DA4X101F [PANASONIC]
Silicon epitaxial planar type; 硅外延平面型
| 型号： | DA4X101F |
| 厂家： | 
PANASONIC |
| 描述： | Silicon epitaxial planar type |
| 文件： | 总4页 (文件大小：484K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This product complies with the RoHS Directive (EU 2002/95/EC).
DA4X101F
Silicon epitaxial planar type
For high speed switching circuits
Features
ꢀPackage
Small reverse current IR
Short reverse recovery time trr
ꢀCode
Mini4-G4-B
ꢀPin Name
1: Anode-1
2: Cathode-2
Contributes to miniaturization of sets, reduction of component count.
Eco-friendly Halogen-free package
3: Anode-2
4: Cathode-1
ꢀBasic Part Number
Dual DA2J101 (Parrarel, oppositely arranged)
ꢀMarking Symbol: 22
ꢀInternal Connection
Packaging
Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)
4
3
Absolute Maximum Ratings Ta = 25°C
Parameter
Symbol
VR
Rating
80
Unit
V
Reverse voltage
1
2
Maximum peak reverse voltage
VRM
80
V
Single
Double
Single
Double
Single
Double
100
mA
mA
mA
mA
mA
mA
°C
Forward current
IF
75
225
Peak forward current
IFM
170
500
Non-repetitive peak forward
surge current *
IFSM
Tj
375
Junction temperature
Storage temperature
150
T
stg
–55 to +150
°C
Note) : 1 t = 1 s
*
Electrical Characteristics Ta = 25°C±3°C
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
V
Forward voltage
Reverse voltage
Reverse current
VF
VR
IR
IF = 100 mA
IR = 100 µA
VR = 80 V
0.95
1.20
80
V
100
2.0
3
nA
pF
ns
Terminal capacitance
Ct
VR = 0 V, f = 1 MHz
0.9
Reverse recovery time *
trr
IF = 10 mA, VR = 6 V, Irr = 0.25 × IRꢀ
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. Absolute frequency of input and output is 100 MHz
3. : trr measurement circuit
*
Input Pulse
tp
Output Pulse
trr
Bias Application Unit (N-50BU)
tr
t
10%
IF
t
A
90%
VR
I
rr = 0.25 × IR
F = 10 mA
VR = 6 V
tp = 2 µs
tr = 0.35 ns
δ = 0.05
I
Pulse Generator
(PG-10N)
Rs = 50 Ω
Wave Form Analyzer
(SAS-8130)
Ri = 50 Ω
Publication date: March 2010
ZKF00150AED
1
This product complies with the RoHS Directive (EU 2002/95/EC).
DA4X101F
IF VF
IR VR
Ct VR
103
1.2
Ta = 25°C
Ta = 85°C
10−4
102
10
1.0
0.8
0.6
0.4
0.2
0
Ta = 85°C
25°C
10−6
1
25°C
−30°C
10−1
10−2
10−8
−30°C
10−10
10−3
0
0
20
40
60
80
100
0.4
0.8
1.2
0
10
20
30
40
Reverse voltage VR (V)
Reverse voltage VR (V)
Forward voltage VF (V)
ZKF00150AED
2
This product complies with the RoHS Directive (EU 2002/95/EC).
DA4X101F
Mini4-G4-B
Unit: mm
2.90 +−00..0250
1.9 ±0.1
0.13 +−00..0025
(0.95)
(0.95)
4
3
1
2
(0.20)
0.65 +−00..0150
0.40 +−00..0150
8°
ZKF00150AED
3
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20100202
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