AXK5L46347G [PANASONIC]
Board Stacking Connector, 46 Contact(s), 2 Row(s), Female, Straight, Surface Mount Terminal, Socket, ROHS COMPLIANT;型号: | AXK5L46347G |
厂家: | PANASONIC |
描述: | Board Stacking Connector, 46 Contact(s), 2 Row(s), Female, Straight, Surface Mount Terminal, Socket, ROHS COMPLIANT 连接器 |
文件: | 总9页 (文件大小:283K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AXK(5/6)L
For board-to-board
Narrow pitch connectors
(0.5mm pitch)
P5KL Series
FEATURES
APPLICATIONS
1. Low profile mated height of 1.2 mm
and 0.5 mm pitch contributes to
device miniaturization.
Digital devices, such as digital still
cameras and digital video cameras.
2. Strong resistance to adverse
environments! Utilizes
“
” construction
for high contact reliability.
Socket
Header
3. Simple lock structure provides
tactile feedback to ensure excellent
mating/unmating operation feel.
RoHS compliant
Simple lock
mechanism
4. Effective mating length 0.3 mm.
0.3mm
ORDERING INFORMATION
AXK
3
7
G
5L: Narrow Pitch Connector P5KL (0.5 mm pitch) Socket
6L: Narrow Pitch Connector P5KL (0.5 mm pitch) Header
Number of pins (2 digits)
Mated height
<Socket>
3: For mated height 1.2 mm
<Header>
3: For mated height 1.2 mm
Functions
3: With positioning bosses
4: Without positioning bosses
Surface treatment (Contact portion / Terminal portion)
7: Ni plating on base, Au plating on surface (for Ni barrier available)
Packing
G: 3,000 pieces embossed tape and plastic reel × 2 (for Ni barrier available)
ACCTB24E 201209-T
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
AXK(5/6)L
PRODUCT TYPES
Part No.
Packing quantity
Inner carton
(1-reel)
Mated height
No. of pins
Socket
Header
Outer carton
10
12
20
24
30
34
40
46
50
60
AXK5L10347G
AXK5L12347G
AXK5L20347G
AXK5L24347G
AXK5L30347G
AXK5L34347G
AXK5L40347G
AXK5L46347G
AXK5L50347G
AXK5L60347G
AXK6L10347G
AXK6L12347G
AXK6L20347G
AXK6L24347G
AXK6L30347G
AXK6L34347G
AXK6L40347G
AXK6L46347G
AXK6L50347G
AXK6L60347G
1.2 mm
3,000 pieces
6,000 pieces
Notes: 1. Regarding ordering units: During production, Please make orders in 1-reel units. Samples for mounting confirmation: Please consult us. Samples: Small lot orders
are possible. Please consult us.
2. The standard type comes without positioning bosses. Connectors with positioning bosses are available for on-demand production.
For this type of connector, 9th digit of the part no. changes from 4 to 3. e.g. 10 pin contacts for sockets: AXK5L10337G
SPECIFICATIONS
1. Characteristics
Item
Specifications
0.5A/pin contact (Max. 10 A at total pin contacts)
60V AC/DC
Conditions
Rated current
Rated voltage
Breakdown voltage
Insulation resistance
Electrical
characteristics
150V AC for 1 minute
Detection current: 1mA
Using 500V DC megger
Min. 1,000MΩ (initial)
Based on the contact resistance measurement method
specified by JIS C 5402.
Contact resistance
Max. 90mΩ
Composite insertion force
Composite removal force
Max. 0.981N {100gf}/pin contacts × pin contacts (initial)
Min. 0.0588N {6gf}/pin contacts × pin contacts
Mechanical
characteristics
Holding force of terminal
securing section
Measuring the maximum force.
As the contact is axially pull out.
Min. 0.981N {100gf}/pin contact
Ambient temperature
–55°C to +85°C
No freezing at low temperatures
Max. peak temperature of 260°C (on the surface of the
Infrared reflow soldering
PC board around the connector terminals)
Soldering heat resistance
300°C within 5 seconds
350°C within 3 seconds
Soldering iron
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Storage temperature
No freezing at low temperatures. No dew condensation.
Conformed to MIL-STD-202F, method 107G
Order Temperature (°C) Time (minutes)
0
Environmental
characteristics
1
2
3
4
–55−3
30
Max. 5
30
Thermal shock resistance
(header and socket mated)
5 cycles, insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
85+3
0
Max. 5
0
–55−3
Humidity resistance
(header and socket mated)
120 hours, insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Bath temperature 40 2°C,
humidity 90 to 95% R.H.
Saltwater spray resistance
(header and socket mated)
24 hours, insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Bath temperature 35 2°C,
saltwarter concentration 5 1%
H2S resistance
(header and socket mated)
Bath temperature 40 2°C, gas concentration 3 1 ppm,
humidity 75 to 80% R.H.
48 hours, contact resistance max. 90mΩ
Lifetime
characteristics
Repeated insertion and removal speed of
max. 200 times/hours
Insertion and removal life
50 times
Unit weight
20 pin contacts; Socket: 0.05g; Header: 0.02g
2. Material and surface treatment
Part name
Material
Surface treatment
—
Molded portion
Heat-resistant resin (UL94V-0)
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal)
The section close to the soldering portion has a nickel barrier.
(The nickel base is exposed.)
Contact/Post
Copper alloy
ACCTB24E 201209-T
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
AXK(5/6)L
The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/
DIMENSIONS (Unit: mm)
• Socket (Mated height: 1.2mm)
CAD Data
A
Terminal
coplanarity
B
0.1
1.20
0.10
0.50 0.05
0.20 0.03
Dimension table (mm)
No. of pins
A
B
10
12
20
24
30
34
40
46
50
60
5.50
2.00
2.50
4.50
5.50
7.00
8.00
9.50
11.00
12.00
14.50
6.00
8.00
9.00
10.50
11.50
13.00
14.50
15.50
18.00
0.10 0.03
General tolerance: 0.2
• Header (Mated height: 1.2mm)
CAD Data
A
Terminal coplanarity
0.95
0.10
B 0.1
0.50 0.05
0.20 0.03
Dimension table (mm)
No. of pins
A
B
10
12
20
24
30
34
40
46
50
60
3.90
4.40
6.40
7.40
8.90
9.90
11.40
12.90
13.90
16.40
2.00
2.50
4.50
5.50
7.00
8.00
9.50
11.00
12.00
14.50
0.10 0.03
General tolerance: 0.2
• Socket and header are mated
Header
Socket
ACCTB24E 201209-T
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
AXK(5/6)L
EMBOSSED TAPE DIMENSIONS (unit: mm, Common for respective contact type, socket and header)
• Tape dimensions (Conforming to JIS C 0806-1990.
However, some tapes have mounting hole pitches that do
not comply with the standard.)
• Plastic reel dimensions (Conforming to EIAJ ET-7200B)
Tape I
Tape II
A 0.3
Taping reel
A 0.3
D 1
C
B
1.75
1.75
Top cover tape
C
Embossed carrier tape
4
2
4
2
Embossed mounting-hole
8.0
8.0
1.5+0.1 dia.
1.5+0.1 dia.
0
0
Dimension table (mm)
Suffix: G (1 reel, 3,000 pieces embossed tape: Plastic reel package)
Mated height
No. of pins
10 to 18
20 to 50
60
Type of taping
A
B
C
D
Quantity per reel
3,000 pcs.
Tape I
16.0
24.0
32.0
—
—
7.5
17.4
25.4
33.4
Socket and header are common:
1.2mm
Tape I
11.5
14.2
3,000 pcs.
Tape II
28.4
3,000 pcs.
Connector orientation with respect to direction of progress of embossed tape
Type
Common for P5KL
Direction of
tape progress
Socket
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
ACCTB24E 201209-T
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
AXK(5/6)L
NOTES
1. As shown below, excess force
during insertion may result in damage
to the connector or removal of the
solder. Also, to prevent connector
damage please confirm the correct
position before mating connectors.
• Socket
• Header
Recommended PC board pattern (TOP VIEW)
Recommended PC board pattern (TOP VIEW)
0.50 0.05
0.25 0.03
0.50 0.05
0.25 0.03
0.40 0.05
0.125 0.03
C
B 0.05
0.40 0.05
0.125 0.03
B 0.05
2. Keep the PC board warp no more
than 0.03 mm in relation to the overall
length of the connector.
: Insulation area
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: 150 µm
(Terminal portion opening area ratio: 57%)
Metal mask thickness: 150 µm
(Terminal portion opening area ratio: 56%)
0.50 0.01
0.23 0.01
0.50 0.01
0.23 0.01
Max. 0.03mm
Max. 0.03mm
3. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder bridges and
other issues make sure the proper levels
of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
0.35 0.01
0.115 0.01
0.35 0.01
0.115 0.01
Recommended metal mask pattern
Metal mask thickness: 120 µm
(Terminal portion opening area ratio: 70%)
Recommended metal mask pattern
Metal mask thickness: 120 µm
(Terminal portion opening area ratio: 70%)
0.50 0.01
0.23 0.01
0.50 0.01
0.23 0.01
0.35 0.01
0.115 0.01
0.35 0.01
0.115 0.01
Notes: 1. See the dimension table on page 87 for
more information on the B dimension of the
socket and header.
Please refer to the latest product
specifications when designing your
product.
2. The socket C dimension is the B dimension
in the dimensions table with 0.8 added.
ACCTB24E 201209-T
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
Notes on Using Narrow-pitch Connectors (Common)
Regarding the design of devices and PC board patterns
1) When connecting several connectors
together by stacking, make sure to
maintain proper accuracy in the design of
structure and mounting equipment so
that the connectors are not subjected to
twisting and torsional forces.
2) With mounting equipment, there may
be up to a 0.2 to 0.3-mm error in
positioning. Be sure to design PC boards
and patterns while taking into
5) For all connectors of the narrow-pitch
series, to prevent the PC board from
coming off during vibrations or impacts,
and to prevent loads from falling directly
on the soldered portions, be sure to
design some means to fix the PC board
in place.
backside of the FPC board to which the
connector is being connected. Please
make the reinforcement board
dimensions bigger than the outer limits of
the recommended PC board pattern
(should be approximately 1 mm greater
than the outer limit).
Material should be glass epoxy or
polyimide, and the thickness should be
between 0.2 and 0.3 mm.
Example) Secure in place with screws
Screw
consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed
on the body to aid in positioning. When
using these connectors, make sure that
the PC board is designed with positioning
holes to match these tabs.
4) To ensure the required mechanical
strength when soldering the connector
terminals, make sure the PC board
meets recommended PC board pattern
design dimensions given.
(2) Collisions, impacts, or turning of FPC
boards, may apply forces on the
connector and cause it to come loose.
Therefore, make to design retaining
plates or screws that will fix the connector
in place.
7) The narrow-pitch connector series is
designed to be compact and thin.
Although ease of handling has been
taken into account, take care when
mating the connectors, as displacement
or angled mating could damage or
deform the connector.
Connector
Spacer
Spacer
PC board
When connecting PC boards, take
appropriate measures to prevent the
connector from coming off.
6) Notes when using a FPC.
(1) When the connector is soldered to an
FPC board, during its insertion and
removal procedures, forces may be
applied to the terminals and cause the
soldering to come off. It is recommended
to use a reinforcement board on the
Regarding the selection of the connector placement machine and the mounting
procedures
1) Select the placement machine taking
into consideration the connector height,
required positioning accuracy, and
packaging conditions.
2) Be aware that if the catching force of
the placement machine is too great, it
may deform the shape of the connector
body or connector terminals.
3) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
4) Depending on the size of the
6) Excessive mounter chucking force may
deform the molded or metal part of the
connector. Consult us in advance if
chucking is to be applied.
connector being used, self alignment
may not be possible. In such cases, be
sure to carefully position the terminal with
the PC board pattern.
5) The positioning bosses give an
approximate alignment for positioning on
the PC board. For accurate positioning of
the connector when mounting it to the PC
board, we recommend using an
automatic positioning machine.
ACCTB48E 201204-T
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
Notes on Using Narrow-pitch Connectors (Common)
Regarding soldering
1. Reflow soldering
Soldering conditions
2. Hand soldering
1) Measure the recommended profile
temperature for reflow soldering by
placing a sensor on the PC board near
the connector surface or terminals. (The
setting for the sensor will differ depending
on the sensor used, so be sure to
carefully read the instructions that comes
with it.)
Please use the reflow temperature profile
conditions recommended below for
reflow soldering. Please contact us
before using a temperature profile other
than that described below (e.g. lead-free
solder).
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
Product name
Soldering iron temperature
300°C within 5 sec.
350°C within 3 sec.
SMD type connectors
• Narrow-pitch connectors
(except P8 type)
2) Do not allow flux to spread onto the
connector leads or PC board. This may
lead to flux rising up to the connector
inside.
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
connector terminal are heated, apply the
solder wire so it melts at the end of the
connector terminals.
2) As for cream solder printing, screen
printing is recommended.
Upper limited (Solder heat resistance)
Lower limited (Solder wettability)
Temperature
3) To determine the relationship between
the screen opening area and the PC-
board foot pattern area, refer to the
diagrams in the recommended patterns
for PC boards and metal masks. Make
sure to use the terminal tip as a reference
position when setting. Avoid an excessive
amount of solder from being applied,
otherwise, interference by the solder will
cause an imperfect contact.
Peak temperature
Peak temperature 260°C
230°C
220°C
200°C
Preheating
60 to 120 sec.
180°C
150°C
25 sec.
70 sec.
Time
• Narrow-pitch connector (P8)
Apply the solder
wire here
Temperature
Peak temperature
245°C max.
200°C
Terminal
Small angle as
Preheating
155 to 165°C
possible up to
45 degrees
Terminal
Paste
60 to 120 sec.
Within 30 sec.
Time
solder
PC board
PC board
foot pattern
Pattern
For products other than the ones above,
please refer to the latest product
specifications.
7) The temperatures are measured at the
surface of the PC board near the
connector terminals. (The setting for the
sensor will differ depending on the sensor
used, so be sure to carefully read the
instructions that comes with it.)
8) The temperature profiles given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed reflow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector beforehand
and then begin mounting.
9) Consult us when using a screen-
printing thickness other than that
recommended.
10) Some solder and flux types may
cause serious solder creeping. Solder
and flux characteristics should be taken
into consideration when setting the reflow
soldering conditions.
4) Consult us when using a screen-
printing thickness other than that
recommended.
5) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly fixed to the PC board. (Double
reflow soldering on the same side is
possible.)
6) N2 reflow, conducting reflow soldering
in a nitrogen atmosphere, increases the
solder flow too greatly, enabling wicking
to occur. Make sure that the solder feed
rate and temperature profile are
appropriate.
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) For soldering of prototype devices
during product development, you can
perform soldering at the necessary
locations by heating with a hot-air gun by
applying cream solder to the foot pattern
beforehand. However, at this time, make
sure that the air pressure does not move
connectors by carefully holding them
down with tweezers or other similar tool.
Also, be careful not to go too close to the
connectors and melt any of the molded
components.
8) If an excessive amount of solder is
applied during manual soldering, the
solder may creep up near the contact
points, or solder interference may cause
imperfect contact.
3. Solder reworking
1) Finish reworking in one operation.
2) For reworking of the solder bridge, use
a soldering iron with a flat tip. To prevent
flux from climbing up to the contact
surfaces, do not add more flux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
ACCTB48E 201204-T
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
Notes on Using Narrow-pitch Connectors (Common)
Handling Single Components
1) Make sure not to drop or allow parts to
fall from work bench
4) Do not insert or remove the connector
when it is not soldered. Forcibly applied
external pressure on the terminals can
weaken the adherence of the terminals to
the molded part or cause the terminals to
lose their evenness.
Excessive force applied for insertion in a
pivot action as shown may also cause
product breakage.
Align the header and socket positions
before connecting them.
2) Excessive force applied to the
terminals could cause warping, come
out, or weaken the adhesive strength of
the solder. Handle with care.
3) Repeated bending of the terminals
may cause terminals to break.
5) Excessive prying-force applied to one
end may cause product breakage and
separation of the solder joints at the
terminal.
3) Since some powerful cleaning
solutions may dissolve molded
components of the connector and wipe
off or discolor printed letters, we
recommend aqua pura electronic parts
cleaners. Please consult us if you wish to
use other types of cleaning fluids.
4) Please note that the surfaces of
molded parts may whiten when cleaned
with alcohol.
Cleaning flux from PC board
Handling the PC board
1) To increase the cleanliness of the
cleaning fluid and cleaning operations,
prepare equipment for cleaning process
beginning with boil cleaning, ultrasonic
cleaning, and then vapor cleaning.
2) Carefully oversee the cleanliness of
the cleaning fluids to make sure that the
contact surfaces do not become dirty
from the cleaning fluid itself.
• Handling the PC board after
mounting the connector
When cutting or bending the PC board
after mounting the connector, be careful
that the soldered sections are subjected
to excessive force.
The soldered areas should not be subjected to force.
Storage of connectors
1) To prevent problems from voids or air
pockets due to heat of reflow soldering,
avoid storing the connectors in areas of
high humidity. When storing the
Some connectors may change color
slightly if subjected to ultraviolet rays
during storage.This is normal and will not
affect the operation of the connector.
3) When storing the connectors with the
PC boards assembled and components
alreeady set, be careful not to stack them
up so the connectors are subjected to
excessive forces.
4) Avoid storing the connectors in
locations with excessive dust. The dust
may accumulate and cause improper
connections at the contact surfaces.
connectors for more than six months, be
sure to consider storage area where the
humidity is properly controlled.
2) Depending on the connector type, the
color of the connector may vary from
connector to connector depending on
when it is produced.
Other Notes
1) These products are made for the
design of compact and lightweight
devices and therefore the thickness of the
molded components has been made very
thin. Therefore, be careful during
insertion and removal operations for
excessive forces applied may damage
the products.
3) Before soldering, try not to insert or
remove the connector more than
absolutely necessary.
4) When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
6) The connectors are not meant to be
used for switching.
7) Be sure not to allow external pressure
to act on connectors when assembling
PCBs or moving in block assemblies.
2) Dropping of the products or rough
mishandling may bend or damage the
terminals and possibly hinder proper
reflow soldering.
5) There may be variations in the colors
of products from different production lots.
This is normal.
ACCTB48E 201204-T
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
Notes on Using Narrow-pitch Connectors (Common)
Regarding sample orders to confirm proper mounting
When ordering samples to confirm
proper mounting with the placement
machine, connectors are delivered in 50-
piece units in the condition given right.
Consult a sale representative for ordering
sample units.
Please refer to the latest product
specifications when designing your
product.
Condition when delivered from manufacturing
Reel
(Delivery can also be made on a reel by
customer request.)
Required number
Embossed tape
of products for
amount required for
sample production
the mounting
(Unit 50 pcs.)
ACCTB48E 201204-T
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
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