DD
DD
DD
Fig.7 Input current.
1999 Apr 16
20
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
MGL625
MGL626
5.3
1.0
handbook, halfpage
handbook, halfpage
I
I
DD
DD(id)
(mA)
(mA)
4.7
0.8
4.1
3.5
0.6
0.4
2.9
2.2
0.2
2.2
2.6
3
3.4
3.8
V
4.2
(V)
2.6
3
3.4
3.8
V
DD
4.2
(V)
DD
Fig.8 Typical operating current as a function of
Fig.9 Typical Idle current as a function of VDD;
VDD; Tamb = 25 °C; fxtal = 7 MHz.
Tamb = 25 °C; fxtal = 7 MHz.
MDA085
4
handbook, halfpage
I
DD(pd)
(µA)
(1)
3
(2)
2
1
(3)
(4)
0
0
1
2
3
4
V
(V)
DD
(1) POR and LVD enabled (Tamb = 70 °C).
(2) POR and LVD enabled (Tamb = 25 °C).
(3) POR and LVD disabled (Tamb = 70 °C).
(4) POR and LVD disabled (Tamb = 25 °C).
Fig.10 Typical power-down current as a function of
VDD
.
1999 Apr 16
21
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
9
AC CHARACTERISTICS
DD = 3 V; VSS = 0 V; Tamb = −25 to +70 °C; CL = 50 pF for Port 0, ALE and PSEN; CL = 80 pF for all other outputs
V
unless otherwise specified. All values verified on sampling basis.
VARIABLE CLOCK
MIN. MAX.
SYMBOL
PARAMETER
UNIT
External program memory
tLHLL
tAVLL
tLLAX
tLLIV
ALE pulse width
address valid to ALE LOW
tCLK
−
−
−
ns
0.5tCLK − 10
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
address hold after ALE LOW
ALE LOW to valid instruction in
ALE LOW to PSEN LOW
0.5tCLK
−
2tCLK − 25
tLLPL
tPLPH
tPLIV
tPXIX
tPXIZ
tAVIV
tPLAZ
0.5tCLK
−
PSEN pulse width
1.5tCLK
−
PSEN LOW to valid instruction in
input instruction hold after PSEN
input instruction float after PSEN
address to valid instruction in
PSEN LOW to address float
−
0
−
−
−
1.5tCLK − 35
−
0.5tCLK
2.5tCLK − 35
5
External data memory
tRLRH
tWLWH
tAVLL
RD pulse width
3tCLK
−
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
WR pulse width
3tCLK
−
address valid to ALE LOW
address hold after ALE LOW
RD LOW to valid data in
data hold after RD
0.5tCLK
−
tLLAX
0.5tCLK
−
tRLDV
tRHDX
tRHDZ
tLLDV
tAVDV
tLLWL
tAVWL
tWHLH
tQVWX
tQVWH
tWHQX
tRLAZ
−
2.5tCLK
0
−
data float after RD
−
tCLK
ALE LOW to valid data in
address to valid data in
ALE LOW to RD or WR LOW
address valid to RD or WR LOW
RD or WR HIGH to ALE HIGH
data valid to WR transition
data valid time WR HIGH
data hold after WR
−
4tCLK
−
4.5tCLK − 30
1.5tCLK − 15
2tCLK
1.5tCLK + 15
−
0.5tCLK − 5
0.5tCLK
3.5tCLK
0.5tCLK
−
0.5tCLK + 5
−
−
−
0
RD LOW to address float
1999 Apr 16
22
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
one machine cycle
one machine cycle
S1
S2
S3
S4
S5
S6
S1
S2
S3
S4
S5
S6
P1 P2
P1 P2
P1 P2 P1 P2 P1 P2
P1 P2 P1 P2 P1 P2
P1 P2 P1 P2 P1 P2
P1 P2
XTAL1
INPUT
ALE
PSEN
RD
dotted lines
are valid when
RD or WR are
active
only active
during a read
from external
data memory
only active
during a write
to external
WR
data memory
BUS
(PORT 0)
inst.
in
address
A0 - A7
inst.
in
address
A0 - A7
inst.
in
address
A0 - A7
inst.
in
address
A0 - A7
external
program
memory
fetch
PORT 2
address A8 - A15
address A8 - A15
address A8 - A15
address A8 - A15
BUS
(PORT 0)
inst.
in
address
A0 - A7
inst.
in
address
A0 - A7
address
A0 - A7
data output or data input
read or
write of
external data
memory
address A8 - A15
address A8 - A15 or Port 2 out
address A8 - A15
PORT 2
PORT
OUTPUT
old data
new data
PORT
INPUT
sampling time of I/O port pins during input (including INT0 and INT1)
SERIAL
PORT
CLOCK
MGA180
Fig.11 Instruction cycle timing.
23
1999 Apr 16
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
t
CY
t
t
LLIV
LHLL
ALE
PSEN
t
LLPL
t
PLPH
t
LLAX
t
t
t
PXIZ
AVLL
PLIV
PORT 0
PORT 2
A0 to A7
inst. input
A0 to A7
inst. input
t
t
PXIX
PLAZ
t
AVIV
address A8 to A15
address A8 to A15
MGA176
Fig.12 Read from external program memory.
t
CY
ALE
t
t
t
LHLL
LLDV
WHLH
PSEN
RD
t
t
RLRH
LLWL
t
t
t
RHDZ
AVLL
LLAX
t
t
t
RHDX
AVWL
RLDV
PORT 0
PORT 2
A0 to A7
data input
t
RLAZ
t
AVDV
address A8 to A15 (DPH) or Port 2
MGA177
Fig.13 Read from external data memory.
24
1999 Apr 16
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
t
CY
t
t
WHLH
LHLL
ALE
PSEN
t
t
WLWH
LLWL
WR
t
AVWL
t
t
t
t
AVLL
LLAX
QVWH
WHQX
t
QVWX
PORT 0
PORT 2
A0 to A7
data output
address A8 to A15 (DPH) or Port 2
MGA178
Fig.14 Write to external data memory.
9.1
AC testing
AC testing inputs are driven at 2.4 V for a HIGH level and 0.45 V for a LOW level. Timing measurements are taken at
2.0 V for a HIGH level and 0.8 V for a LOW level, see Fig.15a. The float state is defined as the point at which a Port 0
pin sinks 3.2 mA or sources 400 µA at the voltage test levels, see Fig.15b.
V
OH(min)
V
IH(min)
V
IL(max)
V
OL(max)
MGL620
a. AC inputs during testing are driven at VOH(min) for a logic 1 and VOL(max) for a logic 0. Timing measurements
are made at VIH(min) for a logic 1 and VIL(max) for a logic 0.
V
V
− 0.1 V
− 0.1 V
OH
OL
V
V
− 0.1 V
− 0.1 V
LOAD
LOAD
V
= 0.5 V
DD
LOAD
MGL619
b. For timing purposes, a port is no longer floating when a 100 mV change from load voltage occurs and begins
to float when a 100 mV change from the loaded VOH/VOL level occurs. IOH/IOL > 1.6 mA.
Fig.15 AC testing input, output waveform (a) and float waveform (b).
1999 Apr 16
25
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
10 PACKAGE OUTLINE
LQFP44: plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm
SOT389-1
c
y
X
33
23
A
E
34
22
Z
E
e
Q
H
E
A
2
A
(A )
3
A
1
w M
p
pin 1 index
θ
b
L
p
L
44
12
detail X
11
1
Z
v M
A
D
e
w M
b
p
D
B
H
v
M
B
D
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
Q
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.
7o
0o
0.15 1.45
0.05 1.35
0.45 0.20 10.10 10.10
0.30 0.12 9.90 9.90
12.15 12.15
11.85 11.85
0.75 0.70
0.45 0.57
1.14 1.14
0.85 0.85
mm
1.60
0.25
0.80
1.0
0.20 0.20 0.10
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-12-19
SOT389-1
1999 Apr 16
26
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
11 SOLDERING
11.1 Introduction to soldering surface mount
packages
• For packages with leads on two sides and a pitch (e):
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
11.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
11.4 Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
11.3 Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
1999 Apr 16
27
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
11.5 Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
REFLOW(1)
BGA, SQFP
not suitable
suitable
suitable
suitable
suitable
suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable(2)
PLCC(3), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
not recommended(3)(4)
not recommended(5)
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
1999 Apr 16
28
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
12 DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
13 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
14 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1999 Apr 16
29
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
NOTES
1999 Apr 16
30
Philips Semiconductors
Product specification
Low-voltage microcontroller with 63-kbyte
OTP program memory and 2-kbyte RAM
P87CL881H
NOTES
1999 Apr 16
31
Philips Semiconductors – a worldwide company
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For all other countries apply to: Philips Semiconductors,
Internet: http://www.semiconductors.philips.com
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5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1999
SCA63
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
465008/00/01/pp32
Date of release: 1999 Apr 16
Document order number: 9397 750 05026
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