A-362Y-A [PARALIGHT]
0.36 INCH DUAL DIGITS DISPLAY;
| 型号： | A-362Y-A |
| 厂家： | 
PARA LIGHT ELECTRONICS CO., LTD. |
| 描述： | 0.36 INCH DUAL DIGITS DISPLAY |
| 文件： | 总10页 (文件大小：209K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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PARALIGHTDCC
PARA LIGHT ELECTRONICS CO., LTD.
4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan,
Tel: 886-2-2225-3733
E-mail: para@para.com.tw
Fax: 886-2-2225-4800
http://www.para.com.tw
DATA SHEET
PART NO. : A-362Y-A B/Y
REV : A / 0
CUSTOMER’S APPROVAL : _______________
DRAWING NO. : DS-12-08-0074
DCC : ____________
Page : 1
DATE : 2008-12-09
HD-R/RD012
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PARALIGHTDCC
0.36 INCH DUAL DIGITS DISPLAY
REV:A / 0
A-362Y-A B/Y
PACKAGE DIMENSIONS
NOTES : 1. All dimensions are in millimeters. (inches)
2. Tolerance is 6 0.25(0.010") unless otherwise specified.
3. Pls. contact with us when your production need to be
operated under the Pb free process.
DRAWING NO. : DS-12-08-0074
DATE : 2008-12-09
Page : 2
HD-R/RD013
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0.36 INCH DUAL DIGITS DISPLAY
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A-362Y-A B/Y
FEATURES
Û 9.20mm (0.36 inch ) DIGIT HEIGHT
Û COMMON ANODE
Û I.C. COMPATIBLE
Û LOW POWER CONSUMPTION
Û Pb FREE PRODUCTS
Û ROHS COMPLIANCE
Û BLACK FACE, YELLOW SEGMENTS
Raw Material : GaAsP/GaP
ABSOLUTE MAXIMUM RATING : ( Ta = 25BC )
SYMBOL
PD
PARAMETER
Power Dissipation Per Segment
Reverse Voltage Per Segment
YELLOW
UNIT
mW
V
60
5
VR
IAF
Continuous Forward Current Per Segment
Peak Forward Current Per Segment
(1/10 Duty Cycle,0.1ms Pulse Width)
Derating Linear From 25BC Per Segment
Operating Temperature Range
20
mA
IPF
80
mA
－
0.27
mA/BC
Topr
Tstg
－35BC to 85BC
－35BC to 85BC
Storage Temperature Range
ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25BC )
SYMBOL
PARAMETER
TEST CONDITION MIN. TYP. MAX. UNIT
VF
IR
Forward Voltage , Per Segment
Reverse Current , Per Segment
Peak Emission Wavelength
Dominant Wavelength
IF = 20mA
VR = 5V
2.1
2.8
V
100
mA
nm
nm
nm
mcd
l P
l D
Δl
IF = 20mA
IF = 20mA
IF = 20mA
IF = 10mA
583
585
30
Spectral Line Half－Width
Luminous Intensity Per Segment
IV
0.6
1.5
BIN CODE ( IF = 10mA )
BIN CODE
C
D
E
F
G
H
IV(mcd)
0.6-0.83 0.84-1.14 1.15-1.58 1.59-2.17 2.18-2.91 2.92-3.70
TOLERANCE IS: ±15％
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DATE : 2008-12-09
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HD-R/RD014
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A-362Y-A B/Y
DRAWING NO. : DS-12-08-0074
DATE : 2008-12-09
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—SOLDERING
METHOD
SOLDERING CONDITIONS
REMARK
— Solder no closer than 2mm from
the base of the package
DIP
Bath temperature: 260 max
Immersion time: within 5 sec
SOLDERING
— Using soldering flux,” RESIN FLUX”
is recommended.
—During soldering, take care not to
press the tip of iron against the
Soldering iron: 30W or smaller
SOLDERING
Temperature at tip of iron: 260℃ or lower PIN.
Soldering time: within 5 sec. (To prevent heat from being
transferred directly to the PIN.)
IRON
1) When soldering the PIN of Display in a jig that the package is fixed with a panel (See fIg.1), be
careful not to stress the PIN with iron tip. When soldering Display in a condition that the package
is fixed with a panel, be careful not to cling and stress the surface of Display on the panel to avoid
damaging the Display.
Fig.1
Regarding solution in the tinning oven for product-tinning, compound sub-solution made of tin &
copper and silver is proposed with the temperature of Celsius 250. The proportion of the
alloyed solution is tin 95.5: copper 3.5: silver 0.5 by percentage. The time of tinning is constantly
3 seconds.
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2) Similarly, when a jig is used to solder the Display to PC board, take care as much as possible to
avoid steering the PIN (See Fig.2).
Fig.2
3) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to
preserve the soldering conditions with irons stated above: select a best-suited method that
assures the least stress to the Display.
4) PIN cutting after soldering should be performed only after the Display temperature has returned
to normal temperature.
—LED MOUNTING METHOD
1) When mounting the Display by using a case, as shown Fig.3, ensure that the mounting holds on
the PC board match the pitch of the PIN correctly-tolerance of dimensions of the respective
components including the Display should be taken into account especially when designing the
case, PC board, etc. to prevent pitch misalignment between the PIN and board holes, the
diameter of the board holes should be slightly larger than the size of the PIN. Alternatively, the
shape of the holes should be made oval. (See Fig.3)
Fig.3
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2) Use Display with holder made of resin (Fig.4) to position the PIN.
Fig.4
—FORMED LEAD
1) The PIN should be bent at a point located at least 2mm away from the package. Bending should
be performed with base fixed means of a jig or pliers (Fig.5)
Fig.5
2) Forming PIN should be carried our prior to soldering and never during or after soldering.
3) Form the PIN to ensure alignment between the PIN and the hole on board, so that stress against
the Display is prevented. (Fig.6)
Fig.6
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—LEAD STRENGTH
1) Bend strength
Do not bend the PIN more than twice. (Fig.7)
Fig.7
2) Tensile strength (@Room Temperature)
If the force is 1kg or less, there will be no problem. (Fig.8)
ok!
Fig.8
1Kg
—HANDLING PRECAUTIONS
Although rigid against vibration, the Display may damaged or scratched if dropped. So take care
when handling.
—CHEMICAL RESISTANCE
1) Avoid exposure to chemicals as it may attack the Display surface and cause discoloration.
2) When washing is required, refer to the following table for the proper chemical to be used.
SOLVENT
Freon TE
ADAPTABILITY
⊙
Chlorothene
Isopropyl Alcohol
Thinner
╳
⊙
╳
Acetone
╳
╳
Trichloroethylene
⊙--Usable
╳--Do not use.
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— STORAGE
1) The Display should be stored at 30℃ or less and 70% RH or less after being shipped from
PARA and the storage life limits are 3 months.
2) PARA Display lead frames are comprised of a stannum plated iron alloy. The silver surface may
be affected by environments which contain corrosive gases and so on. Please avoid conditions
which may cause the Display to corrode, tarnish or discolor. This corrosion or discoloration may
cause difficulty during soldering operations. It is recommended that the Display be used as soon
as possible.
3) Please avoid rapid transitions in ambient temperature, especially, in high humidity environments
where condensation can occur.
— HEAT GENERATION
1) Thermal design of the end product is of paramount importance. Please consider the heat
generation of the Display when making the system design. The coefficient of temperature
increase per input electric power is affected by the thermal resistance of the circuit board and
density of Display placement on the board, as well as other components. It is necessary to avoid
intense heat generation and operate within the maximum ratings given in this specification.
2) The operating current should be decided after considering the ambient maximum temperature of
Display .
—OTHERS
1) Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum
rating when using the Display with matrix drive.
2) Flashing lights have been known to cause discomfort in people; you can prevent this by taking
precautions during use. Also, people should be cautious when using equipment that has had
Display incorporated into it.
3) The Display described in this brochure are intended to be used for ordinary electronic equipment
(such as office equipment, communications equipment, measurement instruments and
household appliances). Consult PARA’s sales staff in advance for information on the applications
in which exceptional quality and reliability are required , particularly when the failure or
malfunction of the Display may directly jeopardize life or health (such as for airplanes,
aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control
equipment, life support systems and safety devices).
DRAWING NO. : DS-12-08-0074
DATE : 2008-12-09
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4) User shall not reverse engineer by disassembling or analysis of the Display without having prior
written consent from PARA. When defective Display are found, the User shall inform PARA
directly before disassembling or analysis.
5) The formal specifications must be exchanged and signed by both parties before large volume
purchase begins.
6) The appearance and specifications of the product may be modified for improvement without
notice.
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DATE : 2008-12-09
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