EVPAX [PANASONIC]
Light Touch Switches;
| 型号： | EVPAX |
| 厂家： | 
PANASONIC |
| 描述： | Light Touch Switches |
| 文件： | 总2页 (文件大小：93K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Light Touch Switches/EVPAX
3.0 mm×2.6 mm Double-action SMD
Light Touch Switches
Type:
EVPAX
■Features
×
● External dimensions: 3.0 mm 2.6 mm Height 0.7 mm
■Recommended Applications
● Camera function
(Digital still cameras, Camcorders, Mobile phones, etc.)
■Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
Product Code
Type
■Specifications
Type
Snap action/Push-on type SPDT
Rating
10 μA 2 Vdc to 20 mA 15 Vdc (Resistive load)
500 mΩ max.
Contact Resistance
Insulation Resistance
100 MΩ min. (at 100 Vdc)
250 Vac (1 minute)
3 ms max. (ON)
20 ms max. (OFF)
0.7 N
Electrical
Dielectric Withstanding Voltage
Bouncing
Operating Force (1st Action)
Operating Force (2nd Action)
Push Travel (1st Action)
Push Travel (2nd Action)
Push Strength
2.0 N
Mechanical
Endurance
0.07 mm
0.16 mm
30 N (15 seconds)
100000 cycles min.
Operating Life
Operating Temperature
Storage Temperature
–40 °C to +70 °C
–40 °C to +85 °C (Bulk)
–20 °C to +60 °C (Taping)
Minimum Quantity/Packing Unit
Quantity/Carton
8000 pcs. Embossed Taping (Reel Pack)
40000 pcs.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
ꢀ Panasonic Corporation 2016
ANCTB29E 201606-Fd
industrial.panasonic.com/ac/e/
–1–
2016.09
Light Touch Switches/EVPAX
■Dimensions in mm (not to scale)
EVPAXBA1A
General dimension tolerance : 0.1
( )dimensions are reference dimensions.
0.7 0.15
0.245
This reference specifications are subject to change.
A
B
A'
C
φ0.775
A
B
A'
C
1st operation
2nd operation
A or/and A' shall be
used as common
terminal
3.4
3
Circuit Diagram
0.1 max.
(film)
without the film
2-3.6 0.05
2-2.5 0.05
Land pattern
(common terminal)
Except area
needs insulation
layer.
Land pattern
(
Exposed)
Soldering thickness t=0.1 0.02
Land pattern plan
■Recommended Reflow Soldering Conditions
● Embossed Carrier Taping
Tape width=12.0 mm (A=12.0 mm)
Feeding hole
MAX.
245
220
Chip pocket
Fan or Normal Temp.
J
D
E
F
I
180
C
B
150
A'
A
Tape running direction
t
Taping condition : Lack of products in the middle of taping should be
one MAX, but total quantity specified in the
specifications should be secured.
(Normal Temp.)
Peeling off strength of top tape : It should be within 0.2N to 1.0N at
165 degree in peeling off angle.
Joint of carrier tape : One joint per one reel may exist.
90 30
40 10
Soldering Time (s)
Unit: mm
Part No.
Height
0.7
A
B
C
D
E
F
G
H
I
J
K
t
+0.15
–
EVPAX
12.0 0.3 1.75 0.10 5.5 0.1
8.0 0.1
4.0 0.1
2.0 0.1
1.5 0.3
3.8 0.2
2.3 0.2 0.75 0.20 (10.25)
0.30 0.10
● Standard Reel Dimensions in mm (not to scale)
G
Item
A
B
C
D
E
E
Rate (mm) φ380.0 2.0 φ80.0 1.0 φ13.0 0.5 φ21.0 1.0
2.0 0.5
C
Item
F
G
D
Rate (mm) 13.5 1.0
17.5 1.0
A
F
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
Panasonic Corporation 2016
ꢀ
ANCTB29E 201606-Fd
–2–
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