74LVC2G125GN,115 [NXP]
74LVC2G125 - Dual bus buffer/line driver; 3-state SON 8-Pin;
| 型号： | 74LVC2G125GN,115 |
| 厂家： | 
NXP |
| 描述： | 74LVC2G125 - Dual bus buffer/line driver; 3-state SON 8-Pin 驱动 光电二极管 逻辑集成电路 |
| 文件： | 总22页 (文件大小：291K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
74LVC2G125
Dual bus buffer/line driver; 3-state
Rev. 14 — 29 March 2013
Product data sheet
1. General description
The 74LVC2G125 provides a dual non-inverting buffer/line driver with 3-state output.
The 3-state output is controlled by the output enable input (pin nOE). A HIGH-level at pin
nOE causes the output to assume a high-impedance OFF-state. Schmitt trigger action at
all inputs makes the circuit highly tolerant of slower input rise and fall times.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these
devices as translators in a mixed 3.3 V and 5 V environment.
This device is fully specified for partial power-down applications using IOFF. The IOFF
circuitry disables the output, preventing a damaging backflow current through the device
when it is powered down.
2. Features and benefits
Wide supply voltage range from 1.65 V to 5.5 V
5 V tolerant input/output for interfacing with 5 V logic
High noise immunity
Complies with JEDEC standard:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8-B/JESD36 (2.7 V to 3.6 V)
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
24 mA output drive (VCC = 3.0 V)
CMOS low-power consumption
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
Inputs accept voltages up to 5 V
Multiple package options
Specified from 40 C to +85 C and 40 C to +125 C
74LVC2G125
NXP Semiconductors
Dual bus buffer/line driver; 3-state
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
74LVC2G125DP
40 C to +125 C
TSSOP8
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
SOT505-2
74LVC2G125DC 40 C to +125 C
VSSOP8
XSON8
XSON8
XSON8
XQFN8
XSON8
XSON8
plastic very thin shrink small outline package; 8 leads; SOT765-1
body width 2.3 mm
74LVC2G125GT
74LVC2G125GF
40 C to +125 C
40 C to +125 C
plastic extremely thin small outline package; no leads; SOT833-1
8 terminals; body 1 1.95 0.5 mm
extremely thin small outline package; no leads;
SOT1089
8 terminals; body 1.35 1 0.5 mm
74LVC2G125GD 40 C to +125 C
74LVC2G125GM 40 C to +125 C
74LVC2G125GN 40 C to +125 C
74LVC2G125GS 40 C to +125 C
plastic extremely thin small outline package; no leads; SOT996-2
8 terminals; body 3 2 0.5 mm
plastic, extremely thin quad flat package; no leads;
8 terminals; body 1.6 1.6 0.5 mm
SOT902-2
SOT1116
SOT1203
extremely thin small outline package; no leads;
8 terminals; body 1.2 1.0 0.35 mm
extremely thin small outline package; no leads;
8 terminals; body 1.35 1.0 0.35 mm
4. Marking
Table 2.
Marking codes
Type number
Marking code[1]
74LVC2G125DP
74LVC2G125DC
74LVC2G125GT
74LVC2G125GF
74LVC2G125GD
74LVC2G125GM
74LVC2G125GN
74LVC2G125GS
V25
V25
V25
VM
V25
V25
VM
VM
[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.
74LVC2G125
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 14 — 29 March 2013
2 of 22
74LVC2G125
NXP Semiconductors
Dual bus buffer/line driver; 3-state
5. Functional diagram
74LVC2G125
74LVC2G125
1A
1Y
2Y
1
EN1
1OE
2A
2
2OE
EN2
mna941
001aae009
Fig 1. Logic symbol
Fig 2. IEC logic symbol
6. Pinning information
6.1 Pinning
74LVC2G125
1OE
1A
1
2
3
4
8
7
6
5
V
CC
2OE
1Y
74LVC2G125
2Y
1
2
3
4
8
7
6
5
1OE
1A
V
CC
2OE
1Y
GND
2A
2Y
GND
2A
001aab739
Transparent top view
001aab738
Fig 3. Pin configuration SOT505-2 and SOT765-1
Fig 4. Pin configuration SOT833-1, SOT1089,
SOT1116 and SOT1203
74LVC2G125
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 14 — 29 March 2013
3 of 22
74LVC2G125
NXP Semiconductors
Dual bus buffer/line driver; 3-state
74LVC2G125
terminal 1
index area
2OE
1
7
6
5
1OE
1A
74LVC2G125
1OE
1A
1
2
3
4
8
7
6
5
V
CC
1Y
2A
2
3
2OE
1Y
2Y
2Y
GND
2A
001aae010
001aai243
Transparent top view
Transparent top view
Fig 5. Pin configuration SOT996-2
Fig 6. Pin configuration SOT902-2
6.2 Pin description
Table 3.
Symbol
Pin description
Pin
Description
SOT505-2, SOT765-1, SOT833-1, SOT1089, SOT902-2
SOT996-2, SOT1116 and SOT1203
1OE, 2OE
1A, 2A
GND
1, 7
2, 5
4
7, 1
6, 3
4
output enable input (active LOW)
data input
ground (0 V)
1Y, 2Y
VCC
6, 3
8
2, 5
8
data output
supply voltage
7. Functional description
Table 4.
Function table[1]
Control
Input
nA
L
Output
nOE
L
nY
L
L
H
H
Z
H
X
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
74LVC2G125
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 14 — 29 March 2013
4 of 22
74LVC2G125
NXP Semiconductors
Dual bus buffer/line driver; 3-state
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground 0 V).
Symbol
VCC
IIK
Parameter
Conditions
Min
0.5
50
0.5
-
Max
+6.5
-
Unit
V
supply voltage
input clamping current
input voltage
VI < 0 V
mA
V
[1]
VI
+6.5
50
VCC + 0.5
+6.5
+6.5
50
100
-
IOK
output clamping current
output voltage
VO > VCC or VO < 0 V
Enable mode
mA
V
[1]
[1]
VO
0.5
0.5
0.5
-
Disable mode
V
[1][2]
Power-down mode
VO = 0 V to VCC
V
IO
output current
mA
mA
mA
C
mW
ICC
IGND
Tstg
Ptot
supply current
-
ground current
100
65
-
storage temperature
total power dissipation
+150
300
[3]
Tamb = 40 C to +125 C
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation.
[3] For TSSOP8 package: above 55 C the value of Ptot derates linearly with 2.5 mW/K.
For VSSOP8 package: above 110 C the value of Ptot derates linearly with 8 mW/K.
For XSON8, XQFN8 packages: above 118 C the value of Ptot derates linearly with 7.8 mW/K.
9. Recommended operating conditions
Table 6.
Symbol
VCC
Operating conditions
Parameter
Conditions
Min
Max
5.5
5.5
VCC
5.5
5.5
+125
20
Unit
V
supply voltage
input voltage
1.65
VI
0
V
VO
output voltage
VCC = 1.65 V to 5.5 V; Enable mode
VCC = 1.65 V to 5.5 V; Disable mode
VCC = 0 V; Power-down mode
0
V
0
V
0
V
Tamb
ambient temperature
40
-
C
ns/V
ns/V
t/V
input transition rise and VCC = 1.65 V to 2.7 V
fall rate
VCC = 2.7 V to 5.5 V
-
10
74LVC2G125
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 14 — 29 March 2013
5 of 22
74LVC2G125
NXP Semiconductors
Dual bus buffer/line driver; 3-state
10. Static characteristics
Table 7.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground 0 V).
Symbol Parameter
Conditions
Min
Typ[1] Max
Unit
Tamb = 40 C to +85 C
VIH
HIGH-level input voltage VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
0.65VCC
-
-
-
-
-
-
-
-
-
V
V
V
V
V
V
V
V
1.7
-
VCC = 2.7 V to 3.6 V
2.0
-
VCC = 4.5 V to 5.5 V
0.7VCC
-
VIL
LOW-level input voltage
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 4.5 V to 5.5 V
-
-
-
-
0.35VCC
0.7
0.8
0.3VCC
VOL
LOW-level output voltage VI = VIH or VIL
IO = 100 A; VCC = 1.65 V to 5.5 V
-
-
-
-
-
-
-
-
-
-
-
-
0.1
V
V
V
V
V
V
IO = 4 mA; VCC = 1.65 V
IO = 8 mA; VCC = 2.3 V
IO = 12 mA; VCC = 2.7 V
IO = 24 mA; VCC = 3.0 V
IO = 32 mA; VCC = 4.5 V
0.45
0.3
0.4
0.55
0.55
VOH
HIGH-level output voltage VI = VIH or VIL
IO = 100 A; VCC = 1.65 V to 5.5 V
IO = 4 mA; VCC = 1.65 V
VCC 0.1
-
-
-
-
-
-
-
-
-
-
-
-
V
1.2
1.9
2.2
2.3
3.8
-
V
IO = 8 mA; VCC = 2.3 V
V
IO = 12 mA; VCC = 2.7 V
V
IO = 24 mA; VCC = 3.0 V
V
IO = 32 mA; VCC = 4.5 V
V
II
input leakage current
VI = 5.5 V or GND; VCC = 0 V to 5.5 V
0.1 5
A
A
IOZ
OFF-state output current VI = VIH or VIL; VO = 5.5 V or GND;
VCC = 3.6 V
-
0.1 10
IOFF
ICC
power-off leakage current VI or VO = 5.5 V; VCC = 0 V
-
-
0.1 10
A
A
supply current
VI = 5.5 V or GND;
CC = 1.65 V to 5.5 V; IO = 0 A
0.1
10
500
-
V
ICC
additional supply current per pin; VI = VCC 0.6 V; IO = 0 A;
-
-
5
A
VCC = 2.3 V to 5.5 V
CI
input capacitance
2
pF
74LVC2G125
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 14 — 29 March 2013
6 of 22
74LVC2G125
NXP Semiconductors
Dual bus buffer/line driver; 3-state
Table 7.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground 0 V).
Symbol Parameter
Conditions
Min
Typ[1] Max
Unit
Tamb = 40 C to +125 C
VIH
HIGH-level input voltage VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
0.65VCC
-
-
-
-
-
-
-
-
-
V
V
V
V
V
V
V
V
1.7
-
VCC = 2.7 V to 3.6 V
2.0
-
VCC = 4.5 V to 5.5 V
0.7VCC
-
VIL
LOW-level input voltage
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 4.5 V to 5.5 V
-
-
-
-
0.35VCC
0.7
0.8
0.3VCC
VOL
LOW-level output voltage VI = VIH or VIL
IO = 100 A; VCC = 1.65 V to 5.5 V
-
-
-
-
-
-
-
-
-
-
-
-
0.1
V
V
V
V
V
V
IO = 4 mA; VCC = 1.65 V
IO = 8 mA; VCC = 2.3 V
IO = 12 mA; VCC = 2.7 V
IO = 24 mA; VCC = 3.0 V
IO = 32 mA; VCC = 4.5 V
0.70
0.45
0.60
0.80
0.80
VOH
HIGH-level output voltage VI = VIH or VIL
IO = 100 A; VCC = 1.65 V to 5.5 V
IO = 4 mA; VCC = 1.65 V
VCC 0.1
-
-
-
-
-
-
-
-
-
V
0.95
1.7
1.9
2.0
3.4
-
-
V
IO = 8 mA; VCC = 2.3 V
-
V
IO = 12 mA; VCC = 2.7 V
-
V
IO = 24 mA; VCC = 3.0 V
-
V
IO = 32 mA; VCC = 4.5 V
-
V
II
input leakage current
VI = 5.5 V or GND; VCC = 0 V to 5.5 V
20
20
A
A
IOZ
OFF-state output current VI = VIH or VIL; VO = 5.5 V or GND;
VCC = 3.6 V
-
IOFF
ICC
power-off leakage current VI or VO = 5.5 V; VCC = 0 V
-
-
-
-
20
A
A
supply current
VI = 5.5 V or GND;
40
VCC = 1.65 V to 5.5 V; IO = 0 A
ICC
additional supply current per pin; VI = VCC 0.6 V; IO = 0 A;
-
-
5
mA
VCC = 2.3 V to 5.5 V
[1] Typical values are measured at VCC = 3.3 V and Tamb = 25 C.
74LVC2G125
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 14 — 29 March 2013
7 of 22
74LVC2G125
NXP Semiconductors
Dual bus buffer/line driver; 3-state
11. Dynamic characteristics
Table 8.
Dynamic characteristics
Voltages are referenced to GND (ground 0 V); for test circuit see Figure 9.
Symbol Parameter Conditions 40 C to +85 C
40 C to +125 C Unit
Min
Typ[1]
Max
Min
Max
[2]
[3]
[4]
[5]
tpd
propagation delay nA to nY; see Figure 7
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
1.0
0.5
1.0
0.5
0.5
3.7
2.5
2.7
2.3
1.9
9.1
4.8
4.8
4.3
3.7
1.0
0.5
1.0
0.5
0.5
11.4
6.0
6.0
5.5
4.6
ns
ns
ns
ns
ns
VCC = 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
ten
enable time
nOE to nY; see Figure 8
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V
1.5
1.0
1.5
0.5
0.5
4.3
2.8
3.3
2.4
2.0
9.9
5.6
5.7
4.7
3.8
1.5
1.0
1.5
0.5
0.5
12.4
7.0
7.1
5.9
4.8
ns
ns
ns
ns
ns
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
nOE to nY; see Figure 8
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
tdis
disable time
1.0
0.5
1.0
1.0
0.5
3.5
1.8
2.7
2.7
1.8
11.6
5.8
4.8
4.6
3.4
1.0
0.5
1.0
1.0
0.5
14.1
7.6
6.2
5.9
4.6
ns
ns
ns
ns
ns
V
CC = 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
CPD
power dissipation per buffer; VI = GND to VCC
capacitance
output enabled
-
-
18
5
-
-
-
-
-
-
pF
pF
output disabled
[1] Typical values are measured at nominal VCC and at Tamb = 25 C.
[2]
tpd is the same as tPLH and tPHL
.
[3] ten is the same as tPZH and tPZL
.
[4] tdis is the same as tPLZ and tPHZ
.
[5]
CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD VCC2 fi N + (CL VCC2 fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL VCC2 fo) = sum of outputs.
74LVC2G125
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 14 — 29 March 2013
8 of 22
74LVC2G125
NXP Semiconductors
Dual bus buffer/line driver; 3-state
12. Waveforms
V
I
V
M
nA input
GND
t
t
PHL
PLH
V
OH
V
nY output
M
V
OL
mna230
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 7. Propagation delay input (nA) to output (nY)
V
I
nOE input
GND
V
M
t
t
PZL
PLZ
V
CC
output
LOW-to-OFF
OFF-to-LOW
V
M
V
X
V
OL
t
t
PHZ
PZH
V
OH
V
Y
output
HIGH-to-OFF
OFF-to-HIGH
V
M
GND
outputs
enabled
outputs
enabled
outputs
disabled
mna362
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 8. 3-state output enable and disable times
Table 9.
Measurement points
Supply voltage
VCC
Input
VM
Output
VM
VX
VY
1.65 V to 1.95 V
2.3 V to 2.7 V
2.7 V
0.5VCC
0.5VCC
1.5 V
1.5 V
0.5VCC
0.5VCC
0.5VCC
1.5 V
VOL + 0.15 V
VOL + 0.15 V
VOL + 0.3 V
VOL + 0.3 V
VOL + 0.3 V
VOH 0.15 V
VOH 0.15 V
VOH 0.3 V
VOH 0.3 V
VOH 0.3 V
3.0 V to 3.6 V
4.5 V to 5.5 V
1.5 V
0.5VCC
74LVC2G125
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 14 — 29 March 2013
9 of 22
74LVC2G125
NXP Semiconductors
Dual bus buffer/line driver; 3-state
t
W
V
I
90 %
negative
pulse
V
V
V
M
M
10 %
0 V
t
t
r
f
t
t
f
r
V
I
90 %
positive
pulse
V
M
M
10 %
0 V
t
W
V
EXT
V
CC
R
L
V
V
O
I
PULSE
GENERATOR
DUT
R
T
C
L
R
L
001aae235
Test data is given in Table 10.
Definitions for test circuit:
RL = Load resistor.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
VEXT = Test voltage for switching times.
Fig 9. Test circuit for measuring switching times
Table 10. Test data
Supply voltage
VCC
Input
VI
Load
CL
VEXT
tr, tf
RL
tPLH, tPHL
open
tPZH, tPHZ
GND
tPZL, tPLZ
2VCC
2VCC
6 V
1.65 V to 1.95 V
2.3 V to 2.7 V
2.7 V
VCC
VCC
2.7 V
2.7 V
VCC
2.0 ns
2.0 ns
2.5 ns
2.5 ns
2.5 ns
30 pF
30 pF
50 pF
50 pF
50 pF
1 k
500
500
500
500
open
GND
open
GND
3.0 V to 3.6 V
4.5 V to 5.5 V
open
GND
6 V
open
GND
2VCC
74LVC2G125
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 14 — 29 March 2013
10 of 22
74LVC2G125
NXP Semiconductors
Dual bus buffer/line driver; 3-state
13. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
SOT505-2
D
E
A
X
c
H
v
M
y
A
E
Z
5
8
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
detail X
1
4
e
w
M
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
A
A
A
b
c
D
E
e
H
E
L
L
p
UNIT
v
w
y
Z
θ
1
2
3
p
max.
0.15
0.00
0.95
0.75
0.38
0.22
0.18
0.08
3.1
2.9
3.1
2.9
4.1
3.9
0.47
0.33
0.70
0.35
8°
0°
mm
1.1
0.65
0.25
0.5
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-01-16
SOT505-2
- - -
Fig 10. Package outline SOT505-2 (TSSOP8)
74LVC2G125
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 14 — 29 March 2013
11 of 22
74LVC2G125
NXP Semiconductors
Dual bus buffer/line driver; 3-state
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
SOT765-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
A
1
(A )
3
pin 1 index
θ
L
p
L
detail X
1
4
e
w
M
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
A
A
A
b
c
D
E
e
H
L
L
p
Q
UNIT
v
w
y
Z
θ
1
2
3
p
E
max.
0.15
0.00
0.85
0.60
0.27
0.17
0.23
0.08
2.1
1.9
2.4
2.2
3.2
3.0
0.40
0.15
0.21
0.19
0.4
0.1
8°
0°
mm
1
0.5
0.12
0.4
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-06-07
SOT765-1
MO-187
Fig 11. Package outline SOT765-1 (VSSOP8)
74LVC2G125
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 14 — 29 March 2013
12 of 22
74LVC2G125
NXP Semiconductors
Dual bus buffer/line driver; 3-state
XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm
SOT833-1
b
1
2
3
4
4×
(2)
L
L
1
e
8
7
6
5
e
1
e
1
e
1
8×
A
(2)
A
1
D
E
terminal 1
index area
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
A
1
UNIT
b
D
E
e
e
1
L
L
1
max max
0.25
0.17
2.0
1.9
1.05
0.95
0.35 0.40
0.27 0.32
mm
0.5 0.04
0.6
0.5
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
- - -
07-11-14
07-12-07
SOT833-1
- - -
MO-252
Fig 12. Package outline SOT833-1 (XSON8)
74LVC2G125
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 14 — 29 March 2013
13 of 22
74LVC2G125
NXP Semiconductors
Dual bus buffer/line driver; 3-state
XSON8: extremely thin small outline package; no leads;
8 terminals; body 1.35 x 1 x 0.5 mm
SOT1089
E
terminal 1
index area
D
A
A
1
detail X
(2)
(4×)
e
L
(2)
(8×)
b
4
5
e
1
1
8
terminal 1
index area
L
1
X
0
0.5
1 mm
scale
Dimensions
Unit
(1)
A
A
b
D
E
e
e
1
L
L
1
1
max 0.5 0.04 0.20 1.40 1.05
0.35 0.40
0.15 1.35 1.00 0.55 0.35 0.30 0.35
0.12 1.30 0.95 0.27 0.32
mm nom
min
Note
1. Including plating thickness.
2. Visible depending upon used manufacturing technology.
sot1089_po
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
10-04-09
10-04-12
SOT1089
MO-252
Fig 13. Package outline SOT1089 (XSON8)
74LVC2G125
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 14 — 29 March 2013
14 of 22
74LVC2G125
NXP Semiconductors
Dual bus buffer/line driver; 3-state
XSON8: plastic extremely thin small outline package; no leads;
8 terminals; body 3 x 2 x 0.5 mm
SOT996-2
D
B
A
E
A
A
1
detail X
terminal 1
index area
e
1
C
v
C
C
A
B
b
e
L
1
y
1
y
w
C
1
4
L
2
L
8
5
X
0
1
2 mm
scale
Dimensions (mm are the original dimensions)
(1)
Unit
A
A
1
b
D
E
e
e
1
L
L
1
L
2
v
w
y
y
1
max
mm nom 0.5
min
0.05 0.35 2.1 3.1
0.00 0.15 1.9 2.9
0.5 0.15 0.6
0.3 0.05 0.4
0.5 1.5
0.1 0.05 0.05 0.1
sot996-2_po
References
Outline
version
European
Issue date
projection
IEC
JEDEC
JEITA
07-12-21
12-11-20
SOT996-2
Fig 14. Package outline SOT996-2 (XSON8)
74LVC2G125
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 14 — 29 March 2013
15 of 22
74LVC2G125
NXP Semiconductors
Dual bus buffer/line driver; 3-state
XQFN8: plastic, extremely thin quad flat package; no leads;
8 terminals; body 1.6 x 1.6 x 0.5 mm
SOT902-2
X
D
B
A
E
terminal 1
index area
A
A
1
detail X
e
C
v
C
C
A
B
b
y
y
w
C
1
4
3
2
5
e
1
6
7
1
terminal 1
index area
8
L
metal area
not for soldering
L
1
0
1
2 mm
scale
Dimensions
(1)
Unit
A
A
1
b
D
E
e
e
1
L
L
v
w
y
y
1
1
max 0.5 0.05 0.25 1.65 1.65
0.35 0.15
0.20 1.60 1.60 0.55 0.5 0.30 0.10 0.1 0.05 0.05 0.05
0.00 0.15 1.55 1.55 0.25 0.05
mm nom
min
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
sot902-2_po
References
Outline
version
European
Issue date
projection
IEC
- - -
JEDEC
JEITA
- - -
10-11-02
11-03-31
SOT902-2
MO-255
Fig 15. Package outline SOT902-2 (XQFN8)
74LVC2G125
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 14 — 29 March 2013
16 of 22
74LVC2G125
NXP Semiconductors
Dual bus buffer/line driver; 3-state
XSON8: extremely thin small outline package; no leads;
8 terminals; body 1.2 x 1.0 x 0.35 mm
SOT1116
b
4
(2)
1
2
3
(4×)
L
L
1
e
8
7
6
5
e
1
e
1
e
1
(2)
(8×)
A
1
A
D
E
terminal 1
index area
0
0.5
scale
1 mm
Dimensions
Unit
(1)
A
A
b
D
E
e
e
1
L
L
1
1
max 0.35 0.04 0.20 1.25 1.05
0.35 0.40
0.15 1.20 1.00 0.55 0.3 0.30 0.35
0.12 1.15 0.95 0.27 0.32
mm nom
min
Note
1. Including plating thickness.
2. Visible depending upon used manufacturing technology.
sot1116_po
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
10-04-02
10-04-07
SOT1116
Fig 16. Package outline SOT1116 (XSON8)
74LVC2G125
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 14 — 29 March 2013
17 of 22
74LVC2G125
NXP Semiconductors
Dual bus buffer/line driver; 3-state
XSON8: extremely thin small outline package; no leads;
8 terminals; body 1.35 x 1.0 x 0.35 mm
SOT1203
b
4
(2)
(4×)
1
2
3
L
L
1
e
8
7
6
5
e
1
e
1
e
1
(2)
(8×)
A
1
A
D
E
terminal 1
index area
0
L
0.5
scale
1 mm
Dimensions
Unit
(1)
A
A
b
D
E
e
e
1
L
1
1
max 0.35 0.04 0.20 1.40 1.05
0.35 0.40
0.15 1.35 1.00 0.55 0.35 0.30 0.35
0.12 1.30 0.95 0.27 0.32
mm nom
min
Note
1. Including plating thickness.
2. Visible depending upon used manufacturing technology.
sot1203_po
References
Outline
version
European
Issue date
projection
IEC
JEDEC
JEITA
10-04-02
10-04-06
SOT1203
Fig 17. Package outline SOT1203 (XSON8)
74LVC2G125
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 14 — 29 March 2013
18 of 22
74LVC2G125
NXP Semiconductors
Dual bus buffer/line driver; 3-state
14. Abbreviations
Table 11. Abbreviations
Acronym
CMOS
DUT
Description
Complementary Metal-Oxide Semiconductor
Device Under Test
ESD
ElectroStatic Discharge
Human Body Model
HBM
MM
Machine Model
TTL
Transistor-Transistor Logic
15. Revision history
Table 12. Revision history
Document ID
Release date
20130329
Data sheet status
Change notice
Supersedes
74LVC2G125 v.14
Modifications:
Product data sheet
-
74LVC2G125 v.13
• For type number 74LVC2G125GD XSON8U has changed to XSON8.
20120622 Product data sheet 74LVC2G125 v.12
• For type number 74LVC2G125GM the SOT code has changed to SOT902-2.
74LVC2G125 v.13
Modifications:
-
74LVC2G125 v.12
Modifications:
20111201
Product data sheet
-
74LVC2G125 v.11
• Legal pages updated.
74LVC2G125 v.11
74LVC2G125 v.10
74LVC2G125 v.9
74LVC2G125 v.8
74LVC2G125 v.7
74LVC2G125 v.6
74LVC2G125 v.5
74LVC2G125 v.4
74LVC2G125 v.3
74LVC2G125 v.2
74LVC2G125 v.1
20100909
20080611
20080226
20070907
20060523
20051223
20050201
20040922
20040109
20030901
20030310
Product data sheet
-
-
-
-
-
-
-
-
-
-
-
74LVC2G125 v.10
74LVC2G125 v.9
74LVC2G125 v.8
74LVC2G125 v.7
74LVC2G125 v.6
74LVC2G125 v.5
74LVC2G125 v.4
74LVC2G125 v.3
74LVC2G125 v.2
74LVC2G125 v.1
-
Product data sheet
Product data sheet
Product data sheet
Product data sheet
Product data sheet
Product specification
Product specification
Product specification
Product specification
Product specification
74LVC2G125
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 14 — 29 March 2013
19 of 22
74LVC2G125
NXP Semiconductors
Dual bus buffer/line driver; 3-state
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
16.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
16.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
74LVC2G125
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 14 — 29 March 2013
20 of 22
74LVC2G125
NXP Semiconductors
Dual bus buffer/line driver; 3-state
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74LVC2G125
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 14 — 29 March 2013
21 of 22
74LVC2G125
NXP Semiconductors
Dual bus buffer/line driver; 3-state
18. Contents
1
2
3
4
5
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7
Functional description . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 19
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19
8
9
10
11
12
13
14
15
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 20
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21
16.1
16.2
16.3
16.4
17
18
Contact information. . . . . . . . . . . . . . . . . . . . . 21
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 29 March 2013
Document identifier: 74LVC2G125
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