LD6836TD12P_技术文档

LD6836 series

Ultra low dropout regulators, low noise, 300 mA

Rev. 2 — 5 October 2012

Product data sheet

1. Product profile

1.1 General description

The LD6836 series is a small-size Low DropOut regulator (LDO) family with a typical

voltage drop of 90 mV at 300 mA current rating. Operating input voltages can range from

2.3 V to 5.5 V. The devices are available with fixed output voltages between 1.2 V

and 3.6 V.

In disabled mode the LD6836x/xxH devices show a high-ohmic state at the output pin

while the LD6836x/xxP devices contain a pull-down switching transistor to provide a

low-ohmic output state (auto discharge function).

The LD6836CX4 and LD6836CX4/C devices are in a 0.4 mm pitch Wafer-Level

Chip-Scale Package (WLCSP) making them ideal for use in portable applications

requiring component miniaturization. The LD6836TD devices are in a small SOT753

Surface-Mounted Device (SMD) plastic package. All devices are manufactured in

monolithic silicon technology.

1.2 Features and benefits

 300 mA output current rating

 Input voltage range 2.3 V to 5.5 V

 Fixed output voltage between 1.2 V and 3.6 V

 Dropout voltage 90 mV at 300 mA output rating

 Low quiescent current in shutdown mode (typical 0.1 A)

 30 V RMS output noise voltage (typical value) at 10 Hz to 100 kHz

 Turn-on time 150 s

 55 dB Power Supply Rejection Ratio (PSRR) at 1 kHz

 Over-temperature protection

 Output current limiter

 LD6836x/xxH: high-ohmic (3-state) output state when disabled

 LD6836x/xxP: low-ohmic output state when disabled (auto discharge function)

 Integrated ElectroStatic Discharge (ESD) protection up to 10 kV Human Body

Model (HBM)

 WLCSP with 0.4 mm pitch and package size of 0.76 mm  0.76 mm  0.47 mm

 Small SOT753 SMD plastic package (SOT23-5 compatible)

 Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen

and antimony (dark green compliant)

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

1.3 Applications

Analog and digital interfaces requiring lower than standard supply voltages in mobile

appliances such as smartphones, mobile phone handsets and cordless telephones. Other

typical applications are digital still cameras, mobile internet devices, personal navigation

devices and portable media players.

2. Pinning information

2.1 Pinning

bump A1

index area

1

2

A

B

5

1

4

3

001aao107

transparent top view,

solder balls facing down

2

Fig 1. Pin configuration for SOT753

Fig 2. Pin configuration for WLCSP4

2.2 Pin description

Table 1.

Pin description for SOT753

Symbol

IN

1

Description

regulator input voltage

supply ground

GND

EN

2

3

device enable input; active HIGH

not connected

n.c.

4

OUT

5

regulator output voltage

Table 2.

Symbol

GND

EN

Pin description for WLCSP4

A1

A2

B1

B2

Description

supply ground

device enable input; active HIGH

regulator output voltage

regulator input voltage

OUT

IN

LD6836_SER

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Product data sheet

Rev. 2 — 5 October 2012

2 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

3. Ordering information

Table 3.

Ordering information

Type number

Package

Name

Description

Version

LD6836CX4

WLCSP4 wafer-level chip-scale package; 4 bumps (2  2) ^[1]

-

LD6836CX4/C

WLCSP4 wafer-level chip-scale package with backside

coating; 4 bumps (2  2) ^[1]

LD6836TD

-

plastic surface-mounted package; 5 leads

SOT753

[1] Size 0.76 mm  0.76 mm.

3.1 Ordering options

Further information on output voltage is available on request; see Section 18 “Contact

information”.

Table 4.

Type number extension of high-ohmic output in WLCSP4

Type number

Nominal output

voltage

Type number

Nominal output

voltage

LD6836CX4/12H

LD6836CX4/13H

LD6836CX4/14H

LD6836CX4/16H

LD6836CX4/18H

LD6836CX4/20H

LD6836CX4/22H

LD6836CX4/23H

1.2 V

1.3 V

1.4 V

1.6 V

1.8 V

2.0 V

2.2 V

2.3 V

LD6836CX4/25H

LD6836CX4/27H

LD6836CX4/28H

LD6836CX4/29H

LD6836CX4/30H

LD6836CX4/33H

LD6836CX4/36H

-

2.5 V

2.7 V

2.8 V

2.9 V

3.0 V

3.3 V

3.6 V

-

Table 5.

Type number extension of pull-down output in WLCSP4

Type number

Nominal output

voltage

Type number

Nominal output

voltage

LD6836CX4/12P

LD6836CX4/13P

LD6836CX4/14P

LD6836CX4/16P

LD6836CX4/18P

LD6836CX4/20P

LD6836CX4/21P

LD6836CX4/22P

1.2 V

1.3 V

1.4 V

1.6 V

1.8 V

2.0 V

2.1 V

2.2 V

LD6836CX4/23P

LD6836CX4/25P

LD6836CX4/27P

LD6836CX4/28P

LD6836CX4/29P

LD6836CX4/30P

LD6836CX4/33P

LD6836CX4/36P

2.3 V

2.5 V

2.7 V

2.8 V

2.9 V

3.0 V

3.3 V

3.6 V

LD6836_SER

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Product data sheet

Rev. 2 — 5 October 2012

3 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

Table 6.

Type number extension of pull-down output in WLCSP4 with backside coating

Type number

Nominal output

voltage

Type number

Nominal output

voltage

LD6836CX4/C12P

LD6836CX4/C13P

LD6836CX4/C14P

LD6836CX4/C16P

LD6836CX4/C18P

LD6836CX4/C20P

LD6836CX4/C21P

LD6836CX4/C22P

1.2 V

1.3 V

1.4 V

1.6 V

1.8 V

2.0 V

2.1 V

2.2 V

LD6836CX4/C23P

LD6836CX4/C25P

LD6836CX4/C27P

LD6836CX4/C28P

LD6836CX4/C29P

LD6836CX4/C30P

LD6836CX4/C33P

LD6836CX4/C36P

2.3 V

2.5 V

2.7 V

2.8 V

2.9 V

3.0 V

3.3 V

3.6 V

Table 7.

Type number extension of high-ohmic output in SOT753

Type number

Nominal output

voltage

Type number

Nominal output

voltage

LD6836TD/12H

LD6836TD/13H

LD6836TD/14H

LD6836TD/16H

LD6836TD/18H

LD6836TD/20H

LD6836TD/22H

1.2 V

1.3 V

1.4 V

1.6 V

1.8 V

2.0 V

2.2 V

LD6836TD/23H

LD6836TD/27H

LD6836TD/28H

LD6836TD/29H

LD6836TD/30H

LD6836TD/33H

LD6836TD/36H

2.3 V

2.7 V

2.8 V

2.9 V

3.0 V

3.3 V

3.6 V

Table 8.

Type number extension of pull-down output in SOT753

Type number

Nominal output

voltage

Type number

Nominal output

voltage

LD6836TD/12P

LD6836TD/13P

LD6836TD/14P

LD6836TD/16P

LD6836TD/18P

LD6836TD/20P

LD6836TD/21P

LD6836TD/22P

1.2 V

1.3 V

1.4 V

1.6 V

1.8 V

2.0 V

2.1 V

2.2 V

LD6836TD/23P

LD6836TD/25P

LD6836TD/27P

LD6836TD/28P

LD6836TD/29P

LD6836TD/30P

LD6836TD/33P

LD6836TD/36P

2.3 V

2.5 V

2.7 V

2.8 V

2.9 V

3.0 V

3.3 V

3.6 V

LD6836_SER

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Product data sheet

Rev. 2 — 5 October 2012

4 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

4. Block diagram

V

OUT

IN

R1

V

reference

V

EN

GENERATOR

THERMAL

PROTECTION

R2

OVERCURRENT

PROTECTION

GND

001aan756

Fig 3. Block diagram of LD6836x/xxH

V

OUT

IN

R1

V

reference

V

EN

GENERATOR

THERMAL

PROTECTION

R2

OVER CURRENT

PROTECTION

GND

001aan299

Fig 4. Block diagram of LD6836x/xxP (auto discharge function)

LD6836_SER

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Product data sheet

Rev. 2 — 5 October 2012

5 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

5. Limiting values

Table 9.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).

Symbol Parameter

Conditions

Min

0.5

-

Max

+6.0

770

Unit

V

V_IN

P_tot

voltage on pin IN

4 ms transient

[1]

total power dissipation

LD6836CX4, LD6836CX4/C

LD6836TD

mW

C

-

800

T_stg

T_j

storage temperature

55

40

-

+150

+125

+85

junction temperature

C

T_amb

V_ESD

ambient temperature

C

[2]

[3]

electrostatic discharge voltage

human body model level 6

machine model class 3

10

kV

V

-

400

[1] The (absolute) maximum power dissipation depends on the junction temperature T_j. Higher power dissipation is allowed with lower

ambient temperatures. The conditions to determine the specified values are T_amb= 25 C and the use of a two layer Printed-Circuit

Board (PCB).

[2] According to IEC 61340-3-1.

[3] According to JESD22-A115C.

6. Recommended operating conditions

Table 10. Operating conditions

Voltages are referenced to GND (ground = 0 V).

Symbol Parameter

Conditions

Min

40

-

Typ

Max

+85

Unit

C

T_amb

ambient temperature

-

T_j

junction temperature

+125

C

Pin IN

V_IN

voltage on pin IN

2.3

0

-

5.5

V_IN

-

V

Pin EN

V_EN

voltage on pin EN

-

V

Pin OUT

C_L(ext)

[1]

external load capacitance

0.7

1.0

F

[1] See Section 10.1 “Capacitor values”.

LD6836_SER

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Product data sheet

Rev. 2 — 5 October 2012

6 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

7. Thermal characteristics

Table 11. Thermal characteristics

Symbol

Parameter

Conditions

Typ

130

125

Unit

K/W

[1][2]

R_th(j-a)

thermal resistance from junction to ambient LD6836CX4, LD6836CX4/C

LD6836TD

[1] The overall R_th(j-a)can vary depending on the board layout. To minimize the effective R_th(j-a), all pins must have a solid connection to

larger Cu layer areas for example to the power and ground layer. In multi-layer PCB applications, the second layer is used to create a

large heat spreader area directly below the LDO. If this layer is either ground or power, it is connected with several vias to the top layer

connecting to the device ground or supply. Avoid the use of solder-stop varnish under the chip.

[2] Use the measurement data given for a rough estimation of the R_th(j-a)in your application. The actual R_th(j-a)value can vary in applications

using different layer stacks and layouts.

8. Characteristics

Table 12. Electrical characteristics

At recommended input voltages and T_amb= 40 C to +85 C; voltages are referenced to GND (ground = 0 V);

unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max Unit

Output voltage

V_do

[1]

dropout voltage

I_OUT= 300 mA; V_IN< V_O(nom)

LD6836CX4, LD6836CX4/C

LD6836TD

-

90

160

200

mV

100

V_O

output voltage variation

V_OUT< 1.8 V; I_OUT= 1 mA

T_amb= +25 C

3

4

0.5

+3

+4

%

30 C  T_amb +85 C

V_OUT 1.8 V; I_OUT= 1 mA

T_amb= +25 C

-

2

3

0.5

+2

+3

%

30 C  T_amb +85 C

-

Line regulation error

[1]

V_O/(V_OxV_I) relative output voltage

V_IN= (V_O(nom)+ 0.2 V) to 5.5 V

0.1

-

+0.1 %/V

variation with input voltage

Load regulation error

V_O/(V_OxI_O) relative output voltage

1 mA  I_OUT 300 mA

-

0.0025 0.01 %/mA

variation with output current

Output current

I_OUT

I_OM

current on pin OUT

peak output current

-

300

mA

[1]

V_IN= (V_O(nom)+ 0.2 V) to 5.5 V

V_O(nom)> 1.8V;

350

-

V

_OUT= 0.95  V_O(nom)

V_O(nom)< 1.8 V;

_OUT= 0.9  V_O(nom)

-

V

I_sc

short-circuit current

pin OUT

600

LD6836_SER

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Product data sheet

Rev. 2 — 5 October 2012

7 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

Table 12. Electrical characteristics …continued

At recommended input voltages and T_amb= 40 C to +85 C; voltages are referenced to GND (ground = 0 V);

unless otherwise specified.

Symbol

Regulator quiescent current

I_qquiescent current

Parameter

Conditions

Min

Typ

Max Unit

V_EN= 1.4 V; I_OUT= 0 mA

V_EN= 1.4 V; 1 mA  I_OUT 300 mA

V_EN 0.4 V

-

70

100

250

1

A

155

0.1

Ripple rejection and output noise

[1]

PSRR

power supply rejection ratio

V_IN= V_O(nom)+ 1.0 V; I_OUT= 30 mA;

-

55

-

dB

f

_ripple= 1 kHz

V_n(o)(RMS)

RMS output noise voltage

f_ripple= 10 Hz to 100 kHz;

30

V

C_L(ext)= 1 F

Enable input and timing

V_IL

LOW-level input voltage

pin EN

0

-

0.4

5.5

-

V

V_IH

HIGH-level input voltage

regulator start-up time

1.1

-

V

[1]

t_startup(reg)

V_IN= 5.5 V; V_OUT= 0.95  V_O(nom)

I_OUT= 300 mA; C_L(ext)= 1 F

;

150

s

LD6836x/xxP; auto discharge function

t_sd(reg)

regulator shutdown time

V_IN= 5.5 V; V_OUT= 0.05  V_O(nom)

C_L(ext)= 1 F

-

300

100

-

s

R_pd

pull-down resistance



Over-temperature protection

T_sd

shutdown temperature

-

160

20

-

C

K

T_sd(hys)

shutdown temperature

hysteresis

[1] V_O(nom)= nominal output voltage (device specific).

LD6836_SER

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Product data sheet

Rev. 2 — 5 October 2012

8 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

9. Dynamic behavior

9.1 Power Supply Rejection Ratio (PSRR)

PSRR stands for the capability of the regulator to suppress unwanted signals on the input

voltage like noise or ripples.

V_{outripple}

V_{inripple}

PSRRdB = 20log

for all frequencies

--------------------------

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V_IN= 4.6 V; V_OUT= 3.6 V; C_L(ext)= 1 F

V_IN= 3.5 V; V_OUT= 2.5 V; C_L(ext)= 1 F

Fig 5. PSRR for LD6836CX4/36H

Fig 6. PSRR of LD6836TD/25H

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V_IN= 2.2 V; V_OUT= 1.2 V; C_L(ext)= 1 F

Fig 7. PSRR of LD6836CX4/12H

LD6836_SER

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Product data sheet

Rev. 2 — 5 October 2012

9 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

9.2 Dropout

The dropout voltage is defined as the smallest input to output voltage difference at a

specified load current when the regulator operates within its linear region. This means that

the input voltage is below the nominal output voltage value and the pass transistor works

as a plain resistor.

A small dropout voltage guarantees lower power consumption and efficiency

maximization.

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Fig 8. Dropout voltage as a function of output

current for LD6836CX4/25x

Fig 9. Dropout voltage as a function of output

current for LD6836TD/36x

9.3 Accuracy

The LD6836 series guarantees high accuracy of the nominal output voltage.

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Fig 10. Working voltage tolerance for LD6836CX4/25x

LD6836_SER

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Product data sheet

Rev. 2 — 5 October 2012

10 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

9.4 Quiescent current

Quiescent (or ground) current is the difference between input and output current of the

regulator.

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I_OUT= 0 mA

Fig 11. Quiescent current for LD6836CX4/25H

9.5 Noise

Output noise voltage of an LDO circuit is given as noise density or RMS output noise

voltage over a defined frequency spectrum (10 Hz to 100 kHz). Permanent conditions are

a constant output current and a ripple-free input voltage. The output noise voltage is

generated by the LDO regulator.

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ꢑ!ꢑꢀꢁꢁꢑ"#

ꢑ!ꢑꢁꢑ"#

ꢜꢝ

ꢎ%12ꢋ

ꢒ)$45ꢓꢔꢕ

ꢆꢄ

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ꢑ!ꢑꢀꢑ"#

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Fig 12. Noise density for LD6836x/25x

LD6836_SER

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Product data sheet

Rev. 2 — 5 October 2012

11 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

9.6 Line Regulation

Line regulation is the capability of the circuit to maintain the nominal output voltage while

varying the input voltage.

ꢀꢀꢀꢁꢂꢂꢃꢇꢆꢈ

ꢀꢀꢀꢁꢂꢂꢃꢄꢉꢇ

ꢈ

ꢂ-ꢇ

$

ꢈ

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ꢃ-ꢈ

$

ꢜꢝ

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ꢜꢝ

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ꢜꢝ ꢑ

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ꢁ

ꢁ-ꢂ

ꢁ-ꢄ

ꢁ-ꢈ

61"ꢋꢑꢒ"2ꢕ

I_OUT= 300 mA

Fig 13. Line regulation for LD6836CX4/33P

Fig 14. Line regulation for LD6836CX4/25P

9.7 Load Regulation

Load regulation is the capability of the circuit to maintain the nominal output voltage while

varying the output current.

ꢀꢀꢀꢁꢂꢂꢃꢄꢉꢆ

ꢀꢀꢀꢁꢂꢂꢄꢇꢂꢄ

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ꢃ-ꢄ

$

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ꢜꢝ

ꢒ#ꢕ

ꢜꢝ

ꢒ$ꢕ

$

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ꢁ-ꢃ

ꢃ-ꢃ

ꢁ-ꢃ

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ꢃ-ꢂ

ꢃ-ꢀ

ꢁ-ꢀ

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ꢂ-ꢃ

ꢛ

ꢜꢝ

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ꢁ

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ꢁ-ꢈ

ꢁ-0

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ꢁ-ꢀ

ꢁ-ꢂ

ꢁ-ꢃ

ꢁ-ꢄ

61"ꢋꢑꢒ"2ꢕ

V_IN= 5.5 V

Fig 15. Load regulation for LD6836CX4/33P

Fig 16. Load regulation for LD6836CX4/25P

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Product data sheet

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LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

9.8 Start-up and shutdown

Start-up time defines the time needed for the LDO to achieve 95 % of its typical output

voltage level after activation via the enable pin. Shutdown time defines the time needed

for the LDO to pull-down the output voltage to 10 % of its nominal output voltage after

deactivation via the enable pin.

ꢀꢀꢀꢁꢂꢂꢃꢄꢉꢋ

ꢀꢀꢀꢁꢂꢂꢃꢄꢉꢃ

ꢀ-ꢈ

ꢄ

ꢀ-ꢄ

ꢈ

ꢅ

ꢄ

ꢃ

ꢂ

ꢀ

ꢁ

$

ꢋꢎ&'7ꢋ

ꢒ$ꢕ

ꢜꢝ

$

ꢒ$ꢕ

ꢋꢎ&'7ꢋ

ꢒ$ꢕ

ꢜꢝ

ꢒ$ꢕ

ꢜꢝ

ꢀ-ꢂ

$

8,

$

ꢀ-ꢂ

ꢁ-ꢇ

ꢁ-ꢄ

ꢁ

ꢃ

ꢂ

ꢀ

ꢁ

8,

ꢀ

ꢁ-ꢇ

ꢁ-ꢈ

ꢁ-ꢄ

ꢁ-ꢂ

ꢁ

$

ꢜꢝ

ꢁ

ꢁ-ꢁꢅ

ꢁ-ꢀ

ꢁ-ꢀꢅ

61"ꢋꢑꢒ"2ꢕ

ꢁ-ꢂ

ꢁ

ꢁ-ꢀ

ꢁ-ꢂ

ꢁ-ꢃ

ꢁ-ꢄ

61"ꢋꢑꢒ"2ꢕ

Fig 17. Start-up for LD6836x/33P

Fig 18. Shutdown for LD6836x/25P

9.9 Enable threshold voltage

An active HIGH signal enables the LDO when the signal exceeds the minimum input

HIGH voltage threshold. The LDO is in Off state as long the signal is below the maximum

LOW threshold. The input voltage threshold is independent from the LDO input voltage.

ꢀꢀꢀꢁꢂꢂꢃꢄꢉꢅ

ꢃ-ꢅ

$

ꢜꢝ

ꢒ$ꢕ

ꢂ-ꢅ

ꢓꢛ.ꢓꢑ6%ꢑ9ꢜ:

9ꢜ:ꢑ6%ꢑꢓꢛ.ꢓ

ꢀ-ꢅ

ꢁ-ꢅ

ꢆꢁ-ꢅ

ꢁ-ꢃ

ꢁ-ꢅ

ꢁ-0

ꢁ-+

ꢀ-ꢀ

ꢀ-ꢃ

ꢀ-ꢅ

$

ꢑꢒ$ꢕ

8,

Fig 19. Enable threshold voltage

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Product data sheet

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13 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

10. Application information

10.1 Capacitor values

The LD6836 series require external capacitors at the output to guarantee a stable

regulator behavior. Do not under-run the specified minimum Equivalent Series

Resistance (ESR). The absolute value of the total capacitance attached to the output pin

OUT influences the shutdown time (t_sd(reg)) of the LD6836 series. Also an input capacitor

is recommended to keep the input voltage stable.

Table 13. External load capacitor

Symbol Parameter

Conditions

Min

0.7

5

Typ

1.0

-

Max

Unit

F

[1]

C_i(ext)

C_L(ext)

ESR

external input capacitance

external load capacitance

equivalent series resistance

-

F

500

m

[1] The minimum value of capacitance for stability and correct operation is 0.7 F. The specified capacitor

tolerance is 30 % or better over the temperature and operating conditions range. The recommended

capacitor type is X7R to meet the full device temperature specification of 40 C to +125 C.

IN

OUT

GND

IN

OUT

1μF

EN

001aan647

Fig 20. Application diagram

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Product data sheet

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LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

11. Test information

11.1 Quality information

This product has been qualified in accordance with NX1-00023 NXP Semiconductors

Quality and Reliability Specification and is suitable for use in consumer applications.

12. Marking

12.1 WLCSP4

WLCSP dies are laser marked with the following information (see Table 14 to 16 and

Figure 21):

1. Shaded area: marking of pin A1

2. The character N gives the version code and describes the output mode of the LDO. If

the code is legible, the LDO has an integrated pull down transistor (“P“ version). If the

character N is rotated counterclockwise by 90°, the LDO is a “H“ version.

3. “YYY” symbolizes a placeholder for some characters of the lot ID

ꢀꢀꢀꢁꢂꢂꢃꢄꢆꢈ

ꢊ&ꢎ2;&ꢊꢋꢎ6ꢑ6%;ꢑ51ꢋ<

Fig 21. Marking WLCSP4

Table 14. Marking code of high-ohmic output

Type number

Nominal output voltage

Marking code

LD6836CX4/12H

LD6836CX4/27H

1.2 V

2.7 V

A

P

LD6836_SER

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Product data sheet

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LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

Table 15. Marking of pull-down output

Type number Nominal Marking

output voltage code

Type number

Nominal

output voltage code

Marking

LD6836CX4/12P 1.2 V

LD6836CX4/13P 1.3 V

LD6836CX4/14P 1.4 V

LD6836CX4/16P 1.6 V

LD6836CX4/18P 1.8 V

LD6836CX4/20P 2.0 V

LD6836CX4/21P 2.1 V

LD6836CX4/22P 2.2 V

A

B

C

E

G

I

LD6836CX4/23P 2.3 V

LD6836CX4/25P 2.5 V

LD6836CX4/27P 2.7 V

LD6836CX4/28P 2.8 V

LD6836CX4/29P 2.9 V

LD6836CX4/30P 3.0 V

LD6836CX4/33P 3.3 V

LD6836CX4/36P 3.6 V

L

N

P

Q

R

S

V

Y

J

K

Table 16. Marking code of pull-down output with backside coating

Type number Nominal Marking Type number Nominal

output voltage code output voltage code

Marking

LD6836CX4/C12P 1.2 V

LD6836CX4/C13P 1.3 V

LD6836CX4/C14P 1.4 V

LD6836CX4/C16P 1.6 V

LD6836CX4/C18P 1.8 V

LD6836CX4/C20P 2.0 V

LD6836CX4/C21P 2.1 V

LD6836CX4/C22P 2.2 V

A

B

C

E

G

I

LD6836CX4/C23P 2.3 V

L

LD6836CX4/C25P 2.5 V

LD6836CX4/C27P 2.7 V

LD6836CX4/C28P 2.8 V

LD6836CX4/C29P 2.9 V

LD6836CX4/C30P 3.0 V

LD6836CX4/C33P 3.3 V

LD6836CX4/C36P 3.6 V

N

P

Q

R

S

V

Y

J

K

12.2 SOT753

ꢅ

ꢄ

>?@

ꢀ

ꢂ

ꢃ

6ꢊ&ꢎ2;&ꢊꢋꢎ6ꢑ6%;ꢑ51ꢋ<

ꢀꢀꢀꢁꢂꢂꢆꢃꢄꢂ

Circle (bottom left) = marking of pin 1

XYZ = version; for marking code corresponding to type number see Table 17 and 18

All other characters = lot ID information

Fig 22. Marking SOT753

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Product data sheet

Rev. 2 — 5 October 2012

16 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

Table 17. Marking code of high-ohmic output

Type number Nominal Marking

output voltage code

Type number

Nominal

output voltage code

Marking

LD6836TD/12H 1.2 V

LD6836TD/13H 1.3 V

LD6836TD/14H 1.4 V

LD6836TD/16H 1.6 V

LD6836TD/18H 1.8 V

LD6836TD/20H 2.0 V

LD6836TD/22H 2.2 V

9AH

9BH

9CH

9EH

9GH

9JH

9KH

LD6836TD/23H 2.3 V

LD6836TD/27H 2.7 V

LD6836TD/28H 2.8 V

LD6836TD/29H 2.9 V

LD6836TD/30H 3.0 V

LD6836TD/33H 3.3 V

LD6836TD/36H 3.6 V

9LH

9PH

9QH

9RH

9SH

9VH

9YH

Table 18. Marking of pull-down output

Type number Nominal Marking

output voltage code

Type number

Nominal

output voltage code

Marking

LD6836TD/12P 1.2 V

LD6836TD/13P 1.3 V

LD6836TD/14P 1.4 V

LD6836TD/16P 1.6 V

LD6836TD/18P 1.8 V

LD6836TD/20P 2.0 V

LD6836TD/21P 2.1 V

LD6836TD/22P 2.2 V

9AP

9BP

9CP

9EP

9GP

9JP

9ZP

9KP

LD6836TD/23P 2.3 V

LD6836TD/25P 2.5 V

LD6836TD/27P 2.7 V

LD6836TD/28P 2.8 V

LD6836TD/29P 2.9 V

LD6836TD/30P 3.0 V

LD6836TD/33P 3.3 V

LD6836TD/36P 3.6 V

9LP

9NP

9PP

9QP

9RP

9SP

9VP

9YP

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Product data sheet

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17 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

13. Package outline

WLCSP4: wafer level chip-size package; 4 bumps (2 x 2)

D

bump A1

index area

A

2

1

E

A

detail X

e

b

B

A

e

1

2

X

European

projection

wlcsp4_2x2_po

Fig 23. Package outline LD6836CX4 (WLCSP4)

Table 19. Dimensions for Figure 23

Symbol

Min

0.44

0.18

0.26

0.21

0.71

-

Typ

0.47

0.20

0.27

0.26

0.76

0.4

Max

Unit

mm

A

0.50

0.22

0.28

0.31

0.81

-

A₁

A₂

b

D

E

e

LD6836_SER

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Product data sheet

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18 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

:9*ꢗꢖꢄBꢑ<&ꢉꢋꢊꢑ7ꢋ5ꢋ7ꢑꢏC1;ꢆ21ꢔꢋꢑ;&ꢏD&Eꢋꢑ<16Cꢑ'&ꢏD21ꢙꢋꢑꢏ%&61ꢎEFꢑꢄꢑ'ꢍ";2ꢑꢒꢂꢑ=ꢑꢂꢕ

/

#

ꢃ

'ꢍ";ꢑ#ꢀ

1ꢎꢙꢋ=ꢑ&ꢊꢋ&

#

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ꢀ

#

8

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ꢋ

'

ꢚ

ꢋ

#

ꢀ

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;ꢊ%Aꢋꢏ61%ꢎ

<7ꢏ2;ꢄGꢂ=ꢂGꢏG;%

Fig 24. Package outline LD6836CX4/C (WLCSP4 with backside coating)

Table 20. Dimensions for Figure 24

Symbol

Min

0.47

0.18

0.26

0.03

0.21

0.71

-

Typ

0.51

0.20

0.27

0.04

0.26

0.76

0.4

Max

Unit

A

0.55

0.22

0.28

0.05

0.31

0.81

-

mm

A₁

A₂

A₃

b

D

E

e

LD6836_SER

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Product data sheet

Rev. 2 — 5 October 2012

19 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

Plastic surface-mounted package; 5 leads

SOT753

D

B

E

A

X

y

H

v

M

A

E

5

4

Q

A

1

c

L

1

2

3

p

detail X

e

b

p

w

M B

0

1

2 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

A

b

c

D

E

e

H

L

Q

v

w

y

p

1

p

E

0.100

0.013

0.40

0.25

1.1

0.9

0.26

0.10

3.1

2.7

1.7

1.3

3.0

2.5

0.6

0.2

0.33

0.23

mm

0.95

0.2

0.1

REFERENCES

JEDEC JEITA

EUROPEAN

PROJECTION

OUTLINE

VERSION

ISSUE DATE

IEC

02-04-16

06-03-16

SOT753

SC-74A

Fig 25. Package outline LD6836 series (SOT753)

LD6836_SER

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Product data sheet

Rev. 2 — 5 October 2012

20 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

14. Soldering

D

e

c

(4×)

solder resist

e

E

solder paste = solderland

occupied area

f

(4×)

Dimensions in mm

wlcsp4_2x2_fr

a. LD6836CX4 (WLCSP4)

/

ꢋ

ꢏ

ꢒꢄꢟꢕ

2%7ꢙꢋꢊꢑꢊꢋ2126

ꢋ

8

2%7ꢙꢋꢊꢑ;&26ꢋꢑ!ꢑ2%7ꢙꢋꢊ7&ꢎꢙ

%ꢏꢏꢍ;1ꢋꢙꢑ&ꢊꢋ&

ꢉ

ꢒꢄꢟꢕ

/1"ꢋꢎ21%ꢎ2ꢑ1ꢎꢑ""

<7ꢏ2;ꢄGꢂ=ꢂGꢏGꢉꢊ

b. LD6836CX4/C (WLCSP4 with backside coating)

Fig 26. Reflow soldering footprint WLCSP4

Table 21. Dimensions for Figure 26

Symbol

Min

Typ

Max

Unit

mm

c

D

E

e

f

-

0.25

0.76

0.4

-

0.71

0.81

0.71

0.81

-

0.325

LD6836_SER

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Product data sheet

Rev. 2 — 5 October 2012

21 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

3.45

1.95

0.45 0.55

(5×) (5×)

solder lands

0.95

3.3 2.825

solder resist

solder paste

occupied area

2.4

Dimensions in mm

0.7

(5×)

0.8

(5×)

sot753_fr

Fig 27. Reflow soldering footprint SOT753

15. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

15.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

15.2 Wave and reflow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature profile. Leaded packages,

packages with solder balls, and leadless packages are all reflow solderable.

LD6836_SER

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Product data sheet

Rev. 2 — 5 October 2012

22 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

Key characteristics in both wave and reflow soldering are:

• Board specifications, including the board finish, solder masks and vias

• Package footprints, including solder thieves and orientation

• The moisture sensitivity level of the packages

• Package placement

• Inspection and repair

• Lead-free soldering versus SnPb soldering

15.3 Wave soldering

Key characteristics in wave soldering are:

• Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

• Solder bath specifications, including temperature and impurities

15.4 Reflow soldering

Key characteristics in reflow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to

higher minimum peak temperatures (see Figure 28) than a SnPb process, thus

reducing the process window

• Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Table 22 and 23

Table 22. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (C)

Volume (mm³)

< 350

235

 350

220

< 2.5

 2.5

220

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Product data sheet

Rev. 2 — 5 October 2012

23 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

Table 23. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (C)

Volume (mm³)

< 350

260

350 to 2000

260

> 2000

260

< 1.6

1.6 to 2.5

> 2.5

260

250

245

250

245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 28.

maximum peak temperature

= MSL limit, damage level

temperature

minimum peak temperature

= minimum soldering temperature

peak

temperature

time

001aac844

MSL: Moisture Sensitivity Level

Fig 28. Temperature profiles for large and small components

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

LD6836_SER

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Product data sheet

Rev. 2 — 5 October 2012

24 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

16. Revision history

Table 24. Revision history

Document ID

Release date

20121005

Data sheet status

Change notice

Supersedes

LD6836_SER v.2

Modifications:

Product data sheet

-

LD6836_SER v.1

• Section 9.2 “Dropout”: corrected

20121004 Product data sheet

LD6836_SER v.1

-

LD6836_SER

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Product data sheet

Rev. 2 — 5 October 2012

25 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

17. Legal information

17.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

Suitability for use — NXP Semiconductors products are not designed,

17.2 Definitions

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

17.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

LD6836_SER

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 5 October 2012

26 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

17.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

18. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

LD6836_SER

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 5 October 2012

27 of 28

LD6836 series

NXP Semiconductors

Ultra low dropout regulators, low noise, 300 mA

19. Contents

1

Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

18

19

Contact information . . . . . . . . . . . . . . . . . . . . 27

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

1.1

1.2

1.3

General description . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits. . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2

2.1

2.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2

3

3.1

4

Ordering information. . . . . . . . . . . . . . . . . . . . . 3

Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 3

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6

Recommended operating conditions. . . . . . . . 6

Thermal characteristics . . . . . . . . . . . . . . . . . . 7

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 7

5

6

7

8

9

Dynamic behavior . . . . . . . . . . . . . . . . . . . . . . . 9

Power Supply Rejection Ratio (PSRR). . . . . . . 9

Dropout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Accuracy. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Quiescent current . . . . . . . . . . . . . . . . . . . . . . 11

Noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Line Regulation. . . . . . . . . . . . . . . . . . . . . . . . 12

Load Regulation . . . . . . . . . . . . . . . . . . . . . . . 12

Start-up and shutdown . . . . . . . . . . . . . . . . . . 13

Enable threshold voltage . . . . . . . . . . . . . . . . 13

9.1

9.2

9.3

9.4

9.5

9.6

9.7

9.8

9.9

10

10.1

11

Application information. . . . . . . . . . . . . . . . . . 14

Capacitor values. . . . . . . . . . . . . . . . . . . . . . . 14

Test information. . . . . . . . . . . . . . . . . . . . . . . . 15

Quality information . . . . . . . . . . . . . . . . . . . . . 15

11.1

12

12.1

12.2

Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

WLCSP4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

SOT753 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

13

14

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

15

Soldering of SMD packages . . . . . . . . . . . . . . 22

Introduction to soldering . . . . . . . . . . . . . . . . . 22

Wave and reflow soldering . . . . . . . . . . . . . . . 22

Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 23

Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 23

15.1

15.2

15.3

15.4

16

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 25

17

Legal information. . . . . . . . . . . . . . . . . . . . . . . 26

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 27

17.1

17.2

17.3

17.4

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 5 October 2012

Document identifier: LD6836_SER


型号：	LD6836TD12P
厂家：	NXP
描述：	Ultra low dropout regulators, low noise, 300 mA 超低压差稳压器，低噪声， 300毫安稳压器
文件：	总28页 (文件大小：589K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LD6836TD12P [NXP]

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