933817040112 [NXP]

TRANSISTOR VHF BAND, Si, N-CHANNEL, RF POWER, MOSFET, CERAMIC PACKAGE-4, FET RF Power;
933817040112
型号: 933817040112
厂家: NXP    NXP
描述:

TRANSISTOR VHF BAND, Si, N-CHANNEL, RF POWER, MOSFET, CERAMIC PACKAGE-4, FET RF Power

局域网 放大器 晶体管
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中文:  中文翻译
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DISCRETE SEMICONDUCTORS  
DATA SHEET  
BLF244  
VHF power MOS transistor  
September 1992  
Product specification  
Philips Semiconductors  
Product specification  
VHF power MOS transistor  
BLF244  
FEATURES  
PIN CONFIGURATION  
High power gain  
Low noise figure  
Easy power control  
Good thermal stability  
Withstands full load mismatch  
k, halfpage  
1
4
Gold metallization ensures  
excellent reliability.  
d
s
g
MBB072  
DESCRIPTION  
2
3
Silicon N-channel enhancement  
mode vertical D-MOS transistor  
designed for large signal amplifier  
applications in the VHF frequency  
range.  
MSB057  
Fig.1 Simplified outline and symbol.  
The transistor is encapsulated in a  
4-lead SOT123 flange envelope, with  
a ceramic cap. All leads are isolated  
from the flange.  
CAUTION  
The device is supplied in an antistatic package. The gate-source input must  
be protected against static charge during transport and handling.  
Matched gate-source voltage (VGS  
groups are available on request.  
)
WARNING  
PINNING - SOT123  
Product and environmental safety - toxic materials  
PIN  
DESCRIPTION  
This product contains beryllium oxide. The product is entirely safe provided  
that the BeO disc is not damaged. All persons who handle, use or dispose of  
this product should be aware of its nature and of the necessary safety  
precautions. After use, dispose of as chemical or special waste according to  
the regulations applying at the location of the user. It must never be thrown  
out with the general or domestic waste.  
1
2
3
4
drain  
source  
gate  
source  
QUICK REFERENCE DATA  
RF performance at Th = 25 °C in a common source test circuit.  
f
MODE OF OPERATION  
(MHz)  
VDS  
(V)  
PL  
(W)  
Gp  
(dB)  
ηD  
(%)  
CW, class-B  
175  
28  
15  
> 13  
> 50  
September 1992  
2
Philips Semiconductors  
Product specification  
VHF power MOS transistor  
BLF244  
LIMITING VALUES  
In accordance with the Absolute Maximum System (IEC 134).  
SYMBOL  
VDS  
PARAMETER  
drain-source voltage  
CONDITIONS  
MIN.  
MAX.  
65  
UNIT  
V
±VGS  
ID  
gate-source voltage  
DC drain current  
20  
3
V
A
Ptot  
Tstg  
Tj  
total power dissipation  
storage temperature  
junction temperature  
up to Tmb = 25 °C  
38  
150  
200  
W
°C  
°C  
65  
THERMAL RESISTANCE  
SYMBOL  
PARAMETER  
CONDITIONS  
THERMAL RESISTANCE  
Rth j-mb  
thermal resistance from  
junction to mounting base  
Tmb = 25 °C; Ptot = 38 W  
4.6 K/W  
Rth mb-h  
thermal resistance from  
Tmb = 25 °C; Ptot = 38 W  
0.3 K/W  
mounting base to heatsink  
MRA919  
MGP151  
10  
50  
handbook, halfpage  
handbook, halfpage  
P
tot  
(W)  
I
D
40  
(A)  
(1)  
30  
20  
10  
(1)  
(2)  
(2)  
1
1  
10  
0
0
2
1
10  
10  
50  
100  
150  
V
(V)  
DS  
T
(°C)  
h
(1) Current is this area may be limited by RDS(on)  
.
(1) Short-time operation during mismatch.  
(2) Continuous operation.  
(2) Tmb = 25 °C.  
Fig.2 DC SOAR.  
Fig.3 Power/temperature derating curves.  
September 1992  
3
Philips Semiconductors  
Product specification  
VHF power MOS transistor  
BLF244  
CHARACTERISTICS  
Tj = 25 °C unless otherwise specified.  
SYMBOL  
V(BR)DSS  
PARAMETER  
CONDITIONS  
VGS = 0; ID = 5 mA  
MIN. TYP. MAX. UNIT  
drain-source breakdown voltage  
drain-source leakage current  
gate-source leakage current  
gate-source threshold voltage  
65  
V
IDSS  
VGS = 0; VDS = 28 V  
±VGS = 20 V; VDS = 0  
ID = 5 mA; VDS = 10 V  
1
mA  
µA  
V
IGSS  
1
VGS(th)  
VGS  
2
4.5  
100  
gate-source voltage difference of ID = 5 mA; VDS = 10 V  
matched devices  
mV  
gfs  
forward transconductance  
drain-source on-state resistance  
on-state drain current  
input capacitance  
ID = 0.75 A; VDS = 10 V  
0.6  
S
RDS(on)  
IDSX  
Cis  
ID = 0.75 A; VGS = 10 V  
0.8  
5
1.5  
VGS = 10 V; VDS = 10 V  
A
VGS = 0; VDS = 28 V; f = 1 MHz  
VGS = 0; VDS = 28 V; f = 1 MHz  
VGS = 0; VDS = 28 V; f = 1 MHz  
60  
40  
4.5  
4.3  
pF  
pF  
pF  
dB  
Cos  
Crs  
output capacitance  
feedback capacitance  
noise figure (see Fig. 13)  
F
ID = 0.5 A; VDS = 28 V; R1 = 23 Ω;  
Th = 25 °C; f = 175 MHz;  
Rth mb-h = 0.3 K/W  
MGP152  
MGP153  
6
2
handbook, halfpage  
handbook, halfpage  
T.C.  
I
(mV/K)  
D
(A)  
0
4
2  
4  
6  
2
0
8  
2
3
0
4
8
12  
16  
1
10  
10  
10  
V
(V)  
GS  
I
(mA)  
D
VDS = 10 V.  
solid line: Tj = 25 °C.  
VDS = 10 V; valid for Tj = 25 to 125 °C.  
dotted line: Tj = 125 °C.  
Fig.5 Drain current as a function of gate-source  
voltage, typical values.  
Fig.4 Temperature coefficient of gate-source  
voltage as a function of drain current, typical  
values.  
September 1992  
4
Philips Semiconductors  
Product specification  
VHF power MOS transistor  
BLF244  
MGP154  
MGP155  
2
160  
handbook, halfpage  
handbook, halfpage  
C
(pF)  
R
DS(on)  
()  
120  
80  
1
C
C
is  
os  
40  
0
0
0
0
40  
80  
120  
160  
10  
20  
30  
40  
T (°C)  
V
(V)  
DS  
j
VGS = 0; f = 1 MHz.  
VGS = 10 V; ID = 0.75 A.  
Fig.6 Drain-source on-state resistance as a  
Fig.7 Input and output capacitance as functions  
of drain-source voltage, typical values.  
function of junction temperature, typical  
values.  
MGP156  
20  
handbook, halfpage  
C
rs  
(pF)  
10  
0
0
20  
40  
V
(V)  
DS  
VGS = 0; f = 1 MHz.  
Fig.8 Feedback capacitance as a function of  
drain-source voltage, typical values.  
September 1992  
5
Philips Semiconductors  
Product specification  
VHF power MOS transistor  
BLF244  
APPLICATION INFORMATION FOR CLASS-B OPERATION  
Th = 25 °C; Rth mb-h = 3 K/W; unless otherwise specified.  
RF performance in CW operation in a common source class-B circuit.  
Zi  
()  
(note 1)  
f
VDS IDQ  
PL  
GP  
(dB)  
ηD  
(%)  
ZL  
()  
R1  
()  
MODE OF OPERATION  
(MHz) (V) (mA) (W)  
CW, class-B  
175  
28  
25  
15  
6
> 13  
typ. 17  
> 50  
typ. 65  
3.0 j4.0  
6.3 + j9.8  
4.5 + j3.3  
46.4//46.4  
100  
175 12.5 25  
typ. 15  
typ. 60  
3.0 j4.0  
Note  
1. R1 included.  
Ruggedness in class-B operation  
The BLF244 is capable of withstanding a load mismatch  
corresponding to VSWR = 50 through all phases under  
the following conditions:  
Th = 25 °C; Rth mb-h = 0.3 K/W; at rated load power.  
MGP157  
MGP158  
30  
20  
100  
handbook, halfpage  
handbook, halfpage  
G
p
η
P
L
(W)  
G
p
(dB)  
D
(%)  
η
D
20  
10  
50  
10  
0
0
0
30  
0
1
2
10  
20  
P
(W)  
IN  
P
(W)  
L
Class-B operation; VDS = 28 V; IDQ = 25 mA;  
f = 175 MHz; Th = 25 °C; Rth mb-h = 0.3 K/W.  
Class-B operation; VDS = 28 V; IDQ = 25 mA;  
f = 175 MHz; Th = 25 °C; Rth mb-h = 0.3 K/W.  
Fig.9 Load power as a function of input power,  
typical values.  
Fig.10 Power gain and efficiency as functions of  
load power, typical values.  
September 1992  
6
Philips Semiconductors  
Product specification  
VHF power MOS transistor  
BLF244  
MGP159  
MGP160  
20  
20  
100  
handbook, halfpage  
handbook, halfpage  
G
p
η
D
(dB)  
(%)  
G
p
P
L
(W)  
16  
80  
η
D
10  
60  
40  
20  
12  
8
4
0
0
0
1
2
4
8
12  
16  
P
(W)  
P (W)  
L
IN  
Class-B operation; VDS = 12.5 V; IDQ = 25 mA;  
Class-B operation; VDS = 12.5 V; IDQ = 25 mA;  
f = 175 MHz; Th = 25 °C; Rth mb-h = 0.3 K/W.  
f = 175 MHz; Th = 25 °C; Rth mb-h = 0.3 K/W.  
Fig.11 Load power as a function of input power,  
typical values.  
Fig.12 Power gain and efficiency as functions of  
load power, typical values.  
+V  
C14  
C7  
L6  
G
R3  
+V  
D
R2  
C13  
C6  
L5  
C8  
C9  
C11  
C12  
L4  
D.U.T.  
L7  
L8  
50 Ω  
output  
C2  
C3  
C5  
C4  
R1  
L3  
C1  
L1  
L2  
50 Ω  
input  
C10  
MGP161  
f = 175 MHz.  
Fig.13 Test circuit for class-B operation.  
September 1992  
7
Philips Semiconductors  
Product specification  
VHF power MOS transistor  
BLF244  
List of components (class-B test circuit)  
COMPONENT  
C1, C12  
DESCRIPTION  
VALUE  
680 nF  
DIMENSIONS  
CATALOGUE NO.  
multilayer ceramic chip capacitor  
(note 1)  
C2  
multilayer ceramic chip capacitor  
(note 1)  
20 pF  
C3, C4, C9  
C5  
film dielectric trimmer  
5 to 60 pF  
75 pF  
2222 809 08003  
2222 852 47103  
multilayer ceramic chip capacitor  
(note 1)  
C6  
C7  
multilayer ceramic chip capacitor  
10 nF  
multilayer ceramic chip capacitor  
(note 1)  
100 pF  
C8  
multilayer ceramic chip capacitor  
(note 1)  
47 pF  
11 pF  
C10, C11  
multilayer ceramic chip capacitor  
(note 1)  
C13  
C14  
L1  
solid tantalum capacitor  
2.2 µF  
multilayer ceramic chip capacitor  
100 nF  
2222 852 47104  
4 turns enamelled 1 mm copper wire 32 nH  
length 6.3 mm  
int. dia. 3 mm  
leads 2 × 5 mm  
L2  
1 turn enamelled 1 mm copper wire 12.2 nH  
int. dia. 5.6 mm  
leads 2 × 5 mm  
L3, L4  
L5  
stripline (note 2)  
30 Ω  
15 × 6 mm  
6 turns enamelled 1 mm copper wire 119 nH  
length 10.4 mm  
int. dia. 6 mm  
leads 2 × 5 mm  
L6  
L7  
grade 3B Ferroxcube RF choke  
4312 020 36640  
2 turns enamelled 1 mm copper wire 19 nH  
length 2.4 mm  
int. dia. 3 mm  
leads 2 × 5 mm  
L8  
4 turns enamelled 1 mm copper wire 28.5 nH  
metal film resistor (note 3)  
length 8.5 mm  
int. dia. 3 mm  
leads 2 × 5 mm  
R1  
R2  
R3  
0.4 W metal film resistor  
0.4 W metal film resistor  
1 MΩ  
10 Ω  
Notes  
1. American Technical Ceramics (ATC) capacitor, type 100B or other capacitor of the same quality.  
2. The striplines are on a double copper-clad printed circuit board, with epoxy fibre-glass dielectric (εr = 4.5),  
thickness 116 inch.  
3. Refer to Application Information for value.  
September 1992  
8
Philips Semiconductors  
Product specification  
VHF power MOS transistor  
BLF244  
150  
strap  
rivet  
70  
strap  
L6  
+V  
D
C7 C14  
R2  
R1  
C13  
C6  
+V  
R3  
G
L5  
C2  
C3  
C11  
C10  
C5  
C4  
C8  
L2  
L7  
L1  
L8  
C1  
C12  
L3  
L4  
C9  
MGP162  
The circuit and components are situated on one side of the epoxy fibre-glass board, the other side being  
unetched copper to serve as ground plane. Earth connections are made by fixing screws, copper straps and  
hollow rivets under the sources and around the edges to provide a direct contact between the copper on the  
component side and the ground plane.  
Dimensions in mm.  
Fig.14 Component layout for 175 MHz class-B test circuit.  
September 1992  
9
Philips Semiconductors  
Product specification  
VHF power MOS transistor  
BLF244  
MGP164  
MGP165  
60  
25  
handbook, halfpage  
handbook, halfpage  
R
L
Z
L
()  
Z
i
()  
20  
40  
15  
10  
5
x
i
20  
X
L
r
i
0
20  
0
20  
40  
60  
80  
100  
120  
40  
60  
80  
100  
120  
f (MHz)  
f (MHz)  
Class-B operation; VDS = 28 V; IDQ = 25 mA;  
PL = 15 W; Th = 25 °C; Rth mb-h = 0.3 K/W.  
Class-B operation; VDS = 28 V; IDQ = 25 mA;  
PL = 15 W; Th = 25 °C; Rth mb-h = 0.3 K/W.  
Fig.15 Input impedance as a function of frequency  
(series components), typical values.  
Fig.16 Load impedance as a function of frequency  
(series components), typical values.  
MGP166  
40  
handbook, halfpage  
G
p
(dB)  
36  
32  
28  
24  
20  
20  
40  
60  
80  
100  
120  
f (MHz)  
Class-B operation; VDS = 28 V; IDQ = 25 mA;  
PL = 15 W; Th = 25 °C; Rth mb-h = 0.3 K/W.  
Fig.17 Power gain as function of frequency, typical  
values.  
September 1992  
10  
Philips Semiconductors  
Product specification  
VHF power MOS transistor  
BLF244  
PACKAGE OUTLINE  
Flanged ceramic package; 2 mounting holes; 4 leads  
SOT123A  
D
A
F
q
C
M
B
U
1
w
2
C
c
H
b
L
4
3
A
α
p
U
3
U
2
w
M
A
B
1
1
2
H
Q
0
5
10 mm  
scale  
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)  
c
A
b
D
D
F
H
L
p
Q
q
U
U
U
w
w
2
α
UNIT  
mm  
1
1
2
3
1
5.82  
5.56  
9.63  
9.42  
7.47  
6.37  
9.73  
9.47  
2.72 20.71 5.61  
2.31 19.93 5.16  
3.33  
3.04  
4.63  
4.11  
25.15 6.61  
24.38 6.09  
9.78  
9.39  
0.18  
0.10  
18.42  
0.725  
0.51 1.02  
0.02 0.04  
45°  
0.229  
0.219  
0.397  
0.371  
0.294  
0.251  
0.383  
0.373  
0.107 0.815 0.221 0.131  
0.091 0.785 0.203 0.120  
0.26 0.385  
0.24 0.370  
0.007  
0.004  
0.182  
0.162  
0.99  
0.96  
inches  
REFERENCES  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
JEDEC  
EIAJ  
SOT123A  
97-06-28  
September 1992  
11  
Philips Semiconductors  
Product specification  
VHF power MOS transistor  
BLF244  
DEFINITIONS  
Data Sheet Status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
September 1992  
12  

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