LNJ208R8ARA_08 [PANASONIC]
Surface Mounting Chip LED; 表面安装LED芯片
| 型号： | LNJ208R8ARA_08 |
| 厂家： | 
PANASONIC |
| 描述： | Surface Mounting Chip LED |
| 文件： | 总3页 (文件大小：310K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This product complies with the RoHS Directive (EU 2002/95/EC).
Light Emitting Diodes
LNJ208R8ARA
Surface Mounting Chip LED
SS Type
ꢀAbsolute Maximum Ratings T = 25°C
ꢀLighting Color
ꢀRed
a
Parameter
Power dissipation
Symbol
Rating
Unit
mW
mA
mA
V
PD
IF
50
20
Forward current
Pulse forward current *
Reverse voltage
IFP
VR
Topr
100
3
Operating ambient temperature
Storage temperature
–25 to +85
–40 to +100
°C
T
stg
°C
Note) : The condition of IFP is duty 10%, Pulse width 1 msec.
*
ꢀElectro-Optical Characteristics T = 25°C
a
Parameter
Luminous intensity
Symbol
IO
Conditions
Min
Typ
Max
Unit
mcd
µA
V
IF = 10 mA
VR = 3 V
2.75
6.7
Reverse current
IR
100
2.5
Forward voltage
VF
IF = 10 mA
IF = 10 mA
IF = 10 mA
1.72
660
20
Peak emission wavelength
Spectral half band width
nm
nm
λP
Δλ
I
O IF
IF VF
Relative luminous intensity Ta
1000
100
10
1
10
100
1
10
0.1
1
10
100
1.6
1.8
2.0
2.2
2.4
−20
0
20
40
60
80
100
Forward current IF (mA)
Forward voltage VF (V)
Ambient temperature Ta (°C)
IF Ta
Relative luminous intensity λP
25
20
100
80
Directive characteristics
0°
10°
10°
20°
20°
30°
30°
15
10
5
40°
50°
60°
70°
40°
50°
60°
70°
80°
90°
80°
60°
40°
20°
60
40
20
0
80°
90°
0
0
20
40
60
80
100
500
600
700
800 100 80
60
40
20
0
20
40
60
80 100
Relative luminous intensity (%)
Peak emission wavelength λP (nm)
Ambient temperature Ta (°C)
Publication date: December 2008
SHD00414BEK
1
This product complies with the RoHS Directive (EU 2002/95/EC).
LNJ208R8ARA
ꢀPackage (Unit: mm)
KLTFTN2K0800
ꢀꢁꢂrꢃꢁꢀ
ꢀꢁꢀrꢃꢁꢀ
ꢃꢁꢅrꢃꢁꢀ
ꢀ
ꢄ
ꢀꢁꢃrꢃꢁꢀ
ꢀ
ꢄ
ꢀPin name
1:Anode
2: Cathode
SHD00414BEK
2
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
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other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
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Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
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20080805
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