R-FR10 [PANASONIC]
Flexible circuit board materials Resin coated copper foil FELIOS FRCC;
| 型号： | R-FR10 |
| 厂家： | 
PANASONIC |
| 描述： | Flexible circuit board materials Resin coated copper foil FELIOS FRCC |
| 文件： | 总1页 (文件大小：174K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Circuit Board Materials
電子回路基板材料
Flexible circuit board materials
Resin coated copper foil
フレキシブル基板材料 樹脂付銅箔
R-FR10
Applications ⽤途
Smartphone(Main/Sub board, Module board), Etc.
スマートフォン ( メイン基板、サブ基板、モジュール基板 ) など
Mobile
モバイル
Possible to make board thinner and simplify the build-up process.
Contribute to thinner and smaller of mobile product and module.ꢀ
薄型多層化、ビルドアップ工程の簡略化を可能とし、モバイル機器やモジュールの薄型化・⼩型化に貢
献
Thinned multi-layer
Simplify the build-up process
Good coplanarity
■ Conceptꢀコンセプト
Thickness of 4 layer Rigid-Flex Board and
Manufacture process
■ Thin multi-layerꢀ薄型多層化
<Example> Multi-layer board 200μm
●In case that used cover-lay
Thick
: 20μm
Solder resist
Copper foil : 27μm(Cu12μｍ+Cu Plating15μｍ)
Typical FCCL
: 30μm
Prepreg
Cover-lay : 28μm(PI8μm+Ad20μm)
Cu Plating15μｍ+Cu5μｍ+PI15μｍ＋
: 55μm
Cu5μｍ+ Cu Plating15μｍ
FCCL
Cover-lay : 28μm(PI8μm+Ad20μm)
: 30μm
Prepreg
Copper foil : 27μm(Cu12μｍ+Cu Plating15μｍ)
: 20μm
Solder resist
Total Thickness：265μm
●In case that used
: 20μm
Solder resist
: 32μm(Cu12μｍ+PI3μｍ+Ad17μｍ)
＋Cu Plating15μｍ
Cu Plating15μｍ+Cu5μｍ+PI15μｍ＋
FCCL
: 55μm
Cu5μｍ+ Cu Plating15μｍ
: 32μm(Cu12μｍ+PI3μｍ+Ad17μｍ)
＋Cu Plating15μｍ
Thin
Solder resist
: 20μm
Easy
Difficult
Total Thickness：189μm
Manufacturing process
■ General propertiesꢀ⼀般特性
Item
Test method
Condition
A
Unit
R-FR10
Dielectric constant(Dk)
1GHz
3.0(Ad) / 3.3(PI)
0.019(Ad) / 0.010(PI)
IPC-TM-650 2.5.5.9
JIS C 6481
－
－
Dissipation factor(Df)
A
Solder heat resistance
No abnormality
260℃ solder float for 1min.
A
Peel strength Copper:0.012mm(12μm)
Flammability
JIS C 6481
UL
N/mm
0.8
94VTM-0*1
A+E-168/70
－
Bending property
MIT*2 method
0.5kgφ0.38, 175cpm, 135°
times
>150
The sample thickness is Copper12μｍ, PI3μｍ, Ad17μm.
*1 Measured by R-FR10/R-F775 25μｍ/R-FR10 construction
*2 Measured 18μｍ ED copper on R-F775 25μｍ covered
by R-FR10 for both side
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others. 当社ハロゲンフリー材料は、JPCA-ES-01-2003 などの定義によるものです。
The above data are typical values and not guaranteed values. 上記データは当社測定による代表値であり、保証値ではありません。
Please see the page for “Notes before you use” 商品のご採用に当たっての注意事項は こちら
2019
201906
industrial.panasonic.com/ww/electronic-materials
panasonic R-FR10
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