AXK7L60217J [PANASONIC]
Card Edge Connector, 60 Contact(s), 2 Row(s), Female, Solder Terminal, Socket;
| 型号： | AXK7L60217J |
| 厂家： | 
PANASONIC |
| 描述： | Card Edge Connector, 60 Contact(s), 2 Row(s), Female, Solder Terminal, Socket PC 连接器 |
| 文件： | 总4页 (文件大小：582K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AXK7L, 8L
NARROW-PITCH
CONNECTORS
FOR PC BOARD-TO-FPC
CONNECTION
NARROW PITCH
(0.4mm)
CONNECTORS F4
FEATURES
1.The lowest profile class among two-
piece connectors in the world (Mated
height: 0.9mm)
Achieved both a 0.4-mm pitch and an ultra
low profile of 0.9 mm high when mated,
contributing to further thickness reduction
of products.
4. Easy to design product circuits
1) An insulating wall provided for the
bottom surface of the connector prevents
contact between the pattern on the PC
board and the metal pins, enabling
pattern wiring under the connector, and
thus contributing to the reduction in size of
PC boards.
2. Ultra low profile, but high contact
reliability
[Socket]
[Header]
Our own bellows-type double contact
structure provides a high resistance to
twisting and shock, ensuring a high
contact reliability.
Socket
Header
Pattern wiring under the
connector is possible.
2) The usage shown below further
enhances the flexibility of connector
positioning.
Double contact
[Example of application of connection
between a board and an FPC]
3. Improved mating strength between
the socket and header
The simple locking structures provided for
the retention fittings and the contact
points improve the mating strength and
provide tactile feedback when locked.
FPC
Example of connection between
a board and an FPC
Before mating
P4
F4
PCB
FPC
Reinforcing
plate (including
the FPC)
Socket
Header
5. Standard use of Ni barrier plating
The use of Ni barrier plating, which is
highly resistant against solder creeping,
on the socket terminals is standard.
F4 connector
PCB
After mating
0.9mm
Locking structure of the retention fittings
PRODUCT TYPES
Part No.
Packing
Mated height
No. of contacts
Socket
Header
Inner carton (1-reel)
Outer carton
20
22
30
40
50
60
70
80
AXK7L20227*
AXK7L22227*
AXK7L30227*
AXK7L40227*
AXK7L50227*
AXK7L60227*
AXK7L70227*
AXK7L80227*
AXK8L20125*
AXK8L22125*
AXK8L30125*
AXK8L40125*
AXK8L50125*
AXK8L60125*
AXK8L70125*
AXK8L80125*
Asterisk at the last digit
of the part No.:
Asterisk at the last digit
of the part No.:
J: 6,000 pieces (2 reels)
V: 15,000 pieces (5 reels)
0.9 mm
J: 3,000 pieces
V: 3,000 pieces
Notes) 1. Regarding ordering units: During production: Please make orders in 1-reel units.
Samples for mounting confirmation: Available in units of 50 pieces. Please consult us.
Samples: Available. Please consult us.
2. The standard type comes with no positioning bosses. Connectors with positioning bosses are available for on-demand production.
For this type of connector, 9th digit of the part no. changes from 2 to 1. e.g. 20 contacts for sockets: AXK7L20217*
3. Please consult us regarding a different number of contacts.
NARROW PITCH (0.4mm) CONNECTORS F4
AKCT1B57E ’03.9
New
http://www.nais-e.com/
AXK7L, 8L
SPECIFICATIONS
1. Characteristics
Item
Specifications
0.3A/terminal (Max. 5 A at total terminals)
60V AC/DC
Conditions
Rated current
Rated voltage
—
—
Electrical
Rated voltage is applied for one minutes and check for short circuit or
damage with a detection current of 1mA
Breakdown voltage
characteristics
150V AC for 1 min.
Insulation resistance
Contact resistance
Ambient temperature
Min. 1,000MΩ (Initial)
Using 250V DC megger (applied for 1 min.)
Measured based on the HP4338B measurement method of JIS C 5402
No freezing at low temperatures
Max. 90mΩ
–55°C to +85°C
Max. peak temperature of 245°C
300°C within 5 sec, 350°C within 3 sec.
Infrared reflow soldering
Soldering heat resistance
Storage temperature
Soldering iron
–55°C to +85°C (Product only)
–40°C to +50°C (Emboss packing)
No freezing at low temperatures
Sequence
+0
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
1. -55 °C, 30 min.
–3
Thermal shock resistance
2. 25+–510 °C, Max.5 min.
(header and socket mated)
+3
Environmental
3. 85 °C, 30 min.
–0
4. 25+–510 °C, Max.5 min.
characteristics
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Humidity resistance
(header and socket mated)
Temperature 40±2°C,
humidity 90 to 95% R.H.
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Saltwater spray resistance
(header and socket mated)
Temperature 35±2°C,
saltwater concentration 5±1%
H2S resistance
48 hours,
Temperature 40±2°C,
(header and socket mated)
contact resistance max. 90mΩ
gas concentration 3±1 ppm, humidity 75 to 80% R.H.
Lifetime
Insertion and removal life
characteristics
50 times
Repeated insertion and removal speed of max. 200 times/hours
Unit weight
40 contacts; Socket: 0.05g Header: 0.03g
2. Material and surface treatment
Part name
Material
Surface treatment
—
Molded portion
Contact/Post
LCP resin (UL94V-0)
Copper alloy
Contact portion: Au plating over Ni
Terminal portion: Au plating over Ni (Except for front edge of terminal)
Retention fitting portion: Sn plating over Ni (Socket: except for front edge of the terminal)
mm General tolerance: ±0.2
DIMENSIONS
• Socket (Mated height 0.9 mm)
Dimension table (mm)
Dimensions
Terminal coplanarity
0.87
0.08
(Contact and
A
B
C
D
No. of
A
This surface
C 0.15
retention fitting)
contacts
B±0.1
0.40±0.05
0.15±0.03
20
22
30
40
50
60
70
80
6.4
6.8
3.6
4.0
5.0
5.4
6.4
6.8
8.4
5.6
7.0
8.4
10.4
12.4
14.4
16.4
18.4
7.6
9.0
10.4
12.4
14.4
16.4
18.4
9.6
11.0
13.0
15.0
17.0
11.6
13.6
15.6
0.10±0.03
Retention solder tab
0.40±0.05
C±0.15
• Header (Mated height: 0.9 mm)
Dimension table (mm)
Dimensions
Terminal coplanarity
0.63
0.08
(Post and
A
B
A
B
C
D
No. of
C±0.1
retention fitting)
contacts
0.40±0.05
0.15±0.03
20
22
30
40
50
60
70
80
6.0
6.4
5.74
6.14
7.74
9.74
3.6
4.0
5.6
7.6
9.6
6.4
6.8
8.0
8.4
10.0
10.4
12.4
14.4
16.4
18.4
12.0 11.74
Retention solder tab
14.0 13.74 11.6
16.0 15.74 13.6
18.0 17.74 15.6
0.08±0.03
2
AXK7L, 8L
• Socket and header are mated
Socket
Header
EMBOSSED TAPE AND REEL DIMENSIONS CHART
1. Socket
• Tape dimensions
1) A dimensions: 24mm
2) A dimensions: 32mm
2) A dimensions: 16mm
(A±0.3)
(B)
(A±0.3)
(A±0.3)
(C)
(1.75)
(C)
Top cover tape
Top cover tape
(C)
(1.75)
(1.75)
Emboss carrier tape
Emboss carrier tape
Narrow pitch connector
Narrow pitch connector
Dimension table (mm)
Dimensions
A
B
C
D
No. of
contacts
Max.24
26 to 70
80
16.0
—
—
7.5
16.4
24.4
32.4
24.0
32.0
11.5
14.2
28.4
2. Header
• Tape dimensions
1) A dimensions: 24mm
2) A dimensions: 32mm
2) A dimensions: 16mm
(A±0.3)
(B)
(A±0.3)
(C)
(A±0.3)
(C)
Top cover tape
(C)
Top cover tape
(1.75)
(1.75)
(1.75)
Emboss carrier tape
Emboss carrier tape
Narrow pitch connector
Narrow pitch connector
Dimension table (mm)
Dimensions
A
B
C
D
No. of
contacts
Max.24
26 to 70
80
16.0
24.0
32.0
—
—
7.5
16.4
24.4
32.4
11.5
14.2
28.4
• Reel dimensions
(D+2
)
0
Label
Top cover tape
Emboss carrier tape
Cavity
Taping reel
3
AXK7L, 8L
NOTES
1. Removal by pulling up from an end
causes the entire connector removal
force to concentrate on the retention
fittings and end terminals.Therefore,
please lift and remove from the side.
Doing so will also prevent cracking of
the soldered parts.
• Socket
• Header
Recommended PC board pattern
(Mount pad arrangement pattern)
Recommended PC board pattern
(Mount pad arrangement pattern)
B±0.05
0.40±0.03
0.23±0.03
C±0.05
0.40±0.03
0.23±0.03
0.57±0.03
Pull
: Through hole without
insulation is prohibited.
1.00±0.03
D±0.05
D±0.05
Relation between connector and mounting pad
Mounting pad
: Through hole without
insulation is prohibited.
(Max. 2.20)
(3.20±0.03)
(4.70±0.03)
NG
Recommended metal mask pattern
Metal mask thickness: 150 µm
Recommended metal mask pattern
Metal mask thickness: 150 µm
Pull
(Terminal portion opening area ratio: 53%)
(Terminal portion opening area ratio: 52%)
(Metal portion opening area ratio: 100%)
(Metal portion opening area ratio: 40%)
1.40±0.01
1.00±0.01
1.30±0.01
0.25±0.01
2. PC Boards and Recommended Metal
Mask Patterns
Connectors are mounted with high
density, with a pitch interval of 0.4 to 0.5
mm. It is therefore necessary to make
sure that the right levels of solder are
used, in order to reduce solder bridge and
other issues. The figures to the right are
recommended metal mask patterns.
Please use them as a reference.
0.20±0.01
0.40±0.01
0.20±0.01
0.40±0.01
Recommended metal mask pattern
Metal mask thickness: 120 µm
(Terminal portion opening area ratio: 66%)
Recommended metal mask pattern
Metal mask thickness: 120 µm
(Terminal portion opening area ratio: 66%)
(Metal portion opening area ratio: 100%)
(Metal portion opening area ratio: 51%)
In particular, if a lot of solder is used in
the header retaining retention fittings,
it might interfere with and cause
incomplete socket mating. Therefore,
please follow the recommended
conditions given on the left.
1.40±0.01
1.00±0.01
1.30±0.01
0.31±0.01
0.20±0.01
0.40±0.01
0.20±0.01
0.40±0.01
These materials are printed on ECF pulp.
These materials are printed with earth-friendly vegetable-based (soybean oil) ink.
Please contact ..........
Matsushita Electric Works, Ltd.
Automation Controls Company
Head Office: 1048, Kadoma, Kadoma-shi, Osaka 571-8686, Japan
Telephone: Japan (81) Osaka (06) 6908-1050
Facsimile: Japan (81) Osaka (06) 6908-5781
http://www.nais-e.com/
COPYRIGHT © 2003 All Rights Reserved
Printed in Japan.
AKCT1B57E 200309-3YT
Specifications are subject to change without notice.
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