MA4X7130G [PANASONIC]

Mixer Diode, L Band, Silicon, ROHS COMPLIANT, MINI4-G3, 4 PIN;
MA4X7130G
型号: MA4X7130G
厂家: PANASONIC    PANASONIC
描述:

Mixer Diode, L Band, Silicon, ROHS COMPLIANT, MINI4-G3, 4 PIN

光电二极管
文件: 总4页 (文件大小:205K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
This product complies with the RoHS Directive (EU 2002/95/EC).  
Schottky Barrier Diodes (SBD)  
MA4X7130G  
Silicon epitaxial planar type  
For switching  
For wave detection  
Features  
Package  
Two isolated elements are contained in one package, allowing  
high-density mounting  
Two MA3X704A is contained in one package (of a type n the  
same direction)  
Forward voltage VF , optimum for low voltage retificaion  
Optimum for high frequency rectification becausof its sort  
reverse recovery time trr  
Code  
Mini4-G3  
Pin Name  
1: C
2: Ca
node 2  
: Ande 1  
Marking Symbol: M1N  
Absolute Maximum Ratings Ta = 25°C  
Parameter  
Reverse voltage  
Maximum peak reverse votge  
mbol  
VR  
Rating  
Unit  
V
Internal Connection  
3
(A2)  
3
(A1)  
4
VRM  
IFM  
30  
150  
V
Peak forward  
current  
Sinle  
mA  
Double  
Sigle  
110  
Forward current  
IF  
3
mA  
ouble *ꢀ  
20  
uction teure  
Stragtemture  
Tj  
125  
°C  
°C  
Tstg  
55 to +125  
2
(C2)  
1
(C1)  
Note) : Vaue of ach dide in double diodes used.  
*
Electrical Characteristics Ta = 25°C 3°C  
r  
Forward v
Symbol  
VF1  
VF2  
IR  
Conditions  
Min  
Typ  
Max  
Unit  
IF = 1 mA  
0.4  
1.0  
1
V
IF = 30 mA  
VR = 30 V  
Reverse current  
µA  
pF  
ns  
Terminal capacitance  
Reverse recovery time *  
Ct  
VR = 1 V, f = 1 MHz  
1.5  
1.0  
trr  
IF = IR = 10 mA  
Irr = 1 mA, RL = 100 Ω  
Detection efficiency  
η
Vin = 3 V(peak) , f = 30 MHz  
RL = 3.9 k, CL = 10 pF  
65  
%
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.  
2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on the charge of a human body  
and the leakage of current from the operating equipment.  
3. Absolute frequency of input and output is 2 GHz.  
4. : trr measurement circuit  
*
Bias Application Unit (N-50BU)  
Input Pulse  
Output Pulse  
tp  
tr  
t
10%  
90%  
trr  
IF  
t
A
VR  
Irr = 1 mA  
tp = 2 µs  
tr = 0.35 ns  
δ = 0.05  
IF = 10 mA  
IR = 10 mA  
RL = 100 Ω  
Pulse Generator  
(PG-10N)  
Wave Form Analyzer  
(SAS-8130)  
Rs = 50 Ω  
Ri = 50 Ω  
Publication date: March 2009  
SKF00105AED  
1
This product complies with the RoHS Directive (EU 2002/95/EC).  
MA4X7130G  
Characteristics charts between pins 1 and 4, 2 and 3  
IF VF  
IR VR  
VF Ta  
103  
102  
10  
103  
102  
10  
1.0  
0.8  
0.6  
0.4  
0
75°C 25°C  
20°C  
Ta = 125°C  
75°C  
Ta = 125°C  
IF = 30 mA  
1
1
3 mA  
1 mA  
101  
102  
101  
102  
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
5
10  
15  
20  
25  
40  
0
40  
)
Ambient temperature Ta °C  
80  
120  
160  
(
)
( )  
eversvoltage VR V  
(
Forward voltage VF  
V
IR Ta  
Ct VR  
103  
102  
10  
3
2
0
f = MHz  
Ta = 25°C  
= 30
15
1
01  
10
0
5
10  
15  
20  
25  
30  
40  
0
80  
120 160 200  
( )  
Reverse voltage VR V  
(
)
raturTa °C  
SKF00105AED  
2
This product complies with the RoHS Directive (EU 2002/95/EC).  
MA4X7130G  
Mini4-G3  
Unit: mm  
2.90 +00..0250  
0.13 +00..0025  
1.9 0.1  
(0.95)  
(0.95)  
3
4
1
(020)  
0.
0.40 +00..0150  
8°  
SKF00105AED  
3
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any  
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any  
other company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability requied, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subjet to change wit notice for modification and/or im-  
provement. At the final stage of your design, purchasingr use of the roducts, therfor the most up-to-date Product  
Standards in advance to make sure that the latest specifictions stisfy your requirements.  
(5) When designing your equipment, comply with he ange f absolute maximing nd the guaranteed operating conditions  
(operating power supply voltage and operating nvirent etc.). Especiall, plee be ceful not to exceed the range of absolute  
maximum rating on the transient state, such as powpower-off and modeswitching. Otherwise, we will not be liable for any  
defect which may arise later in your equpmen
Even when the products are used withthe guaanteed values, kinto he cosideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the sytems such as redundant design, arresting the spread of fire  
or preventing glitch are recommin ordto prevent physicinjury, fre, social damaes, for example, by using the products.  
(6) Comply with the instructios for se in rder to prevent breakdwn and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanicastress) at the time of andlig, mounting or at customer's process. When using products for which  
damp-proof packinis reqired, stisfy the condtions, sch as shelf life and the elapsed time since first opening the packages.  
(7) This book may e not eprinted or reprodhethr wholly or partially, without the prior written permission of our company.  
2008080

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