BSS138_14 [PANJIT]

50V N-Channel Enhancement Mode MOSFET - ESD Protected;
BSS138_14
型号: BSS138_14
厂家: PAN JIT INTERNATIONAL INC.    PAN JIT INTERNATIONAL INC.
描述:

50V N-Channel Enhancement Mode MOSFET - ESD Protected

文件: 总5页 (文件大小:151K)
中文:  中文翻译
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BSS138  
50V N-Channel Enhancement Mode MOSFET - ESD Protected  
Unitinch(mm)  
SOT-23  
FEATURES  
• RDS(ON), VGS@10V,IDS@500mA=3Ω  
• RDS(ON), VGS@4.5V,IDS@200mA=4Ω  
• RDS(ON), VGS@2.5V,IDS@100mA=6Ω  
0.120(3.04)  
0.110(2.80)  
• Advanced Trench Process Technology  
• High Density Cell Design For Ultra Low On-Resistance  
• Very Low Leakage Current In Off Condition  
• Specially Designed for Battery Operated Systems, Solid-State Relays  
Drivers : Relays, Displays, Lamps, Solenoids, Memories, etc.  
• ESD Protected  
0.056(1.40)  
0.047(1.20)  
0.008(0.20)  
0.003(0.08)  
0.079(2.00)  
0.070(1.80)  
• Lead free in comply with EU RoHS 2002/95/EC directives.  
• Green molding compound as per IEC61249 Std. . (Halogen Free)  
MECHANICAL DATA  
0.044(1.10)  
0.035(0.90)  
0.004(0.10)MAX.  
• Case: SOT-23 Package  
Terminals : Solderable per MIL-STD-750,Method 2026  
• Marking : 138  
0.020(0.50)  
0.013(0.35)  
• Apporx. Weight: 0.0003 ounces, 0.0084 grams  
Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted )  
PARAMETER  
Drain-Source Voltage  
Symbol  
VDS  
Limit  
50  
Units  
V
Gate-Source Voltage  
VGS  
ID  
+20  
300  
V
Continuous Drain Current  
mA  
mA  
1)  
Pulsed Drain Current  
IDM  
2000  
TA=25OC  
TA=75OC  
350  
210  
Maximum Power Dissipation  
PD  
mW  
Operating Junction and Storage Temperature  
Range  
TJ,TSTG  
RθJA  
-55 to + 150  
357  
OC  
Junction-to Ambient Thermal Resistance(PCB mounted)2  
OC/W  
Note: 1. Maximum DC current limited by the package  
2. Surface mounted on FR4 board, t < 5 sec  
PAN JIT RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,FUNCTIONS AND RELIABILITY WITHOUT NOTICE  
October 26,2010-REV.00  
PAGE . 1  
BSS138  
ELECTRICALCHARACTERISTICS  
Parameter  
Static  
Symbol  
Test Condition  
Min.  
Typ.  
Max.  
Units  
Drain-Source Breakdown  
Voltage  
BVDSS  
VGS(th)  
RDS(on)  
RDS(on)  
VGS=0V , ID=10μA  
VDS=VGS , ID=250μA  
VGS=2.5V , I D=100mA  
VGS=4.5V , I D=200mA  
50  
0.8  
-
-
-
V
V
Gate Threshold Voltage  
-
1.5  
6.0  
4.0  
Drain-Source On-State  
Resistance  
2.8  
1.8  
Drain-Source On-State  
Resistance  
-
Ω
Drain-Source On-State  
Resistance  
RDS(on)  
IDSS  
VGS=10V , I D=500mA  
VDS=50V , VGS=0V  
-
1.6  
3.0  
1
Zero Gate Voltage Drain  
Current  
-
-
-
-
-
μA  
μA  
mS  
Gate Body Leakage  
Forward Transconductance  
Dynamic  
IGSS  
VGS=+20V , VDS=0V  
VDS=10V , ID=250mA  
+10  
-
gfS  
100  
VDS=25V, ID=250mA  
VGS=4.5V  
Total Gate Charge  
Qg  
-
-
1.0  
nC  
ns  
Turn-On Time  
ton  
toff  
-
-
-
-
-
-
-
-
-
-
40  
150  
50  
10  
VDD=30V , RL=100Ω  
ID=300mA , VGEN=10V  
RG=6Ω  
Turn-Off Time  
Input Capacitance  
Output Capacitance  
Ciss  
Coss  
Crss  
VDS=25V , VGS=0V  
f=1.0MHZ  
pF  
Reverse Transfer  
Capacitance  
5
Source-Drain Diode  
Diode Forward Voltage  
VSD  
IS  
IS=250mA , VGS=0V  
-
-
-
0.82  
1.2  
300  
V
Continuous Diode Forward  
Current  
-
-
-
-
mA  
mA  
Pulse Diode Forward  
Current  
ISM  
2000  
V
DD  
V
DD  
Switching  
Gate Charge  
Test Circuit  
Test Circuit  
RL  
RL  
V
IN  
VGS  
V
OUT  
1mA  
RG  
RG  
October 26,2010-REV.00  
PAGE . 2  
BSS138  
Typical CChhaarraacctteerriissttiiccss CCuurrvveess ((TTA==2255OCC,,uunnlleessss ootthheerrwwiissee nnootteedd))  
1
0.8  
0.6  
0.4  
0.2  
0
1.2  
VGS=10V~4.0V  
VDS =10V  
1.0  
0.8  
3.0V  
0.6  
TJ = 25oC  
0.4  
0.2  
0
0
1
2
3
4
5
6
0
1
2
3
4
5
VDS- Drain-to-Source Voltage (V)  
VGS- Gate-to-Source Voltage (V)  
FIG.1-OOuuttppuuttCChhaarraacctteerriissttiicc
FIG.2- Transfer Characteristic  
5
4
3
5
4
3
2
1
0
ID =200mA  
VGS=4.5V  
2
ID =500mA  
VGS=10V  
1
0
0
2
4
6
8
10  
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
VGS - Gate-to-Source Voltage (V)  
ID - Drain Current (A)  
FIG.4- On Resistance vs Gate to Source Voltage  
FIG.3- On Resistance vs Drain Current  
1.8  
VGS =10 V  
1.6  
1.4  
1.2  
1
ID =500mA  
0.8  
0.6  
-50 -25  
0
25 50 75 100 125 150  
TJ - Junction Temperature (OC)  
FIG.5- On Resistance vs Junction Temperature  
October 26,2010-REV.00  
PAGE . 3  
BSS138  
1
10  
VGS= 0V  
I
D =250mA  
8
6
4
2
0
TJ = 125OC  
TJ =25OC  
0.1  
TJ =-55OC  
0.01  
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
VSD - Source-to-Drain Voltage (V)  
Qg - Gate Charge (nC)  
Fiigg..77 SSoouurrccee--DDrraaiinn DDiiooddee FFoorrwwaarrdd VVoollttaaggee  
Fig.6 - Gate Charge Waveform  
1.2  
1.2  
ID = 250mA  
ID = 250mA  
1.1  
1.0  
1.15  
1.1  
1.05  
1
0.9  
0.8  
0.7  
0.95  
0.9  
-50 -25  
0
25 50 75 100 125 150  
-50 -25  
0
25 50  
75 100 125 150  
TJ - Junction Temperature (OC)  
TJ - Junction Temperature (OC)  
Fig.8 - Threshold Voltage vs Temperature  
Fig.9 - Breakdown Voltage vs Junction Temperature  
October 26,2010-REV.00  
PAGE . 4  
BSS138  
MOUNTING PAD LAYOUT  
Unitinch(mm)  
SOT-23  
0.031 MIN.  
(0.80) MIN.  
0.037  
(0.95)  
0.043  
(1.10)  
0.106  
(2.70)  
ORDER INFORMATION  
• Packing information  
T/R - 12K per 13" plastic Reel  
T/R - 3K per 7” plastic Reel  
LEGALSTATEMENT  
Copyright PanJit International, Inc 2012  
The information presented in this document is believed to be accurate and reliable. The specifications and information herein are  
subject to change without notice. Pan Jit makes no warranty, representation or guarantee regarding the suitability of its produ cts for  
any particular purpose. Pan Jit products are not authorized for use in life support devices or systems. Pan Jit does not convey any  
license under its patent rights or rights of others.  
October 26,2010-REV.00  
PAGE . 5  

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