MIP516 [PANASONIC]

Silicon MOSFET type integrated circuit; 硅MOSFET型集成电路
MIP516
型号: MIP516
厂家: PANASONIC    PANASONIC
描述:

Silicon MOSFET type integrated circuit
硅MOSFET型集成电路

文件: 总3页 (文件大小:65K)
中文:  中文翻译
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Intelligent Power Devices (IPDs)  
MIP516  
Silicon MOSFET type integrated circuit  
Features  
Unit : mm  
+0.20  
–0.05  
1.9 0.1  
0.95 0.95  
2.90  
Built-in five protection functions. (over-current, over-voltage, load-  
short-circuit, over heat, ESD)  
+0.10  
–0.06  
0.16  
Driving directly from CMOS (microcomputer) is possible.  
It is exchangeable easily from a bipolar transistor and MOSFET  
The miniaturized package equipped with three terminals was  
adapted.  
4
3
5
6
2
1
+0.10  
–0.05  
0.30  
0.50  
Applications  
+0.10  
–0.05  
Lamp-Solenoid, driver  
Motor driver  
10°  
1 : Drain  
2 : Drain  
3 : Source  
4 : In  
5 : Drain  
6 : Drain  
Absolute Maximum Ratings TC = 25°C 3°C  
Parameter  
Drain-source voltage  
Output current  
Symbol  
VDS  
IO  
Rating  
Unit  
V
0.5 to +45  
1.0  
A
Mini6-G1 Package  
Input voltage  
VIN  
IIN  
0.5 to +6.0  
V
Marking Symbol: MB  
Input current  
2
13  
mA  
mJ  
W
1
Drain clamp energy endurance *  
ECLP  
PD1  
2
Power dissipation 1 *  
0.2  
3
Power dissipation 2 *  
PD2  
0.8  
W
Operating ambient temperature  
Channel temperature  
Topr  
Tch  
40 to +85  
150  
°C  
°C  
°C  
Storage temperature  
Tstg  
55 to +150  
Note) 1: L = 10 mH, I = 1.61 A, VDD = 20 V, 1 pulse, TC = 25°C  
*
L
2: Single unit  
*
*3: Mounting on the PCB (40 mm2, thickness 1.7mm glass epoxy  
substrate) (Ta = 25°C)  
Block Diagram  
Drain  
Over-current  
protection  
Load short-circuit  
protection  
Gate cutoff  
circuit  
In  
Over-heat  
protection  
Over-voltage  
protection  
ESD protection  
Source  
Publication date: August 2003  
SLB00059AED  
1
MIP516  
Electrical Characteristics TC = 25°C 3°C  
Parameter  
Symbol  
RDS(on)  
VDS(on)  
VDS(CLP)  
IDS(off)1  
IDS(off)2  
IDS(off)3  
VIN(H)  
Conditions  
VIN = 5 V, IDS = 1 A  
Min  
Typ  
0.70  
0.70  
52  
Max  
0.90  
0.90  
Unit  
Drain-source ON resistance  
Drain-source voltage  
VIN = 5 V, IDS = 1 A  
VIN = 0 V, IDS = 3 mA  
VIN = 0 V, VDS = 12 V  
VIN = 0 V, VDS = 25 V  
VIN = 0 V, VDS = 40 V  
IDS = 0.5 A  
V
Drain clamp voltage  
45  
V
Drain-source cutoff current 1  
Drain-source cutoff current 2  
Drain-source cutoff current 3  
Input voltage high-level  
0.01  
0.02  
5.00  
8.00  
µA  
0.08 10.00  
4
V
V
Input voltage low-level  
VIN(L)  
IDS = 1 mA  
0.80  
Input current (normal)  
IIN(on)  
VIN = 5 V, VDS = 0 V  
VIN = 5 V  
0.3  
0.75  
1.7  
0.5  
mA  
mA  
A
Input current (act on protection) *  
Over current protection limit  
Short circuit load protection limit  
Input voltage of act on protection  
IIN(PROT)  
IOCP  
VDS(SHT)  
VIN(PROT)  
1.10  
VIN = 5 V  
1.1  
1.0  
4.0  
VIN = 5 V  
1.6  
V
6.0  
V
Note) 1. At on-state when drain voltage exceeds the "Short circuit load protection voltage", output current begin to oscillate.  
2. When drain voltage exceeds the "drain clamp voltage" output MOS turn on, so drain voltage are clamped before the  
drain-source junction become breakdown  
3. : State of short circuit laod protection and over heat protection (designed guarantee).  
*
SLB00059AED  
2
Request for your special attention and precautions in using the technical information  
and semiconductors described in this material  
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government  
if any of the products or technologies described in this material and controlled under the "Foreign  
Exchange and Foreign Trade Law" is to be exported or taken out of Japan.  
(2) The technical information described in this material is limited to showing representative characteris-  
tics and applied circuits examples of the products. It neither warrants non-infringement of intellec-  
tual property right or any other rights owned by our company or a third party, nor grants any license.  
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the  
product or technologies as described in this material.  
(4) The products described in this material are intended to be used for standard applications or general  
electronic equipment (such as office equipment, communications equipment, measuring instru-  
ments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,  
combustion equipment, life support systems and safety devices) in which exceptional quality and  
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or  
harm the human body.  
Any applications other than the standard applications intended.  
(5) The products and product specifications described in this material are subject to change without  
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of  
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that  
the latest specifications satisfy your requirements.  
(6) When designing your equipment, comply with the guaranteed values, in particular those of maxi-  
mum rating, the range of operating power supply voltage, and heat radiation characteristics. Other-  
wise, we will not be liable for any defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of  
incidence of break down and failure mode, possible to occur to semiconductor products. Measures  
on the systems such as redundant design, arresting the spread of fire or preventing glitch are  
recommended in order to prevent physical injury, fire, social damages, for example, by using the  
products.  
(7) When using products for which damp-proof packing is required, observe the conditions (including  
shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets  
are individually exchanged.  
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written  
permission of Matsushita Electric Industrial Co., Ltd.  
2002 JUL  

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