AXT152164 [PANASONIC]

Board Stacking Connector, 52 Contact(s), 2 Row(s), Female, Straight, Surface Mount Terminal, Socket, ROHS COMPLIANT;
AXT152164
型号: AXT152164
厂家: PANASONIC    PANASONIC
描述:

Board Stacking Connector, 52 Contact(s), 2 Row(s), Female, Straight, Surface Mount Terminal, Socket, ROHS COMPLIANT

连接器
文件: 总10页 (文件大小:413K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
For board-to-board For board-to-FPC  
Narrow pitch connectors  
(0.35mm pitch)  
P35S  
FEATURES  
1. Small size 0.35 mm pitch  
contributes to device miniaturization.  
Smaller compared to P4S (40 pins):  
Socket — 11% smaller,  
3. Greater flexibility in connector  
placement.  
Pattern wiring to the connector bottom is  
made possible with a molded covering on  
the undersurface of the connector.  
Header — 12% smaller  
Soldering terminals  
at each corner  
<Socket>  
<Header>  
Socket  
Socket  
Header  
9.55 (40 pins)  
Soldering  
Insulation terminals  
3.60  
Insulation  
area  
area  
Connector bottom:  
at each  
corner  
Soldering  
terminals  
at each  
Soldering terminals  
at each corner  
RoHS compliant  
Create any thru-hole  
and pattern wiring.  
corner  
Header  
4. Connectors for inspection available  
8.73 (40 pins)  
2.35  
APPLICATIONS  
2. Strong resistance to adverse  
environments! Utilizes  
Mobile devices, such as cellular  
phones, digital still cameras and  
digital video cameras.  
” construction  
for high contact reliability.  
ORDERING INFORMATION  
AXT  
1
2
4
1: Narrow Pitch Connector P35S (0.35 mm pitch) Socket  
2: Narrow Pitch Connector P35S (0.35 mm pitch) Header  
Number of pins (2 digits)  
Mated height  
<Socket>/<Header>  
1: For mated height 1.5 mm  
Functions  
<Socket>/<Header>  
2: No pickup cover, without positioning bosses  
Surface treatment (Contact portion / Terminal portion)  
<Socket>  
4: Ni plating on base, Au plating on surface (for Ni barrier available)  
<Header>  
4: Ni plating on base, Au plating on surface  
ACCTB87E 201602-T  
–1–  
Narrow pitch connectors P35S (0.35mm pitch)  
PRODUCT TYPES  
Part number  
Packing  
Mated height  
Number of pins  
Socket  
Header  
Inner carton (1-reel)  
3,000 pieces  
Outer carton  
6,000 pieces  
40  
50  
AXT140124  
AXT150124  
AXT160124  
AXT170124  
AXT180124  
AXT100124  
AXT240124  
AXT250124  
AXT260124  
AXT270124  
AXT280124  
AXT200124  
60  
1.5mm  
70  
80  
100  
Notes: 1. Regarding ordering units; During production: Please make orders in 1-reel units.  
For samples, please contact our sales office.  
SPECIFICATIONS  
1. Characteristics  
Item  
Specifications  
Conditions  
Rated current  
Rated voltage  
0.25A/pin contact (Max. 4 A at total pin contacts)  
60V AC/DC  
Rated voltage is applied for one minute and check for  
short circuit or damage with a detection current of 1mA.  
Electrical  
characteristics  
Dielectric strength  
Insulation resistance  
Contact resistance  
150V AC for 1 min.  
Min. 1,000MΩ (initial)  
Max. 100mΩ  
Using 250V DC megger (applied for 1 min.)  
Based on the contact resistance measurement method  
specified by JIS C 5402.  
Composite insertion force  
Composite removal force  
Max. 0.981N/pin contact × pin contacts (initial)  
Min. 0.0588N/pin contact × pin contacts  
Mechanical  
characteristics  
Contact holding force  
(Socket contact)  
Measuring the maximum force.  
As the contact is axially pull out.  
Min. 0.981N/pin contact  
Ambient temperature  
–55°C to +85°C  
Max. peak temperature of 260°C (on the surface of the  
PC board around the connector terminals)  
No icing or condensation.  
Infrared reflow soldering  
Soldering iron  
Soldering heat resistance  
300°C within 5 sec. or 350°C within 3 sec.  
–55°C to +85°C (product only)  
–40°C to +50°C (emboss packing)  
Storage temperature  
No icing or condensation.  
Conformed to MIL-STD-202F, method 107G  
Order Temperature (°C) Time (minutes)  
0
1
2
3
4
–553  
30  
Max. 5  
30  
Thermal shock resistance  
(header and socket mated)  
5 cycles, insulation resistance min. 100MΩ,  
contact resistance max. 100mΩ  
Environmental  
characteristics  
85+3  
0
Max. 5  
0
–553  
Humidity resistance  
(header and socket mated)  
120 hours, insulation resistance min. 100MΩ,  
contact resistance max. 100mΩ  
Conformed to IEC60068-2-78  
Temperature 40°C 2°C, humidity 90% to 95% R.H.  
Saltwater spray resistance  
(header and socket mated)  
24 hours, insulation resistance min. 100MΩ,  
contact resistance max. 100mΩ  
Conformed to IEC60068-2-11  
Temperature 35°C 2°C, saltwater concentration 5% 1%  
Temperature 40°C 2°C,  
gas concentration 3 ppm 1 ppm,  
humidity 75% to 80% R.H.  
H2S resistance  
(header and socket mated)  
48 hours,  
contact resistance max. 100mΩ  
Lifetime  
characteristics  
Repeated insertion and removal speed of  
max. 200 times/hours  
Insertion and removal life  
50 times  
Unit weight  
50 pin contacts Socket: 0.06 g Header: 0.03 g  
2. Material and surface treatment  
Part name  
Material  
Surface treatment  
Molded portion  
LCP resin (UL94V-0)  
Contact portion: Ni plating on base, Au plating on surface  
Terminal portion: Ni plating on base, Au plating on surface (Except for front edge of terminal)  
However, the area adjacent to the socket terminal is exposed to Ni on base.  
Soldering terminals portion;  
Contact and Post  
Copper alloy  
Socket: Ni plating on base, Pd + Au flash plating on surface (Expect for front edge of terminal)  
Header: Ni plating on base, Au plating on surface (Expect for front edge of terminal)  
ACCTB87E 201602-T  
–2–  
Narrow pitch connectors P35S (0.35mm pitch)  
The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/  
DIMENSIONS (Unit: mm)  
1. Socket (Mated height: 1.5mm)  
CAD Data  
A
Terminal coplanarity  
0.08  
B 0.1  
1.45  
0.35 0.05  
(Contact and  
soldering terminals)  
0.12 0.03  
(0.66)  
Y (Note)  
Z (Note)  
Dimension table (mm)  
Number of pins/  
A
B
C
dimension  
40  
50  
9.55  
6.65  
8.35  
11.30  
8.40 10.10  
0.30 0.03  
60  
13.05 10.15 11.85  
14.80 11.90 13.60  
16.55 13.65 15.35  
20.05 17.15 18.85  
C 0.1  
70  
80  
100  
General tolerance: 0.2  
2. Header (Mated height: 1.5mm)  
CAD Data  
A
Terminal coplanarity  
0.08  
B 0.1  
1.24  
(Contact and  
soldering terminals)  
0.35 0.05  
0.12 0.03  
Soldering terminals  
Dimension table (mm)  
Number of pins/  
dimension  
A
B
C
40  
50  
8.73  
6.65  
8.40  
8.05  
9.80  
10.48  
0.12 0.03  
60  
12.23 10.15 11.55  
13.98 11.90 13.30  
15.73 13.65 15.05  
19.23 17.15 18.55  
C 0.1  
70  
80  
100  
General tolerance: 0.2  
Socket and Header are mated  
Header  
Socket  
ACCTB87E 201602-T  
–3–  
Narrow pitch connectors P35S (0.35mm pitch)  
EMBOSSED TAPE DIMENSIONS (unit: mm, Common for respective contact type, socket and header)  
• Tape dimensions (Conforming to JIS C 0806:1990.  
However, some tapes have mounting hole pitches that do  
not comply with the standard.)  
• Plastic reel dimensions (Conforming to EIAJ ET-7200B)  
Tape I  
Tape II  
Taping reel  
D 1  
A 0.3  
B
Label  
A 0.3  
C
Top cover tape  
C
1.75  
1.75  
Embossed carrier tape  
4
2
4
2
Embossed mounting-hole  
8.0  
8.0  
Dimension table (mm)  
Mated height  
Number of pins  
Type of taping  
Tape I  
A
B
C
D
Quantity per reel  
3,000  
40 to 70  
24.0  
32.0  
11.5  
14.2  
25.4  
33.4  
Common for socket and header:  
1.5mm  
72 to 100  
Tape II  
28.4  
3,000  
Connector orientation with respect to direction of progress of embossed tape  
Type  
Common for P35S  
Direction of  
tape progress  
Socket  
Header  
Note: There is no indication on this product regarding top-bottom or left-right orientation.  
ACCTB87E 201602-T  
–4–  
For board-to-board For board-to-FPC  
Connectors for  
inspection usage  
(0.35mm pitch)  
P35S  
FEATURES  
APPLICATIONS  
1. 3,000 mating and unmating cycles  
2. Same external dimensions and foot  
pattern as standard type.  
Ideal for module unit inspection and  
equipment assembly inspection  
Note: Mating retention force cannot be  
warranted.  
3. Improved mating  
Insertion and removal easy due to a  
reduction in mating retention force. This  
is made possible by a simple locking  
structure design.  
Please avoid using for applications other  
than inspection.  
Socket  
Header  
RoHS compliant  
TABLE OF PRODUCT TYPES  
: Available for sale  
Product name  
Number of pins  
40  
50  
60  
70  
80  
100  
P35S  
for inspection  
Notes: 1. The pickup surface shape of the inspection sockets is different from that of the standard sockets. (For details, refer to the product specification diagram.)  
2. Please inquire number of pins other than those shown above.  
3. Please inquire us regarding availability.  
4. Please keep the minimum order quantities no less than 50 pieces per lot.  
5. Please inquire if further information is needed.  
PRODUCT TYPES  
Specifications  
Socket  
Part No.  
Specifications  
Header  
Part No.  
AXT1E∗∗26  
AXT2E∗∗26  
Note: When placing an order, substitute the “” (asterisk) in the above part number with the number of pins for the specific connector.  
ACCTB87E 201602-T  
–5–  
Narrow pitch connectors P35S (0.35mm pitch)  
NOTES  
1. As shown below, excess force  
during insertion may result in damage  
to the connector or removal of the  
solder. Also, to prevent connector  
damage please confirm the correct  
position before mating connectors.  
Socket (Mated height: 1.5mm)  
Header (Mated height: 1.5mm)  
Recommended PC board pattern  
(TOP VIEW)  
Recommended PC board pattern  
(TOP VIEW)  
0.35 0.03  
0.20 0.03  
0.35 0.03  
0.20 0.03  
0.45 0.03  
0.70 0.03  
0.85 0.03  
0.70 0.03  
: Insulation area  
Recommended metal mask pattern  
Recommended metal mask pattern  
Metal mask thickness: When 120 μm  
(Terminal portion opening area ratio: 60%)  
(Metal portion opening area ratio: 100%)  
Metal mask thickness: When 120 μm  
(Terminal portion opening area ratio: 60%)  
(Metal portion opening area ratio: 100%)  
2. Keep the PC board warp no more  
than 0.03 mm in relation to the overall  
length of the connector  
0.35 0.01  
0.18 0.01  
0.35 0.01  
0.18 0.01  
0.45 0.01  
0.70 0.01  
0.70 0.01  
0.85 0.01  
Max. 0.03 mm  
Max. 0.03 mm  
3. If extra resistance to shock caused  
by dropping is required, we  
recommend using P4.  
4. Recommended PC board and metal  
mask patterns  
Please refer to the latest product  
specifications when designing your  
product.  
Connectors are mounted with high pitch  
density, intervals of 0.35 mm, 0.4 mm or  
0.5 mm.  
In order to reduce solder and flux rise,  
solder bridges and other issues make  
sure the proper levels of solder is used.  
The figures to the right are recommended  
metal mask patterns. Please use them as  
a reference.  
ACCTB87E 201602-T  
–6–  
For board-to-board/board-to-FPC  
Notes on Using Narrow pitch Connectors/  
High Current Connectors  
About safety Remarks  
1) Do not use these connectors beyond  
the specification sheets. The usage  
outside of specified rated current,  
dielectric strength, and environmental  
conditions and so on may cause circuitry  
damage via abnormal heating, smoke,  
and fire.  
2) In order to avoid accidents, your  
thorough specification review is  
appreciated.  
Corporation cannot guarantee the quality  
and reliability.  
Continued usage in a state of degraded  
condition may cause the deteriorated  
insulation, thus result in abnormal heat,  
smoke or firing. Please carry out safety  
design and periodic maintenance  
including redundancy design, design for  
fire spread prevention, and design for  
malfunction prevention so that no  
accidents resulting in injury or death, fire  
accidents, or social damage will be  
caused as a result of failure of the  
products or ending life of the products.  
3) Panasonic Corporation is consistently  
striving to improve quality and reliability.  
However, the fact remains that electrical  
components and devices generally cause  
failures at a given statistical probability.  
Furthermore, their durability varies with  
use environments or use conditions. In  
this respect, please check for actual  
electrical components and devices under  
actual conditions before use.  
Please contact us if your usage is out of  
the specifications. Otherwise, Panasonic  
Regarding the design of devices and PC board patterns  
1) When using the board to board  
connectors, do not connect a pair of  
board with multiple connectors.  
Otherwise, misaligned connector  
positions may cause mating failure or  
product breakage.  
Therefore, minimize the thickness of the  
coverlay, etc. so as to prevent the  
occurrence of poor soldering.  
6) For all connectors of the narrow pitch  
series, to prevent the PC board from  
coming off during vibrations or impacts,  
and to prevent loads from falling directly  
on the soldered portions, be sure to  
design some means to fix the PC board  
in place.  
the condition when the reinforcing plate is  
attached to the backside of FPC where  
the connector is mounted. The external  
dimension of the reinforcing plate is  
recommended to be larger than the  
dimension of “PC board recommended  
process pattern” (extended dimension of  
one side is approximately 0.5 to 1.0 mm).  
The materials and thickness of the  
reinforcing plate are glass epoxy or  
polyimide (thickness 0.2 - 0.3 mm) or  
SUS (thickness 0.1 - 0.2 mm).  
• As this connector has temporary locking  
structure, the connector mating may be  
separated by the dropping impact  
depend on the size, weight or bending  
force of the FPC. Please consider the  
measures at usage to prevent the mating  
separation.  
2) With mounting equipment, there may  
be up to a 0.2 to 0.3-mm error in  
positioning. Be sure to design PC boards  
and patterns while taking into  
consideration the performance and  
abilities of the required equipment.  
3) Some connectors have tabs embossed  
on the body to aid in positioning. When  
using these connectors, make sure that  
the PC board is designed with positioning  
holes to match these tabs.  
4) To ensure the required mechanical  
strength when soldering the connector  
terminals, make sure the PC board  
meets recommended PC board pattern  
design dimensions given.  
Example) Secure in place with screws  
Screw  
Connector  
Spacer  
Spacer  
PC board  
When connecting PC boards, take  
appropriate measures to prevent the  
connector from coming off.  
7) When mounting connectors on a FPC  
board:  
8) The narrow pitch connector series is  
designed to be compact and thin.  
Although ease of handling has been  
taken into account, take care when  
mating the connectors, as displacement  
or angled mating could damage or  
deform the connector.  
5) PC board  
• When the connector soldered to FPC is  
mated or unmated, solder detachment  
may occur by the force to the terminals.  
Connector handling is recommended in  
Control the thicknesses of the coverlay  
and adhesive to prevent poor soldering.  
This connector has no stand-off.  
Regarding the selection of the connector placement machine and the mounting  
procedures  
1) Select the placement machine taking  
into consideration the connector height,  
required positioning accuracy, and  
packaging conditions.  
2) Be aware that if the chucking force of  
the placement machine is too great, it  
may deform the shape of the connector  
body or connector terminals.  
3) Be aware that during mounting,  
external forces may be applied to the  
connector contact surfaces and terminals  
and cause deformations.  
4) Depending on the size of the  
6) In case of dry condition, please note  
the occurrence of static electricity.  
The product may be adhered to the  
embossed carrier tape or the cover tape  
in dry condition.  
Recommended humidity is from 40%RH  
to 60%RH and please remove static  
electricity by ionizer in manufacturing  
process.  
connector being used, self alignment  
may not be possible. In such cases, be  
sure to carefully position the terminal with  
the PC board pattern.  
5) The positioning bosses give an  
approximate alignment for positioning on  
the PC board. For accurate positioning of  
the connector when mounting it to the PC  
board, we recommend using an  
automatic positioning machine.  
ACCTB48E 201606-T  
–1–  
Notes on Using Narrow pitch Connectors/High Current Connectors  
Regarding soldering  
Reflow soldering  
8) Soldering conditions  
3) Touch the soldering iron to the foot  
pattern. After the foot pattern and  
connector terminal are heated, apply the  
solder wire so it melts at the end of the  
connector terminals.  
1) Measure the recommended profile  
temperature for reflow soldering by  
placing a sensor on the PC board near  
the connector surface or terminals.  
(Please refer to the specification for detail  
because the temperature setting differs  
by products.)  
Please use the reflow temperature profile  
conditions recommended below for  
reflow soldering. Please contact us  
before using a temperature profile other  
than that described below (e.g. lead-free  
solder).  
Apply the solder  
wire here  
Upper limited (Solder heat resistance)  
Lower limited (Solder wettability)  
2) As for cream solder printing, screen  
printing is recommended.  
Terminal  
Temperature  
Small angle as  
Peak temperature  
possible up to  
45 degrees  
Peak temperature 260°C  
3) When setting the screen opening area  
and PC board foot pattern area, refer the  
recommended PC board pattern and  
window size of metal mask on the  
specification sheet, and make sure that  
the size of board pattern and metal mask  
at the base of the terminals are not  
increased.  
230°C  
220°C  
200°C  
Preheating  
60 to 120 sec.  
180°C  
150°C  
PC board  
25 sec.  
70 sec.  
Pattern  
Time  
4) Be aware that soldering while applying  
a load on the connector terminals may  
cause improper operation of the  
connector.  
For products other than the ones above,  
please refer to the latest product  
specifications.  
4) Please pay attentions not to provide  
too much solder. It makes miss mating  
because of interference at soldering  
portion when mating.  
9) The temperature profiles given in this  
catalog are values measured when using  
the connector on a resin-based PC  
board. When performed reflow soldering  
on a metal board (iron, aluminum, etc.) or  
a metal table to mount on a FPC, make  
sure there is no deformation or  
discoloration of the connector before  
mounting.  
5) Thoroughly clean the soldering iron.  
6) Flux from the solder wire may get on  
the contact surfaces during soldering  
operations. After soldering, carefully  
check the contact surfaces and clean off  
any solder before use.  
7) These connector is low profile type. If  
too much solder is supplied for hand  
soldering, It makes miss mating because  
of interference at soldering portion.  
Please pay attentions.  
Terminal  
Paste  
solder  
PC board  
foot pattern  
5) When mounting on both sides of the  
PC board and the connector is mounting  
on the underside, use adhesives or other  
means to ensure the connector is  
properly fixed to the PC board. (Double  
reflow soldering on the same side is  
possible.)  
6) The condition of solder or flux rise and  
wettability varies depending on the type  
of solder and flux. Solder and flux  
characteristics should be taken into  
consideration and also set the reflow  
temperature and oxygen level.  
10) Consult us when using a screen-  
printing thickness other than that  
recommended.  
Solder reworking  
Hand soldering  
1) Finish reworking in one operation.  
2) In case of soldering rework of bridges.  
Don’t use supplementary solder flux.  
Doing so may cause contact problems by  
flux.  
1) Set the soldering iron so that the tip  
temperature is less than that given in the  
table below.  
Table A  
3) Keep the soldering iron tip temperature  
below the temperature given in Table A.  
Product name  
Soldering iron temperature  
300°C within 5 sec.  
350°C within 3 sec.  
SMD type connectors  
2) Do not allow flux to spread onto the  
connector leads or PC board. This may  
lead to flux rising up to the connector  
inside.  
7) Do not use resin-containing solder.  
Otherwise, the contacts might be firmly  
fixed.  
Handling Single Components  
1) Make sure not to drop or allow parts to  
fall from work bench.  
2) Excessive force applied to the  
terminals could cause warping, come  
out, or weaken the adhesive strength of  
the solder. Handle with care.  
3) Do not insert or remove the connector  
when it is not soldered. Forcibly applied  
external pressure on the terminals can  
weaken the adherence of the terminals to  
the molded part or cause the terminals to  
lose their evenness.  
Precautions for mating  
Press-fitting while the mating  
inlets of the socket and  
header are not matched.  
This product is designed with ease of  
handling. However, in order to prevent the  
deformation or damage of contacts and  
molding, take care and do not mate the  
connectors as shown right.  
Strongly pressed and twisted  
Tilted mating  
ACCTB48E 201606-T  
–2–  
Notes on Using Narrow pitch Connectors/High Current Connectors  
Cleaning flux from PC board  
There is no need to clean this product.  
If cleaning it, pay attention to the  
following points to prevent the negative  
effect to the product.  
2) Some cleaning solvents are strong and  
they may dissolve the molded part and  
characters, so pure water passed liquid  
solvent is recommended.  
1) Keep the cleaning solvent clean and  
prevent the connector contacts from  
contamination.  
Handling the PC board after mounting the connector  
When cutting or bending the PC board  
after mounting the connector, be careful  
that the soldered sections are subjected  
to excessive force.  
The soldered areas should not be subjected to force.  
Storage of connectors  
1) To prevent problems from voids or air  
pockets due to heat of reflow soldering,  
avoid storing the connectors in areas of  
high humidity.  
Some connectors may change color  
slightly if subjected to ultraviolet rays  
during storage.This is normal and will not  
affect the operation of the connector.  
3) When storing the connectors with the  
PC boards assembled and components  
alreeady set, be careful not to stack them  
up so the connectors are subjected to  
excessive forces.  
4) Avoid storing the connectors in  
locations with excessive dust. The dust  
may accumulate and cause improper  
connections at the contact surfaces.  
2) Depending on the connector type, the  
color of the connector may vary from  
connector to connector depending on  
when it is produced.  
Other Notes  
1) Do not remove or insert the electrified  
connector (in the state of carrying current  
or applying voltage).  
4) When coating the PC board after  
soldering the connector to prevent the  
deterioration of insulation, perform the  
coating in such a way so that the coating  
does not get on the connector.  
5) There may be variations in the colors  
of products from different production lots.  
This is normal.  
7) Product failures due to condensation  
are not covered by warranty.  
2) Dropping of the products or rough  
mishandling may bend or damage the  
terminals and possibly hinder proper  
reflow soldering.  
3) Before soldering, try not to insert or  
remove the connector more than  
absolutely necessary.  
6) The connectors are not meant to be  
used for switching.  
Regarding sample orders to confirm proper mounting  
When ordering samples to confirm  
proper mounting with the placement  
machine, connectors are delivered in 50-  
piece units in the condition given right.  
Consult a sale representative for ordering  
sample units.  
Please refer to the latest product  
specifications when designing your  
product.  
Condition when delivered from manufacturing  
Reel  
(Delivery can also be made on a reel by  
customer request.)  
Required number  
of products for  
Embossed tape  
amount required for  
the mounting  
sample production  
(Unit 50 pcs.)  
ACCTB48E 201606-T  
–3–  

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SI9135_11

SMBus Multi-Output Power-Supply Controller

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SI9136_11

Multi-Output Power-Supply Controller

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SI9130CG-T1-E3

Pin-Programmable Dual Controller - Portable PCs

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SI9130LG-T1-E3

Pin-Programmable Dual Controller - Portable PCs

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VISHAY

SI9130_11

Pin-Programmable Dual Controller - Portable PCs

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SI9137

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9137DB

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9137LG

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9122E

500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification Drivers

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