DRA3115E [PANASONIC]
Small Signal Bipolar Transistor, 0.1A I(C), 1-Element, PNP, Silicon, HALOGEN FREE AND ROHS COMPLIANT, SSSMINI3-F2-B, 3 PIN;
| 型号： | DRA3115E |
| 厂家： | 
PANASONIC |
| 描述： | Small Signal Bipolar Transistor, 0.1A I(C), 1-Element, PNP, Silicon, HALOGEN FREE AND ROHS COMPLIANT, SSSMINI3-F2-B, 3 PIN 光电二极管 晶体管 |
| 文件： | 总4页 (文件大小：480K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This product complies with the RoHS Directive (EU 2002/95/EC).
DRA3115E
Silicon PNP epitaxial planar type
For digital circuits
Complementary to DRC3115E
DRA9115E in SSSMini3 type package
ꢀPackage
Features
ꢀCode
Low collector-emitter saturation voltage VCE(sat)
Contributes to miniaturization of sets, reduction of component count.
Eco-friendly Halogen-free package
SSSMini3-F2-B
ꢀPin Name
1: Base
2: Emitter
Packaging
3: Collector
Embossed type (Thermo-compression sealing): 10000 pcs / reel (standard)
ꢀMarking Symbol: LN
ꢀInternal Connection
ꢀAbsolute Maximum Ratings T = 25°C
a
Parameter
Collector-base voltage (Emitter open)
Collector-emitter voltage (Base open)
Collector current
Symbol
VCBO
VCEO
IC
Rating
–50
Unit
V
C
E
R1
B
–50
V
R2
–100
mA
mW
°C
Total power dissipation
PT
100
R1
R2
100 kΩ
100 kΩ
Resistance value
Junction temperature
Tj
150
Storage temperature
T
stg
–55 to +150
°C
ꢀElectrical Characteristics T = 25°C±3°C
a
Parameter
Symbol
Conditions
Min
–50
–50
Typ
Max
Unit
V
Collector-base voltage (Emitter open)
Collector-emitter voltage (Base open)
Collector-base cutoff current (Emitter open)
Collector-emitter cutoff current (Base open)
Emitter-base cutoff current (Collector open)
Forward current transfer ratio
Collector-emitter saturation voltage
Input voltage (ON)
VCBO IC = –10 µA, IE = 0
VCEO IC = –2 mA, IB = 0
V
ICBO
ICEO
IEBO
hFE
VCB = –50 V, IE = 0
VCE = –50 V, IB = 0
VEB = –6 V, IC = 0
– 0.1
– 0.5
– 0.1
µA
µA
mA
V
VCE = –10 V, IC = –5 mA
80
VCE(sat) IC = –10 mA, IB = – 0.5 mA
VI(on) VCE = – 0.2 V, IC = –5 mA
– 0.25
–5.7
V
Input voltage (OFF)
VI(off) VCE = –5 V, IC = –100 µA
– 0.8
+30%
1.2
V
Input resistance
R1
–30%
0.8
100
1.0
kΩ
Resistance ratio
R1 / R2
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Publication date: December 2010
Ver. BED
1
This product complies with the RoHS Directive (EU 2002/95/EC).
DRA3115E
PT T
IC VCE
hFE IC
a
150
125
100
−120
−100
−80
−60
−40
−20
0
300
250
200
150
100
50
V
CE = −10 V
Ta = 25°C
Ta = 85°C
I
B = −800 µA
−700 µA
−600 µA
−500 µA
25°C
−30°C
−400 µA
−300 µA
75
50
25
−200 µA
−100 µA
0
0
0
40
80
120
160
200
0
−2
−4
−6
−8 −10 −12
− 0.1
−1
−10
−100
(
)
Ambient temperature Ta °C
Collector current IC (mA)
Collector-emitter voltage VCE (V)
VCE(sat) IC
IO VIN
VIN IO
−10
−1
−100
−10
−1
IC / IB = 20
VO = −5 V
V
O = − 0.2 V
Ta = 85°C
25°C
−10
−1
Ta = −30°C
−10−1
−10−2
−10−3
25°C
85°C
Ta = 85°C
−30°C
−30°C
− 0.1
25°C
−1
− 0.1
− 0.01
0
− 0.5
−1.0
−1.5
−2.0
− 0.1
−1
−10
−100
− 0.1
−10
−100
Output current IO (mA)
Collector current IC (mA)
(V)
Input voltage VIN
Ver. BED
2
This product complies with the RoHS Directive (EU 2002/95/EC).
DRA3115E
SSSMini3-F2-B
Unit: mm
1.20 ±0.05
0.30 +−00..0025
3
2
1
0.13 +−00..0025
0.20 +−00..0025
(0.4)
(0.4)
0.80 ±0.05
(5°)
Ver. BED
3
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20100202
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