UNRF2AV [PANASONIC]

Small Signal Bipolar Transistor, 0.08A I(C), 50V V(BR)CEO, 1-Element, NPN, Silicon, 1 X 0.60 MM, 0.39 MM HEIGHT, ROHS COMPLIANT, LEADLESS, ULTRA MINIATURE, ML3-N2, 3 PIN;
UNRF2AV
型号: UNRF2AV
厂家: PANASONIC    PANASONIC
描述:

Small Signal Bipolar Transistor, 0.08A I(C), 50V V(BR)CEO, 1-Element, NPN, Silicon, 1 X 0.60 MM, 0.39 MM HEIGHT, ROHS COMPLIANT, LEADLESS, ULTRA MINIATURE, ML3-N2, 3 PIN

晶体 小信号双极晶体管 开关
文件: 总3页 (文件大小:204K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
This product complies with the RoHS Directive (EU 2002/95/EC).  
Transistors with built-in Resistor  
UNRF2AL  
Silicon NPN epitaxial planar type  
Unit: mm  
For digital circuits  
3
2
1
Features  
Suitable for high-density mounting and douwsizing of the equip-  
ment for ultraminiature leadless package  
Package: 0.6 mm × 1.0 mm (height 0.39 mm)  
+0.01  
0.39  
1.00 0.0ꢀ  
0.03  
0.2ꢀ 0.0ꢀ  
0.2ꢀ 0.0ꢀ  
1
Absolute Maximum Ratings Ta = 25°C  
Parameter  
Symbol  
Rating  
Unit  
V
2
3
Collector-base voltage (Emitter open) VCBO  
Collector-emitter voltage (Base open) VCEO  
50  
50  
0.6ꢀ 0.01  
0.0ꢀ 0.03  
V
Collector current  
IC  
PT  
Tj  
80  
mA  
mW  
°C  
1: Base  
2: Emitter  
3: Collector  
Total power dissipation  
Junction temperature  
Storage temperature  
100  
125  
ML3-N2 Package  
Tstg  
55 to +125  
°C  
Marking Symbol: 1C  
Internal Connection  
R1 (4.7 kΩ)  
B
C
E
R2  
(4.7 kΩ)  
Electrical Characteristics Ta = 25°C 3°C  
Parameter  
Symbol  
VCBO  
VCEO  
ICBO  
Conditions  
Min  
50  
Typ  
Max  
Unit  
V
Collector-base voltage (Emitter open)  
Collector-emitter voltage (Base open)  
Collector-base cutoff current (Emitter open)  
Collector-emitter cutoff current (Base open)  
Emitter-base cutoff current (Collector open)  
Forward current transfer ratio  
Collector-emitter saturation voltage  
Output voltage high level  
IC = 10 µA, IE = 0  
IC = 2 mA, IB = 0  
VCB = 50 V, IE = 0  
VCE = 50 V, IB = 0  
VEB = 6 V, IC = 0  
VCE = 10 V, IC = 5 mA  
50  
V
0.1  
0.5  
2.0  
µA  
µA  
mA  
ICEO  
IEBO  
hFE  
20  
VCE(sat) IC = 10 mA, IB = 0.3 mA  
0.25  
V
VOH  
VOL  
R1  
VCC = 5 V, VB = 0.5 V, RL = 1 kΩ  
4.9  
V
Output voltage low level  
VCC = 5 V, VB = 2.5 V, RL = 1 kΩ  
0.2  
+30%  
1.2  
V
Input resistance  
30%  
4.7  
0.1  
150  
kΩ  
Resistance ratio  
R1 / R2  
fT  
0.8  
Transition frequency  
VCB = 10 V, IE = −2 mA, f = 200 MHz  
MHz  
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
Publication date: May 2005  
SJH00104BED  
1
This product complies with the RoHS Directive (EU 2002/95/EC).  
UNRF2AL  
PT Ta  
IC VCE  
VCE(sat) IC  
140  
120  
100  
80  
60  
40  
20  
0
10  
IC / IB = 10  
0.8 mA  
Ta = 25°C  
0.6 mA  
IB = 1.0 mA  
0.9 mA  
120  
100  
80  
60  
40  
20  
0
0.7 mA  
0.5 mA  
0.4 mA  
1
0.3 mA  
0.2 mA  
Ta = 85°C  
0.1  
25°C  
25°C  
0.01  
0
2
4
6
8
10  
12  
0
80  
40  
120  
1
10  
100  
1000  
(
)
Collector current IC mA  
(
)
Ambient temperature Ta °C  
(
)
V
Collector-emitter voltage VCE  
hFE IC  
Cob VCB  
IO VIN  
300  
250  
200  
150  
100  
50  
100  
10  
Ta = 85°C  
VO = 5 V  
Ta = 25°C  
f = 1 MHz  
Ta = 25°C  
VCE = 10 V  
10  
25°C  
25°C  
0
0.1  
1
1
0
1
2
3
4
5
6
1
10  
100  
1000  
0
10  
20  
30  
40  
(
)
Collector current IC mA  
(
)
V
Collector-base voltage VCB (V)  
Input voltage VIN  
VIN IO  
10  
VO = 0.2 V  
Ta = 25°C  
1
0.1  
0.1  
1
10  
100  
(
)
Output current IO mA  
SJH00104BED  
2
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other  
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other  
company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita  
Electric Industrial Co., Ltd.  

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