UNR2122 [PANASONIC]

Silicon NPN epitaxial planar type (Tr1) Silicon PNP epitaxial planar type (Tr2) For switching/digital circuits; NPN硅外延平面型( Tr1的) PNP硅外延平面型( TR2)对于开关/数字电路
UNR2122
型号: UNR2122
厂家: PANASONIC    PANASONIC
描述:

Silicon NPN epitaxial planar type (Tr1) Silicon PNP epitaxial planar type (Tr2) For switching/digital circuits
NPN硅外延平面型( Tr1的) PNP硅外延平面型( TR2)对于开关/数字电路

晶体 开关 小信号双极晶体管 光电二极管
文件: 总5页 (文件大小:108K)
中文:  中文翻译
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Composite Transistors  
XN04381 (XN4381)  
Silicon NPN epitaxial planar type (Tr1)  
Silicon PNP epitaxial planar type (Tr2)  
Unit: mm  
+0.20  
–0.05  
1.9 0.1  
(0.95) (0.95)  
2.90  
For switching/digital circuits  
+0.10  
0.16  
–0.06  
4
3
5
6
Features  
Two elements incorporated into one package  
(Transistors with built-in resistor)  
2
1
Reduction of the mounting area and assembly cost by one half  
+0.10  
–0.05  
0.30  
0.50  
Basic Part Number  
+0.10  
–0.05  
UNR2213 (UN2213) + UNR2122 (UN2122)  
10˚  
Absolute Maximum Ratings Ta = 25°C  
Parameter  
Symbol  
Rating  
Unit  
Tr1  
Tr2  
Collector-base voltage  
(Emitter open)  
VCBO  
50  
V
1: Collector (Tr1)  
2: Base (Tr2)  
3: Emitter (Tr2)  
EIAJ: SC-74  
4: Collector (Tr2)  
5: Base (Tr1)  
6: Emitter (Tr1)  
Collector-emitter voltage  
(Base open)  
VCEO  
50  
V
Mini6-G1 Package  
Collector current  
IC  
100  
mA  
V
Marking Symbol: CW  
Internal Connection  
Collector-base voltage  
(Emitter open)  
VCBO  
50  
Collector-emitter voltage  
(Base open)  
VCEO  
50  
V
4
5
6
Collector current  
IC  
PT  
Tj  
500  
300  
mA  
mW  
°C  
Tr2  
Overall Total power dissipation  
Junction temperature  
Tr1  
1
150  
Storage temperature  
Tstg  
55 to +150  
°C  
3
2
Note) The part number in the parenthesis shows conventional part number.  
Publication date: July 2003  
SJJ00068BED  
1
XN04381  
Electrical Characteristics Ta = 25°C 3°C  
Tr1  
Parameter  
Symbol  
VCBO  
VCEO  
ICBO  
Conditions  
IC = 10 µA, IE = 0  
Min  
50  
Typ  
Max  
Unit  
V
Collector-base voltage (Emitter open)  
Collector-emitter voltage (Base open)  
Collector-base cutoff current (Emitter open)  
Collector-emitter cutoff current (Base open)  
Emitter-base cutoff current (Collector open)  
Forward current transfer ratio  
Collector-emitter saturation voltage  
Output voltage high-level  
IC = 2 mA, IB = 0  
VCB = 50 V, IE = 0  
VCE = 50 V, IB = 0  
VEB = 6 V, IC = 0  
VCE = 10 V, IC = 5 mA  
50  
V
0.1  
0.5  
0.1  
µA  
µA  
mA  
ICEO  
IEBO  
hFE  
80  
VCE(sat) IC = 10 mA, IB = 0.3 mA  
0.25  
V
VOH  
VOL  
R1  
VCC = 5 V, VB = 0.5 V, RL = 1 kΩ  
4.9  
V
Output voltage low-level  
VCC = 5 V, VB = 3.5 V, RL = 1 kΩ  
0.2  
+30%  
1.2  
V
Input resistance  
30%  
47  
1.0  
150  
kΩ  
Resistance ratio  
R1 / R2  
fT  
0.8  
Transition frequency  
VCB = 10 V, IE = −2 mA, f = 200 MHz  
MHz  
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
Tr2  
Parameter  
Symbol  
VCBO  
VCEO  
ICBO  
Conditions  
IC = −10 µA, IE = 0  
Min  
50  
50  
Typ  
Max  
Unit  
V
Collector-base voltage (Emitter open)  
Collector-emitter voltage (Base open)  
Collector-base cutoff current (Emitter open)  
Collector-emitter cutoff current (Base open)  
Emitter-base cutoff current (Collector open)  
Forward current transfer ratio  
Collector-emitter saturation voltage  
Output voltage high-level  
IC = −2 mA, IB = 0  
V
VCB = −50 V, IE = 0  
VCE = −50 V, IB = 0  
VEB = −6 V, IC = 0  
1  
1  
2  
µA  
µA  
mA  
ICEO  
IEBO  
hFE  
VCE = −10 V, IC = −100 mA  
50  
VCE(sat) IC = −100 mA, IB = −5 mA  
0.25  
V
VOH  
VOL  
R1  
VCC = −5 V, VB = − 0.5 V, RL = 500 Ω −4.9  
V
Output voltage low-level  
VCC = −5 V, VB = −3.5 V, RL = 500 Ω  
0.2  
+30%  
1.2  
V
Input resistance  
30%  
0.8  
4.7  
1.0  
200  
kΩ  
Resistance ratio  
R1 / R2  
fT  
Transition frequency  
VCB = −10 V, IE = 50 mA, f = 200 MHz  
MHz  
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
Common characteristics chart  
PT Ta  
500  
400  
300  
200  
100  
0
0
40  
80  
120  
160  
(
)
Ambient temperature Ta °C  
SJJ00068BED  
2
XN04381  
Characteristics charts of Tr1  
IC VCE  
VCE(sat) IC  
hFE IC  
160  
400  
300  
200  
100  
0
100  
10  
IC / IB = 10  
Ta = 25°C  
VCE = 10 V  
IB = 1.0 mA  
0.9 mA  
0.8 mA  
0.7 mA  
120  
Ta = 75°C  
25°C  
0.6 mA  
0.5 mA  
0.4 mA  
25°C  
80  
1
0.3 mA  
Ta = 75°C  
25°C  
0.2 mA  
40  
0.1  
0.01  
25°C  
0.1 mA  
0
0
2
4
6
8
10  
12  
0.1  
1
10  
100  
1
10  
100  
1000  
Collector-emitter voltage VCE (V)  
Collector current IC (mA)  
Collector current IC (mA)  
Cob VCB  
IO VIN  
VIN IO  
104  
103  
102  
10  
1
6
5
4
3
2
1
0
100  
10  
VO = 0.2 V  
Ta = 25°C  
f = 1 MHz  
IE = 0  
VO = 5 V  
Ta = 25°C  
Ta = 25°C  
1
0.1  
0.01  
0.1  
1
10  
100  
0.1  
1
10  
100  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
Collector-base voltage VCB (V)  
Output current IO (mA)  
Input voltage VIN (V)  
SJJ00068BED  
3
XN04381  
Characteristics charts of Tr2  
IC VCE  
VCE(sat) IC  
hFE IC  
300  
160  
120  
80  
40  
0
100  
10  
IC / IB = 10  
Ta = 75°C  
25°C  
Ta = 25°C  
VCE = 10 V  
250  
IB = −1.0 mA  
200  
150  
100  
50  
0
0.9 mA  
0.8 mA  
0.7 mA  
1  
Ta = 75°C  
0.6 mA  
0.5 mA  
0.4 mA  
0.3 mA  
25°C  
25°C  
0.1  
0.2 mA  
0.1 mA  
25°C  
0.01  
0
2  
4  
6  
8  
10 12  
1  
10  
100  
1000  
1  
10  
100  
1000  
Collector-emitter voltage VCE (V)  
Collector current IC (mA)  
Collector current IC (mA)  
Cob VCB  
IO VIN  
VIN IO  
104  
103  
102  
10  
1  
24  
20  
16  
12  
8
100  
10  
f = 1 MHz  
IE = 0  
VO = −5 V  
Ta = 25°C  
VO = − 0.2 V  
Ta = 25°C  
Ta = 25°C  
1  
0.1  
0.01  
4
0
0.1  
1  
10  
100  
0.4 0.6 0.8 1.0  
1.2  
1.4  
0.1  
1  
10  
100  
Collector-base voltage VCB (V)  
Input voltage VIN (V)  
Output current IO (mA)  
SJJ00068BED  
4
Request for your special attention and precautions in using the technical information  
and semiconductors described in this material  
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government  
if any of the products or technologies described in this material and controlled under the "Foreign  
Exchange and Foreign Trade Law" is to be exported or taken out of Japan.  
(2) The technical information described in this material is limited to showing representative characteris-  
tics and applied circuits examples of the products. It neither warrants non-infringement of intellec-  
tual property right or any other rights owned by our company or a third party, nor grants any license.  
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the  
product or technologies as described in this material.  
(4) The products described in this material are intended to be used for standard applications or general  
electronic equipment (such as office equipment, communications equipment, measuring instru-  
ments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,  
combustion equipment, life support systems and safety devices) in which exceptional quality and  
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or  
harm the human body.  
Any applications other than the standard applications intended.  
(5) The products and product specifications described in this material are subject to change without  
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of  
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that  
the latest specifications satisfy your requirements.  
(6) When designing your equipment, comply with the guaranteed values, in particular those of maxi-  
mum rating, the range of operating power supply voltage, and heat radiation characteristics. Other-  
wise, we will not be liable for any defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of  
incidence of break down and failure mode, possible to occur to semiconductor products. Measures  
on the systems such as redundant design, arresting the spread of fire or preventing glitch are  
recommended in order to prevent physical injury, fire, social damages, for example, by using the  
products.  
(7) When using products for which damp-proof packing is required, observe the conditions (including  
shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets  
are individually exchanged.  
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written  
permission of Matsushita Electric Industrial Co., Ltd.  
2002 JUL  

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