L513HD-U1 [PARALIGHT]
Single Color LED, Red, Diffused, T-1 3/4, 5mm, ROHS COMPLIANT PACKAGE-2;
| 型号： | L513HD-U1 |
| 厂家： | 
PARA LIGHT ELECTRONICS CO., LTD. |
| 描述： | Single Color LED, Red, Diffused, T-1 3/4, 5mm, ROHS COMPLIANT PACKAGE-2 光电 |
| 文件： | 总12页 (文件大小：350K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PARA LIGHT ELECTRONICS CO., LTD.
4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan.
Tel: 886-2-2225-3733
Fax: 886-2-2225-4800
E-mail: para@para.com.tw
http://www.para.com.tw
DATA SHEET
PART NO. : L513HD-U1
REV : A / 0
PARA LIGHT ENGINEERING:
CUSTOMER'S APPROVAL:
DCC:
DATE : 2009-08-20
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PACKAGE DIMENSIONS
ITEM
RESIN
MATERIALS
Epoxy Resin
LEAD FRAME Sn Plating iron Alloy
Note:
1.All Dimensions are in millimeters.
2.Tolerance is ±0.25mm(0.010 ")
Unless otherwise specified.
3.Protruded resin under flange
is 1.5mm(0.059 ") max.
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FEATURES
* High-brightness
* High reliability
* Low-voltage characteristics
* Wide Viewing Angle
* Pb FREE Products
* RoHS Compliant
CHIP MATERIALS
*
*
*
Dice Material : GaP/GaP
Light Color : RED
Lens Color : RED DIFFUSED
ABSOLUTE MAXIMUM RATING : ( Ta = 25°C )
SYMBOL
PARAMETER
RED
85
UNIT
mW
V
PD
Power Dissipation Per Chip
VR
Reverse Voltage Per Chip
5
IAF
Continuous Forward Current Per Chip
Peak Forward Current Per Chip (Duty－0.1,1KHz)
Derating Linear From 25°C Per Chip
Operating Temperature Range
30
200
0.40
mA
mA
IPF
－
mA/°C
Topr
Tstg
-25°C to 85°C
-25°C to 85°C
Storage Temperature Range
IFP Condition : Pulse Width≤10msec, 10% duty cycle
ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25°C )
SYMBOL
PARAMETER
Forward Voltage
TEST CONDITION MIN. TYP. MAX. UNIT
VF
IR
IF = 20mA
VR = 5V
2.3
2.8
V
Reverse Current
100
µA
λP
∆λ
Peak Emission Wavelength
Spectral Line Half-Width
IF = 20mA
IF = 20mA
IF = 20mA
IF = 20mA
700
100
110
1.0
nm
nm
deg
mcd
2θ1/2 Half Intensity Angle
IV Luminous Intensity
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█
TJ= 25℃
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Label Explanation
光鼎电子股份有限公司
PARA NO. : L513HD-U1
Refer to page 12
LOT
NO. : E
L
L
4
7
0009
A
B
C
D
E
F
A---E: For series number
B---L: Local
C---L: LAMP
D---Year
F: Foreign
E---Month
F--- Serial number
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ySOLDERING
METHOD
SOLDERING CONDITIONS
REMARK
y Solder no closer than 3mm from the
base of the package
y Using soldering flux,” RESIN FLUX”
DIP
SOLDERING
Bath temperature: 260℃
Immersion time: within 5 sec, 1 time
is recommended.
y During soldering, take care not to
press the tip of iron against the
lead.
Soldering iron: 30W or smaller
SOLDERING
emperature at tip of iron: 300℃ or lower (To prevent heat from being
Soldering time: within 3 sec. transferred directly to the lead, hold
IRON
the lead with a pair of tweezers
while soldering)
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.
ꢀ
Lead wries
Panel
(Fig.1)
2) When soldering wire to the lead, work with a jig (See Fig.2) to avoid stressing the package.
ꢀ
Lead wries
Leave a slight
clearance
(Fig.2)
Regarding tinning the leads, compound made of tin ,copper and sliver is proposed with the
temperature of 260℃. The proportion of the alloyed solution is 95.5% tin, 3.5 % copper, 0.5%
silver. The time of tinning is 3 seconds.
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3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to
avoid stressing the leads (See Fig.3).
ꢀ
PC board
（Fig.）3
jig
4) Repositioning after soldering should be avoided as much as possible. If inevitable: select a
best-suited method that assures the least stress to the LED.
5) Lead cutting after soldering should be performed only after the LED temperature has returned to
normal temperature.
y STORAGE
1) The LEDs should be stored at 30℃ or less and 70% RH or less after being shipped from PARA
and the storage life limit is 1 year .
2) PARA LED lead frames are comprised of a tin plated iron alloy. The surface may be affected by
environments which contain corrosive gases and so on. Please avoid conditions which may
cause the LEDs to corrode, tarnish or discolor. This corrosion or discoloration may cause
difficulty during soldering operations. It is recommended that the LEDs be used as soon as
possible.
3) Please avoid rapid changes in ambient temperature, especially, in high humidity environments
where condensation can occur.
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y STATIC ELECTRICITY
1) Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band and an anti-electrostatic glove be used when handling the
LEDs.
2) All devices, equipment and machinery must be properly grounded. It is recommended that
measures be taken against surge voltage to the LED mounting equipment.
3) When inspecting the final products in which LEDs were assembled, it is recommended to
check whether the assembled LEDs are damaged by static electricity. To find static-damaged
LEDs, perform a light-on test or a VF test at a lower current (below 1mA is recommended).
4) Damaged LEDs will show some unusual characteristics such as the leakage current
remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low
current.
Criteria : ( VF>2.0V at IF=0.5mA )
yLED MOUNTING METHOD
1) When mounting the LED to a housing, as shown on Fig.4, ensure that the mounting holes on
the PC board match the pitch of the leads correctly. Tolerance of dimensions of the
respective components including the LEDs should be taken into account especially when
designing the housing, PC board, etc. to prevent pitch misalignment between the leads and
holes on PCB, the diameter of the holes should be slightly larger than the size of the lead.
Alternatively, the shape of the holes could be made oval. (See Fig.4)
case
pc board
Fig.4
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2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of plastic (Fig.6) to position the
LEDs.
Tube
Stand-off
Fig.6
Fig.5
yFORMING LEAD
1) The lead should be bent at least 2mm away from the package. Bending should be performed
with base fixed to a jig to pliers (Fig.7)
Fig.7
2) Forming lead should be carried our prior to soldering and never during or after soldering.
3) Form the lead to ensure alignment between the leads and the holes on PCB, so that stress
against the LED is prevented. (Fig.8)
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yLEAD STRENGTH
1) Bend strength
Do not bend the lead more than twice. (Fig.9)
Fig.9
2) Tensile strength (@Room Temperature)
If the force is 1kg or less, there will be no problem. (Fig.10)
OK！
1Kg
Fig.10
y HEAT MANAGEMANT
1) Thermal design of the end product is of paramount importance. Please consider the heat
generation of the LED when designing the system. The temperature increase is affected by
the thermal resistance of the circuit board and density of LED placement on the board, as
well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
2) The operating current (IF) should be decided after considering the ambient maximum
temperature of LEDs.
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yCHEMICAL RESISTANCE
1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration.
2) When washing is required, refer to the following table for the proper chemical to be used.
(Immersion time: within 3 minutes at room temperature.)
SOLVENT
Freon TE
Chlorothene
Isopropyl Alcohol
Thinner
ADAPTABILITY
NOTE: Influences of ultrasonic cleaning of the LED
resin body differ depending on factors such
as the oscillator output, size of the PC board
⊙
╳
⊙
╳
╳
╳
and the way in which the LED is mounted.
Therefore, ultrasonic cleaning should only be
performed by confirming an ultrasonic
cleaning trial run.
Acetone
Trichloroethylene
⊙--Usable ╳--Do not use.
yOTHER CONSIDERTIONS
1) Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum
rating when using the LEDs with matrix drive.
2) The LEDs described in this data sheet are intended to be used for ordinary electronic
equipment (such as office equipment, communications equipment, measurement
instruments and household appliances). Consult PARA’s sales staff in advance for
information on the applications in which exceptional quality and reliability are required ,
particularly when the failure or malfunction of the LEDs may directly jeopardize life or health
(such as for airplanes, spacecraft, automobiles, traffic control equipment etc).
3) The formal specifications must be exchanged and signed by both parties before large volume
purchase begins.
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LED Lamps: Part Number Rules
L
X
D
5
1
3
Special Operati on & Other
D: Color Diffused
T: Color Transparent
C: Water Clear
Lens Color
W: White Diffused
G: Gap Green
E: GaAs/Gap Orange & Hi-effi-Red
H: Gap Red
SR,LR,UR: GaAlAs Red
Y: GaAsP/Gap Yellow
VG3:GaAllnp Green
HUR: GaAllnP Red
LW,VE: GaAllnP Orange
LY,UY,VY: GaAllnP Yellow
SPG4,LPG4: GaInN Green
UB5,VB5: GaInN Blue
UW5 VW5,UWT:GalnN White
PU4:GalnN Purple
1: 0.8" Length with Stand-off
2: 0.5" Length Standard
3: 1"Length with Large Reflector
4: 1"Length with Small Reflector
5: 1"WITH 3 Leads for Dual Color
7: 1"WITH 2 Leads for Dual Color
9: 1"WITH 3 Leads for Dual Color
Package Type(Style)
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