HTMS1001FTB/AF [NXP]
IC SPECIALTY TELECOM CIRCUIT, PDSO3, 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, SOT-1122, SON-3, Telecom IC:Other;
| 型号： | HTMS1001FTB/AF |
| 厂家： | 
NXP |
| 描述： | IC SPECIALTY TELECOM CIRCUIT, PDSO3, 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, SOT-1122, SON-3, Telecom IC:Other 电信 光电二极管 电信集成电路 |
| 文件： | 总57页 (文件大小：464K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HTMS1x01; HTMS8x01
HITAG µ transponder IC
Rev. 3.2 — 3 July 2012
152932
Product data sheet
COMPANY PUBLIC
1. General description
The HITAG product line is well known and established in the contactless identification
market.
Due to the open marketing strategy of NXP Semiconductors there are various
manufacturers well established for both the transponders/cards as well as the read/write
devices. All of them supporting HITAG 1, HITAG 2 and HITAG S transponder ICs.
With the new HITAG µ family, this existing infrastructure is extended with the next
generation of ICs being substantially smaller in mechanical size, lower in cost, offering
more operation distance and speed, but still being operated with the same reader
infrastructure and transponder manufacturing equipment.
The protocol and command structure for HITAG µ is design to support Reader Talks First
(RTF) operation, including anti-collision algorithm.
Different memory sizes are offered and can be operated using exactly the same protocol.
1.1 Target markets
1.1.1 Animal identification
The ISO standards ISO 11784 and ISO 11785 are well established in this market and
HITAG µ is especially designed to deliver the optimum performance compliant to these
standards. The HITAG µ advanced ICs are offering additional memory for storage of
customized offline data like further breeding details.
1.1.2 Laundry automation
• Identify 200 pcs of garment with one read/write device
• Long operation distance with typical small shaped laundry button transponders
• Insensitive to harsh conditions like pressure, heat and water
HTMS1x01; HTMS8x01
NXP Semiconductors
HITAG µ transponder IC
1.1.3 Beer keg and gas cylinder logistic
• Recognizing a complete pallet of gas cylinders at one time
• Long writing distance
• Voluntarily change between TTF Mode with user defined data length and read/write
modes without changing the configuration on the transponder
• Authenticity check at the beer pubs - between beer bumper and supplied beer keg,
provides a safe protection of the beer brand
1.1.4 Brand protection
• Authenticity check for high level brands or for original refilling e.g. toner for fax
machines.
1.2 Customer application support and training
Within the dedicated CAS team within the BU Identification.
Accompanying data sheets and application notes:
http://www.nxp.com/products/identification/HITAG
2. Features and benefits
2.1 Features
Integrated circuit for contactless identification transponders and cards
Integrated resonance capacitor of 210 pF with 3 % tolerance or 280 pF with 5 %
tolerance over full production
Frequency range 100 kHz to 150 kHz
2.2 Protocol
Modulation read/write device transponder: 100 % ASK and binary pulse length
coding
Modulation transponder read/write device: Strong ASK modulation with
anti-collision, Manchester and Biphase coding
Fast anti-collision protocol
Cyclic Redundancy Check (CRC)
Transponder Talks First (TTF) mode
Temporary switch from Transponder Talks First into Reader Talks First (RTF) Mode
Data rate read/write device to transponder: 5.2 kbit/s
Data rates transponder to read/write device: 2 kbit/s, 4 kbit/s, 8 kbit/s
2.3 Memory
Different memory options
Up to 10000 erase/write cycles
10 years non-volatile data retention
Memory Lock functionality
HTMS1x01_8x01
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Product data sheet
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HITAG µ transponder IC
32-bit password feature
2.4 Supported standards
Full compliant to ISO 11784 and ISO 11785 Animal ID
Designed to support ISO/IEC 14223 Animal ID with anticollision and read/write
functionality
2.5 Security features
48-bit Unique Identification Number (UID)
2.6 Delivery types
Sawn, gold-bumped 8” wafer
HVSON2
SOT-1122
3. Applications
Animal identification
Laundry automation
Beer keg and gas cylinder logistic
Brand protection
4. Quick reference data
Table 1.
Symbol
Wafer EEPROM characteristics
Quick reference data
Parameter
Conditions
Min
Typ
Max
Unit
tret
retention time
Tamb 55 C
10
-
-
-
-
year
Nendu(W)
write endurance
100000
cycle
Interface characteristics
Ci input capacitance
between LA and LB
HTMS1x01
[1][2]
[1][3]
203.7
266
210
280
216.3 pF
294 pF
HTMS8x01
[1] Measured with an HP4285A LCR meter at 125 kHz/room temperature (25C); VIN1-IN2 = 0.5 V (RMS)
[2] Integrated Resonance Capacitor: 210 pF 3 %
[3] Integrated Resonance Capacitor: 280 pF 5 %
HTMS1x01_8x01
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Product data sheet
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HITAG µ transponder IC
5. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Type
Version
HTMS1001FUG/AM
HTMS1101FUG/AM
Wafer
sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG , 210 pF
-
-
Wafer
sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG Advanced,
210 pF
HTMS1201FUG/AM
Wafer
sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG Advanced+,
-
210 pF
HTMS8001FUG/AM
HTMS8101FUG/AM
Wafer
Wafer
sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG , 280pF
-
-
sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG Advanced,
280 pF
HTMS8201FUG/AM
HTMS1001FTB/AF
HTMS1101FTB/AF
HTMS1201FTB/AF
HTMS8001FTB/AF
HTMS8101FTB/AF
HTMS8201FTB/AF
HTMS1001FTK/AF
Wafer
sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG Advanced+,
-
280 pF
XSON3
XSON3
XSON3
XSON3
XSON3
XSON3
HVSON2
plastic extremely thin small outline package; no HITAG , 210 pF
leads; 4 terminals; body 1 1.45 0.5 mm
SOT1122
SOT1122
SOT1122
SOT1122
SOT1122
SOT1122
SOT899-1
plastic extremely thin small outline package; no HITAG Advanced,
leads; 4 terminals; body 1 1.45 0.5 mm
plastic extremely thin small outline package; no HITAG Advanced+,
leads; 4 terminals; body 1 1.45 0.5 mm 210 pF
210 pF
plastic extremely thin small outline package; no HITAG , 280 pF
leads; 4 terminals; body 1 1.45 0.5 mm
plastic extremely thin small outline package; no HITAG Advanced,
leads; 4 terminals; body 1 1.45 0.5 mm
plastic extremely thin small outline package; no HITAG Advanced+,
leads; 4 terminals; body 1 1.45 0.5 mm 280 pF
280 pF
plastic thermal enhanced very thin small outline HITAG , 210 pF
package; no leads; 2 terminals; body 3 2
0.85 mm
HTMS1101FTK/AF
HTMS1201FTK/AF
HTMS8001FTK/AF
HTMS8101FTK/AF
HTMS8201FTK/AF
HVSON2
HVSON2
HVSON2
HVSON2
HVSON2
plastic thermal enhanced very thin small outline HITAG Advanced,
SOT899-1
SOT899-1
SOT899-1
SOT899-1
SOT899-1
package; no leads; 2 terminals; body 3 2
210 pF
0.85 mm
plastic thermal enhanced very thin small outline HITAG Advanced+,
package; no leads; 2 terminals; body 3 2
210 pF
0.85 mm
plastic thermal enhanced very thin small outline HITAG , 280 pF
package; no leads; 2 terminals; body 3 2
0.85 mm
plastic thermal enhanced very thin small outline HITAG Advanced,
package; no leads; 2 terminals; body 3 2
280 pF
0.85 mm
plastic thermal enhanced very thin small outline HITAG Advanced+,
package; no leads; 2 terminals; body 3 2
280 pF
0.85 mm
HTMS1x01_8x01
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© NXP B.V. 2012. All rights reserved.
Product data sheet
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HITAG µ transponder IC
6. Block diagram
The HITAG µ transponder ICs require no external power supply. The contactless interface
generates the power supply and the system clock via the resonant circuitry by inductive
coupling to the Read/Write Device (RWD). The interface also demodulates data
transmitted from the RWD to the HITAG µ transponder IC, and modulates the magnetic
field for data transmission from the HITAG µ transponder IC to the RWD.
Data are stored in a non-volatile memory (EEPROM). The EEPROM has a capacity of up
to 1760 bit and is organized in blocks.
ANALOGUE
RF INTERFACE
DIGITAL CONTROL
ANTICOLLISION
EEPROM
VREG
PAD
VDD
RECT
Cres
DEMOD
READ/WRITE
CONTROL
data
in
TRANSPONDER
ACCESS CONTROL
MOD
data
out
R/W
EEPROM INTERFACE
CONTROL
CLK
PAD
clock
RF INTERFACE
CONTROL
SEQUENCER
CHARGE PUMP
001aai334
Fig 1. Block diagram of HITAG µ transponder IC
HTMS1x01_8x01
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Product data sheet
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7. Pinning information
(4)
(4)
(3)
(2)
(5)
(1)
(1)
(Y)
LA
LB
(6)
(6)
(X)
001aaj823
Fig 2. HITAG µ - Mega bumps bondpad locations
Table 3. HITAG µ - Mega bumps dimensions
Description
Dimension
550 µm
(X) chip size
(Y) chip size
550 µm
(1) pad center to chip edge
(2) pad center to chip edge
(3) pad center to chip edge
(4) pad center to chip edge
(5) pad center to chip edge
100.5 µm
48.708 µm
180.5 µm
55.5 µm
48.508 µm
HTMS1x01_8x01
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Product data sheet
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HITAG µ transponder IC
Table 3.
HITAG µ - Mega bumps dimensions
Description
Dimension
(6) pad center to chip edge
Bump Size:
165.5 µm
LA, LB
294 x 164 µm
60 x 60 µm
Remaining pads
Note: All pads except LA and LB are electrically disconnected after dicing.
HTMS1x01_8x01
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Product data sheet
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HITAG µ transponder IC
8. Mechanical specification
8.1 Wafer specification
See Ref. 2 “General specification for 8” wafer on UV-tape with electronic fail die marking”.
8.1.1 Wafer
• Designation:
each wafer is scribed with batch number and
wafer number
• Diameter:
• Thickness:
• Process:
• Batch size:
• PGDW:
200 mm (8”)
150 m ± 15 m
CMOS 0.14 µm
25 wafers
91981
8.1.2 Wafer backside
• Material:
Si
• Treatment:
• Roughness:
ground and stress release
Ra max. 0.5 m, Rt max. 5 m
8.1.3 Chip dimensions
• Die size without scribe:
550 m x 550 m = 302500 m2
• Scribe line width:
X-dimension:
15 m (scribe line width is measured between
nitride edges)
Y-dimension:
15 m (scribe line width is measured between
nitride edges)
• Number of pads:
5
8.1.4 Passivation on front
• Type:
sandwich structure
• Material:
• Thickness:
PE-Nitride (on top)
1.75 m total thickness of passivation
HTMS1x01_8x01
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Product data sheet
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HITAG µ transponder IC
8.1.5 Au bump
• Bump material:
> 99.9% pure Au
35 – 80 HV 0.005
> 70 MPa
• Bump hardness:
• Bump shear strength:
• Bump height:
18 m
• Bump height uniformity:
– within a die:
± 2 m
± 3 m
± 4 m
± 1.5 m
– within a wafer:
– wafer to wafer:
• Bump flatness:
• Bump size:
– LA, LB
294 x 164 m
60 x 60 m
5 m
– TEST, GND, VDD
– Bump size variation:
• Under bump metallization:
sputtered TiW
8.1.6 Fail die identification
No inkdots are applied to the wafer.
Electronic wafer mapping (SECS II format) covers the electrical test results and
additionally the results of mechanical/visual inspection.
See Ref. 2 “General specification for 8” wafer on UV-tape with electronic fail die marking”.
8.1.7 Map file distribution
See Ref. 2 “General specification for 8” wafer on UV-tape with electronic fail die marking”.
HTMS1x01_8x01
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© NXP B.V. 2012. All rights reserved.
Product data sheet
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HITAG µ transponder IC
9. Functional description
9.1 Memory organization
The EEPROM has a capacity of up to 1760 bit and is organized in blocks of 4 bytes each
(1 block = 32 bits). A block is the smallest access unit.
The HITAG µ transponder IC is available with different memory sizes as shown in Table 4
“Memory organization HITAG m (128-bit)”, Table 5 “Memory organization HITAG µ
Advanced (512 bit)” and Table 6 “Memory organization HITAG µ Advanced+ (1760 bit)”.
For permanent lock of blocks please refer to Section 14.9 “LOCK BLOCK”.
9.1.1 Memory organization HITAG transponder ICs
Table 4.
Memory organization HITAG (128-bit)
Block address
Content
User Config
PWD
Password Access
FFh
FEh
03h
02h
01h
00h
bit3=0 R/W[2]
bit3=1 RO[1]
ISO 11784/ISO 11785 128 bit TTF data
[1] RO: Read without password, write with password
[2] R/W: Read and write without password
HTMS1x01_8x01
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Product data sheet
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9.1.2 Memory organization HITAG µ Advanced
Table 5.
Memory organization HITAG µ Advanced (512 bit)
Block address
FFh
Content
User Config
PWD
Password Access
FEh
0Fh
0Eh
0Dh
0Ch
0Bh
bit4=0 R/W[2]
bit4=1 RO[1]
0Ah
User Memory
09h
08h
07h
06h
05h
04h
03h
bit3=0 R/W[2]
bit3=1 RO[1]
02h
ISO 11784/ISO 11785 128-bit TTF data
01h
00h
[1] RO: Read without password, write with password
[2] R/W: Read and write without password
HTMS1x01_8x01
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Product data sheet
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9.1.3 Memory organization HITAG µ Advanced +
Table 6.
Memory organization HITAG µ Advanced+ (1760 bit)
Block address
FFh
FEh
36h
Content
User Config
PWD
Password Access
35h
...
bit6=0 bit5=0 R/W[2]
bit6=0 bit5=1 RO[1]
bit6=1 bit5=0 R/W(P)[3]
bit6=1 bit5=1 R/W(P)[3]
14h
User Memory
13h
12h
11h
10h
0Fh
0Eh
0Dh
0Ch
0Bh
0Ah
09h
bit4=0 R/W[2]
bit4=1 RO[1]
User Memory
08h
07h
06h
05h
04h
03h
bit3=0 R/W[2]
bit3=1 RO[1]
02h
ISO 11784/ISO 11785 128-bit TTF data
01h
00h
[1] RO: Read without password, write with password
[2] R/W: Read and write without password
[3] R/W(P): Read and write with password
HTMS1x01_8x01
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9.2 Memory configuration
The user configuration block consists of one configurable byte (Byte0) and three reserved
bytes (Byte1 to Byte3)
The bits in the user configuration block enable a customized configuration of the HITAG µ
transponder ICs. In TTF mode the user can choose Bi-phase or Manchester encoding and
also the data rate for the return link (bit0 to bit2). In RTF mode data rate and coding are
fixed with 4 kbit/s Manchester encoding.
Fitting to ISO 11785 standard the default values are set for 4 kbit/s Bi-Phase encoding.
The next four bits (bit 3 to bit 6) are used for password settings.
Three areas (TTF area(128bit), lower 512 bits and upper memory) can be restricted to
read/write access.
The user configuration block (User Config) is programmable by using WRITE SINGLE
BLOCK command at address FFh. Bits 7 to 31 (Byte1 to Byte3) are reserved for further
usage.
The user configuration block (block address FFh) and the password block (block address
FEh) can be locked with the LOCK BLOCK command.
Attention:
• Pre-programmed default values are not locked !
• Configuration block has to be locked to make data unalterable!
• The lock of the blocks is permanently and therefore irreversible!
Table 7.
User configuration block to Byte0
Byte0
bit3
Description
bit6
bit5
bit4
bit2
bit1 ... 0
Bit-no.
PWD (r/w) [2]
Bit512… Max
PWD (w) [1]
Bit512… Max
PWD (w) [1]
Bit128… 511
PWD (w) [1]
Bit0… 127
Encoding
Data rate
0… MCH
’00’… 2kbit/s
’01’… 4kbit/s
’10’… 8kbit/s
Value/meaning
1… Bi-Ph.
[1] PWD(w)=1: read without password and write with password
[2] PWD(r/w)=1: read and write with password
HTMS1x01_8x01
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Product data sheet
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HITAG µ transponder IC
10. General requirements
The HITAG transponder ICs are compatible with ISO 11785. At the time a HITAG
transponder IC is in the interrogator field it will respond according to ISO 11785.
A HITAG advanced/advanced+ can be identified as a transponder being in the data
exchange mode (advanced mode) by the type information in the reserved bit field sent to
the RWD.
• Bit 15 of the ISO 11784 frame shall be set to ’1’ indicating that this is an HITAG µ
advanced/advanced+ in data exchange mode.
• Bit 16 of the ISO 11784 frame (additional data flag set to ’1’, indicating that the
HITAG µ advanced/advanced+ in data exchange mode contains additional data in the
user memory area.
To bring the HITAG µ transponder ICs into the data exchange mode, the RWD needs to
send a valid request or a valid switch command within the defined listening window.
A HITAG µ transponder IC in data exchange mode only responds when requested by the
RWD (RTF mode).
The identification code, all communication from reader to HITAG µ transponder ICs and
vice versa and the CRC error detection bits (if applicable) are transmitted starting with
LSB first.
In the case that multiple HITAG µ advanced/advanced+ in data exchange mode are in the
interrogation field which cause collisions the RWD has to start the anticollision procedure
as described in this document. Depending in which part of the ISO 11785 timing frame the
collision is detected the RWD will start with the anticollision request.
The HITAG transponder IC in data exchange mode switches back to the standard
ISO 11785 mode when it :
• is no longer in the interrogation field
• has terminated the data exchange mode operations and the interrogation field was
switched off for at least 5 ms afterwards
11. HITAG transponder IC air interface
11.1 Downlink description
To transfer the HITAG µ transponder ICs into the data exchange mode, the RWD's
interrogation field needs be switched off. After this off-period, the interrogation field is
switched on again, and either the SOF at the start of a valid request or the special switch
command needs to be sent to the HITAG µ transponder IC within the specified switch time
window. The HITAG µ transponder IC switches itself into the data exchange mode upon
reception of any of the switch commands. In this mode, the HITAG µ transponder IC
respond when requested by the RWD (reader driven protocol).
The HITAG µ transponder IC in data exchange mode switches back to the ISO 11785
mode after the interrogation field has been switched off for at least 5 ms.
HTMS1x01_8x01
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Product data sheet
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The steps necessary to transfer the HITAG transponder IC into the data exchange mode
are shown in Figure 3. The downlink communication takes place in period C and D. The
example in Figure 3 shows two data blocks (#1 and #2) being selected by the RWD, which
then are transmitted by the HITAG µ transponder IC.
ISO11785
5 .. 20 ms
HITAG μ
ISO11785
5 .. 20 ms
min 5 ms
D
A
B
C
D
E
A
B
A
reader
field
HITAG μ
response
ISO11785
#1
#2
ISO11785
time
001aaj824
Fig 3. RF interface for HITAG µ
Cycle A:
Cycle B:
The RWD reads the ISO 11785 frame.
The RWD switches off the interrogation field for at least 5 ms in order to reset the
HITAG µ transponder IC.
Cycle C:
The RWD sends either the SOF at the start of a valid request or the SWITCH
command to the HITAG µ transponder IC in order to put it into the data exchange
mode. Any of these has to be issued within the switch window after reset - as
defined in Section 11.2 “Mode switching protocol”
Cycle D:
Cycle E:
Read/Write (for HITAG µ transponder ICs) or Inventory (HITAG µ
advanced/advanced+ transponder ICs) operation in the data exchange mode.
After all operations are finished or the HITAG µ transponder IC left the antenna
field, the RWD switches off the field for at least 5 ms in order to poll for new
incoming HITAG µ or HITAG µ advanced/advanced+.
HTMS1x01_8x01
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11.2 Mode switching protocol
After powering the HITAG µ transponder IC switches to the data exchange mode after
receiving one of the two possible switch commands from the RWD during the specified
switch window (see Table 8 and Figure 4 for details).
312.5 × T
232 × T
c
c
TTF operation in case
of no command
during switching window
001aak278
Fig 4. Switching window timing
Table 8.
HITAG µ transponder IC air interface parameters [1]
Description
Parameter
Interrogation field modulation
Encoding
Amplitude modulation (ASK), 90 - 100%
Pulse Interval Encoding; Least Significant Bit (LSB) first
5.2 kbit/s typically
Bit rate
Mode switching
Either a specific 5 bit switch command or the detection of the
SOF as part of a valid HITAG µ transponder IC command,
transmitted after the interruption of the interrogation field for at
least 5 ms
Mode switch timing
HITAG µ transponder IC settling time: 312.5 TC switch
command window after HITAG µ transponder IC settling:
232.5 TC
All within cycle C in Figure 3.
00011 or SOF sequence
Mode switch command
[1] TC...Carrier period time (kHz = 7.45 s nominal)
HTMS1x01_8x01
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The RWD sends either the SOF at the start of a valid request or a special switch
command to the HITAG µ (as shown in Figure 5) in order to transfer it into the data
exchange mode.
SOF
code violation
FDX ADV command
0
carrier on
carrier off
transceiver
switch command
1
0
0
0
1
stop condition
carrier on
carrier off
time
001aaj825
Fig 5. Reader downlink modulation for SWITCH command
11.2.1 SWITCH
Setting the transponder into data exchange mode (advanced mode) is done by sending
SOF pattern or the switch command within the listening window (232.5 x TC). The
SWITCH command itself does not contain SOF and EOF.
Table 9.
Command
5
SWITCH Command
Description
No. of bits
00011
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11.3 Downlink communication signal interface - RWD to HITAG µ
transponder IC
11.3.1 Modulation parameters
Communications between RWD and HITAG µ transponder IC takes place using ASK
modulation with a modulation index of m > 90%.
T
F1
T
T
F3
F2
y
a
x
b
envelope of transceiver field
001aaj826
Fig 6. Modulation details of data transmission from RWD to HITAG µ transponder IC
Table 10. Modulation coding times[1][2]
Symbol
Min
Max
m = (a-b)/(a+b)
90%
100%
TF1
TF2
TF3
x
4 Tc
10 Tc
0.5 TF1
0.5 TFd0
0.05 a
0.05 a
0
0
0
0
y
[1] TF3 shall not exceed TFd0 - TF1 - 3 Tc
[2] TC...Carrier period time (kHz = 7.45 s nominal)
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11.3.2 Data rate and data coding
The RWD to HITAG µ transponder IC communication uses Pulse Interval Encoding. The
RWD creates pulses by switching the carrier off as described in Figure 7. The time
between the falling edges of the pulses determines either the value of the data bit ’0’, the
data bit ’1’, a code violation or a stop condition.
data "0''
T
Fd0
T
T
T
T
T
F1
F1
F1
F1
F1
carrier on
carrier off
data "1''
T
Fd1
T
F1
carrier on
carrier off
"code violation''
T
Fcv
T
F1
carrier on
carrier off
"stop condition''
T
Fsc
carrier on
carrier off
001aaj827
Fig 7. Reader to HITAG µ transponder IC: Pulse Interval Encoding
Assuming equal distributed data bits ’0’ and ’1’, the data rate is in the range of about
5.2 kbit/s.
Table 11. Data coding times [1]
Meaning
Symbol
TF1
Min
Max
Carrier off time
Data “0” time
4 Tc
10 Tc
22 Tc
30 Tc
38 Tc
n/a
TFd0
18 Tc
26 Tc
34 Tc
42 Tc
Data “1” time
TFd1
Code violation time
Stop condition time
TFcv
TFsc
[1] TC...Carrier period time (kHz = 7.45 s nominal)
HTMS1x01_8x01
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11.3.3 RWD - Start of frame pattern
The RWD requests in the data exchange mode always a start with a SOF pattern for ease
of synchronization. The SOF pattern consists of an encoded data bit ’0’ and a ’code
violation’.
data "0"
"code violation"
T
T
Fcv
Fd0
T
T
T
F1
F1
F1
carrier on
carrier off
T
FpSOF
001aaj828
Fig 8. Start of frame pattern
The HITAG µ advanced/advanced+ is ready to receive a SOF from the RWD within
1.2 ms after having sent a response to the RWD.
The HITAG µ advanced/advanced+ is ready to receive a SOF or switch command from
the RWD within 2.33 ms after the RWD has established the powering field.
11.3.4 RWD - End of frame pattern
For slot switching during a multi-slot anticollision sequence, the RWD request is an EOF
pattern. The EOF pattern is represented by a RWD ’Stop condition’.
"stop condition''
T
Fsc
T
F1
carrier on
carrier off
T
FpEOF
001aaj829
Fig 9. End of frame pattern
HTMS1x01_8x01
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11.4 Communication signal interface - HITAG µ transponder IC to RWD
11.4.1 Data rate and data coding
The HITAG µ transponder IC accepts the following data rates and encoding schemes:
• 1/TFd Differential bi-phase coded data signal in the ISO 11785 mode, without SOF and
EOF
• 1/TFd Manchester coded data signal on the response to the HITAG µ
advanced/advanced+ commands in data exchange mode
• 1/(2 TFd) dual pattern data coding when responding within the inventory process
• TTF mode (not ISO 11785 compliant): 1/(2 TFd), 2/TFd Manchester or bi-phase
coded
TFd = 32 / fc = 32 Tc
Remark: The slower data rate used during the inventory process allows for improving the
collision detection when several HITAG µ transponder ICs are present in the RWD field,
especially if some HITAG µ transponder ICs are in the near field and others in the far field.
data
element
response encoding to a RWD
request in data exchange mode
response encoding in
INVENTORY mode
T
T
T
T
T
Fd
Fd
Fd
data "0"
load off
load on
load off
load on
T
Fd
Fd
Fd
data "1"
load off
load on
load off
load on
001aaj830
Fig 10. HITAG µ transponder IC - Load modulation coding
data
1
0
1
1
1
0
0
1
Bi-phase
001aaj831
Fig 11. HITAG µ transponder IC - Differential Bi-Phase Modulation
Differential Bi-phase (or FM0 respectively) contains a transition in the center of bit
conversion representing Data ’0’ and no one for Data ’1’. At the beginning of every bit
modulation a level transition must be performed.
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11.4.2 Start of frame pattern
The HITAG µ transponder IC response - if not in ISO 11785 compliant mode - always
starts with a SOF pattern. The SOF is a Manchester encoded bit sequence of ’110’.
data "1"
data "1"
data "0"
T
T
T
Fd
Fd
Fd
load off
load on
001aaj832
Fig 12. Start of fame pattern
11.4.3 End of frame pattern
A specific EOF pattern is neither used nor specified for the HITAG µ transponder IC
response. An EOF is detected by the reader if there is no load modulation for more than
two data bit periods (TFd).
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12. General protocol timing specification
For requests where an EEPROM erase and/or programming operation is required, the
transponder IC returns its response when it has completed the write/lock operation. This
will be after 20 ms upon detection of the last falling edge of the interrogator request or
after the interrogator has switched off the field.
12.1 Waiting time before transmitting a response after an EOF from the
RWD
When the HITAG advanced/advanced+ in data exchange mode has detected an EOF of a
valid RWD request or when this EOF is in the normal sequence of a valid RWD request, it
waits for TFp1 before starting to transmit its response to a RWD request or when switching
to the next slot in an inventory process.
TFp1 starts from the detection of the falling edge of the EOF received from the RWD.
Remark: The synchronization on the falling edge from the RWD to the EOF of the HITAG
µ transponder ICs is necessary to ensure the required synchronization of the HITAG µ
transponder IC responses.
request
request (or EOF)
carrier on
carrier off
transceiver
T
T
T
Fp2
Fp1
NRT
load off
load on
HITAG μ
response
001aaj833
Fig 13. General protocol timing diagram
The minimum value of TFp1 is TFp1min = 204 TC
The typical value of TFp1 is TFp1typ = 209 TC
The maximum value of TFp1 is TFp1max = 213 TC
If the HITAG µ transponder IC detects a carrier modulation during this time (TFp1), it shall
reset its TFp1-timer and wait for a further time (TFp1) before starting to transmit its
response to a RWD request or to switch to the next slot when in an inventory process.
HTMS1x01_8x01
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12.2 RWD waiting time before sending a subsequent request
• When the RWD has received a HITAG µ advanced/advanced+ response to a previous
request other than inventory and quiet, it needs to wait TFp2 before sending a
subsequent request. TFp2 starts from the time the last bit has been received from the
HITAG µ advanced/advanced+.
• When the RWD has sent a quiet request, it needs to wait TFp2 before sending a
subsequent request. TFp2 starts from the end of the quiet request's EOF (falling edge
of EOF pulse + 42 TC). This results in awaiting time of (150 TC + 42 TC) before
the next request.
The minimum value of TFp2 is TFp2min = 150 TC ensures that the HITAG µ
advanced/advanced+ICs are ready to receive a subsequent request.
Remark: The RWD needs to wait at least 2.33 ms after it has activated the
electromagnetic field before sending the first request, to ensure that the HITAG µ
transponder ICs are ready to receive a request.
• When the RWD has sent an inventory request, it is in an inventory process.
12.3 RWD waiting time before switching to next inventory slot
An inventory process is started when the RWD sends an inventory request. For a detailed
explanation of the inventory process refer to Section 14.3 and Section 14.4.
To switch to the next slot, the RWD sends an EOF after waiting a time period specified in
the following sub-clauses.
12.3.1 RWD started to receive one or more HITAG µ transponder IC responses
During an inventory process, when the RWD has started to receive one or more HITAG µ
advanced/advanced+ transponder IC responses (i.e. it has detected a HITAG µ
advanced/advanced+ transponder IC SOF and/or a collision), it shall
• wait for the complete reception of the HITAG µ advanced/advanced+ transponder IC
responses (i.e. when a last bit has been received or when the nominal response time
TNRT has elapsed),
• wait an additional time TFp2 and then send an EOF to switch to the next slot, if a 16
slot anticollision request is processed, or send a subsequent request (which could be
again an inventory request).
TFp2 starts from the time the last bit has been received from the HITAG µ
advanced/advanced+ transponder IC.
The minimum value of TFp2 is TFp2min = 150 TC.
TNRT is dependant on the anticollisions current mask value and on the setting of the CRCT
flag.
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12.3.2 RWD receives no HITAG µ transponder IC response
During an inventory process, when the RWD has received no HITAG µ
advanced/advanced+ transponder IC response, it needs to wait TFp3 before sending a
subsequent EOF to switch to the next slot, if a 16 slot anticollision request is processed, or
sending a subsequent request (which could be again an inventory request).
TFp3 starts from the time the RWD has generated the falling edge of the last sent EOF.
The minimum value of TFp3 is TFp3min = TFp1max + TFpSOF
.
TFpSOF is the time duration for a HITAG µ advanced/advanced+ transponder to transmit
an SOF to the reader.
request
request (or EOF)
carrier on
carrier off
reader
T
T
FpSOF
Fp1MAX
T
Fp3
load off
load on
HITAG μ
no response
001aaj834
Fig 14. Protocol timing diagram without HITAG µ transponder IC response
Table 12. Overview timing parameters [1]
Symbol
TFpSOF
TFp1
Min
Max
3 TFd
3 TFd
204 TC
150 TC
TFp1max + TFpSOF
213 TC
TFp2
-
-
TFp3
[1] TC...Carrier period time (kHz = 7.45 s nominal)
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13. State diagram
13.1 General description of states
RF Off
The powering magnetic field is switched off or the HITAG µ transponder IC is out of the
field.
WAIT
After start up phase, the HITAG µ transponder IC is ready to receive the first command.
READY
The HITAG µ transponder IC enters this state after a valid command, except of the STAY
QUIET, SELECT or WRITE-ISO11785 command. If there are several HITAG µ
transponder ICs at the same time in the field of the RWD antenna, the anticollision
sequence can be started to determine the UID of every HITAG µ transponder IC.
SELECTED
The HITAG µ transponder IC enters the Selected state after receiving the SELECT
command with a matching UID. In the Selected state the respective commands with
SEL=1 are valid only for selected transponder.
Only one HITAG µ transponder IC can be selected at one time. If one transponder is
selected and a second transponder receives the SELECT Command, the first transponder
will automatically change to Quiet state.
QUIET
The HITAG µ transponder IC enters this state after receiving a STAY QUIET command or
when he was in selected state and receives a SELECT command addressed to another
transponder.
In this state, the HITAG µ transponder IC reacts to any request commandos where the
ADR flag is set.
ISO 11785 STATE
In this state the HITAG µ transponder IC replies according to the ISO 11785 protocol.
Remark:
In case of an invalid command the transponder will remain in his actual state.
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13.2 State diagram HITAG advanced/advanced+
out of field
or RF off
RF on
RF Off
No request
and RF on
WAIT
for time-out
RF on
ISO 11785
FDX-B
Invalid Request
(reset time-out)
out of field
or RF off
valid
request
out of field
or RF off
Anticollision
„read UID“ or
„INVENTORY“
any other request
with SEL flag not set
„INVENTORY ISO-11785“
„READ MULTIPLE BLOCK
in inventory mode“
READY
„STAY QUIET“
(UID)
„SELECT“ (UID)
RF-off:
„go to RF-off state“
„SELECT“ (UID)
SELECTED
QUIET
any other request
with ADR flag set
any other request
with ADR flag set or
SEL flag set
„STAY QUIET“ or
„SELECT“ (non-matching-UID)
aaa-000326
Fig 15. State diagram of HITAG µ advanced/advanced+ transponder ICs
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13.3 State diagram HITAG
out of field
or RF off
RF on
RF Off
No request
and RF on
WAIT
for time-out
RF on
ISO 11785
FDX-B
Invalid Request
(reset time-out)
valid
request
out of field
or RF off
„read UID“ or
any other request
with SEL flag not set
READY
aaa-000325
Fig 16. State diagram of HITAG µ transponder IC
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13.4 Modes
HITAG µ transponder IC
13.4.1 ISO 11785 Mode
This mode is also named TTF (Transponder Talks First).
Every time a transponder IC is activated by the field it starts executing this mode. After
waiting the maximum listening window time (see Section 11.2) the transponder IC sends
continuously its TTF data (128-bit).
The TTF data stored in the memory will be not checked for ISO compliance, therefore
data will be sent as stored in the EEPROM.
Receiving a valid command or a switch command within the listening window sets the
transponder IC into RTF (Reader Talks First) mode.
13.4.2 RTF Mode
In this mode the transponder IC reacts only to RWD request commands as presented in
Section 14. A valid request consists of a command sent to the transponder IC being in
matching state (therefore see tables in Section 14 and transponder ICs state machine in
Section 13).
13.4.3 Anticollision
The RWD is the master of the communication with one or multiple transponder ICs. It
starts the anticollision sequence by issuing the inventory request (see Section 14.3).
Within the RWD command the NOS flag must be set to the desired setting (1 or 16 slots)
and add the mask length and the mask value after the command field.
The mask length n indicates the number of significant bits of the mask value. It can have
any value between 0 and 44 when 16 slots are used and any value between 0 and 48
when 1 slot is used.
The next two subsections summarize the actions done by the transponder IC during an
inventory round.
13.4.3.1 Anticollision with 1 slot
The transponder IC will receive one ore more inventory commands with NOS = '1'. Every
time the transponder ICs fractional or whole UID matches the mask value of RWD's
request it responses with remaining UID without mask value.
Transponder ICs responses are modulated by dual pattern data coding as described in
Section 11.4.
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13.4.3.2 Anticollision with 16 slots
The transponder IC will receive several inventory commands with NOS = '0' defining an
amount of 16 slots. Within the request there is the mask specified by length and value
(sent LSB first).
In case of mask length = '0' the four least significant bits of transponder ICs UID become
the starting value of transponder IC's slot counter.
In case of mask length '0' the received fractional mask is compared to transponder IC's
UID. If it matches the starting value for transponder IC's slot number will be calculated.
Starting at last significant bit of the sent mask the next four less significant bits of UID are
used for this value. At the same time transponder IC's slot counter is reset to '0'.
Now the RWD begins its anticollision algorithm. Every time the transponder IC receives an
EOF it increments slot-counter. Now if mask value and slot-counter value are matching
the transponder IC responses with the remaining UID without mask value but with slot
number
In case of collision within one slot the RWD changes the mask value and starts again
running its algorithm.
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14. Command set
The first part of this section (Section 14.1) describes the flags used in every RWD
command. The following subsections (Section 14.3 until Section 14.13) explain all
implemented commands and their suitable transponder IC responses which are done with
tables showing the command itself and suitable responses.
Within tables flags, parameter bits and parts of a response written in braces are optional.
That means if the suitable flag is set resulting transponder IC's action will be performed
according to Section 14.1.
Every command except the Switch command is embedded in SOF and EOF pattern. As
described in Table 13 and Table 14 sending and receiving data is done with the least
significant bit of every field on first position.
Important information:
In this document the fields (i.e. command codes) are written with most significant
bit first.
Table 13. Reader - Transponder IC transmission [1][2]
SOF
Flags
Commands
6
Parameters
var.
Data
CRC-16
(16)
EOF
-
-
5
var.
-
-
LSB ... MSB
LSB ... MSB
LSB ... MSB
LSB ... MSB
LSB ... MSB
[1] values in braces are optional
[2] data is sent with least significant bit first
Table 14. Transponder IC - Reader transmission [1][2]
SOF
Error flag
Data/Error code CRC-16
EOF
-
-
1
-
var.
(16)
-
-
LSB ... MSB
LSB ... MSB
[1] values in braces are optional
[2] data is sent with least significant bit first
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14.1 Flags
HITAG µ transponder IC
Every request command contains five flags which are sent in order Bit 1 (LSB) to Bit 5
(MSB). The specific meaning depends on the context.
Table 15. Command Flags
Bit Flag
Full name
Value Description
1
2
3
PEXT
Protocol EXTension
0
1
0
1
0
1
No protocol format extension
RFU
INV
INVentory
Flag 4 and Flag 5 are ’SEL’ and ’ADR’ Flag
Flag 4 and Flag 5 are ’RFU’ and ’NOS’ Flag
Transponder IC respond without CRC
Transponder IC respond contains CRC
in combination with ADR (see Table 17)
CRCT
CRC-Transponder
4
5
4
5
SEL
(INV==0)
SELect
ADR
(INV==0)
ADdRess
in combination with SEL (see Table 17)
this flag is not used and set to '0'
RFU
(INV==1) use
Reserved for future
0
NOS
(INV==1)
0
1
16 slots while performing anti-collision
1 slot while performing anti-collision
Table 16. Command Flags - Bit order
MSB
LSB
bit5
bit4
bit3
bit2
INV
INV
bit1
INV==0
INV==1
ADR
NOS
SEL
RFU
CRCT
CRCT
PEXT
PEXT
Table 17. Meaning of ADR and SEL flag
ADR
SEL
0
Meaning
0
1
Request without UID, all transponder ICs in READY state shall respond
0
Request contains UID, one transponder IC (with corresponding UID) shall
respond
0
1
1
1
Request without UID, the transponder IC in SELECTED state shall respond
Reserved for future use
Note:
For HITAG µ inventory (INV) flag and select (SEL) flag must be set to ’0’
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14.2 Error handling
In case an error has been occurred the transponder IC responses with the set error flag
and the three bit code ’111’ (meaning ’unknown error’).
The general response format in case of an error response is shown in Table 18 whereas
commands not supporting error responses are excluded. In case of an unsupported
command there will be no response. The format is embedded into SOF and EOF.
Table 18. Response format in error case
Error flag
Error code
CRC-16
Description
1
1
3
(16)
No. of bits
111
Error Flag
''0''
SOF
Data
(CRC)
EOF
001aak260
Fig 17. HITAG µ transponder IC response - in case of no error
Error Flag
''1''
Error Code
''111''
SOF
(CRC)
EOF
001aak262
Fig 18. HITAG µ transponder IC response - in error case
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14.3 INVENTORY
[Advanced, Advanced+]
Upon reception of this command without error, all transponder ICs in the ready state shall
perform the anticollision sequence. The inventory (INV) flag shall be set to '1'. The NOS
flag determines whether 1 or 16 slots are used.
If a transponder IC detects any error, it shall remain silent.
Table 19. INVENTORY - Request format (00h)
Flags
Command
Mask length
Mask value
CRC-16
Description
5
6
6
n
(16)
No. of bits
AC with 1
timeslot
10(1)10
00(1)10
000000
000000
0 n UID length
0 n UID length
UID Mask
UID Mask
AC with 16
timeslot
Table 20. Response to a successful INVENTORY request [1][2]
Error Flag
Data
CRC-16
Description
1
0
48 - n
(16)
No. of bits
Remaining UID without mask value
[1] Error and CRC are Manchester coded, UID is dual pattern coded
[2] Response within the according time slot
Error Flag set to ’0’ indicates no error.
HTMS1x01_8x01
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14.4 INVENTORY ISO 11785
[Advanced, Advanced+]
Upon reception of this command without error, all transponder ICs in the ready state are
performing the anticollision sequence. The inventory (INV) flag is set to '1'. The NOS flag
determines whether 1 or 16 slots are used.
In contrast to INVENTORY command the transponder IC (holding requested slot) sends
the 64-bit ISO 11785 number in addition to remaining UID. The 64-bit number is taken
from a fixed area of EEPROM. It will not be checked on ISO 11785 compliance before
sending.
If a transponder IC detects any error, it remains silent.
Table 21. INVENTORY ISO 11785 - request format (23h)
Flags
Command
Mask length
Mask value
CRC-16
Description
5
6
6
n
(16)
No. of bits
AC with 1
timeslot
10(1)10
00(1)10
100011
100011
0 n UID length
0 n UID length
UID Mask
UID Mask
AC with 16
timeslot
Table 22. Response to a successful INVENTORY ISO 11785 request[1]
Error Flag Data 1
Data 2
CRC-16
Description
1
0
48 - n
64
(16)
No. of bits
Remaining UID without mask value ISO 11785 number
[1] Error, CRC and ISO 11785 number are Manchester coded, UID is dual pattern coded
14.5 STAY QUIET
[Advanced, Advanced+]
Upon reception of this command without error, a transponder IC in either ready state or
selected state enters the quiet state and shall not send back a response.
The STAY QUIET command with both SEL and ADR flag set to '0' or both set to '1' is not
allowed.
There is no response to the STAY QUIET request, even if the transponder detects an error
Table 23. STAY QUIET - request format(01h)
Flags
5
Command
6
Data
(48)
-
CRC-16
Description
No. of bits:
without UID
with UID
(16)
00(1)00
11(1)00
000001
000001
UID
HTMS1x01_8x01
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14.6 READ UID
[, Advanced, Advanced+]
Upon reception of this command without error all transponder ICs in the ready state are
sending their UID.
The addressed (ADR), the select (SEL), the inventory (INV) and the (PEXT) flag are set to
'0'.
Table 24. READ UID - request format (02h)
Flags
5
Command
6
CRC-16
Description
(16)
No. of bits
00(1)00
000010
Table 25. Response to a successful READ UID request
Error flag
Data
48
CRC-16
Description
1
0
(16)
No. of bits
UID
Error flag set to ’0’ indicates no error.
HTMS1x01_8x01
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14.7 READ MULTIPLE BLOCK
[, Advanced, Advanced+]
Upon reception of this command without error, the transponder reads the requested
block(s) and sends back their value in the response. The blocks are numbered from 0 to
255.
The number of blocks in the request is one less than the number of blocks that the
transponder returns in its response i.e. a value of '6' in the ’Number of blocks’ field
requests to read 7 blocks. A value '0' requests to read a single block.
Table 26. READ MULTIPLE BLOCKS (advanced/advanced+) - request format (12h)
Flags
5
Command Data 1
Data 2
Data 3
CRC-16 Description
6
(48)
-
8
8
(16)
No. of bits
00(1)00
010010
First block
number
Number of
blocks
without UID
in READY
state
10(1)00
01(1)00
010010
010010
UID
-
First block
number
Number of
blocks
with UID in
READY
state
First block
number
Number of
blocks
without UID
in
SELECTED
state
Table 27. READ MULTIPLE BLOCKS (µ) - request format (12h)
Flags
5
Command Data 1
Data 2
Data 3
CRC-16 Description
6
(48)
-
8
8
(16)
No. of bits
00(1)00
010010
First block
number
Number of
blocks
without UID
in READY
state
10(1)00
010010
UID
First block
number
Number of
blocks
with UID in
READY
state
Table 28. Response to a successful READ MULTIPLE BLOCKS request
Error Flag
Data
CRC-16 Description
1
0
32 x Number of blocks
User memory block data
(16)
No. of bits
Error Flag set to ’0’ indicates no error.
HTMS1x01_8x01
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14.7.1 READ MULTIPLE BLOCKS in INVENTORY mode
[Advanced, Advanced+]
The READ MULTIPLE BLOCK command can also be sent in inventory mode (which is
marked by INV-Flag = '1' within the request). Here request and response will change as
shown in following tables.
If the transponder detects an error during the inventory sequence, it shall remain silent.
Table 29. READ MULTIPLE BLOCKS - request format (12h)
Flags
Command Mask
length
Mask Parameter 1 Parameter 2 CRC-16 Description
value
5
6
6
n
8
8
(16)
No. of bits
10(1)10 010010
0 n UID
length
First block
number
Number of
blocks
AC with 1
timeslot
00(1)10 010010
0 n UID
length
First block
number
Number of
blocks
AC with 16
timeslot
After receiving RWD's command without error the transponder IC transmits the remaining
section of the UID in dual pattern code. The following data (Error Flag, Data 2, optional
CRC in no error case; Error Flag, Error Code, optional CRC in error case) is transmitted in
Manchester Code.
Table 30. READ MULTIPLE BLOCKS in INVENTORY mode Response format [1]
Error Flag Data 1
Data 2
CRC-16 Description
(16) No.of bits
1
0
48 - n
32 x number of blocks
User memory block data
Remaining section of UID
(without mask value)
[1] Error, CRC and Data are Manchester coded, UID is dual pattern coded
HTMS1x01_8x01
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14.8 WRITE SINGLE BLOCK
[, Advanced, Advanced+]
Upon reception of this command without error, the transponder IC writes 32-bit of data into
the requested user memory block and report the success of the operation in the response.
Table 31. WRITE SINGLE BLOCK (advanced/advanced+) - request format (14h)
Flags
5
Command Data 1
Data 2
Data 3
CRC-16 Description
6
(48)
-
8
32
(16)
No. of bits
(1)0(1)00
010100
block number block data
block number block data
block number block data
without UID
in READY
state
0(1)(1)00
01(1)00
010100
010100
UID
-
with UID in
READY
state
without UID
in
SELECTED
state
Table 32. WRITE SINGLE BLOCK (µ) - request format (14h)
Flags
5
Command Data 1
Data 2
Data 3
CRC-16 Description
6
(48)
-
8
32
(16)
No. of bits
00(1)00
010100
block number block data
without UID
in READY
state
10(1)00
010100
UID
block number block data
with UID in
READY
state
Table 33. Response to a successful WRITE SINGLE BLOCK request
Error Flag
CRC-16
Description
1
0
(16)
No. of bits
Error Flag set to ’0’ indicates no error.
HTMS1x01_8x01
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14.9 LOCK BLOCK
[, Advanced, Advanced+]
Upon reception of this command without error, the transponder IC is write locking the
requested block (block size = 32-bit) permanently.
Blocks within the block address range from 00h to 17h as well as FEh and FFh can be
locked individually.
For HITAG µ advanced+ transponder IC a LOCK BLOCK command with a block number
value between 18h to 36h will lock all blocks within the block address range 18h to 36h.
In case a password is applied to the memory a lock is only possible after a successful
login.
Table 34. LOCK BLOCK (advanced/advanced+) - request format (16h)
Flags
5
Command
6
Data 1
(48)
-
Data 2
CRC-16
Description
8
(16)
No. of bits
00(1)00
010110
block number
without UID
in READY
state
10(1)00
01(1)00
010110
010110
UID
-
block number
block number
with UID in
READY
state
without UID
in
SELECTED
state
Table 35. LOCK BLOCK (µ) - request format (16h)
Flags
5
Command
6
Data 1
(48)
Data 2
CRC-16
Description
8
(16)
No. of bits
00(1)00
010110
UID
block number
without UID
in READY
state
10(1)00
010110
-
block number
with UID in
READY
state
Table 36. Response to a successful LOCK BLOCK request
Error flag
CRC-16
Description
1
0
(16)
No. of bits
Error Flag set to ’0’ indicates no error.
HTMS1x01_8x01
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14.10 SELECT
[Advanced, Advanced+]
The SELECT command is always be executed with SEL flag set to '0' and ADR flag set to
'1'. There are several possibilities upon reception of this command without error:
• If the UID, received by the transponder IC, is equal to its own UID, the transponder IC
enters the Selected state and shall send a response.
• If the received UID is different there are two possibilities
– A transponder IC in a non-selected state (QUIET or READY) is keeping its state
and not sending a response.
– The transponder IC in the Selected state enters the Quiet state and does not send
a response.
Table 37. SELECT - request format (18h)
Flags
5
Command
6
Data 1
48
CRC-16
Description
(16)
No. of bits
10(1)00
011000
UID
Table 38. Response to a successful SELECT request
Error flag
CRC-16
Description
1
0
(16-bit)
No. of bits
Error Flag set to ’0’ indicates no error.
HTMS1x01_8x01
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14.11 WRITE ISO 11785 (custom command)
[, Advanced, Advanced+]
Upon reception of this command without error, the transponder IC (in Ready state) writes
128-bit of ISO 11785 TTF data into suitable reserved memory block and report the
success of the operation in the response. The user does not have to attend whether the
data is compliant to ISO 11785 or not. The command data block is sent exactly the same
way as it is sent by the transponder IC in TTF mode (Header, 64-bit ID, CRC…) after
entering the field again.
There are two different command codes one for locking the TTF area after successful
write command and one without locking.
The command must be completed by a reset of the IC. After entering the RF field the
ISO 11785 data is sent when the transponder is in ISO 11785 state.
Table 39. WRITE ISO 11785 - request format (38h, 39h)
Flags
5
Command
6
Data 1
CRC-16
Description
128
(16)
No. of bits
00(1)00
00(1)00
111000
111001
ISO 11785 TTF data
ISO 11785 TTF data
inc. LOCK
Table 40. Response to a successful WRITE ISO 11785 request
Error flag
CRC-16
Description
1
0
(16)
No. of bits
Error Flag set to ’0’ indicates no error.
request
request (or EOF)
carrier on
transceiver
carrier off
T
T
T
Fp2
Fp1
NRT
load off
load on
HITAG μ
response
001aaj833
Fig 19. Waiting time before a response for WRITE ISO 11785 command
The minimum value of TFp1 is 20 ms.
HTMS1x01_8x01
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14.12 GET SYSTEM INFORMATION
[Advanced, Advanced+]
Upon reception of this command without error, the transponder IC reads the requested
system memory block(s) and sends back their values in the response.
Table 41. GET SYSTEM INFORMATION - request format (17h)
Flags
5
Command
6
Data 1
CRC-16
Description
No. of bits
without UID
with UID
(48)
(16)
00(1)00
10(1)00
010111
010111
UID
Table 42. GET SYSTEM INFORMATION - response format
Error
flag
Data
CRC-16
Description
1
0
40
8
8
8
8
8
8
8
0
8
0
(16)
No. of bits
system memory block data
MSN MFC ICR
0
0
0
0
Error Flag set to ’0’ indicates no error.
HTMS1x01_8x01
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14.13 LOGIN
HITAG µ transponder IC
[, Advanced, Advanced+]
Upon reception of this command without error, the transponder IC compares received
password with PWD in memory block (FEh) and if correct it permits write (opt. read)
access to the protected memory area (defined in User config, see Table 7) and reports the
success of the operation in the response. In case a wrong password is issued in a further
login request no access to protected memory blocks will be granted.
Default password: FFFFFFFFh
Table 43. LOGIN (advanced/advanced+) - request format
Flags
5
Command IC MFC
Parameter 1 Password
CRC-16 Description
6
8
(48)
-
32
(16)
No. of bits
00(1)00
101000
MFC
password
without UID
in READY
state
10(1)00
01(1)00
101000
101000
MFC
MFC
UID
-
password
password
with UID in
READY state
without UID
in
SELECTED
state
Table 44. LOGIN (µ) - request format
Flags
5
Command IC MFC
Parameter 1 Password
CRC-16 Description
6
8
(48)
-
32
(16)
No. of bits
00(1)00
101000
MFC
password
without UID
in READY
state
10(1)00
101000
MFC
UID
password
with UID in
READY state
Table 45. Response to a successful LOGIN request
Error flag
CRC-16
Description
1
0
(16)
No. of bits
HTMS1x01_8x01
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15. Transponder Talks First (TTF) mode
This mode of the HITAG µ transponder enables data transmission to a RWD without
sending any command. Every time the transponder IC is activated by the field it starts
executing this mode.
The transponder in TTF mode sends the data stored in the EEPROM independent if the
data is ISO compliant or not.
If the transponder IC is configured in TTF mode a SWITCH command or SOF sent by the
RWD within the defined listening window sets the transponder into RTF mode.
16. Data integrity/calculation of CRC
The following explanations show the features of the HITAG µ protocol to protect read and
write access to transponders from undetected errors. The CRC is an 16-bit CRC
according to ISO 11785.
16.1 Data transmission: RWD to HITAG µ transponder IC
Data stream transmitted by the RWD to the HITAG µ transponder may include an optional
16-bit Cyclic Redundancy Check (CRC-16).
The data stream is first verified for data errors by the HITAG µ transponder IC and then
executed.
The generator polynomial for the CRC-16 is:
u
16 + u12 + u5+ 1 = 1021h
The CRC pre set value is: 0000h
16.2 Data transmission: HITAG µ transponder IC to RWD
The HITAG µ transponder calculates the CRC on all received bits of the request. Whether
the HITAG µ transponder IC calculated CRC is appended to the response depends on the
setting of the CRCT flag.
HTMS1x01_8x01
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17. Limiting values
Table 46. Limiting values[1][2]
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Tstg
Parameter
Conditions
Min
55
2
Max
+125
-
Unit
C
storage temperature
electrostatic discharge voltage
VESD
JEDEC JESD 22-A114-AB
Human Body Model
kV
Ii(max)
Tj
maximum input current
junction temperature
IN1-IN2
20
mA
40
+85
C
[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical
Characteristics section of this specification is not implied.
[2] This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static
charge. Nonetheless, it is suggested that conventional precautions should be taken to avoid applying values greater than the rated
maxima
18. Characteristics
Table 47. Characteristics
Symbol
Parameter
Conditions
Min
100
4
Typ
125
5
Max
150
6
Unit
kHz
V
foper
VI
operating frequency
input voltage
IN1-IN2
II
input current
IN1-IN2
-
-
10
mA
Ci
input capacitance
between IN1-IN2
HTMS1x01
HTMS8x01
[2][3]
[2][4]
203.7
266
210
280
216.3
294
pF
pF
[1] Typical ratings are not guaranteed. Values are at 25 C.
[2] Measured with an HP4285A LCR meter at 125 kHz/room temperature (25C); VIN1-IN2 = 0.5 V (RMS)
[3] Integrated Resonance Capacitor: 210pF 3%
[4] Integrated Resonance Capacitor: 280pF 5%
HTMS1x01_8x01
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19. Marking
19.1 Marking SOT1122
Table 48. Marking SOT1122
Type
Type code
HTMS1001FTB/AF
HTMS1101FTB/AF
HTMS1201FTB/AF
HTMS8001FTB/AF
HTMS8101FTB/AF
HTMS8201FTB/AF
10
11
12
80
81
82
Table 49. Pin description SOT1122
Pin
1
Description
IN 1
2
IN 2
3
n.c not connected
HTMS1x01_8x01
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19.2 Marking HVSON2
Only two lines are available for marking (Figure 20).
A : 5
B : 4
0
3
aaa-004170
Fig 20. Marking overview
First line consists on five digits and contains the diffusion lot number. Second line consists
on four digits and describes the product type, HTSH5601ETK or HTSH4801ETK (see
example in Table 50).
Table 50. Marking example
Line
A
Marking
70960
Description
5 digits, Diffusion Lot Number, First letter truncated
4 digits, Type: Table 51 “Marking HVSON2”
B
HM10
Table 51. Marking HVSON2
Type
Type code
HM10
HTMS1001FTK/AF
HTMS1101FTK/AF
HTMS1201FTK/AF
HTMS8001FTK/AF
HTMS8101FTK/AF
HTMS8201FTK/AF
HM11
HM12
HM80
HM81
HM82
HTMS1x01_8x01
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20. Package outline
XSON3: plastic extremely thin small outline package; no leads; 3 terminals; body 1 x 1.45 x 0.5 mm
SOT1122
b
b
1
1
4×
(2)
L
1
3
L
e
2
e
1
e
1
4×
A
(2)
A
1
D
type code
E
terminal 1
index area
pin 1 indication
0
1
2 mm
scale
Dimensions
Unit
(1)
A
A
b
b
D
E
e
e
1
L
L
1
1
1
max 0.50 0.04 0.45 0.55 1.50 1.05
0.35 0.30
0.40 0.50 1.45 1.00 0.55 0.425 0.30 0.25
0.37 0.47 1.40 0.95 0.27 0.22
mm nom
min
Notes
1. Dimension A is including plating thickness.
2. Can be visible in some manufacturing processes.
sot1122_po
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
09-10-09
SOT1122
MO-252
Fig 21. Package outline SOT1122
HTMS1x01_8x01
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HITAG µ transponder IC
HVSON2: plastic thermal enhanced very thin small outline package; no leads;
2 terminals; body 3 × 2 × 0.85 mm
SOT899-1
D
B
A
E
A
A
1
detail X
terminal 1
index area
C
y
C
1
y
M
M
∅ v
∅ w
C
A
B
b
C
terminal 1
index area
1
L
e
E
h
2
X
D
h
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
1
b
D
D
h
E
E
e
L
v
w
y
y
1
h
max
0.05
0
0.9
0.7
2.1
1.9
1.35
1.05
3.1
2.9
1.35
1.05
0.5
0.3
mm
1
2.5
0.1
0.05 0.05
0.1
Note
1. Plastic or metal protrusions of 0.75 mm maximum per side are not included
REFERENCES
JEDEC JEITA
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
05-02-25
05-05-09
SOT899-1
Fig 22. Package outline HVSON2
HTMS1x01_8x01
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21. Abbreviations
Table 52. Abbreviations
Abbreviation
AC
Definition
Anticollision Code
ASK
BC
Amplitude Shift Keying
Bi-phase Code
BPLC
CRC
DSFID
EEPROM
EOF
IC
Binary Pulse Length Coding
Cyclic Redundancy Check
Data Storage Format Identifier
Electrically Erasable Programmable Read-Only Memory
End Of Frame
Integrated Circuit
ICR
Integrated Circuit Reference number
Least Significant Bit
Least Significant Byte
Modulation Index
LSB
LSByte
m
MC
Manchester Code
MFC
MSB
MSByte
MSN
NA
integrated circuit Manufacturer Code
Most Significant Bit
Most Significant Byte
Manufacturer Serial Number
No Access
NOB
NOP
NOS
NSS
OTP
PID
Number Of Block
Number Of Pages
Number Of Slots
Number Of Sensors
One Time Programmable
Product Identifier
PWD
RF
Password
Radio Frequency
RFU
RND
RO
Reserved for Future Use
Random Number
Read Only
RTF
Reader Talks First
R/W
Read/Write
RWD
SOF
TTF
Read Write Device
Start of Frame
Transponder Talks First
Unique IDentifier
UID
HTMS1x01_8x01
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.2 — 3 July 2012
152932
51 of 57
HTMS1x01; HTMS8x01
NXP Semiconductors
HITAG µ transponder IC
22. References
[1] Application note — AN10214, HITAG Coil Design Guide, Transponder IC
BU-ID Doc.No.: 0814**1
[2] General specification for 8” wafer on UV-tape with electronic fail die
marking — Delivery type description, BU-ID Doc.No.: 1093**1
1. ** ... document version number
HTMS1x01_8x01
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.2 — 3 July 2012
152932
52 of 57
HTMS1x01; HTMS8x01
NXP Semiconductors
HITAG µ transponder IC
23. Revision history
Table 53: Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
HTMS1x01_8x01 20120703
Product data sheet
-
H152931_HITAGµ
Modifications:
• Section 9.2 “Memory configuration”: updated
• Section 14.9 “LOCK BLOCK”: updated
• Some modifications done to comply with HTMS1x01_HTSMS8x01 short data sheet
152931
20100114
Product data sheet
152930
Modifications:
• Section 6 “Ordering information”: updated
• Section 10 “Mechanical specification”, Section 21 “Marking” and Section 22
“Package outline”: added
• A number of tables have been redesigned.
152930
20090716
Product data sheet
152912
Modifications:
• Section 3.6 “Delivery types”: remove delivery types
• Section 6 “Ordering information”: remove delivery types SOT1122 and
SOT732-1
• Section 15.2 “State diagram HITAG m advanced/advanced+”: Note added
• Section 19 “Limiting values”: move input current to table 42
• Section 17 “Package outline”: removed
• Section 20 “Legal information”: update
152912
20090619
Objective data sheet
152911
Modifications:
• General update
• The drawings have been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
152911
20090225
Objective data sheet
-
-
152910
-
Modifications:
152910
• General update
20090114
Objective data sheet
HTMS1x01_8x01
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.2 — 3 July 2012
152932
53 of 57
HTMS1x01; HTMS8x01
NXP Semiconductors
HITAG µ transponder IC
24. Legal information
24.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
24.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
24.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
HTMS1x01_8x01
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.2 — 3 July 2012
152932
54 of 57
HTMS1x01; HTMS8x01
NXP Semiconductors
HITAG µ transponder IC
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
24.4 Licenses
ICs with HITAG functionality
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
NXP Semiconductors owns a worldwide perpetual license for the patents
US 5214409, US 5499017, US 5235326 and for any foreign counterparts
or equivalents of these patents. The license is granted for the Field-of-Use
covering: (a) all non-animal applications, and (b) any application for animals
raised for human consumption (including but not limited to dairy animals),
including without limitation livestock and fish.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Please note that the license does not include rights outside the specified
Field-of-Use, and that NXP Semiconductors does not provide indemnity for
the foregoing patents outside the Field-of-Use.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
24.5 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
HITAG — is a trademark of NXP B.V.
25. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
HTMS1x01_8x01
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.2 — 3 July 2012
152932
55 of 57
HTMS1x01; HTMS8x01
NXP Semiconductors
HITAG µ transponder IC
26. Contents
1
General description. . . . . . . . . . . . . . . . . . . . . . 1
11.4
Communication signal interface -
HITAG µ transponder IC to RWD. . . . . . . . . . 21
Data rate and data coding . . . . . . . . . . . . . . . 21
Start of frame pattern . . . . . . . . . . . . . . . . . . . 22
End of frame pattern . . . . . . . . . . . . . . . . . . . 22
1.1
Target markets . . . . . . . . . . . . . . . . . . . . . . . . . 1
Animal identification . . . . . . . . . . . . . . . . . . . . . 1
Laundry automation . . . . . . . . . . . . . . . . . . . . . 1
Beer keg and gas cylinder logistic . . . . . . . . . . 2
Brand protection . . . . . . . . . . . . . . . . . . . . . . . 2
Customer application support and training. . . . 2
11.4.1
11.4.2
11.4.3
1.1.1
1.1.2
1.1.3
1.1.4
1.2
12
12.1
General protocol timing specification. . . . . . 23
Waiting time before transmitting a response
after an EOF from the RWD. . . . . . . . . . . . . . 23
RWD waiting time before sending a
subsequent request . . . . . . . . . . . . . . . . . . . . 24
RWD waiting time before switching to next
inventory slot . . . . . . . . . . . . . . . . . . . . . . . . . 24
RWD started to receive one or more
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Supported standards . . . . . . . . . . . . . . . . . . . . 3
Security features. . . . . . . . . . . . . . . . . . . . . . . . 3
Delivery types. . . . . . . . . . . . . . . . . . . . . . . . . . 3
12.2
2.1
2.2
2.3
2.4
2.5
2.6
12.3
12.3.1
12.3.2
HITAG µ transponder IC responses. . . . . . . . 24
RWD receives no HITAG µ transponder
IC response . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3
4
5
6
7
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Quick reference data . . . . . . . . . . . . . . . . . . . . . 3
Ordering information. . . . . . . . . . . . . . . . . . . . . 4
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pinning information. . . . . . . . . . . . . . . . . . . . . . 6
13
13.1
13.2
13.3
State diagram. . . . . . . . . . . . . . . . . . . . . . . . . . 26
General description of states . . . . . . . . . . . . . 26
State diagram HITAG advanced/advanced+ 27
State diagram HITAG . . . . . . . . . . . . . . . . . 28
Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
ISO 11785 Mode . . . . . . . . . . . . . . . . . . . . . . 29
RTF Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Anticollision . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8
8.1
Mechanical specification . . . . . . . . . . . . . . . . . 8
Wafer specification . . . . . . . . . . . . . . . . . . . . . . 8
Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Wafer backside. . . . . . . . . . . . . . . . . . . . . . . . . 8
Chip dimensions . . . . . . . . . . . . . . . . . . . . . . . . 8
Passivation on front . . . . . . . . . . . . . . . . . . . . . 8
Au bump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Fail die identification . . . . . . . . . . . . . . . . . . . . 9
Map file distribution. . . . . . . . . . . . . . . . . . . . . . 9
13.4
13.4.1
13.4.2
13.4.3
8.1.1
8.1.2
8.1.3
8.1.4
8.1.5
8.1.6
8.1.7
13.4.3.1 Anticollision with 1 slot. . . . . . . . . . . . . . . . . . 29
13.4.3.2 Anticollision with 16 slots . . . . . . . . . . . . . . . . 30
14
Command set . . . . . . . . . . . . . . . . . . . . . . . . . 31
Flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Error handling . . . . . . . . . . . . . . . . . . . . . . . . 33
INVENTORY . . . . . . . . . . . . . . . . . . . . . . . . . 34
[Advanced, Advanced+]. . . . . . . . . . . . . . . . . . 34
INVENTORY ISO 11785 . . . . . . . . . . . . . . . . 35
[Advanced, Advanced+]. . . . . . . . . . . . . . . . . . 35
STAY QUIET . . . . . . . . . . . . . . . . . . . . . . . . . 35
[Advanced, Advanced+]. . . . . . . . . . . . . . . . . . 35
READ UID . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
[, Advanced, Advanced+]. . . . . . . . . . . . . . . . 36
READ MULTIPLE BLOCK . . . . . . . . . . . . . . . 37
[, Advanced, Advanced+]. . . . . . . . . . . . . . . . 37
READ MULTIPLE BLOCKS in INVENTORY
mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
[Advanced, Advanced+]. . . . . . . . . . . . . . . . . . 38
WRITE SINGLE BLOCK . . . . . . . . . . . . . . . . 39
[, Advanced, Advanced+]. . . . . . . . . . . . . . . . 39
LOCK BLOCK . . . . . . . . . . . . . . . . . . . . . . . . 40
[, Advanced, Advanced+]. . . . . . . . . . . . . . . . 40
SELECT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
14.1
14.2
14.3
9
9.1
9.1.1
Functional description . . . . . . . . . . . . . . . . . . 10
Memory organization . . . . . . . . . . . . . . . . . . . 10
Memory organization HITAG transponder
ICs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Memory organization HITAG µ Advanced . . . 11
Memory organization HITAG µ Advanced + . . 12
Memory configuration. . . . . . . . . . . . . . . . . . . 13
14.4
14.5
14.6
14.7
14.7.1
9.1.2
9.1.3
9.2
10
General requirements . . . . . . . . . . . . . . . . . . . 14
11
HITAG m transponder IC air interface . . . . . . 14
Downlink description. . . . . . . . . . . . . . . . . . . . 14
Mode switching protocol. . . . . . . . . . . . . . . . . 16
SWITCH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Downlink communication signal interface -
RWD to HITAG µ transponder IC . . . . . . . . . . 18
Modulation parameters. . . . . . . . . . . . . . . . . . 18
Data rate and data coding . . . . . . . . . . . . . . . 19
RWD - Start of frame pattern . . . . . . . . . . . . . 20
RWD - End of frame pattern . . . . . . . . . . . . . . 20
11.1
11.2
11.2.1
11.3
14.8
14.9
14.10
11.3.1
11.3.2
11.3.3
11.3.4
continued >>
HTMS1x01_8x01
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.2 — 3 July 2012
152932
56 of 57
HTMS1x01; HTMS8x01
NXP Semiconductors
HITAG µ transponder IC
[Advanced, Advanced+] . . . . . . . . . . . . . . . . . .41
14.11
14.12
14.13
WRITE ISO 11785 (custom command) . . . . . 42
[, Advanced, Advanced+] . . . . . . . . . . . . . . . .42
GET SYSTEM INFORMATION. . . . . . . . . . . . 43
[Advanced, Advanced+] . . . . . . . . . . . . . . . . . .43
LOGIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
[, Advanced, Advanced+] . . . . . . . . . . . . . . . .44
15
Transponder Talks First (TTF) mode . . . . . . . 45
16
16.1
Data integrity/calculation of CRC. . . . . . . . . . 45
Data transmission: RWD to HITAG µ transponder
IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Data transmission: HITAG µ transponder IC
16.2
to RWD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
17
18
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 46
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 46
19
19.1
19.2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Marking SOT1122. . . . . . . . . . . . . . . . . . . . . . 47
Marking HVSON2. . . . . . . . . . . . . . . . . . . . . . 48
20
21
22
23
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 49
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 51
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 53
24
Legal information. . . . . . . . . . . . . . . . . . . . . . . 54
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 54
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 55
24.1
24.2
24.3
24.4
24.5
25
26
Contact information. . . . . . . . . . . . . . . . . . . . . 55
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 July 2012
152932
相关型号：
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SI9137LG
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SI9122E
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