MA27V17 [PANASONIC]

Silicon epitaxial planar type; 硅外延平面型
MA27V17
型号: MA27V17
厂家: PANASONIC    PANASONIC
描述:

Silicon epitaxial planar type
硅外延平面型

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Variable Capacitance Diodes  
MA27V17  
Silicon epitaxial planar type  
Unit: mm  
+0.05  
–0.02  
+0.05  
–0.02  
0.27  
0.10  
For VCO  
2
Features  
Good linearity and large capacitance-ratio in CD VR relation  
Small series resistance r  
D
1
0.60 0.05  
Absolute Maximum Ratings Ta = 25°C  
5˚  
Parameter  
Reverse voltage  
Symbol  
VR  
Rating  
Unit  
V
6
Junction temperature  
Storage temperature  
Tj  
125  
°C  
°C  
Tstg  
55 to +125  
1 : Anode  
2 : Cathode  
SSSMini2-F1 Package  
Marking Symbol: L  
Electrical Characteristics Ta = 25°C 3°C  
Parameter  
Reverse current  
Symbol  
IR  
Conditions  
Min  
Typ  
Max  
10  
Unit  
nA  
VR = 5 V  
Diode capacitance  
CD(1V)  
CD(4V)  
CD(1V)/CD(4V)  
rD  
VR = 1 V, f = 1 MHz  
VR = 4 V, f = 1 MHz  
2.86  
1.17  
2.34  
3.10  
1.27  
2.54  
0.35  
pF  
Capacitance ratio  
Series resistance *  
VR = 4 V, f = 470 MHz  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.  
2. Absolute frequency of input and output is 470 MHz  
3. : Measuring instrument; YHP MODEL 4191A RF IMPEDANCE ANALYZER  
*
Publication date: August 2003  
SKD00085AED  
1
MA27V17  
IF VF  
CD VR  
CD Ta  
120  
10  
f = 1 MHz  
f = 1 MHz  
Ta = 25°C  
1.032  
1.024  
1.016  
1.008  
1.000  
100  
80  
60  
40  
20  
0
VR = 1 V  
Ta = 85°C  
25°C  
1
4 V  
0.992  
0.984  
0.976  
0.968  
25°C  
101  
0.4  
0
0.2  
1.0 1.2 1.4  
0.6 0.8  
25  
5  
15  
35  
55  
75  
0
1
2
3
4
5
6
7
Forward voltage VF (V)  
Ambient temperature Ta (°C)  
Reverse voltage VR (V)  
IR Ta  
100  
10  
VR = 5 V  
1
0.1  
0.01  
25 5  
15  
35  
55  
75  
95  
Ambient temperature Ta (°C)  
SKD00085AED  
2
Request for your special attention and precautions in using the technical information  
and semiconductors described in this material  
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government  
if any of the products or technologies described in this material and controlled under the "Foreign  
Exchange and Foreign Trade Law" is to be exported or taken out of Japan.  
(2) The technical information described in this material is limited to showing representative characteris-  
tics and applied circuits examples of the products. It neither warrants non-infringement of intellec-  
tual property right or any other rights owned by our company or a third party, nor grants any license.  
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the  
product or technologies as described in this material.  
(4) The products described in this material are intended to be used for standard applications or general  
electronic equipment (such as office equipment, communications equipment, measuring instru-  
ments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,  
combustion equipment, life support systems and safety devices) in which exceptional quality and  
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or  
harm the human body.  
Any applications other than the standard applications intended.  
(5) The products and product specifications described in this material are subject to change without  
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of  
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that  
the latest specifications satisfy your requirements.  
(6) When designing your equipment, comply with the guaranteed values, in particular those of maxi-  
mum rating, the range of operating power supply voltage, and heat radiation characteristics. Other-  
wise, we will not be liable for any defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of  
incidence of break down and failure mode, possible to occur to semiconductor products. Measures  
on the systems such as redundant design, arresting the spread of fire or preventing glitch are  
recommended in order to prevent physical injury, fire, social damages, for example, by using the  
products.  
(7) When using products for which damp-proof packing is required, observe the conditions (including  
shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets  
are individually exchanged.  
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written  
permission of Matsushita Electric Industrial Co., Ltd.  
2002 JUL  

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